201034092 六、發明說明： 【發明所屬之技術領域】 本發明係有關微小晶粒封裝之方法與結構，特別係將液態膠定位，進 而簡易元件定位且防止溢膠之技術。 【先前技術】 . 按’微小晶粒封裝係為各個領域之學問所集合出的技術，其涉及光電、 機電或生醫各方面’例如微小發光元件、微致動器或微感測器之製程皆屬 於微小晶粒封裝之技術範疇。而加上製程封裝走向高積集度趨勢，使得基 ® 板本身的承載量必須一再提升’因此’各界對微小晶粒封裝技術之要求曰 益提高。 . f知的晶粒封裝巾’普通會輯赫(Underfiu dispensing)步驟，以加強 鞏固微小70件料於基板’其侧肖—微麟轉至基板上， 液態膠之功用通常係將元件定位於基板上以及保護元件之用途。如中華民 國專利公告號1206804所揭示之-種發光二極體封裝結構1〇，如第t圖所 示’其技術特徵係為-基板11結構之表面具有容置槽12與二個溝槽141、 ® 142 ’容置槽12係裝置一發光二極體16 ’並有封裝膠體18覆蓋發光二極體 16 ’其中’藉由表面張力將封裝膠體18峡於兩端溝槽 141、142 之間， .目此發光二祕16可定錄―預定位置巾。_，前述專利健針對單一 區域做點勝動作’不能對大量元件以及液態膠定位。 此外，目前產業需求走向將多種不同元件封裝於同一基板以減小其 產如體積是元件本身尺寸介於微米與奈米等級時對於使用點勝機 械系統時’造成不少成本與時間耗費。而若沒有拿捏精確液態膠量，則產 201034092 生液態膝溢流，污染鄰近元件，而導致產品良率降低。第2圖係為上基板 如與肅42接合嶋簡獅，瓣的液態勝 44，容易巧染到鄰近元件46，如第3圖所示。 為了解決上述機械點膠的缺失，另有一種流體自組裝技術來製作微小 讀雜’獻基絲面敍錢何雜與親财__助，作為微小 、元件預定接合位置，將複數個微小元件與基板浸入液體中，由流體帶動使 微小讀流動至預定位置’但由於此種技術必須將基板整個浸入液體製作 ❹ 組裝’取出基板後’時常發生液體污染基板表面之情形，因此，亦非零缺 點之封裝技術。 有鐘於此，本發明提出一種定位定量黏著封裝方法和結構，以提供同 行技藝者選擇使用，以獅發生前述等問題。 【發明内容】 本發明之主要目的係提供—種定蚊量黏著封裝方法與結構將親疏 水性材料齡於第-基板上，賴_膠之預定位置，再_第二基板與 ❿第-基板__產生毛細現象，使賴騎動至預定位置，以簡便後段 元件定位。 ； 本發明之Ρ目I種定蚊量崎封裝綠與結構，係將第二基板 蝕刻微流道或置容孔，以作為黏著定位位置或可避免溢膠的情況產生。 為達到上述之目的，本發明揭示一種定位定量黏著封裝方法，係在第 —基板表面上水⑽瓶雜區域與疏水健域，以預定液 態膠分佈位置，接著形成—祕料第—基板表面，並_第二基板僅相 距第-基板表面-些微距離，且液態膠介於兩基板之間，因此液態勝可流 201034092 動分佈於第-基板表面之親水區域’最射移㈣二基板留下分佈於預 定位置之液或是將第二基板可直接與第，基板結合其中第二基板 包含賴流道或置容孔，使液_填人微流道或置容孔，以料義膠定 位設計或防止溢膠設計。 糾’本發明揭示—種定蚊量«峨輯，純含二基板，第一 基板上包含有親水傾域無水倾域4 第二基板係可包含至少-微流道或置容孔，以及一液態膠附著於二基板之 〇 fBl ’且係在第—基板之具有親水性區域表面。其中，第二基板係可與第- 基板分離，僅訂液祕於第-基板上表面之親水性_，或第二基板與 第4板結合’液祕進人該紐道或置容孔，_㈣敎位設計或防 止溢膠設計。 底下藉由具體實施例配合所附的圖式詳加說明，當更容易瞭解本發明 之目的、技術内容、特點及其所達成之功效。 【實施方式】 β 本發鴨提出_種定蚊魏著封裝方法餘構，叹蚊量液態膠 的措施，來簡便定位微小元件製程與預防溢流之用途。 ' 本發明係揭示一種定位定量黏著封裝方法，先提供第-基板，其表面 • 概積親水性㈣與疏水性機，並使第-基板表賴分為親水性區域與 疏水性區域，該親水性材料與該疏水性材料係為金屬或非金屬；再由一探 針將液態膠點在親水性區域上，並將第二基板於第—基板上方保留一空 隙’且液·轉介於二基板之間’使液轉附著於二基板騎著力大於液態 膝本身的内聚力，因此液態膠受到吸引，進而可流動分佈於第一基板表面 5 201034092 之親水性區域’最後再額第二基板或是二基板與第—基板結合1 下’將提供本發明之三種實施例並佐以圖式，加以詳細說明。 第-實施例之定位定量黏著封裝方法，如第4(A)圖至第4⑹圖所示。 第-步驟’提供至少-種金屬或非金屬材料所製之第一基板22，其表面有 沈積分佈雜乳切’如第5圖所示’其中㈣接觸角約為5G度，因此石夕 /7佈之區域可為疏水性區域32,喊化碎的接觸㈣為25度因此氧化妙 分佈之區域可魏雜區域3G H驟…探針％將_舰態膠％點 _ 在親水性區域上’該探針係為金屬或非金屬材料製成且液態膠係選自紫外 線硬化膠、黏膠或熱固化膠；第三步驟，提供至少—種金屬或非金屬材料 所製之第二基板28於第-基板22上方；第四步驟，將第二基板28向第一 基板22靠近’與第-基板22距離約7〇um，以保留一間隙，因而液態膠％ 在間隙_生毛細側’進而流動於第—基板22表面之親水性區域；第五 步驟’移開第二基板28，留下第一基板22與分佈於第一基板22親水性區 域之液態膠26» ® 藉由上述定蚊量黏著封裝方法’可製縣個第-實軸之結構， 請參見第6圖與第7圖。第—實施例係為至少—種金屬或非金屬材料所製 之第-基板22，其表面由氧化石夕與石夕劃分出親水性區域3〇與疏水性區域 32 ’並有一液態膠26分佈於第一基板二之親水性區域3〇，可做與其他元 件接合位置’另有-至少-種金屬或非金屬材料所製之第二基板(圖中未示） 位於第-基板上方22。其中第—基板與第二基板之材料係為至少_種金屬 或非金屬材料’雜獅為料線硬化n娜或熱固娜。由於第一基 板、第二基板、親疏水性區域以及液態膠皆為本發明之主要^^牛，因此以 6 201034092 下重複出現者將不贅述其材料性質。201034092 VI. Description of the Invention: [Technical Field] The present invention relates to a method and structure for micro-die packaging, and in particular to a technique for positioning a liquid glue, thereby locating a simple component and preventing overflow. [Prior Art] The technology that is based on the knowledge of various fields in the 'small-grain packaging system, which involves various processes such as photoelectric, electromechanical or biomedical aspects, such as micro-lighting elements, micro-actuators or micro-sensors. Both belong to the technical category of micro-die packaging. In addition, the process package has a tendency to accumulate a high degree of integration, so that the load of the base plate itself must be increased repeatedly. Therefore, the requirements for the micro die packaging technology are greatly improved. F know the die-packing towel 'Underfiu dispensing step' to strengthen and consolidate the tiny 70 pieces of material on the substrate's side-micro-transfer to the substrate, the function of the liquid glue usually locates the component The use on the substrate and the