1364845 17408pif.doc 九、發明說明： 本申請案主張於2004年7月14號提交的美國專利臨 時申請案第60/587,761號的優先權，該專利申請案所揭露 之内容系完整結合於本說明書中以供參考。 【發明所屬之技術領域】 本發明是有關於半導體元件測試，特別是有關於半導 體産業中手動和/或自動封裝的測試環境。 【先前技術】 # 在封裝後積體電路（integrated circuits，即ic)的測 試過程中’在測試機（tester )或測試系統與受測元件之間 通常須有一介面（interface)。這一介面一般包含電接點 (electrical connection point)，該被測試元件的電接觸窗 (electrical contact)與介面一侧的電接點連接，而測試機 的電接觸窗則與介面另一側電性連接。 由於被測試的積體電路種類繁多，因而每一積體電路 均須有與之相適應的介面裝置（interface device)。例如， 積體電路尺寸各異，因而需要各種介面來適應不同尺寸的 胃積體電路。 通常如果使用者想要測試一新的或不同的積體電路， 就須獲得適合該積體電路的介面。在封裝測試中’大多數 此類介面通常爲模製塑膠（molded plastic)如射出成型 (injection molded)，且壓製成適合於待測積體電路的特定尺 寸和結構；但令人困擾的是設計與製造此類介面耗費時 6 1364,845 17408pif.doc 間尤其對於高速運轉的半導體産業。另外，每測試一不 同的積體電路即需要一介面，這也會增加使用者的成本。 1X1 » | ^ 一 ---- 有必要提出一互連裝置來彌補上述先前介面裝 置的不足。 【發明内容】 一本發明—較佳實施例提出一互連裝置，用於在一被測 ^測4機之間提供電性互連。該互連裝置包括一基 ΐ筮二具有—第一側面和一第二側面。該基座定義多個貫 H 2面和第二側面的通孔。該基座第一侧面用於收納 互連裝置還包括多個對準機構，其與基座的 用“節U準機構中的每—機構均包括—調整機構， 側面由多個對準機構所定義的區域。 測試機的載入板之間，配置-用於互連=:“:牛二一 側面上的L電繼座第- 基座的第一侧面可拆却式_。該j二=有： -組定位面制定錄縣 科祕所具有的 元件。該多侧準機構的各 2以支雜體電路 限定區域的尺寸。 疋1曲了移動，從而改變其所 【貫施方式】 本發明揭示了一種封步德井 了裒後積體電路(即1C)測試裝置 ^04845 17408Pif.dc (即互連裝置），玎適用於各種幾何圖形和結構之積體電 路的測試平臺。根據本發明一較佳實施例，該裝置由一組 '、、且式拼裝零件構成。這些零件可由不銹鋼、聚越越酮 (PEEK)或聚酰胺酰亞胺（Torlon)等材料製成。這此零 件具有在手動或自動測試設備（ATE)環境上測試封^後 積體電路所需的固定、對準和電性接觸等各種功能。 本發明提出一測試方案，適用於各種積體電路結構。 此外，其選用的材料可以相對低的成本實現高精度製造， 且其零件在適當存儲條件（如真空包裝）下可永久^存。 利用本發明實施一根據封裝幾何圖形所確定的測試方 f蜜其接觸窗設計不再依賴於3〜4個定制加工零件:根據 本f利’由拼裝零件所猶的接設計，可與印刷電路 = printed circuit board)共同形成一接觸窗測試方 茱，其尺寸和幾何形狀可任意調整。 方⑽目_，本發明崎降低了設計和 ^的别置時間〇ead time)和_成本 較少的配置零件(例如5個)測試全 口球格職）、晶片⑽）和針型柵格陣列（PGA) 同化本發明推動了測試板（test board)的普及應用。 内置之封裝積體電路測試裝置（互連裂置）^用一 t ^機構可測試多種在測元件⑽T，device under 二大:^'/該測試裝置可重新配置以適應在測元件 .笔米的圖形，而無需從載入板或測試機上卸 下。此外，該測試裝置適用於各種採用模組技術（m〇duiar 8 1364845 17408pif.doc technology)的載入板。 本發明可提供適於晶片組系列（Chip_set famiiy ) 一面 積可調整的測試方案。本發明亦縮短了測試機調試時間。 而且，本發明通過減少測試所需裝置顯著降低了晶月組系 列的總成本。 根據本發明一較佳實施例，該測試裝置使最終用戶可 利用一面積可調節插槽測試全系列晶片組。通常這一測試 需要多種插槽設計。利用一專用工具如自鎖凸輪可調節沿 對角線配置的角定位塊(如角凸輪擋塊）。該模組設計理念 使知/、需簡單地更換一探針卡盒（pin cartridge)(即基座） 即可重新配置該測試裝置以適應更大或更小的晶片组 列。 ，’、 根據本發明一較佳實施例，該互連裝置圍繞一組5〜 10個台肩式彈簧探針（“sh〇ulder，，type spring pin)，適用 2格陣列（BGA)、平坦格狀陣列（LGA)和無引線四 扁平無接腳（QFN)或四方扁平（QFP)封裝元件。該 ，連裝置可精確調節面積以應用於絕大多數晶片組^ 見的封裝尺寸增量，而無需從載入板卸下。 根據^發明一較佳實施例，該互連裝置在常用英制單 卜還挺供公制單位以擴展在歐洲和亞洲的應用。 圖1A所示之互連裝置1〇〇，其提供一在測元; 裝後積濟雷攸a #、< , , . T k女口封 償體電路兀件）和一測試機之間的互連作用 置在一印刷電路板(如載入:） 互連。在測元件則可配置與本發明所描述的 9 1364845 17408pif.doc 互連裝置100接觸。之後對在測元件施力（如由測試機施 力）以實現在測元件的電接觸窗與互連裝置100之間，以 及互連裝置100與測試機各電接觸窗之間的電性連接。 圖1B繪示爲互連裝置1〇〇的分解圖。互連裝置1〇〇 包括基座（base)102(即探針卡盒102)，角凸輪擋塊1〇4a 和104b，調整機構l〇6a和106b(如凸輪1〇63和106b)， 配件108a〜108d ’緊固件ii〇a〜u〇h，以及螺帽U2a和 U2b。通常’角凸輪擋塊i〇4a和i〇4b與基座1〇2可拆卸 鲁 式搞接，從而限定基座102上一區域（即限定區域)， 以供在測元件嵌入其中測試。繼而利用緊固件11〇a〜u〇h (如固定螺釘）將配件l〇8a〜108d與基座1〇2可拆卸式耦 接，並將基座102固定到測試機上（如穿過一印製電路板 -_ _ _或類似元件）。 調整機構106a和l〇6b分別與配件i〇8d和螺帽112b 以及配件l〇8b和螺帽112a耦合。在操作時，旋轉螺帽112a 和/或112b以分別調節調整機構i〇6a和i〇6b，從而改變 ^ 限定區域105的尺寸。 圖2Α繪示爲互連裝置1〇〇的俯視圖’圖2Β繪示爲互 連裝置100的侧視圖。 圖3Α繪示爲互連裝置1〇〇之基座1〇2的示意圖。圖 綠示爲基座102的分解圖。基座1〇2包括上部件i〇2a 和下部件102b，其例如可由聚合材料（如模製塑膠）製成。 在每一上部件l〇2a和下部件102b之各自的區域l〇5a和 105b配置若干通孔。一在測元件（置於基座102 —側）的 17408pif.doc J接觸窗與-測試機（置於基座1〇2的另一側）的 固通過這些通孔實現電性互連。若干探 ^ 僅描述了-隻探針。