200816907 九、發明說明： 【發明所屬之技術領域】 .本發明涉及—種散熱裝置，特別係指-種用以冷卻電 子元件之熱管散熱裝置。 【先前技術】 中央處理器等電子元件運行時產生大量熱量，而使其 本身及系統溫度升高，繼而導致其運行性能下降。為確保 電子元件能正常運行，通常在電子元件上安裝散熱裝置， 排出其所產生之大量熱量。 傳統散熱器-般包括與電子元件接觸之一底板及設於 底板上之複數散熱片。電子元件運行產生之熱量被底板吸 收後，再通過散熱片散失到周圍環境令以冷卻電子元件。 准通吊/、有底板之一部分，—般為底板之中心部分直接 與電子元件接觸並吸收熱量，使底板中心部分溫度過高， 而底板上之其他區域溫度相對較低。這導致遠離底板中心 區域之散熱片未能充分吸熱及散熱，對電子元件散熱仍不 夠充分。 【發明内容】 有蓉於此，有必要提供一種具有較佳散熱性能之散熱 裝置。 種散熱裝置，包括：-基座，包括—第—導熱板及 凸設於該第-導熱板之-側表面上之一第二導熱板，該第 200816907 二導熱板之寬度小於第一導熱板之寬度；複數散熱片，該 等複數散熱片設於第一導熱板之另一側表面；以及一熱 管：該熱管喪設於該第二導熱板底面並伸出於該第二導熱 板，向、並延伸至第一導熱板。 上述散熱裝置中將熱管嵌設於第二導熱板底面，既可 與電子元件直接接觸，又可將電子元件產生之熱量快速而 均勻地分佈到整個基座上，故本發明散熱裝置與傳統散熱 裝置相比，散熱性能有較大提昇。 下面參照附圖，結合具體實施例對本發明作進一步描 述。 【實施方式】 圖1至圖3所示為本發明散熱裝置之第一實施例。該散 熱裝置100包括一基座110、設於基座110上之複數散熱片 130及欣叹於基座1底部、呈s型之一熱管;[5〇。 基座110係由鋁、銅等導熱性能良好之材料製成。該基 座110包括兩部分，即一第一導熱板114和自該第一導熱板 114中部凸出而成之一第二導熱板112。其中，該第一導熱 板114與散熱片13〇連接，而第二導熱板112之底面通常與電 子元件如中央處理器（圖中未示）等接觸，以便吸收電子 元件所產生之熱量。 第 V熱板U4和第二導熱板112之外形輪廓都呈矩 形’且第一導熱板114之寬度要比第二導熱板112之寬度 大因而在該第二導熱板112之相對兩侧分別形成一台階部 7 200816907 (未標號）。這樣設置既可以減輕散熱裝置100之重量，又 可以節約材料，降低散熱裝置100之成本。 .在第二導熱板112之底部上設有沿第二導熱板112之寬 度方向延伸之三個直形溝槽1122，該等溝槽1122間隔地分 佈於第二導熱板112之底部，其中一溝槽1122位於第二導熱 板112之中部，而其他二溝槽1122分別靠近第二導熱板112 之兩端部。該等溝槽1122主要用於部分容納上述之S形熱管 150，以使熱管150可以直接與電子元件接觸。 / 該S形熱管150包括三個相互平行之第一傳熱段152和 將該等第一傳熱段152連接之二第二傳熱段154。該等第二 傳熱段154位於相鄰之兩個第一傳熱段152之間。 上述熱管150之第一傳熱段152分別嵌設於第二導熱板 112底部相應之溝槽1122内，並可通過鉚接、衝壓等技術令 熱管150之第一傳熱段152與第二導熱板112緊密結合並使 熱管150與第二導熱板112之底部齊平，而無需添加焊接劑 :等，以便降低熱管150與第二導熱板112之間之熱阻，並且 可以令熱管150與電子元件直接接觸。當然，根據實際需 求，也可以通過焊接等方式將熱管150固定在第二導熱板 112内。另外，由於第二導熱板112之寬度小於第一導熱板 114之寬度，降低了熱管150與第二導熱板112之間之結合面 積，有利於鉚接操作；當然，若熱管150與第二導熱板112 之間通過焊接結合時，也可以節省焊劑。 當將熱管150之第一傳熱段152組合於第二導熱板112 8 200816907 上之溝槽1122内之後，熱管150之第二傳熱段154分別位於 第二導熱板112外之兩側，並平行於第二導熱板112之側 壁？這樣，熱管150之第二傳熱段154位於由第一導熱板114 之四邊和第二導熱板112之四邊所限定之區域内；而整個熱 管150位於由第一導熱板114之四邊所限定之範圍内。此 外，在本實施例中，熱管150同時與第一導熱板n4和第二 導熱板112接觸’即：第一傳熱段152與第二導熱板112接 觸，第二傳熱段154與第一導熱板114接觸。 使用時，位於中間之第一傳熱段152作為熱管150之蒸 發段，主要用於吸收電子元件所產生之熱量；而其他二第 —傳熱段152作為熱管150之冷凝段。當散熱裝置100放置於 電子元件之上表面時，位於中間之第一傳熱段152與電子元 件接觸，並吸收電子元件所產生之熱量。熱管15〇所吸收之 熱量通過其第二傳熱段154傳遞給熱管150之其他二第一傳 段152和第一導熱板114。熱管150之其他二第一傳段152再 將熱量傳遞給與其接觸之第二導熱板112,從而使電子元件 所產生之熱量分佈到整個基座110。最後，基座11〇上之熱 量通過散熱片130散發到周圍環境中。 如上所述，熱管150之中間之第一傳熱段152可將電子 元件所產生之熱量迅速吸收，進而通過熱管15〇之其他二第 一傳熱段152將熱量快速而均勻地分佈到整個基座ι1〇上， 這有助於將熱量快速地由基座110傳遞給散熱片13〇，從而 提高散熱裝置100之散熱性能。 另外，該熱管150之每一第二傳熱段154之一側面貼附 200816907 於第二導熱板112之底面，而其他三個側面暴露於空氣中， 故，熱管150之第二傳熱段154可同時被第一導熱板114和空 氣直接冷卻。 _為便於將散熱裝置100裝設於電子元件上，可在散熱片 130中部設置一通道160，用以容納一扣具；這樣佈置，可 方便地將散熱裝置100安裝到電子元件上。 圖4所示為本發明散熱裝置另一實施例之底部朝上時 之立體圖。該散熱裝置100a與上述之散熱裝置100之結構相 似，兩者之間之主要不同之處在於熱管在第二導熱板上之 排布方式。該散熱裝置100a之第二導熱板112a上形成有四 個平行之直溝槽1122a，該等溝槽1122a沿第二導熱板112a 之寬度方向延伸，並且彼此按照預定之間隔設置用以容納 二U形熱管150a。每一熱管150a包括二相互平行之第一傳熱 段152a和將第一傳熱段152a連接之一第二傳熱段154a，其 中，熱管150a之第一傳熱段152a嵌設於第二導熱板112a上之 相應溝槽1122a内，而第二傳熱段154a位於第二導熱板112a 外之一側。 在本實施例中，該二熱管150a之第二傳熱段154a位於 第二導熱板112a外之相對兩側；當然也可通過調節熱管之 第一傳熱段之間之距離等方式，使二熱管之第二傳熱段位 於第二導熱板外之同側，不另作圖示。 當將熱管150a裝設於第二導熱板112a之後，兩熱管150a 並排設置並使其U型開口方向相反。每一熱管150a之一第一 200816907 傳熱段152a位於第二導熱板112a之中部，以便迅速吸收電 子元件所產生之熱量。每一熱管150a之位於第二導熱板 llga中部之第一傳熱段15 2a位於另一熱管150a之二第一傳 熱段152a之間。 綜上所述，本發明散熱裝置100、l〇〇a中將熱管150、 150a之第一傳熱段152、152a及第二傳熱段154、154a分佈於 基座110、110a上，可將電子元件產生之熱量快速而均勻地 分佈到整個基座110、110a上，故本明散熱裝置100、100a 與傳統散熱裝置相比，性能有較大提昇。此外，由於第二 導熱板112、112a之寬度小於第一導熱板114、114a之寬度， 故可以減輕散熱裝置1〇〇、l〇〇a整體之重量，同時可以節約 材料，降低成本。另外，熱管100、100a之第二傳熱段154、 154a位於第二導熱板112、112a之兩侧，使熱管100、100a 之第二傳熱段154、154a與空氣之間之接觸面積增大，故， 熱管150、150a之第二傳熱段154、154a可以將部分熱量散 發，以提昇散熱裝置100、100a之散熱性能。