protective components. For example, the light-emitting diode package structure disclosed in the Chinese Patent Publication No. 1206804, as shown in FIG. 2, is characterized in that the surface of the substrate 11 has a receiving groove 12 and two grooves 141. , 142 ' 容 槽 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 , the second illuminating secret 16 can be recorded - the predetermined position towel. _, the aforementioned patents do a little bit of action for a single area' cannot locate a large number of components and liquid glue. In addition, the current industry demand is to pack a variety of different components on the same substrate to reduce its production. If the size of the component itself is between the micron and nanometer scales, it will cost a lot of time and time for the use of the point win mechanical system. If the precise amount of liquid glue is not taken, the 201034092 raw liquid knee overflows, polluting adjacent components, resulting in a decrease in product yield. Figure 2 is the upper substrate. If the lion is engaged with the squid 42, the liquid of the lobes is 44, which is easily dyed to the adjacent element 46, as shown in Fig. 3. In order to solve the above-mentioned lack of mechanical dispensing, another fluid self-assembly technique is used to make a micro-reading ' 献 丝 丝 叙 何 何 何 亲 亲 亲 亲 亲 亲 , , , , , , , , , , , , , , , , , , , 作为 作为The substrate is immersed in the liquid, and the fluid is driven to move the micro-read to a predetermined position. However, since the substrate must be immersed in the liquid as a whole, the substrate is assembled and 'after the substrate is taken out, the liquid often contaminates the surface of the substrate. Therefore, it is also non-zero. Disadvantages of packaging technology. In view of the above, the present invention proposes a positioning and quantitative adhesive encapsulation method and structure to provide a method for the skilled practitioner to select and use to cause the aforementioned problems with the lion. SUMMARY OF THE INVENTION The main object of the present invention is to provide a method and structure for fixing a certain amount of mosquitoes, and the structure of the hydrophilic and hydrophobic material is on the first substrate, the predetermined position of the substrate, and then the second substrate and the first substrate. _ Produces a capillary phenomenon that allows the ride to be moved to a predetermined position for easy positioning of the rear segment components. The object of the present invention is that the second substrate is etched into the micro flow channel or the accommodating hole to be used as an adhesive positioning position or to avoid overflow. In order to achieve the above object, the present invention discloses a positioning and quantitative adhesive packaging method, which is characterized in that a water (10) bottle region and a hydrophobic health region are arranged on a surface of a first substrate, a predetermined liquid glue distribution position is formed, and then a secret material first substrate surface is formed. And the second substrate is only a few distance away from the surface of the first substrate, and the liquid glue is between the two substrates, so the liquid wins the flow 201034092 and is distributed on the hydrophilic region of the surface of the first substrate. The most displaced (four) two substrates are left. The liquid distributed in the predetermined position or the second substrate can be directly combined with the first substrate, wherein the second substrate comprises a flow channel or a receiving hole, so that the liquid is filled into the