TWD202065S - Ssd storage device - Google Patents
Ssd storage device Download PDFInfo
- Publication number
- TWD202065S TWD202065S TW108303325F TW108303325F TWD202065S TW D202065 S TWD202065 S TW D202065S TW 108303325 F TW108303325 F TW 108303325F TW 108303325 F TW108303325 F TW 108303325F TW D202065 S TWD202065 S TW D202065S
- Authority
- TW
- Taiwan
- Prior art keywords
- storage device
- design
- ssd storage
- item
- ssd
- Prior art date
Links
- 239000007787 solid Substances 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 1
Images
Abstract
【物品用途】;本設計物品是一種固態硬碟(Solid State Drive,簡稱SSD)儲存裝置,其經由使用半導體來儲存資料於其內。;【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分。[Use of item]; This design item is a solid state drive (SSD) storage device that uses semiconductors to store data in it. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design.
Description
本設計物品是一種固態硬碟(Solid State Drive,簡稱SSD)儲存裝置,其經由使用半導體來儲存資料於其內。This design item is a solid state drive (Solid State Drive, SSD for short) storage device, which uses semiconductors to store data in it.
圖式所揭露之虛線部分,為本案不主張設計之部分。The dotted line exposed in the diagram is the part that does not advocate design in this case.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR30-2018-0057455 | 2018-12-06 | ||
| KR20180057455 | 2018-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD202065S true TWD202065S (en) | 2020-01-11 |
Family
ID=81535867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108303325F TWD202065S (en) | 2018-12-06 | 2019-06-05 | Ssd storage device |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD951937S1 (en) |
| TW (1) | TWD202065S (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA210644S (en) * | 2021-08-25 | 2023-08-17 | Redarc Tech Pty Ltd | Assembled electronics housing |
| CA210646S (en) * | 2021-08-25 | 2023-08-17 | Redarc Tech Pty Ltd | Assembled electronics housing |
| USD1077800S1 (en) * | 2022-02-25 | 2025-06-03 | Redarc Technologies Pty Ltd. | Assembled electronics housing |
| TWD231132S (en) * | 2023-09-11 | 2024-05-01 | 四零四科技股份有限公司 新北市新莊區新北大道四段三號十三樓 (中華民國) | Portion of connecting device |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW495101U (en) * | 2001-08-06 | 2002-07-11 | Wen-Chen Wei | Heat dissipating apparatus of memory |
| US7221569B2 (en) * | 2004-09-15 | 2007-05-22 | Comptake Technology Co., Ltd. | Memory heat-dissipating device |
| US7609523B1 (en) * | 2004-09-29 | 2009-10-27 | Super Talent Electronics, Inc. | Memory module assembly including heat sink attached to integrated circuits by adhesive and clips |
| US7215551B2 (en) * | 2004-09-29 | 2007-05-08 | Super Talent Electronics, Inc. | Memory module assembly including heat sink attached to integrated circuits by adhesive |
| US7312996B2 (en) * | 2005-03-14 | 2007-12-25 | Wan Chien Chang | Heat sink for memory strips |
| TWM279165U (en) * | 2005-05-31 | 2005-10-21 | Akust Technology Co Ltd | Improved cooling fins for memory |
| US7738252B2 (en) * | 2006-01-09 | 2010-06-15 | Ocz Technology, Group, Inc. | Method and apparatus for thermal management of computer memory modules |
| CN100482060C (en) * | 2006-02-22 | 2009-04-22 | 富准精密工业(深圳)有限公司 | Heat radiator |
| CN101043789B (en) * | 2006-03-25 | 2010-05-12 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| US7391613B2 (en) * | 2006-05-12 | 2008-06-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Memory module assembly including a clamp for mounting heat sinks thereon |
| US7349220B2 (en) * | 2006-05-15 | 2008-03-25 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Memory module assembly |
| US7532477B2 (en) * | 2007-01-22 | 2009-05-12 | June-On Co., Ltd. | Memory module and heat sink arrangement |
| TWD133725S1 (en) | 2009-05-25 | 2010-03-11 | 廣穎電通股份有限公司 | USB flash drive with two-way sliding connector |
| US9245820B2 (en) * | 2010-03-08 | 2016-01-26 | International Business Machines Corporation | Liquid DIMM cooling device |
| US8411443B2 (en) * | 2011-01-21 | 2013-04-02 | Comptake Technology Inc. | Slidingly-engaged heat-dissipating assembly for memory and memory device having the same |
| CN102956251A (en) * | 2011-08-25 | 2013-03-06 | 鸿富锦精密工业(深圳)有限公司 | Solid state disk assembly |
| USD660810S1 (en) * | 2011-10-17 | 2012-05-29 | Corsair Memory, Inc. | Heat spreader with fins for a computer memory module |
| USD689829S1 (en) * | 2013-01-02 | 2013-09-17 | Comptake Technology Inc. | Heat dissipating module of memory |
| USD717744S1 (en) * | 2013-08-30 | 2014-11-18 | Corsair Memory, Inc. | Heat spreader on a memory module |
| USD797662S1 (en) * | 2015-11-25 | 2017-09-19 | GreenPack GmbH | Rechargeable battery |
| USD793400S1 (en) * | 2016-05-09 | 2017-08-01 | Kingston Digital, Inc. | Heat sink for memory module |
| TWD189064S (en) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | Ssd storage device |
| TWD189066S (en) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | Ssd storage device |
| TWD190983S (en) * | 2017-02-17 | 2018-06-11 | 三星電子股份有限公司 | Ssd storage device |
| USD862402S1 (en) * | 2017-12-18 | 2019-10-08 | Kingston Digital, Inc. | Memory heat dissipation sink |
| USD896229S1 (en) * | 2018-11-30 | 2020-09-15 | Samsung Electronics Co., Ltd. | SSD storage device |
| USD896230S1 (en) * | 2018-11-30 | 2020-09-15 | Samsung Electronics Co., Ltd. | SSD storage device |
| USD896231S1 (en) * | 2018-11-30 | 2020-09-15 | Samsung Electronics Co., Ltd. | SSD storage device |
| USD937773S1 (en) * | 2020-06-03 | 2021-12-07 | Delta Electronics, Inc. | Power supply |
-
2019
- 2019-06-05 TW TW108303325F patent/TWD202065S/en unknown
- 2019-06-05 US US29/693,844 patent/USD951937S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD951937S1 (en) | 2022-05-17 |
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