如圖3B所示，上f =見’^ _通過綱m和探針㈣合上^職和下部件 在測試操作中’當對在測元件（已置於基座上）施力 時’部分個力傳遞給基座，從錢在測元 ί測試機的電接觸窗（即探針間經過基座中通fL= 連接。 圖4A繪示爲基座102的俯視圖，而圖4b繪示爲其側 H ^部t lG2a和下部件1G2b例如可由輯_同 (EEK)或抗靜電聚醚醚酮（pEEKESD)製成。 姑圖5緣示爲基座102之下部件娜的立體圖，其更清 疋地描述了位於區域職内之通孔的情況。此外，圖5 遇描述了若伐位鎖122。定位銷122穿過上部件10 下部件腿中對應的預置孔，使二者定位固定，亦可/過 配件108a〜108d與上部件102a中對應的預置孔 定位。 可 圖6A繪示爲基座102之下部件腿的俯視圖，而圖 6B繪示爲其側視圖。 一圖7繪示爲本發明一較佳實施例之對準機構12〇的分 解不意圖。該對準機構120起連接作用。對準機構12〇由 圖1B中的部分零件，包括角凸輪擔塊1〇4a、配件腦、 螺帽112b和調整機構106a組成。當然，只要有利於調節 1364845 17408pif.doc 收納在測半導體元件之區域的形狀，亦可替換其他對準機 構。 如圖7所示，角凸輪擋塊l〇4a包括與在測元件接觸的 彈性表面107。由於表面1〇7具有彈性，因而其可與不同 尺寸的若干元件接觸（並使之定位固定）。進而，如上所 述，通過旋轉螺帽112b (以及調整機構l〇6a)，彈性表面 107可向内或向外移動，改變基座102上收納在測元件之 限定區域105的大小，從而適應元件尺寸較大範圍的變 • 化。根據本發明一較佳實施例，調節一對調整機構（如圖 1B中所示的調整機構i〇6a和i〇6b)可改變區域105以適 應元件尺寸在2毫米間的變動（如尺寸在18〜2〇毫米的元 件）。 例如，角凸輪擋塊104a與104b (包括彈性表面1〇7) 可以是聚醚醚酮元件，調整機構l〇6a和i〇6b可以是具有 預定行程（如0.053〃/180。）的自鎖凸輪致動機構。 圖8A繪示爲對準機構120的俯視圖，圖8B纟會示爲對 φ 準機構12〇的前視圖，圖8C繪示爲對準機構120的側視 圖。 在實際應用中，本發明提出的互連裝置克服了先前技 術的諸多缺陷。例如，可使用多個不同尺寸的基座1〇2與 互連裝置100的其他零件（即角凸輪擋塊1 〇4a和1 〇4b、 調整機構106a和106b、配件l〇8a〜l〇8d，緊固件ll〇a 〜110h、以及螺帽112a和112b)連接。例如，基座1〇2 主要由兩部分模製塑膠（即上部件102&和下部件1〇2b) 12 1364845 ί 740δρ/£ ci〇c 構成。可壓制多個不同基座（如具有不同尺寸，不同通孔 和幾何形狀的基座），每一基座均可與互連裝置1〇〇其餘 相同零件（即角凸輪擋塊104a和104b，調整機構106a和 106b ’配件l〇8a〜108d ’緊固件110a〜11 Oh，以及螺帽 112a和112b)配合使用。 此外，互連裝置100其餘零件中的某些零件（如角凸 輪擔塊l(Ma和ICHb ’以及配件l〇8a〜l〇8d)可由金屬繁 成。與塑膠相比，金屬的強度大、剛性好，因而這些零^ 可做得相對較小，而這在半導體産業中至關重要。一々 —與本發明的互連裝置不同，某些先前系統採用具有固 定凹槽（pocket)的壓制塑谬介面使在測元件固 此時由凹槽來限制在測元件的旋轉或其’ 的模製塑膠介面相對鼓，而且對於每 需要-不嶋面。本發明彌補了上述缺陷，=二 連裝置’ Θ互連裝置包含可與多種 ？，、 用的標準零件。此外，如 及封裝兀件配合使 元件（如由於元件或塊件‘寸或元件或封裝 用不同基座與其餘零件配合。由於匹配），可使 用’不同的基座零件（適用於' 夕數零件已備齊待 生的應力分佈。這匈荷通機械载荷而產 人工作業）過 1364845 17408pif.doc 私·中由手動女裝插槽蓋（hand socket lid )而産生’其會導 致插槽周邊産生過量變形（接觸電阻與陣列周邊尺寸相 關）、硬體配置失敗（負荷傳遞不足）、以及插腳/插槽介 面（latch/socket interface)的機械故障。 本發明的另一優點在於降低和大量消除了因彈簧探針 預載（pre-load)而產生的高（機械）應力。該應力常會造 成基板材料的較大撓曲（deflecti〇n)以及在陣列周邊産生 無法承受的應力疲勞程度。本發明致力於通過⑴最佳化 ^盒基板厚度（基座厚度）、⑵大量減少和消除鑽柱坑 ’（3)大量減少和消除應力料點（ 二==，以及(4)採用較低預載值的彈 水蒸汽_ (潮濕 替換材料基本解決了這一問題。 袭置採用 如上所述，本發明允許較寬範圍的 於晶片組系列的設計。通常須有數 ^並有盈 :=題而本發_每，機 ==1=裝_變化。 整機構、緊固件和螺帽等） 2輪擋塊、配件、調 基座含有互連介質時）一同/、·疋的基座或卡盒（當 ““或可單獨銷售）。這樣， 1364845 i 7408pif.doc 相同一套通用零件可與不同的基座單元配合使用，從而降 低了成本，提高了設備可維護性，縮短了零件前置時間並 帶來其他相關利益。</ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; For reference. TECHNICAL FIELD OF THE INVENTION The present invention relates to semiconductor component testing, and more particularly to test environments for manual and/or automated packaging in the semiconductor industry. [Prior Art] # During the testing of integrated circuits (ie, ic), there is usually an interface between the tester or the test system and the device under test. This interface generally includes an electrical connection point, the electrical contact of the device under test is connected to the electrical contact on one side of the interface, and the electrical contact window of the tester is electrically connected to the other side of the interface. Sexual connection. Due to the wide variety of integrated circuits being tested, each integrated circuit must have an interface device