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TWD223990S - Front opening wafer carrier - Google Patents

Front opening wafer carrier Download PDF

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Publication number
TWD223990S
TWD223990S TW111301059F TW111301059F TWD223990S TW D223990 S TWD223990 S TW D223990S TW 111301059 F TW111301059 F TW 111301059F TW 111301059 F TW111301059 F TW 111301059F TW D223990 S TWD223990 S TW D223990S
Authority
TW
Taiwan
Prior art keywords
wafer carrier
design
open
front opening
opening wafer
Prior art date
Application number
TW111301059F
Other languages
Chinese (zh)
Inventor
邱銘乾
莊家和
李國華
林書弘
Original Assignee
家登精密工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 家登精密工業股份有限公司 filed Critical 家登精密工業股份有限公司
Priority to TW111301059F priority Critical patent/TWD223990S/en
Priority to JP2022017431F priority patent/JP1734009S/en
Priority to US29/850,241 priority patent/USD1069741S1/en
Publication of TWD223990S publication Critical patent/TWD223990S/en

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Abstract

【物品用途】;本設計之前開式晶圓載具係用於在半導體製程中保護、運送並儲存晶圓的容器。;【設計說明】;本案創作之前開式晶圓載具係為一新穎獨特之設計,藉由獨特地設計的前開式晶圓載具,可顯現出先前技藝未曾有過的視覺效果。;使用狀態參考圖係顯示本設計之前開式晶圓載具插入有擴散管及其支撐件的形態。[Item Usage]; The open wafer carrier before this design is a container used to protect, transport and store wafers during the semiconductor manufacturing process. ;[Design Description];Before the creation of this project, the open-type wafer carrier was a novel and unique design. Through the uniquely designed front-opening wafer carrier, it can show visual effects that have never been seen in previous technologies. ;The reference picture of the use state shows the form of the open wafer carrier with the diffusion tube and its support inserted before this design.

Description

前開式晶圓載具Front opening wafer carrier

本設計之前開式晶圓載具係用於在半導體製程中保護、運送並儲存晶圓的容器。The open wafer carrier before this design is a container used to protect, transport and store wafers in semiconductor manufacturing process.

本案創作之前開式晶圓載具係為一新穎獨特之設計,藉由獨特地設計的前開式晶圓載具,可顯現出先前技藝未曾有過的視覺效果。The front-opening wafer carrier created in this case is a novel and unique design. With the uniquely designed front-opening wafer carrier, it can show visual effects that have never been seen before.

使用狀態參考圖係顯示本設計之前開式晶圓載具插入有擴散管及其支撐件的形態。The use state reference diagram shows the form of the open wafer carrier inserted with the diffusion tube and its support before this design.

TW111301059F 2022-03-03 2022-03-03 Front opening wafer carrier TWD223990S (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW111301059F TWD223990S (en) 2022-03-03 2022-03-03 Front opening wafer carrier
JP2022017431F JP1734009S (en) 2022-03-03 2022-08-16 Front-opening wafer carrier
US29/850,241 USD1069741S1 (en) 2022-03-03 2022-08-18 Front opening unified pod

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111301059F TWD223990S (en) 2022-03-03 2022-03-03 Front opening wafer carrier

Publications (1)

Publication Number Publication Date
TWD223990S true TWD223990S (en) 2023-03-01

Family

ID=84797035

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111301059F TWD223990S (en) 2022-03-03 2022-03-03 Front opening wafer carrier

Country Status (3)

Country Link
US (1) USD1069741S1 (en)
JP (1) JP1734009S (en)
TW (1) TWD223990S (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD223988S (en) * 2022-03-03 2023-03-01 家登精密工業股份有限公司 air box

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD214942S (en) 2021-05-14 2021-10-21 日商日立全球先端科技股份有限公司 Semiconductor substrate conveying device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110005967A1 (en) * 2008-01-13 2011-01-13 Entegris, Inc. Methods and apparatuses for large diameter wafer handling
JP6231012B2 (en) * 2012-11-28 2017-11-15 信越ポリマー株式会社 Substrate storage container
KR102219534B1 (en) * 2013-04-26 2021-02-24 엔테그리스, 아이엔씨. Wafer container with latching mechanism for large diameter wafers
KR101986924B1 (en) * 2014-12-18 2019-06-07 엔테그리스, 아이엔씨. Wafer container with shock condition protection
TWI579215B (en) * 2016-10-07 2017-04-21 家登精密工業股份有限公司 Vertical Fixing Transmission Box and Transmission Method Using the Same
JP6992240B2 (en) * 2017-11-16 2022-01-13 信越ポリマー株式会社 Board storage container
JP7313975B2 (en) * 2019-08-27 2023-07-25 信越ポリマー株式会社 Substrate storage container
WO2021234809A1 (en) * 2020-05-19 2021-11-25 ミライアル株式会社 Substrate storage container
TWI817828B (en) * 2022-08-11 2023-10-01 家登精密工業股份有限公司 Substrate container with built-in negative pressure cavity
TW202421288A (en) * 2022-09-19 2024-06-01 美商恩特葛瑞斯股份有限公司 Substrate container systems and methods of purging a substrate container
TW202439510A (en) * 2023-03-23 2024-10-01 家登精密工業股份有限公司 Valve cover and substrate container using the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD214942S (en) 2021-05-14 2021-10-21 日商日立全球先端科技股份有限公司 Semiconductor substrate conveying device

Also Published As

Publication number Publication date
JP1734009S (en) 2023-01-10
USD1069741S1 (en) 2025-04-08

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