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上該者僅為本發明之較佳實施例，舉凡熟 悉本案技藝之人士，在妥依本發明精神所作之等效修飾或 變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置一實施例之立體圖。 圖2係圖1中散熱裝置之底部朝上時之立體圖。 圖3係圖2中散熱裝置之立體分解圖。 11 200816907 圖4係本發明散熱裝置另一實施例之底部朝上時之立體 圖。 【主要元件符號說明】 散.熱裝置 100 、 100a 基座 110 、 110a 第二導熱板 112 、 112a 第一導熱板 114 、 114a 散熱片 130 熱管 150 、 150a 第一傳熱段 152、152a 第二傳熱段 154 、 154a 通道 160 溝槽 1122 、 1122a 12200816907 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a heat dissipating device, and more particularly to a heat pipe heat dissipating device for cooling an electronic component. [Prior Art] Electronic components such as a central processing unit generate a large amount of heat during operation, and the temperature of the system itself and the system rises, which in turn causes the running performance to deteriorate. In order to ensure the normal operation of electronic components, a heat sink is usually installed on the electronic components to discharge a large amount of heat generated. Conventional heat sinks typically include a backplane in contact with the electronic components and a plurality of heat sinks disposed on the backplane. The heat generated by the operation of the electronic components is absorbed by the substrate, and then dissipated to the surrounding environment through the heat sink to cool the electronic components. The quasi-passing/with a part of the bottom plate, generally the central part of the bottom plate directly contacts the electronic component and absorbs heat, so that the temperature of the central part of the bottom plate is too high, and the temperature of other areas on the bottom plate is relatively low. This causes the heat sink away from the center area of the backplane to fail to sufficiently absorb heat and dissipate heat, and the heat dissipation of the electronic components is still insufficient. SUMMARY OF THE INVENTION It is necessary to provide a heat dissipating device having better heat dissipation performance. The heat dissipating device comprises: a base, comprising: a first heat conducting plate and a second heat conducting plate protruding from a side surface of the first heat conducting plate, wherein the width of the second heat conducting plate is smaller than the first heat conducting plate a plurality of heat sinks, the plurality of heat sinks are disposed on the other side surface of the first heat conducting plate; and a heat pipe: the heat pipe is disposed on the bottom surface of the second heat conducting plate and protrudes from the second heat conducting plate, And extending to the first heat conducting plate. In the above heat dissipating device, the heat pipe is embedded in the bottom surface of the second heat conducting plate, which can directly contact the electronic component, and can quickly and evenly distribute the heat generated by the electronic component to the entire base, so the heat sink of the present invention and the conventional heat sink Compared with the device, the heat dissipation performance is greatly improved. The invention will now be further described with reference to the specific embodiments with reference to the accompanying drawings. [Embodiment] Figs. 1 to 3 show a first embodiment of a heat sink according to the present invention. The heat dissipating device 100 includes a base 110, a plurality of fins 130 disposed on the base 110, and a heat pipe s-shaped at the bottom of the base 1; [5〇. The susceptor 110 is made of a material having good thermal conductivity such as aluminum