KR102720537B1 - Display panel - Google Patents

Abstract

A display panel is provided. The display panel includes a printed circuit board on one side. The printed circuit board has a pattern portion including a first driving electrode and a first sensing electrode arranged on a first surface, and a cover portion including a first pressure sensing layer facing the pattern portion and overlapping the first driving electrode and the first sensing electrode.

Description

DISPLAY PANEL

The present invention relates to a display panel.

The importance of display devices is increasing with the development of multimedia. In response, various types of display devices such as liquid crystal displays (LCDs) and organic light emitting displays (OLEDs) are being used. Among them, organic light emitting displays are attracting attention as next-generation display devices because they are self-luminous elements with excellent viewing angles.

Recently, touch panels that recognize touch inputs are being widely applied to display devices, especially smartphones and tablet PCs. The convenience of the touch method is replacing existing physical input devices such as keypads. Research is being conducted to go beyond touch panels and install pressure sensors on display devices to implement various inputs.

The pressure sensor has a structure in which a substrate including a driving electrode, a sensing electrode, etc., and a substrate including a pressure sensing layer are spaced apart from each other and face each other, and can be driven through an electrical connection with a control circuit board. Accordingly, the control circuit board may include a connector terminal connected to a connection portion of the pressure sensor. As display devices become slimmer, it may be difficult to secure a space for mounting the connector terminal in the control circuit board, and therefore research on integration of the pressure sensor and the control circuit board is required.

The problem that the present invention seeks to solve is to integrate a pressure sensor and a control circuit board.

The tasks of the present invention are not limited to the tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those skilled in the art from the description below.

According to one embodiment of the present invention for solving the above problem, a display panel includes a printed circuit board on one side. The printed circuit board has a pattern portion including a first driving electrode and a first sensing electrode arranged on a first surface, and a cover portion including a first pressure sensing layer facing the pattern portion and overlapping the first driving electrode and the first sensing electrode.

An insulating layer is disposed on the first surface, and the insulating layer can expose the first driving electrode and the first sensing electrode.

The above pattern portion may include a second driving electrode and a second sensing electrode.

The above pattern portion may include a second pressure sensing layer in contact with the second driving electrode and the second sensing electrode.

The second pressure sensing layer can be disposed on at least one side of the second driving electrode and at least one side of the second sensing electrode.

A gap may exist between the first pressure sensing layer, the first driving electrode, and the first sensing electrode.

The above cover portion may include a spacer that maintains the gap.

The above cover part may further include an adhesive material on one surface.

The above printed circuit board can be bent and joined to one side of the display panel by the adhesive member.

A lower panel member may further be included between one side of the display panel and the printed circuit board.

A plurality of first driving electrodes and first sensing electrodes are arranged on the first surface of the pattern portion, and the first driving electrodes and the first sensing electrodes are formed to be long in a first direction, and the first driving electrodes and the first sensing electrodes can be arranged alternately in a second direction intersecting the first direction.

The device may further include a driving connection electrode to which the first driving electrodes and the second driving electrodes are connected; and a sensing connection electrode to which the first sensing electrodes and the second sensing electrodes are connected.

The device may further include a driving line connected to the driving connection electrode and to which a driving voltage is applied; and a sensing line connected to the sensing connection electrode.

The above printed circuit board includes a pressure-sensitive driving unit on a second surface opposite to the first surface, wherein the pressure-sensitive driving unit can be electrically connected to the driving line and the sensing line through a contact hole.

According to another embodiment for solving the above problem, a display panel includes a printed circuit board on one side. The printed circuit board has a pattern portion including a first driving electrode, a first sensing electrode, a second driving electrode, and a second sensing electrode arranged on a first surface, and a cover portion including a first pressure-sensing layer facing the pattern portion and overlapping the first driving electrode and the first sensing electrode, and a second pressure-sensing layer overlapping the second driving electrode and the second sensing electrode.

An insulating layer is disposed on the first surface, and the insulating layer can expose the first driving electrode, the first sensing electrode, the second driving electrode, and the second sensing electrode.

A gap may exist between the first pressure sensing layer, the first driving electrode, and the first sensing electrode.

The above cover portion may include a spacer that maintains the gap.

The second pressure sensing layer can be in contact with the second driving electrode and the second sensing electrode.

An adhesive material may further be included on one surface of the above cover portion.

According to a display device according to one embodiment of the present invention, a pressure sensor and a control circuit board can be integrated.

The effects according to the present invention are not limited to those exemplified above, and further diverse effects are included in the present specification.

