TWI365693B - Solder bump printing method for single print circuit board - Google Patents
Solder bump printing method for single print circuit boardInfo
- Publication number
- TWI365693B TWI365693B TW097138955A TW97138955A TWI365693B TW I365693 B TWI365693 B TW I365693B TW 097138955 A TW097138955 A TW 097138955A TW 97138955 A TW97138955 A TW 97138955A TW I365693 B TWI365693 B TW I365693B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- printing method
- solder bump
- print circuit
- single print
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW097138955A TWI365693B (en) | 2008-10-09 | 2008-10-09 | Solder bump printing method for single print circuit board |
| JP2009175005A JP5004061B2 (en) | 2008-10-09 | 2009-07-28 | Solder bump printing method for single printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW097138955A TWI365693B (en) | 2008-10-09 | 2008-10-09 | Solder bump printing method for single print circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201016087A TW201016087A (en) | 2010-04-16 |
| TWI365693B true TWI365693B (en) | 2012-06-01 |
Family
ID=42255640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097138955A TWI365693B (en) | 2008-10-09 | 2008-10-09 | Solder bump printing method for single print circuit board |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5004061B2 (en) |
| TW (1) | TWI365693B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104191808B (en) * | 2014-08-07 | 2016-08-31 | 深圳市广晟德科技发展有限公司 | Full-automatic stencil printing machine |
| TWI665455B (en) * | 2018-05-30 | 2019-07-11 | 緯穎科技服務股份有限公司 | Circuit board for transmitting high speed signal and for said signal to be detected |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3196596B2 (en) * | 1995-09-29 | 2001-08-06 | 松下電器産業株式会社 | Electronic component manufacturing method and electronic component mounting method |
| JP2000216518A (en) * | 1999-01-21 | 2000-08-04 | Ibiden Co Ltd | Manufacture of printed wiring board |
| JP2001068823A (en) * | 1999-08-25 | 2001-03-16 | Sumitomo Metal Electronics Devices Inc | Substrate for multiple boards and wiring board |
| JP2003260783A (en) * | 2002-03-08 | 2003-09-16 | Matsushita Electric Ind Co Ltd | Solder paste printing method and mask for solder paste printing |
| JP2004155185A (en) * | 2002-10-18 | 2004-06-03 | Ngk Spark Plug Co Ltd | Soldering paste printing method, soldering paste printing machine, and method for manufacturing wiring board having solder printing layer |
| JP2005072556A (en) * | 2003-08-06 | 2005-03-17 | Kenseidou Kagaku Kogyo Kk | Wiring substrate carrier |
| JP2005150196A (en) * | 2003-11-12 | 2005-06-09 | Matsushita Electric Ind Co Ltd | Method for manufacturing module and module manufacturing apparatus used therefor |
| JP4506515B2 (en) * | 2005-03-08 | 2010-07-21 | 株式会社デンソー | Screen printing device |
| US7472473B2 (en) * | 2006-04-26 | 2009-01-06 | Ibiden Co., Ltd. | Solder ball loading apparatus |
| JP4842864B2 (en) * | 2007-03-15 | 2011-12-21 | 新光電気工業株式会社 | Electronic device and manufacturing method thereof |
-
2008
- 2008-10-09 TW TW097138955A patent/TWI365693B/en active
-
2009
- 2009-07-28 JP JP2009175005A patent/JP5004061B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010093232A (en) | 2010-04-22 |
| TW201016087A (en) | 2010-04-16 |
| JP5004061B2 (en) | 2012-08-22 |
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