suitable for it. For example, integrated circuits vary in size and require various interfaces to accommodate different sizes of gastric integrated circuits. Usually if the user wants to test a new or different integrated circuit, it is necessary to obtain an interface suitable for the integrated circuit. In packaging testing, most of these interfaces are typically molded plastics such as injection molded and are pressed into a specific size and structure suitable for the integrated circuit to be tested; but the design is disturbing It is costly to manufacture such interfaces between 6 1364, 845 17408 pif.doc, especially for the high-speed semiconductor industry. In addition, an interface is required for each different integrated circuit test, which also increases the cost of the user. 1X1 » | ^ one ---- It is necessary to propose an interconnection device to make up for the shortcomings of the previous interface device. SUMMARY OF THE INVENTION A preferred embodiment of the invention provides an interconnect device for providing electrical interconnection between a test machine. The interconnecting device includes a base having a first side and a second side. The pedestal defines a plurality of through holes extending through the H 2 face and the second side. The first side of the base for accommodating the interconnecting device further comprises a plurality of aligning mechanisms, and the pedestal uses a "adjustment mechanism for each of the mechanisms", and the side is composed of a plurality of aligning mechanisms Defined area. Between the load boards of the test machine, configured - for interconnection =: ": L electric seat on the side of the cow two - the first side of the base is detachable _. The j== there are: - The group positioning surface is developed to have the components of the county secret department. Each of the multi-sided alignment mechanisms is sized to define a region of the hybrid circuit.疋 曲 曲 曲 曲 曲 曲 曲 曲 曲 曲 曲 曲 曲 曲 曲 曲 曲 曲 曲 曲 曲 曲 曲 德 】 】 】 】 】 】 】 】 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ A test platform for integrated circuits of various geometries and structures. According to a preferred embodiment of the invention, the device is constructed from a set of ', and assembled parts. These parts can be made of materials such as stainless steel, polyacetone (PEEK) or polyamideimide (Torlon). These components have the ability to test the fixed, aligned, and electrical contacts required for the integrated circuit in a manual or automated test equipment (ATE) environment. The invention proposes a test scheme suitable for various integrated circuit structures. In addition, the materials selected can be manufactured with high precision at relatively low cost, and their parts can be permanently stored under appropriate storage conditions such as vacuum packaging. With the implementation of the present invention, the test window is determined according to the package geometry. The contact window design is no longer dependent on 3 to 4 