Figure 1 is a perspective view showing a display device according to one embodiment.
Figure 2 is an exploded perspective view of the display device of Figure 1.
FIG. 3 is a cross-sectional view showing in detail a display area of a display panel according to one embodiment.
FIG. 4 is a bottom view showing a configuration in which a display circuit board according to one embodiment is bent and placed on a lower member of a panel.
Figure 5 is a cross-sectional view showing a section taken along line I-I' of Figure 4.
FIG. 6 is a plan view showing a pressure sensor integrated into a display circuit board according to one embodiment.
FIG. 7 is a plan view showing area A of FIG. 6 according to one embodiment.
FIG. 8 is a cross-sectional view illustrating a section taken along line II-II' of FIG. 7 according to one embodiment.
FIG. 9 is a cross-sectional view showing a pattern portion of FIG. 8 according to one embodiment.
FIG. 10 is a cross-sectional view showing the cover portion of FIG. 8 according to one embodiment.
Fig. 11 is an equivalent circuit diagram of the pressure sensor of Fig. 7.
FIG. 12 is a schematic cross-sectional view of a display circuit board according to one embodiment.
FIG. 13 is a cross-sectional view illustrating a section taken along line II-II' of FIG. 7 according to another embodiment.
Fig. 14 is a cross-sectional view showing a pattern portion of Fig. 13 according to another embodiment.
Fig. 15 is a cross-sectional view showing the cover part of Fig. 13 according to another embodiment.
FIG. 16 is a schematic cross-sectional view of a display circuit board according to another embodiment.

The advantages and features of the present invention, and the method for achieving them, will become clear with reference to the embodiments described in detail below together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and these embodiments are provided only to make the disclosure of the present invention complete and to fully inform a person having ordinary skill in the art to which the present invention belongs of the scope of the invention, and the present invention is defined only by the scope of the claims.

When elements or layers are referred to as being "on" or "on" another element or layer, this includes not only directly on the other element or layer, but also cases where there are other layers or elements intervening. In contrast, when an element is referred to as being "directly on" or "directly above" it indicates that there are no other intervening elements or layers.

The spatially relative terms "below," "beneath," "lower," "above," "on," "on," "upper," and the like can be used to easily describe the relationship of one element or component to another element or component, as illustrated in the drawings. The spatially relative terms should be understood to include different orientations of the elements during use or operation in addition to the orientations depicted in the drawings. For example, if an element illustrated in the drawings is flipped, an element described as being "below" another element may end up being placed "above" the other element. Thus, the exemplary term "below" can include both the above and below directions. The elements may also be oriented in other directions, in which case the spatially relative terms can be interpreted according to the orientation.

The same drawing reference numerals are used throughout the specification for identical or similar parts.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Fig. 1 is a perspective view showing a display device according to one embodiment. Fig. 2 is an exploded perspective view of the display device of Fig. 1.

Referring to FIGS. 1 and 2, a display device (1) according to one embodiment includes a cover window (100), a touch sensing device (200), a touch circuit board (210), a display panel (300), a display circuit board (310), a panel lower member (400), a pressure sensor (500), a lower bracket (600), a main circuit board (710), and a lower cover (800).

In this specification, “upper”, “top”, and “upper surface” refer to the direction in which the window (100) is arranged based on the display panel (300), i.e., the Z-axis direction, and “lower”, “bottom”, and “lower surface” refer to the direction in which the lower panel member (400) is arranged based on the display panel (300), i.e., the opposite direction of the Z-axis direction.

The display device (1) may be formed in a rectangular shape on a plane. For example, the display device (1) may have a rectangular shape on a plane having a short side in a first direction (X-axis direction) and a long side in a second direction (Z-axis direction). An edge where the short side in the first direction (X-axis direction) and the long side in the second direction (Z-axis direction) meet may be formed rounded to have a predetermined curvature or formed at a right angle, as shown in Fig. 1. The plane shape of the display device (1) is not limited to a rectangle, and may be formed in another polygonal, circular, or oval shape.

The cover window (100) may be placed on the upper part of the display panel (300) to cover the upper surface of the display panel (300). Accordingly, the cover window (100) may function to protect the upper surface of the display panel (300). The cover window (100) may be attached to the touch sensing device (200) via an adhesive layer. The adhesive layer may be an optically cleared adhesive film (OCA) or an optically cleared resin (OCR).

The cover window (100) may include a transparent portion (DA100) corresponding to the display area (DA) of the display panel (300) and a light-shielding portion (NDA100) corresponding to the non-display area (NDA) of the display panel (300). The light-shielding portion (NDA100) of the cover window (100) may be formed opaquely. Alternatively, the light-shielding portion (NDA100) of the cover window (100) may be formed as a decorative layer having a pattern formed thereon that can be shown to the user when an image is not displayed. For example, a company logo or various characters, such as “SAMSUNG,” may be patterned on the light-shielding portion (NDA100) of the cover window (100).

The cover window (100) may be made of glass, sapphire, and/or plastic. The cover window (100) may be formed to be rigid or flexible.