micro flow channel or the filling hole to position the material. Design or prevent overfill design. The invention discloses a method for determining the amount of mosquitoes, which comprises two substrates, the first substrate comprising a hydrophilic tilting domain, and the second substrate system comprising at least a microchannel or a receiving hole, and a The liquid glue adheres to the 〇fB1′ of the two substrates and is on the surface of the first substrate having the hydrophilic region. Wherein, the second substrate is separable from the first substrate, and only the liquid is secreted by the hydrophilicity of the upper surface of the first substrate, or the second substrate is combined with the fourth plate to enter the channel or the filling hole. _ (four) 敎 design or prevent overflow design. The purpose, technical contents, features and effects achieved by the present invention will become more apparent from the detailed description of the embodiments and the accompanying drawings. [Embodiment] β The hair duck proposed the method of formulating the residual structure of the mosquito and the liquid glue of the mosquito, so as to conveniently locate the process of the micro component and prevent the overflow. The present invention discloses a method for positioning quantitative adhesive encapsulation, which first provides a first substrate, a surface thereof, a hydrophilic product (IV) and a hydrophobic machine, and the first substrate is divided into a hydrophilic region and a hydrophobic region, the hydrophilic The material and the hydrophobic material are metal or non-metal; the liquid glue is spotted on the hydrophilic region by a probe, and the second substrate retains a gap above the first substrate and the liquid is rotated between two The liquid-to-liquid adhesion of the substrate to the two substrates is greater than the cohesion of the liquid knee itself, so that the liquid glue is attracted, and then can be distributed on the first substrate surface 5 201034092 in the hydrophilic region 'final second substrate or The combination of the two substrates with the first substrate will provide three embodiments of the present invention and will be described in detail with reference to the drawings. The positioning quantitative adhesive encapsulation method of the first embodiment is as shown in Figs. 4(A) to 4(6). The first step 'provides a first substrate 22 made of at least one metal or non-metal material, the surface of which has a deposition distribution of the milk cuts as shown in Fig. 5, wherein (4) the contact angle is about 5 G degrees, so Shi Xi/ The area of the 7 cloth can be the hydrophobic area 32, the contact of the shattered (4) is 25 degrees, so the area of the oxidized distribution can be 3G H... The probe % will be the _ 'The probe is made of a metal or non-metal material and the liquid glue is selected from the group consisting of ultraviolet curing glue, adhesive or heat curing glue; and the third step is to provide at least a second substrate 28 made of metal or non-metal material. Above the first substrate 22; in the fourth step, the second substrate 28 is brought closer to the first substrate 22 by a distance of about 7 um from the first substrate 22 to retain a gap, so that the liquid glue % is on the gap _ raw capillary side Further flowing to the hydrophilic region on the surface of the first substrate 22; the fifth step 'moving away the second substrate 28, leaving the first substrate 22 and the liquid glue 26»® distributed in the hydrophilic region of the first substrate 22 by the above Mosquito adhesive packaging method can be used to build a county-real