or copper. The base 110 includes two portions, a first heat conducting plate 114 and a second heat conducting plate 112 protruding from a central portion of the first heat conducting plate 114. The first heat conducting plate 114 is connected to the heat sink 13B, and the bottom surface of the second heat conducting plate 112 is usually in contact with an electronic component such as a central processing unit (not shown) to absorb heat generated by the electronic component. The outer contours of the second hot plate U4 and the second heat conducting plate 112 are both rectangular and the width of the first heat conducting plate 114 is larger than the width of the second heat conducting plate 112 and thus formed on opposite sides of the second heat conducting plate 112. A step 7 200816907 (not numbered). This arrangement can reduce the weight of the heat sink 100, save material, and reduce the cost of the heat sink 100. On the bottom of the second heat conducting plate 112, three straight grooves 1122 extending along the width direction of the second heat conducting plate 112 are disposed, and the grooves 1122 are spacedly distributed at the bottom of the second heat conducting plate 112, one of which The trench 1122 is located in the middle of the second heat conducting plate 112, and the other two trenches 1122 are respectively adjacent to the two ends of the second heat conducting plate 112. The grooves 1122 are primarily used to partially accommodate the S-shaped heat pipe 150 described above such that the heat pipe 150 can be in direct contact with the electronic components. The S-shaped heat pipe 150 includes three first heat transfer sections 152 that are parallel to each other and two second heat transfer sections 154 that connect the first heat transfer sections 152. The second heat transfer segments 154 are located between the adjacent two first heat transfer segments 152. The first heat transfer section 152 of the heat pipe 150 is respectively embedded in the corresponding groove 1122 at the bottom of the second heat conducting plate 112, and the first heat transfer section 152 and the second heat conductive plate of the heat pipe 150 can be made by riveting, stamping or the like. The 112 is tightly bonded and the heat pipe 150 is flush with the bottom of the second heat conducting plate 112 without adding a solder: etc., in order to reduce the thermal resistance between the heat pipe 150 and the second heat conducting plate 112, and the heat pipe 150 and the electronic component can be made direct contact. Of course, the heat pipe 150 may be fixed in the second heat conducting plate 112 by welding or the like according to actual needs. In addition, since the width of the second heat conducting plate 112 is smaller than the width of the first heat conducting plate 114, the joint area between the heat pipe 150 and the second heat conducting plate 112 is reduced, which is advantageous for the riveting operation; of course, if the heat pipe 150 and the second heat conducting plate When soldering is combined between 112, solder can also be saved. After the first heat transfer section 152 of the heat pipe 150 is combined in the trench 1122 on the second heat conducting plate 112 8 200816907, the second heat transfer sections 154 of the heat pipe 150 are respectively located on both sides of the second heat conducting plate 112, and Parallel to the sidewall of the second heat conducting plate 112? Thus, the