A touch detection device (200) including touch sensors for detecting a user's touch may be placed between the cover window (100) and the display panel (300). The touch detection device (200) is a device for detecting a user's touch position, and may be implemented in an electrostatic capacitance manner, such as a self-capacitance manner or a mutual capacitance manner, or in an infrared manner.

The touch sensing device (200) may be formed in a panel form or a film form. Alternatively, the touch sensing device (200) may be formed integrally with the display panel (300). For example, when the touch sensing device (200) is formed in a film form, it may be formed integrally with a barrier film for encapsulating the display panel (300).

A touch circuit board (210) may be attached to one side of the touch sensing device (200). Specifically, the touch circuit board (210) may be attached to pads provided on one side of the touch sensing device (200) using an anisotropic conductive film. In addition, a touch connection portion may be provided on the touch circuit board (210), and the touch connection portion may be connected to a connector of the display circuit board (310). The touch circuit board may be a flexible printed circuit board or a chip on film.

The touch driver (220) can apply touch driving signals to the touch sensing device (200), detect detection signals from the touch sensing device (200), and analyze the detection signals to calculate the user's touch position. The touch driver (220) can be formed as an integrated circuit and mounted on a touch circuit board (210).

The display panel (300) may include a display area (DA) and a non-display area (NDA). The display area (DA) is an area where an image is displayed, and the non-display area (NDA) is an area where an image is not displayed, and may be a surrounding area of the display area (NDA). The non-display area (NDA) may be arranged to surround the display area (DA) as shown in FIG. 2, but is not limited thereto. The display area (DA) may be arranged to overlap the transparent portion (100DA) of the cover window (100), and the non-display area (NDA) may be arranged to overlap the light-shielding portion (100NDA) of the cover window (100).

The display panel (300) may be a light-emitting display panel including a light emitting element. For example, the display panel (300) may be an organic light-emitting display panel using an organic light emitting diode, an ultra-small light emitting diode display panel using an ultra-small light emitting diode (micro LED), and a quantum dot light emitting display panel including a quantum dot light emitting diode. Hereinafter, the display panel (300) will be described mainly as an organic light emitting display panel as shown in FIG. 3.

The display area (DA) of the display panel (300) refers to the area where the light-emitting element layer (304) is formed to display an image, and the non-display area (NDA) refers to the area surrounding the display area (DA).

Figure 3 is a cross-sectional view showing the display area of the display panel in detail.

Referring to FIG. 3, the display panel (300) may include a support substrate (301), a flexible substrate (302), a thin film transistor layer (303), a light emitting element layer (304), an encapsulation layer (305), and a barrier film (306).

A flexible substrate (302) is placed on a support substrate (301). Each of the support substrate (301) and the flexible substrate (302) may include a polymer material having flexibility. For example, each of the support substrate (301) and the flexible substrate (302) may be polyethersulphone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylenenapthalate (PEN), polyethylene terephthalate (PET), polyphenylenesulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), cellulosetriacetate (CAT), cellulose acetate propionate (CAP), or a combination thereof.

A thin film transistor layer (303) is formed on a flexible substrate (302). The thin film transistor layer (303) includes thin film transistors (335), a gate insulating film (336), an interlayer insulating film (337), a protective film (338), and a planarizing film (339).

A buffer film may be formed on the flexible substrate (302). The buffer film may be formed on the flexible substrate (302) to protect the thin film transistors (335) and light-emitting elements from moisture penetrating through the support substrate (301) and the flexible substrate (302) that are vulnerable to moisture permeation. The buffer film may be formed of a plurality of inorganic films that are alternately laminated. For example, the buffer film may be formed as a multi-film in which one or more inorganic films of a silicon oxide film (SiOx), a silicon nitride film (SiNx), and SiON are alternately laminated. The buffer film may be omitted.

A thin film transistor (335) is formed on the buffer film. The thin film transistor (335) includes an active layer (331), a gate electrode (332), a source electrode (333), and a drain electrode (334). In FIG. 8, the thin film transistor (335) is exemplified as being formed in a top gate manner in which the gate electrode (332) is positioned above the active layer (331), but it should be noted that the present invention is not limited thereto. That is, the thin film transistors (335) may be formed in a bottom gate manner in which the gate electrode (332) is positioned below the active layer (331), or in a double gate manner in which the gate electrode (332) is positioned both above and below the active layer (331).

An active layer (331) is formed on the buffer film. The active layer (331) may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. A light-blocking layer may be formed between the buffer film and the active layer (331) to block external light incident on the active layer (331).

A gate insulating film (336) may be formed on the active layer (331). The gate insulating film (316) may be formed of an inorganic film, for example, a silicon oxide film (SiOx), a silicon nitride film (SiNx), or a multi-film thereof.