custom-machined parts: according to the design of the assembly, it can be combined with the printed circuit. = printed circuit board) together form a contact window test box, the size and geometry of which can be arbitrarily adjusted. Fang (10) _, the invention reduces the design and time of the 〇ead time) and _ less costly configuration parts (such as 5 test full-mouth job), wafer (10)) and needle grid Array (PGA) Assimilation The present invention facilitates the popularization of test boards. Built-in package integrated circuit test device (interconnect split) ^ can test a variety of components under test with a t ^ mechanism (10) T, device under two: ^ ' / the test device can be reconfigured to fit the component under test. Graphics without having to remove them from the load board or test machine. In addition, the test set is suitable for a variety of load boards using modular technology (m〇duiar 8 1364845 17408pif.doc technology). The present invention provides a test solution that is adaptable to the chipset series (Chip_set famiiy). The invention also shortens the test machine debugging time. Moreover, the present invention significantly reduces the overall cost of the Jingyue Group by reducing the equipment required for testing. In accordance with a preferred embodiment of the present invention, the test apparatus allows an end user to test a full range of chipsets using an area adjustable slot. Usually this test requires multiple slot designs. An angular positioning block (such as an angular cam stop) configured along the diagonal can be adjusted using a special tool such as a self-locking cam. The modular design concept allows the test device to be reconfigured to accommodate larger or smaller wafer sets by simply replacing a pin cartridge (ie, the pedestal). According to a preferred embodiment of the present invention, the interconnection device surrounds a set of 5 to 10 shoulder spring probes ("sh〇ulder", type spring pin), which is suitable for a 2 grid array (BGA), flat Lattice Array (LGA) and leadless quad flat no-pin (QFN) or quad flat (QFP) package components. This device allows for precise area adjustment for the package size increments seen in most wafer packages. There is no need to remove from the loading plate. According to a preferred embodiment of the invention, the interconnection device is also available in metric units for use in metric units to expand applications in Europe and Asia. 〇〇, it provides a test element; after the installation of Jiji Thunder a #, <, , . T k female mouth compensation body circuit element) and a test machine between the interconnection function placed in a printed circuit The board (eg, load:) is interconnected. The component under test is configurable to contact the 9 1364845 17408 pif.doc interconnect device 100 described herein. The force applied to the device under test (eg, applied by the tester) is implemented. Between the electrical contact window of the component under test and the interconnect device 100, and the