axis structure, see section 6 7 and FIG. The first embodiment is a first substrate 22 made of at least one kind of metal or non-metal material, the surface of which is divided into a hydrophilic region 3 〇 and a hydrophobic region 32 ′ by an oxidized stone and a stone eve, and has a liquid glue 26 distribution. In the hydrophilic region 3 of the first substrate 2, a second substrate (not shown) made of another metal element or a non-metal material may be disposed at the upper surface 22 of the substrate. The material of the first substrate and the second substrate is at least _ metal or non-metal material ‘the lion is the material line hardening nna or thermosetting. Since the first substrate, the second substrate, the hydrophilic and hydrophobic regions, and the liquid glue are all the main products of the present invention, the material properties will not be described repeatedly if they are repeated under 6 201034092.
❹ 第-實施例之定蚊量黏著封裝方法如第8(A)圖至第_圖所示。 第步驟’提供第-基板22，其表面沈積分佈石夕與氧化石夕，使第一基板η 表面劃分為親水性區域(圖中未示)與疏水性區域(圖中未示）；第二步驟，一 探針24將液態膠26點在親水性區域上；第三步驟，提供第二基板烈，兑 中第二基板28上可有複數個置容孔或至少一微流道，且置容孔或微流道係 為非等向性侧結構、等向性_結構或材料晶格方向之特定角度餘 刻結構在本實施例中’第二基板利用穿透第二基板之複數個置容孔^， 以供元件黏著定位所需；第四步驟，將第二基板π接近第—基板a，保持 約間距’使液態膠％流動分佈整個第一基板η之親水性區域，在毛 細現象流動的職會朗導二基板之置容孔％，進而鮮面延伸至垂直 °第步驟將第一基板Μ往第一基板Μ方向移動且接觸第一基板 22 ’因而第一基板28表面定點分佈有冒出置容孔％之液態勝％。 藉由上述之定位定量黏著封裝方法，以得本發明第二實施例之結構， 請參見第9圖與第1〇圓。第二實施例係為第一基板，其表面由氧化石夕與 石夕劃分錄水舰域與疏雜區域，並有―液娜％分佈魏水性區域， 以及第二基板28藉由液態膠26與第一基板22接合，其中第二基板28設 有複數個置谷孔34 ’且液態膠％穿透冒出該置容孔Μ，形成《立黏著 位置，以供其他元件封裝黏著使用。 第一實施例之疋位定量黏著封裝方法，以防止液態勝溢流，污染鄰近 的元件，其步称如第_圓至第_圖所示。第-步驟，提供第-基板 其上有其他元件36與接合工作區(圊中未示），在工作區上可分佈有親 7 201034092 水性區域與疏水性區域m形成—液轉26於工作區之親水性區 域；第三步驟’提供第二基板28 ’其中第二基板28上可有複數個置容孔或 至少-微流道，且置容孔或微流道係為非等向雜刻結構、等向性蚀刻結 構或利用材料晶格方向之特定角度_結構，而置容孔或微流道係可穿透 .或非穿透第二基板，在第三實施例中，第二基板上具複數個置容孔34，其 係稱做防溢膠之置容孔設計(Throgh smc〇n Via，TSV)，該置容孔％係穿透 第二基板；第四步驟使第二基板28接近第—基板22 ;第五步驟，使兩基板 ^ 22、28接合，在液態膠26流經置容孔34時，多餘液態膠26因毛細現象進 入置容孔34’多餘的液態膠量儲存於置容孔34,以避免溢出於兩基板22、 28接合工作區域。 藉由上述之定位定量黏著封裝方法，以得本發明第三實施例之結構， 叫參見第I2圖與第13圖。第三實施例之結構係為第一基板η，其上設有 接合工作區38與其他元件36,以及一液態膠26將第二基板28與第-基板 22接合，其中第二基板28設有複數個置容孔34，其係穿透第二基板， 懸 此種置容孔之料乃係驗大量驗祕酿至無元件，*污染其他元 件，其屬TSV防止溢膠之設計。 另外，再對第三實施例所提之TSV設計進一步詳細說明，第14圖係為 第二基板28仰視圖，中間部位為即將黏著於第一基板之接合工作區，在第 二基板周圍設上複數個防止溢膠之置容孔34，其可穿透或非穿透第二基 板°而在第二基板與第一基板接合時，液態膠受到擠壓開始向四周蔓延， 如果膠量不多，則無需用到TSV設計，則接合完成時，液態膠所在之區域 大約至最小液態膠覆蓋範圍50 ;若液態膠漫溢至TSV設計，會因毛細現象 201034092 被吸引至置容孔中，而液態膠所分佈範圍則為最大液態膠覆蓋範園52。因 此，將控制液態膠量於可容許範圍内’再配合本發明中Tsv設計，比起習 知技術，控制液態膠量有較大的彈性空間，且可預防溢膠的情況發生。 以上所述之實施麵係為說明本發明之技術思想及特點，其目的在使 熟習此項技藝之人士能夠瞭解本發明之内容並據以實施，當不能以之限定 本發明之專利範圍’即大凡依本發明所揭示之精神所作之均等變化或修 飾，仍應涵蓋在本發明之專利範圍内。 ^ 【圖式簡單說明】 第1圖為習知發光二極體封裝結構之剖視圖。 第2圖為習知使用液態膠上下基板連結示意圖。 第3圖為習知缺失液態膠溢流示意圖。 第4(A)圖至第4(E)圖為本發明第一實施例之方法流程圖。 第5圖為第一基板劃分為親水性區域與疏水性區域之示意圖。 第6圖為本發明第一實施例結構之立體圖。 _ 第7圖為本發明第一實施例結構之側視圖。 第8(A)圖至第8(E)圖為本發明第二實施例之方法流程圖。 第9圖為本發明第二實施例結構之立體圖。 第10圖為本發明第二實施例結構之側視圖。 第11(A)圖至第11⑹圖為第三實施例之方法流程圖。 第Π圖為本發明第三實施例結構之立體圖。 第13圖為本發明第三實施例結構之側視圖。 第14圖為本發明之具有置容孔設計的第二基板仰視圖。 9 201034092 【主要元件符號說明】 10 發光二極體封裝結構 11 基板 12 容置槽 141 、142溝槽 16 發光二極體 18 封裝膠體 22 第一基板 24 探針 26 液態膠 28 第二基板 30 親水性區域 32 疏水性區域 34 置容孔 36 其他元件 38 接合工作區 40 上基板 42 下基板 44 液態膠 46 鄰近元件 5Ό最小液態膠覆蓋範圍 52最大液態膠覆蓋範圍❹ The method of encapsulating the mosquito paste of the first embodiment is as shown in Fig. 8(A) to Fig. In the first step, a first substrate 22 is provided, and a surface of the first substrate η is divided into a hydrophilic region (not shown) and a hydrophobic region (not shown); Step, a probe 24 points the liquid glue 26 on the hydrophilic region; in the third step, the second substrate is provided, and the second substrate 28 can have a plurality of receiving holes or at least one micro flow channel, and The aperture or microchannel is an anisotropic side structure, an