A gate electrode (332) and a gate line may be formed on the gate insulating film (316). The gate electrode (332) and the gate line may be formed as a single layer or multiple layers made of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

An interlayer insulating film (337) may be formed on the gate electrode (332) and the gate line. The interlayer insulating film (337) may be formed of an inorganic film, for example, a silicon oxide film (SiOx), a silicon nitride film (SiNx), or a multi-film thereof.

A source electrode (333), a drain electrode (334), and a data line may be formed on the interlayer insulating film (337). Each of the source electrode (333) and the drain electrode (334) may be connected to the active layer (331) through a contact hole penetrating the gate insulating film (336) and the interlayer insulating film (337). The source electrode (333), the drain electrode (334), and the data line may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

A protective film (338) for insulating a thin film transistor (335) may be formed on the source electrode (333), the drain electrode (334), and the data line. The protective film (338) may be formed of an inorganic film, for example, a silicon oxide film (SiOx), a silicon nitride film (SiNx), or a multi-film thereof.

A planarization film (339) may be formed on the protective film (338) to level the step caused by the thin film transistor (335). The planarization film (339) may be formed of an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

A light-emitting element layer (304) is formed on the thin film transistor layer (303). The light-emitting element layer (304) includes light-emitting elements and a pixel definition film (344).

Light-emitting elements and pixel defining film (344) are formed on the planarization film (339). The light-emitting element may be an organic light emitting device. In this case, the light-emitting element may include an anode electrode (341), light-emitting layers (342), and a cathode electrode (343).

The anode electrode (341) can be formed on the planarization film (339). The anode electrode (341) can be connected to the source electrode (333) of the thin film transistor (335) through a contact hole penetrating the protective film (338) and the planarization film (339).

The pixel defining film (344) may be formed to cover the edge of the anode electrode (341) on the planarizing film (339) to define pixels. That is, the pixel defining film (344) serves as a pixel defining film that defines pixels. Each pixel represents a region in which an anode electrode (341), a light-emitting layer (342), and a cathode electrode (343) are sequentially laminated, and holes from the anode electrode (341) and electrons from the cathode electrode (343) are combined with each other in the light-emitting layer (342) to emit light.

Emission layers (342) are formed on the anode electrode (341) and the pixel defining film (344). The emission layer (342) may be an organic emission layer. The emission layer (342) may emit one of red light, green light, and blue light. The peak wavelength range of the red light may be about 620 nm to 750 nm, and the peak wavelength range of the green light may be about 495 nm to 570 nm. In addition, the peak wavelength range of the blue light may be about 450 nm to 495 nm. Alternatively, the emission layer (342) may be a white emission layer that emits white light, and in this case, the red emission layer, the green emission layer, and the blue emission layer may be laminated and may be a common layer commonly formed in the pixels. In this case, the display panel (300) may further include a separate color filter for displaying red, green, and blue.

The light emitting layer (342) may include a hole transporting layer, a light emitting layer, and an electron transporting layer. In addition, the light emitting layer (342) may be formed in a tandem structure of two or more stacks, and in this case, a charge generation layer may be formed between the stacks.

The cathode electrode (343) is formed on the light-emitting layer (342). The second electrode (343) may be formed to cover the light-emitting layer (342). The second electrode (343) may be a common layer formed commonly on the pixels.

When the light-emitting element layer (304) is formed in a top emission manner in which light is emitted upward, the anode electrode (341) can be formed of a metal material having a high reflectivity, such as a laminated structure of aluminum and titanium (Ti/Al/Ti), a laminated structure of aluminum and ITO (ITO/Al/ITO), an APC alloy, and a laminated structure of an APC alloy and ITO (ITO/APC/ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu). In addition, the cathode electrode (263) can be formed of a transparent metal material (TCO, Transparent Conductive Material) such as ITO or IZO that can transmit light, or a semi-transmissive metal material (Semi-transmissive Conductive Material) such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). When the cathode electrode (343) is formed of a semi-transparent metal material, the light emission efficiency can be increased by a micro cavity.

When the light-emitting element layer (304) is formed in a bottom emission manner that emits light in a downward direction, the anode electrode (341) may be formed of a transparent conductive material (TCO) such as ITO or IZO, or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). The second electrode (343) may be formed of a metal material having a high reflectivity, such as a laminated structure of aluminum and titanium (Ti/Al/Ti), a laminated structure of aluminum and ITO (ITO/Al/ITO), an APC alloy, and a laminated structure of an APC alloy and ITO (ITO/APC/ITO). When the anode electrode (341) is formed of a semi-transmissive metal material, the light emission efficiency may be increased by a micro cavity.