interconnect device 100 and the tester Electrical connection between the contact windows. Figure 1B is an exploded view of the interconnection device 1A. The interconnection device 1A includes a base 102 (i.e., a probe cartridge 102), an angular cam stop 1〇4a and 104b, adjustment mechanisms l6a and 106b (such as cams 1〇63 and 106b), fittings 108a to 108d' fasteners ii〇a~u〇h, and nuts U2a and U2b. Usually 'angular cams The blocks i〇4a and i〇4b are detachably connected to the base 1〇2 to define an area (ie, a defined area) on the base 102 for testing in which the component under test is embedded. a~u〇h (such as a fixing screw) detachably couples the accessories l〇8a~108d with the base 1〇2 and fixes the base 102 to the test machine (eg, through a printed circuit board -_ _ _ or similar elements. The adjustment mechanisms 106a and 106b are coupled to the fitting i 8d and the nut 112b and the fitting 10b and the nut 112a, respectively. In operation, the rotating nut 112a and / or 112b are separately adjusted The mechanisms i 〇 6a and i 〇 6b are adjusted to change the size of the finite area 105. FIG. 2A is a top view of the interconnection device 1 ' FIG. Figure 3A is a schematic view of the pedestal 1 〇 2 of the interconnecting device 1 . Green is shown as an exploded view of the susceptor 102. The pedestal 1 〇 2 includes an upper part i 〇 2a and a lower part 102 b, It may be made, for example, of a polymeric material such as a molded plastic. A plurality of through holes are provided in respective regions l〇5a and 105b of each of the upper part 102a and the lower part 102b. The side of the 17408pif.doc J contact window and the tester (on the other side of the pedestal 1 〇 2) are electrically connected through these through holes. Several probes have only described - probes only. As shown in Fig. 3B, the upper f = see '^ _ through the m and the probe (four) close the ^ and the lower part in the test operation 'when applying the force on the measuring element (already placed on the base)' part The force is transmitted to the pedestal, and the electrical contact window of the tester is tested (ie, the probe is connected through the pedestal through the pedestal.) Figure 4A is a top view of the susceptor 102, and Figure 4b is shown as The side H ^ portion t lG2a and the lower member 1G2b can be made, for example, by the same type (EEK) or antistatic polyetheretherketone (pEEKESD). The edge of the figure 5 is shown as a perspective view of the part below the base 102, which is more The situation of the through holes in the area is described in a clear manner. In addition, Figure 5 depicts the falcon position lock 122. The locating pin 122 passes through the corresponding pre-positioning hole in the lower part leg of the upper part 10 to position the two The fixing can also be used to position the corresponding preset holes in the upper part 102a. Figure 6A shows a top view of the component legs below the base 102, and Figure 6B shows a side view thereof. 