second heat transfer section 154 of the heat pipe 150 is located in a region defined by the four sides of the first heat conducting plate 114 and the four sides of the second heat conducting plate 112; and the entire heat pipe 150 is defined by the four sides of the first heat conducting plate 114. Within the scope. In addition, in the embodiment, the heat pipe 150 is in contact with the first heat conducting plate n4 and the second heat conducting plate 112 at the same time, that is, the first heat transfer section 152 is in contact with the second heat conducting plate 112, and the second heat transfer section 154 is first. The heat conducting plate 114 is in contact. In use, the first heat transfer section 152 in the middle serves as an evaporation section of the heat pipe 150 for absorbing the heat generated by the electronic components; and the other two heat transfer sections 152 serve as the condensation section of the heat pipe 150. When the heat sink 100 is placed on the upper surface of the electronic component, the first heat transfer section 152 in the middle contacts the electronic component and absorbs heat generated by the electronic component. The heat absorbed by the heat pipe 15 is transferred to the other two first sections 152 of the heat pipe 150 and the first heat conducting plate 114 through its second heat transfer section 154. The other two first sections 152 of the heat pipe 150 transfer heat to the second heat conducting plate 112 in contact therewith, thereby distributing the heat generated by the electronic components to the entire susceptor 110. Finally, the heat on the susceptor 11 is dissipated through the heat sink 130 into the surrounding environment. As described above, the first heat transfer section 152 in the middle of the heat pipe 150 can quickly absorb the heat generated by the electronic component, and then the heat is quickly and evenly distributed to the entire base through the other two first heat transfer sections 152 of the heat pipe 15 On the seat ι1, this helps to quickly transfer heat from the susceptor 110 to the heat sink 13 〇, thereby improving the heat dissipation performance of the heat sink 100. In addition, one side of each of the second heat transfer sections 154 of the heat pipe 150 is attached to the bottom surface of the second heat conducting plate 112 on the side, and the other three sides are exposed to the air. Therefore, the second heat transfer section 154 of the heat pipe 150 is attached. It can be directly cooled by the first heat conducting plate 114 and the air at the same time. In order to facilitate the mounting of the heat sink 100 on the electronic component, a channel 160 may be provided in the middle of the heat sink 130 for accommodating a fastener; thus, the heat sink 100 can be conveniently mounted to the electronic component. Fig. 4 is a perspective view showing the other embodiment of the heat sink of the present invention with the bottom facing upward. The heat dissipating device 100a is similar in structure to the heat dissipating device 100 described above, and the main difference between the two is the arrangement of the heat pipes on the second heat conducting plate. The second heat conducting plate 112a of the heat dissipating device 100a is formed with four parallel straight grooves 1122a extending along the width direction of the second heat conducting plate 112a, and arranged at predetermined intervals to