An encapsulating layer (305) is formed on the light-emitting element layer (304). The encapsulating layer (305) serves to prevent oxygen or moisture from penetrating into the light-emitting layer (342) and the cathode electrode (343). To this end, the encapsulating layer (305) may include at least one inorganic film. The inorganic film may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. In addition, the encapsulating layer (305) may further include at least one organic film. The organic film may be formed to a sufficient thickness to prevent foreign substances (particles) from penetrating the encapsulating layer (305) and entering the light-emitting layer (342) and the cathode electrode (343). The organic film may include any one of epoxy, acrylate, and urethane acrylate.

A barrier film (306) is placed on the encapsulating layer (305). The barrier film (306) is placed to cover the encapsulating layer (305) to protect the light-emitting element layer (304) from oxygen or moisture. The barrier film (306) may be formed integrally with the touch sensing device (200).

A polarizing film may be additionally attached to the upper surface of the display panel (300) to prevent reduced visibility due to reflection of external light.

A display circuit board (310) may be attached to one side of the display panel (300). Specifically, the display circuit board (310) may be attached to pads provided on one side of the display panel (300) using an anisotropic conductive film.

The touch circuit board (210) and the display circuit board (310) can be bent from the top to the bottom of the display panel (300). The display circuit board (310) can be connected to the touch connection portion of the touch circuit board (210) through a connector. Alternatively, the display circuit board (310) can include corresponding pads instead of the connector, in which case the display circuit board (310) can be connected to the touch circuit board (210) using anisotropic conductive films. The display circuit board (310) can be connected to the main circuit board (710) through the display connection portion (350).

The display driver (320) outputs signals and voltages for driving the display panel (300) through the display circuit board (310). The display driver (320) may be formed as an integrated circuit and mounted on the display circuit board (310), but is not limited thereto. For example, the display driver (320) may be attached to one side of the display panel (300).

The lower panel member (400) may be placed on the lower surface of the display panel (300). The lower panel member (400) may include at least one of a heat dissipation layer for efficiently dissipating heat of the display panel (300), an electromagnetic wave shielding layer for shielding electromagnetic waves, a light blocking layer for blocking light incident from the outside, a light absorption layer for absorbing light incident from the outside, and a buffer layer for absorbing impact from the outside.

Specifically, the lower panel member (400) may include a light absorbing member, a buffer member, and a heat dissipating member.

The light absorbing member may be placed at the bottom of the display panel (300). The light absorbing member blocks the transmission of light, thereby preventing the pressure sensor (500) positioned at the bottom of the light absorbing member from being viewed from the top of the display panel (300). The light absorbing member may include a light absorbing material, such as a black pigment or dye.

The buffer member may be placed under the light absorbing member. The buffer member absorbs external impact to prevent the display panel (300) from being damaged. The buffer member may be formed of a single layer or multiple layers. For example, the buffer member may be formed of a polymer resin such as polyurethane, polycarbonate, polypropylene, polyethylene, or the like, or may include an elastic material such as a sponge formed by foaming rubber, a urethane-based material, or an acrylic-based material. The buffer member may be a cushion layer.

The heat dissipation member may be arranged under the buffer member. The heat dissipation member may include at least one heat dissipation layer. For example, the heat dissipation member may include a first heat dissipation layer including graphite or carbon nanotubes, and a second heat dissipation layer formed of a metal film such as copper, nickel, ferrite, or silver that can shield electromagnetic waves and has excellent thermal conductivity.

The pressure sensor (500) may be placed on one side of the display circuit board (310). When the display circuit board (310) is bent, the pressure sensor (500) may be placed close to one side of the lower panel member (400). The pressure sensor (500) may detect a pressure applied to the transparent portion (DA100a) of the cover window (100). The pressure sensor (500) may be utilized as a substitute for a physical button of the display device (1).

For example, a pressure sensor (500) positioned close to one side of the lower panel member (400) can be used as a substitute for the home button of the display device (1). That is, when a first pressure is detected from the pressure sensor (500) positioned close to one side of the lower panel member (400), the screen of the display device (1) can be turned on.

A lower bracket (600) may be placed at the lower portion of the panel lower member (400). The lower bracket (600) may include synthetic resin, metal, or both synthetic resin and metal.

Specifically, the lower bracket (600) may be arranged to surround the cover window (100), the touch sensing device (200), the display panel (300), the panel lower member (400), the pressure sensor (500), the touch circuit board (210), the display circuit board (310), etc. Depending on the embodiment of the display device (1), the side of the lower bracket (600) may be exposed to the side of the display device (1), or the lower bracket (600) may be omitted and only the lower cover (800) may be present.

A main circuit board (710) may be placed at the bottom of the lower bracket (600). The main circuit board (710) may be connected to another display connection portion (350) of the display circuit board (310) via a cable connected to the main connector (790). As a result, the main circuit board (710) may be electrically connected to the display circuit board (310) and the touch circuit board (210). The main circuit board (710) may be a printed circuit board or a flexible printed circuit board.