7 is a schematic exploded view of the alignment mechanism 12A according to a preferred embodiment of the present invention. The alignment mechanism 120 functions as a connection. The alignment mechanism 12 is illustrated by FIG. 1B. Some parts, including the corner cam block 1〇4a, the fitting brain, the nut 112b, and the adjusting mechanism 106a. Of course, as long as it is advantageous to adjust the shape of the 1364845 17408pif.doc stored in the area of the semiconductor component, other pairs may be replaced. As shown in Fig. 7, the angular cam stop 104a includes a resilient surface 107 in contact with the component under test. Since the surface 1〇7 is elastic, it can be in contact with (and position) several components of different sizes. Further, as described above, by rotating the nut 112b (and the adjustment mechanism 106a), the elastic surface 107 can move inward or outward, changing the size of the defined area 105 of the base on the base 102. Thereby adapting to a wide range of component sizes. According to a preferred embodiment of the invention, adjusting a pair of adjustment mechanisms (such as adjustment mechanisms i〇6a and i〇6b as shown in Fig. 1B) can change region 105 to accommodate The component size varies between 2 mm (eg, an element having a size of 18 to 2 mm). For example, the angular cam stops 104a and 104b (including the elastic surface 1〇7) may be a polyetheretherketone component, an adjustment mechanism 6a and i〇6b may be self-locking cam actuating mechanisms having a predetermined stroke (e.g., 0.053 〃/180.) Figure 8A is a plan view of the alignment mechanism 120, and Figure 8B is shown as a φ-alignment mechanism 12〇 The front view, Figure 8C, is a side view of the alignment mechanism 120. In practical applications, the interconnect device proposed by the present invention overcomes many of the deficiencies of the prior art. For example, multiple different sized bases can be used. 2 and other parts of the interconnection device 100 (i.e., the angular cam stops 1 〇 4a and 1 〇 4b, the adjustment mechanisms 106a and 106b, the fittings 8a 8a to 8d, the fasteners 11a to 110h, and the nut 112a) Connected to 112b). For example, the base 1〇2 is mainly composed of two parts of molded plastic (ie, upper part 102& and lower part 1〇2b) 12 1364845 ί 740δρ/£ ci〇c. A plurality of different pedestals (e.g., pedestals having different sizes, different through holes and geometries) may be pressed, each pedestal being the same as the interconnecting device 1 (i.e., angular cam stops 104a and 104b, The adjustment mechanisms 106a and 106b's fittings 8a to 108d' fasteners 110a to 11 Oh, and the nuts 112a and 112b are used in combination. In addition, some of the remaining parts of the interconnect device 100 (such as the angular cam block l (Ma and ICHb ' and the accessories l 8a ~ l 8d) can be made of metal. Compared with plastic, the strength of the metal is large, Rigidity is good, so these zeros can be made relatively small, which is of paramount importance in the semiconductor