accommodate two Us. Heat pipe 150a. Each heat pipe 150a includes two first heat transfer sections 152a parallel to each other and a second heat transfer section 154a connecting the first heat transfer section 152a, wherein the first heat transfer section 152a of the heat pipe 150a is embedded in the second heat transfer. The corresponding heat transfer section 154a is located on one side of the second heat conducting plate 112a. In this embodiment, the second heat transfer section 154a of the two heat pipes 150a is located on opposite sides of the second heat conducting plate 112a; of course, by adjusting the distance between the first heat transfer sections of the heat pipe, etc. The second heat transfer section of the heat pipe is located on the same side as the second heat conducting plate, and is not illustrated. After the heat pipe 150a is mounted on the second heat conducting plate 112a, the two heat pipes 150a are arranged side by side with their U-shaped openings facing in opposite directions. One of the first heat pipe segments 152a of each of the heat pipes 150a is located in the middle of the second heat conducting plate 112a to quickly absorb the heat generated by the electronic components. The first heat transfer section 15 2a of each heat pipe 150a located in the middle of the second heat transfer plate 11ga is located between the first heat transfer sections 152a of the other heat pipe 150a. In summary, in the heat dissipating device 100, 10a of the present invention, the first heat transfer sections 152, 152a and the second heat transfer sections 154, 154a of the heat pipes 150, 150a are distributed on the pedestals 110, 110a, and The heat generated by the electronic components is quickly and evenly distributed to the entire base 110, 110a, so that the heat sink 100, 100a has a greater performance than the conventional heat sink. In addition, since the width of the second heat conducting plates 112, 112a is smaller than the width of the first heat conducting plates 114, 114a, the weight of the heat dissipating device 1 〇〇, l 〇〇 a can be reduced, and materials can be saved and the cost can be reduced. In addition, the second heat transfer sections 154, 154a of the heat pipes 100, 100a are located on both sides of the second heat conducting plates 112, 112a, so that the contact area between the second heat transfer sections 154, 154a of the heat pipes 100, 100a and the air is increased. Therefore, the second heat transfer sections 154, 154a of the heat pipes 150, 150a can dissipate part of the heat to improve the heat dissipation performance of the heat sinks 100, 100a. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above is only a preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be covered by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an embodiment of a heat sink according to the present invention. 2 is a perspective view of the heat sink of FIG. 1 with the bottom facing upward. 3 is an exploded perspective view of the heat sink of FIG. 2. 11 200816907 Figure 4 is a perspective view of another embodiment of the heat sink of the present invention with the bottom facing upward. [Main component symbol description] Heat dissipation device 100, 100a Base 110, 110a Second heat conduction plate 112, 112a First heat conduction plate 114, 114a Heat sink 130 Heat pipe 150, 150a First heat transfer section 152, 152a Second pass Hot section 154, 154a channel 160 trench 1122, 1122a 12