The main circuit board (710) may include a main processor (720) and a camera device (760) as shown in FIG. 2. In FIG. 2, the main processor (720), the camera device (760), and the main connector (790) are mounted on one side of the main circuit board (710) facing the lower bracket (600), but this is not limited thereto. That is, the main processor (720), the camera device (760), and the main connector (790) may be mounted on the other side of the main circuit board (710) facing the lower cover (800).

The main processor (720) can control all functions of the display device (1). For example, the main processor (720) can output image data to the display driver (320) of the display circuit board (310) so that the display panel (300) displays an image. In addition, the main processor (720) can receive touch data from the touch driver (220), determine the user's touch location, and then execute an application indicated by an icon displayed at the user's touch location. In addition, the main processor (720) can control the sound volume of the display device (1) or implement haptics. The main processor (720) can be an application processor formed of an integrated circuit, a central processing unit, or a system chip.

The camera device (760) processes image frames, such as still images or moving images, obtained by an image sensor in camera mode and outputs them to the main processor (720).

In addition, the main circuit board (710) may be further equipped with a mobile communication module capable of transmitting and receiving a wireless signal with at least one of a base station, an external terminal, and a server on a mobile communication network. The wireless signal may include various forms of data according to a voice signal, a video call signal, or a text/multimedia message transmission and reception. In addition, the main circuit board (710) may be further equipped with an audio output device capable of outputting sound, and a vibration device capable of generating vibration for haptic implementation.

The lower cover (800) can be placed on the lower bracket (600) and the lower side of the main circuit board (710). The lower cover (800) can form the lower surface appearance of the display device (1). The lower cover (800) can include plastic and/or metal.

Fig. 4 is a bottom view showing a configuration in which a display circuit board is bent and placed on a lower member of the panel. Fig. 5 is a cross-sectional view showing a section cut along line I-I' of Fig. 4. It should be noted that since Figs. 1 and 2 are plan perspective views while Fig. 4 is a bottom view, the left and right sides of the display device (1) of Figs. 1 and 2 are reversed in Fig. 4.

Referring to FIGS. 2, 4, and 5, a display circuit board (310) disposed on a lower panel member (400) may include a display driving unit (320), a display connecting unit (350), and a pressure sensor (500).

The display circuit board (310) may include a sensing area (SA) in which pressure sensing cells (CE) are arranged, and a wiring area (LA) in which driving lines (TL) and first to pth sensing lines are arranged, as illustrated in FIG. 6. According to one embodiment, the display driving unit (320) and the display connecting unit (350) may be arranged in the wiring area (LA), and the pressure sensor (500) may be arranged over a portion of the sensing area (SA) and the wiring area (LA).

The display panel (300) may include a display area (DA) and a panel pad area (P_PA). A touch sensing device (200) may be arranged on one side of the display panel (300), and a cover window (100) may be arranged on one side of the touch sensing device (200). On the other hand, a panel lower member (400) may be arranged on the other side of the display panel (300). A display circuit board (310) may be attached to one side of the panel pad area (P_PA) of the display panel (300) and may be bent toward the lower surface of the display panel (300). At this time, a part of the display circuit board (310) may be arranged to overlap the display area (DA).

The display circuit board (310) may include a first surface (310_1S) facing one surface of the panel lower member (400) and a second surface (310_2S) opposite the first surface (310_1S). According to one embodiment, the pressure sensor (500) may be disposed on the first surface (310_1S), and the display driver (320) may be disposed on the second surface (310_2S). The pressure sensor (500) may be formed integrally with the display circuit board (310). That is, the lower surface (500_2S) of the pressure sensor (500) may be the same layer as the first surface (310_1S), which is the upper surface of the display circuit board (310). The upper surface (500_1S) of the pressure sensor (500) may include an adhesive layer (PSA), so as to be coupled with the panel lower member (400). Due to this, the display circuit board (310) can be secured to the lower panel member (400).

For convenience of explanation, although not illustrated, the display circuit board (310) may include a touch connector (not illustrated) on the second surface (310_2S). The touch circuit board (210) may be bent like the display circuit board (310), and the touch connector and a touch connection portion (230) provided at one end of the bent touch circuit board (210) may be interconnected. As a result, the touch driver (220) may be electrically connected to the display circuit board (310).

FIG. 6 is a plan view showing a pressure sensor integrated into a display circuit board according to one embodiment. FIG. 7 is a plan view showing an example of area A of FIG. 6. FIG. 8 is a cross-sectional view showing an example of Ⅱ-Ⅱ’ of FIG. 7. FIG. 9 is a cross-sectional view showing a pattern portion of FIG. 8. FIG. 10 is a cross-sectional view showing a cover portion of FIG. 8. FIG. 11 is an equivalent circuit diagram of the pressure sensor of FIG. 7.