industry. Aside from the interconnection device of the present invention, some prior systems employ a compression molding with a fixed pocket. The 谬 interface allows the component under test to be fixed by the recess to limit the rotation of the component under test or its molded plastic interface to the drum, and for each need - no face. The present invention compensates for the above drawbacks, = two-connected device ' Θ Interconnect devices contain a wide range of standard parts that can be used with a variety of components. In addition, components such as packaged components or components (such as components or blocks or components or packages with different pedestals with the rest of the components) Match), you can use 'different pedestal parts (applicable to 'the number of parts has been prepared for the stress distribution. This Hungarian mechanical load produced by manual work) over 1364845 17408pif.doc private · by manual women's insert groove (hand socket lid) produces 'which causes excessive deformation around the slot (contact resistance is related to the size of the array perimeter), hardware configuration failure (underload transfer), and pin/socket interface (latch/socket interface) Mechanical failure. Another advantage of the present invention is that it reduces and largely eliminates the high (mechanical) stresses caused by the spring probe pre-load. This stress often causes greater deflection of the substrate material (deflecti〇n And the degree of stress fatigue that can not be tolerated at the periphery of the array. The present invention is directed to (1) optimizing the thickness of the substrate (base thickness), (2) substantially reducing and eliminating the drill string pit (3) mass reduction and stress relief Points (two ==, and (4) using a lower preload value of the water vapor _ (wet replacement material basically solves this problem. The attack uses the above as described above, the invention allows for a wider range of chipset series The design usually requires a number of ^ and has a profit: = and the hair _ each, machine = = 1 = _ change. The whole mechanism, fasteners and nuts, etc.) 2 wheel stop, accessories, adjustment base contains each other Lian Jie At the same time, the base of the /, 疋 or the cassette (when "" or can be sold separately). Thus, 1364845 i 7408pif.doc The same set of common parts can be used with different base units, thus reducing costs, Increased equipment maintainability, reduced part lead time and other related benefits.
儘官本發明主要描述了手動/機械式調整機構（如凸 輪機構），但並不局限於此。例如，該凸輪機構可被自動 控制亦可替換爲壓力致動器(piezo actuator)[諸如壓電致 動器（piezoelectric actuator )]的自控裝置以移動一對準機 構的定位面，進而改變收納積體電路元件的區域。例如， y編制軟體，根據待測元件的識別特徵（如零件號、尺寸 等）對壓電傳動機構施加指令信號使之將—對準機構的定 位面移動到適合待測積體電路元件的位置。 限定=發揭露如上’然其並非用以 个^ #㈣自此技藝者’在不脫離本發明之 %圍内’當可作些許之更動與潤飾，因此本 ^ ^當錢社巾請專魏_界定者絲。