isotropic structure or a specific angular remnant structure of the material lattice direction. In this embodiment, the second substrate utilizes a plurality of locations penetrating the second substrate. The hole is required for the component to be positioned; in the fourth step, the second substrate π is close to the first substrate a, maintaining a pitch of 'the liquid glue % flow distributes the hydrophilic region of the first substrate η, in the capillary phenomenon The flow of the job guides the % of the mounting holes of the two substrates, and the fresh surface extends to the vertical direction. The first step moves the first substrate toward the first substrate and contacts the first substrate 22' so that the surface of the first substrate 28 is fixedly distributed. There is a liquid percentage of % of the volume of the hole. The structure of the second embodiment of the present invention is obtained by the above-described positioning quantitative adhesive encapsulation method, see Fig. 9 and the first circle. The second embodiment is a first substrate, the surface of which is divided into a water-filled ship domain and a sparse zone by the oxidized stone eve and the stone eve, and has a liquid-water distribution area, and the second substrate 28 is provided by a liquid glue 26 The first substrate 22 is joined to the first substrate 22, wherein the second substrate 28 is provided with a plurality of valley holes 34' and the liquid glue is penetrated to form the "hole" position to form a "adhesive position" for use in other component packages. The clamp quantification encapsulation method of the first embodiment prevents the liquid from overflowing and contaminating adjacent components, and the steps are as shown in the _th to the _th. The first step provides a first substrate with other components 36 and a bonding work area (not shown), and a pro- 7 may be distributed on the working area. 201034092 Aqueous region and hydrophobic region m form - liquid transfer 26 in the working area a hydrophilic region; a third step 'providing a second substrate 28' wherein the second substrate 28 may have a plurality of receiving holes or at least a micro flow channel, and the receiving holes or microchannels are non-isotropic The structure, the isotropic etch structure or the specific angle _ structure using the lattice direction of the material, and the accommodating hole or the micro flow channel can penetrate or not penetrate the second substrate. In the third embodiment, the second substrate The upper part has a plurality of receiving holes 34, which are referred to as a thirling hole design (Throgh smc〇n Via, TSV), the access hole % penetrates the second substrate; the fourth step makes the second substrate 28 is close to the first substrate 22; in the fifth step, the two substrates 22, 28 are joined, and when the liquid glue 26 flows through the receiving hole 34, the excess liquid glue 26 enters the receiving hole 34' due to capillary phenomenon. It is stored in the receiving hole 34 to avoid overflowing the two substrates 22, 28 to join the working area. The structure of the third embodiment of the present invention is obtained by the above-described positioning quantitative adhesive encapsulation method, which is referred to as Figures I2 and 13. The structure of the third embodiment is a first substrate η having a bonding working area 38 and other components 36 disposed thereon, and a liquid glue 26 bonding the second substrate 28 to the first substrate 22, wherein the second substrate 28 is provided A plurality of accommodating holes 34 are penetrated through the second substrate, and the