Referring to FIGS. 6 to 11, the pressure sensor (500) may include a pattern portion (510) formed on a display circuit board (310), and a cover portion (520) positioned to overlap the pattern portion (510).

According to one embodiment, the pattern portion (510) may include a first driving electrode (TE1), a first sensing electrode (RE1), a second driving electrode (TE2), a second sensing electrode (RE2), a driving line (TL), first to p-th sensing lines (RL1 to RLp, where p is an integer of 2 or greater), and a second pressure sensing layer (PSL2). The cover portion (520) may include a substrate (SUB) as a base layer, and a first pressure sensing layer (PSL1) and a spacer (SPC) may be disposed on one surface of the substrate (SUB), and an adhesive layer (PSA) may be disposed on the other surface of the substrate (SUB). Pressure sensing cells (CE1 to CEp) may be included between the pattern portion (510) and the cover portion (520).

The pressure sensor (500) may have a shape that extends in one direction on a plane, for example, in the X-axis direction, and in this case, the length of the pressure sensor (500) in the extension direction may be greater than the width. However, the shape of the pressure sensor (500) is not limited thereto and may vary depending on the location to which it is applied.

Pressure sensing cells (CE1 to CEp) are arranged between the pattern portion (510) and the cover portion (520). A driving line (TL) and first to pth sensing lines (RL1 to RLp) are arranged on one surface of the pattern portion (510) facing the cover portion (520). Pressure sensing cells (CE1 to CEp) are arranged between the pattern portion (510) and the cover portion (520).

Each of the pressure sensing cells (CE1 to CEp) can independently sense the pressure at the corresponding location. In Fig. 6, the pressure sensing cells (CE1 to CEp) are arranged in one row, but this is not limited thereto. The pressure sensing cells (CE1 to CEp) may be arranged in multiple rows as needed. In addition, each of the pressure sensing cells (CE1 to CEp) may be arranged at a predetermined interval as in Fig. 1, or may be arranged continuously.

The pressure sensing cells (CE1 to CEp) may have different areas depending on the purpose. For example, when the pressure sensing cells (CE1 to CEp) are used to detect pressure applied to the front of the display device (1) as shown in Fig. 6, the pressure sensing cells (CE1 to CEp) may be formed in a size corresponding to the pressure sensing area.

Each of the pressure sensing cells (CE1 to CEp) can be connected to at least one driving line and at least one sensing line. For example, as shown in FIG. 6, the pressure sensing cells (CE1 to CEp) are commonly connected to one driving line (TL), whereas they can be connected one-to-one to the sensing lines (RL1 to RLp). The first pressure sensing cell (CE1) can be connected to the driving line (TL) and the first sensing line (RL1), and the second pressure sensing cell (CE2) can be connected to the driving line (TL) and the second sensing line (RL2). In addition, the third pressure sensing cell (CE3) can be connected to the driving line (TL) and the third sensing line (RL3), and the p-th pressure sensing cell (CEp) can be connected to the driving line (TL) and the p-th sensing line (RLp).

The driving line (TL) and the first to p-th detection lines (RL1 to RLp) can be connected to the display driving unit (350). That is, the pressure sensor driving unit can be integrated into the display driving unit (350). The display driving unit (350) can detect the pressure applied to the pressure detection cells (CE1 to CEp) by applying a driving voltage to the driving line (TL) and detecting current values or voltage values from the detection lines (RL1 to RLp). However, the driving line (TL) and the first to p-th detection lines (RL1 to RLp) can be connected to a pressure sensor driving unit (not shown) installed separately from the display driving unit (350).

The spacer (SPC) of the cover portion (520) may be a bonding layer that is arranged between the display circuit board (310) and the substrate (SUB) to bond them together. The bonding layer may be formed of a pressure-sensitive adhesive layer or an adhesive layer. The bonding layer may be arranged along the periphery of the pattern portion (510) and the cover portion (520). In one embodiment, the bonding layer may completely surround the edges of the pattern portion (510) and the cover portion (520) to seal the interior of the pressure sensor (500). In addition, the bonding layer may serve to maintain a constant gap between the pattern portion (510) and the cover portion (520). The bonding layer may not overlap with the driving line (TL), the sensing lines (RL1 to RLp), and the pressure sensing cells (CE1 to CEp). The bonding layer may be first attached to one surface of the cover portion (520) and then attached to one surface of the pattern portion (510) during the bonding process. Each of the pressure sensing cells (CE1 to CEp) includes a driving connection electrode (TCE), a sensing connection electrode (RCE), a first driving electrode (TE1), a first sensing electrode (RE1), a second driving electrode (TE1), a second sensing electrode (RE1), a first pressure sensing layer (PSL1), and a second pressure sensing layer (PSL2).