J之保遴 【圖式簡單說明】The present invention mainly describes a manual/mechanical adjustment mechanism (e.g., a cam mechanism), but is not limited thereto. For example, the cam mechanism can be automatically controlled or replaced with a self-control device of a piezo actuator (such as a piezoelectric actuator) to move the positioning surface of an alignment mechanism, thereby changing the storage product. The area of the body circuit component. For example, y compiles a software, and applies a command signal to the piezoelectric actuator according to the identification characteristics of the component to be tested (such as part number, size, etc.) to move the positioning surface of the alignment mechanism to a position suitable for the integrated circuit component to be tested. .限================================================================================================================ _Defining the silk. J's guarantee [Simplified illustration]
圖1A繪示爲本發明一較佳實 一 體示意圖。 請錢裝置的立 圖1B績示爲圖1A所示互輕置的分解圖。 圖从繪示爲圖1A所示互連裝置的俯視圖。 圖2B繪不爲圖1A所示互連裝置的側視圖。 圖3A㈣爲圖1A所示互連裝置之基座的立體示意 圖3B繪示爲圖3A所示基座的分解圖 1364845 17408pif.doc 圖4A繪示爲圖3A所示基座的俯視圖。 圖4B繪示爲圖3A所示基座的側視圖。 圖5繪示爲圖3A所示基座之一部分的立體示意圖。 圖6A繪示爲圖5所示之基座一部分的俯視圖。 圖6B繪示爲圖5所示之基座一部分的側視圖。 圖7繪示爲圖1A所示之互連裝置一部分的分解圖。 圖8A繪示爲圖7所示之互連裝置一部分的俯視圖。 圖8B繪示爲圖7所示之互連裝置一部分的前視圖。 圖8C繪示爲圖7所示之互連裝置一部分的側視圖。 【主要元件符號說明】 100 :互連裝置 102 :基座 102a :基座上部件 102b :基座下部件 104a :角凸輪擋塊 104b :角凸輪擋塊 105 :限定區域 105a :基座上部件之區域 105b :基座下部件之區域 106a :調整機構 106b :調整機構 107 :角凸輪擋塊之彈性表面 108a〜108d :配件 110a〜110h : 16 1364845 17408pif.doc 112a :緊固件 112b :螺帽 116 :緊固件 118 :探針 120 :對準機構 122 :定位鎖1A is a schematic view of a preferred embodiment of the present invention. The figure 1B of the money device is shown as an exploded view of the mutual light shown in Fig. 1A. The figure is depicted as a top view of the interconnect device of Figure 1A. Figure 2B depicts a side view of the interconnect device of Figure 1A. 3A(4) is a perspective view of the base of the interconnection device shown in FIG. 1A. FIG. 3B is an exploded view of the base shown in FIG. 3A. 1364845 17408pif.doc FIG. 4A is a top view of the base shown in FIG. 3A. 4B is a side view of the susceptor shown in FIG. 3A. FIG. 5 is a perspective view showing a portion of the base shown in FIG. 3A. 6A is a top plan view of a portion of the base shown in FIG. 5. Figure 6B is a side elevational view of a portion of the base shown in Figure 5. Figure 7 is an exploded view of a portion of the interconnect device of Figure 1A. Figure 8A is a top plan view of a portion of the interconnect device of Figure 7. Figure 8B is a front elevational view of a portion of the interconnect device of Figure 7. Figure 8C is a side elevational view of a portion of the interconnect device of Figure 7. [Main component symbol description] 100: interconnection device 102: base 102a: base upper member 102b: base lower member 104a: angular cam stop 104b: angular cam stop 105: defined area 105a: upper base member Region 105b: region 106a of lower base member: adjustment mechanism 106b: adjustment mechanism 107: elastic surfaces 108a to 108d of angular cam stop: fittings 110a to 110h: 16 1364845 17408pif.doc 112a: fastener 112b: nut 116: Fastener 118: Probe 120: Alignment mechanism 122: Positioning lock