materials of the venting holes are tested to a large number of samples to the absence of components, and * contaminate other components, which is a design of TSV to prevent overflow. In addition, the TSV design of the third embodiment is further described in detail. FIG. 14 is a bottom view of the second substrate 28, and the middle portion is a bonding working area to be adhered to the first substrate, and is disposed around the second substrate. a plurality of apertures 34 for preventing overflow, which can penetrate or not penetrate the second substrate. When the second substrate is bonded to the first substrate, the liquid glue is squeezed and spreads to the periphery, if the amount of glue is small , the TSV design is not needed, when the bonding is completed, the area where the liquid glue is located is about 50% of the minimum liquid glue coverage; if the liquid glue overflows to the TSV design, it will be attracted to the receiving hole due to the capillary phenomenon 201034092, and the liquid state The range of glue distribution is the maximum liquid glue covering Fanyuan 52. Therefore, the amount of liquid glue will be controlled within the allowable range. In combination with the Tsv design of the present invention, the amount of liquid glue is controlled to have a larger elastic space than the conventional technique, and the occurrence of overflow can be prevented. The above-mentioned embodiments are intended to be illustrative of the technical spirit and characteristics of the present invention, and are intended to enable those skilled in the art to understand the subject matter of the present invention and Equivalent changes or modifications made by the spirit of the present invention should still be included in the scope of the present invention. ^ [Simple Description of the Drawings] Fig. 1 is a cross-sectional view showing a conventional light emitting diode package structure. Fig. 2 is a schematic view showing the connection between the upper and lower substrates using liquid glue. Figure 3 is a schematic diagram of a conventional missing liquid gel overflow. 4(A) to 4(E) are flowcharts of the method of the first embodiment of the present invention. Fig. 5 is a schematic view showing the division of the first substrate into a hydrophilic region and a hydrophobic region. Figure 6 is a perspective view showing the structure of the first embodiment of the present invention. Figure 7 is a side view showing the structure of the first embodiment of the present invention. 8(A) to 8(E) are flowcharts of a method of the second embodiment of the present invention. Figure 9 is a perspective view showing the structure of a second embodiment of the present invention. Figure 10 is a side view showing the structure of a second embodiment of the present invention. 11(A) to 11(6) are flowcharts of the method of the third embodiment. The third drawing is a perspective view showing the structure of a third embodiment of the present invention. Figure 13 is a side view showing the structure of a third embodiment of the present invention. Figure 14 is a bottom plan view of a second substrate having a design of a receiving aperture of the present invention. 9 201034092 [Explanation of main component symbols] 10 LED package structure 11 Substrate 12 Sockets 141, 142 Trench 16 LEDs 18 Encapsulant 22 First substrate 24 Probe 26 Liquid glue 28 Second substrate 30 Hydrophilic Sexual area 32 hydrophobic area 34 accommodating hole 36 other elements 38 bonding work area 40 upper substrate 42 lower substrate 44 liquid glue 46 adjacent element 5 Ό minimum liquid glue coverage 52 maximum liquid glue coverage