The driving connection electrode (TCE), the sensing connection electrode (RCE), the first driving electrode (TE1), the first sensing electrode (RE1), the second driving electrode (TE1), the second sensing electrode (RE1), and the second pressure sensing layer (PSL2) are arranged on the pattern portion (510) facing the cover portion (520).

The driving connection electrode (TCE) is connected to the driving line (TL) and the first driving electrode (TE1). Specifically, the driving connection electrode (TCE) is connected to the driving line (TL) at both ends in the longitudinal direction (Y-axis direction). The first driving electrodes (TE1) can be branched in the width direction (X-axis direction) of the driving connection electrode (TCE).

The sensing connection electrode (RCE) is connected to one of the sensing lines (RL1 to RLp) and the first sensing electrode (RE1). Specifically, the sensing connection electrode (TCE) is connected to one of the sensing lines (RL1 to RLp) at one end in the longitudinal direction (Y-axis direction). The first sensing electrodes (RE1) may be branched in the width direction (X-axis direction) of the sensing connection electrode (RCE).

The first driving electrode (TE1) and the first sensing electrode (RE1) may be arranged on the same layer. The first driving electrode (TE1) and the first sensing electrode (RE1) may be made of the same material. For example, the first driving electrode (TE1) and the first sensing electrode (RE1) may include a conductive material such as silver (Ag) or copper (Cu). The first driving electrode (TE1) and the first sensing electrode (RE1) may be formed on the pattern portion (510) by screen printing.

The first driving electrodes (TE1) and the first sensing electrodes (RE1) are arranged adjacent to each other, but are not connected to each other. The first driving electrodes (TE1) and the first sensing electrodes (RE1) can be arranged parallel to each other. The first driving electrodes (TE1) and the first sensing electrodes (RE1) can be arranged alternately in the longitudinal direction (Y-axis direction) of the driving connection electrode (TCE) and the sensing connection electrode (RCE). That is, the first driving electrode (TE1), the first sensing electrode (RE1), the first driving electrode (TE1), and the first sensing electrode (RE1) can be repeatedly arranged in the order of the longitudinal direction (Y-axis direction) of the driving connection electrode (TCE) and the sensing connection electrode (RCE).

The first pressure sensing layer (PSL1) is arranged on one surface of the cover portion (520) facing the pattern portion (510). The first pressure sensing layer (PSL1) may be arranged to overlap the first driving electrodes (TE1) and the first sensing electrodes (RE1).

The first pressure-sensitive layer (PSL1) may include a pressure-sensitive material and a polymer resin in which the pressure-sensitive material is disposed. The pressure-sensitive material may be metal microparticles (or metal nanoparticles) such as nickel, aluminum, titanium, tin, and copper. For example, the first pressure-sensitive layer (PSL1) may be a quantum tunneling composite (QTC).

When pressure is not applied to the cover portion (520) in the height direction (Z-axis direction) of the pressure sensor (500), a gap exists between the first pressure sensing layer (PSL1) and the first driving electrodes (TE1) and between the first pressure sensing layer (PSL1) and the first sensing electrodes (RE1), as shown in FIG. 8. That is, when pressure is not applied to the cover portion (520), the first pressure sensing layer (PSL1) is spaced apart from the first driving electrodes (TE1) and the first sensing electrodes (RE1).

When pressure is applied to the cover portion (520) in the height direction (Z-axis direction) of the pressure sensor (500), the first pressure sensing layer (PSL1) comes into contact with the first driving electrodes (TE1) and the first sensing electrodes (RE1). Therefore, the first driving electrode (TE1) and the first sensing electrode (RE1) can be physically connected through the first pressure sensing layer (PSL1), and the first pressure sensing layer (PSL1) can act as an electrical resistor.

The display driving unit (320), which also performs the pressure sensor driving function, can calculate the resistance value of the pressure detection cell connected to the detection line of the pressure sensor (500) by applying a driving voltage to the driving line (TL) of the pressure sensor (500) and then detecting the current or voltage of the detection line of the pressure sensor (500).

As described above, the pressure sensor (500) can change the resistance value of the pressure detection cell because the area in which the first pressure detection layer (PSL1) comes into contact with the first driving electrode (TE1) and the first detection electrode (RE1) varies depending on the applied pressure. Accordingly, the pressure sensor (500) can detect the pressure applied by the user's hand.

The second driving electrode (TE2) may be branched in the width direction (X-axis direction) of the driving connection electrode (TCE). The second driving electrode (TE2) may be arranged parallel to the first driving electrode (TE1).

The second sensing electrode (RE2) may be branched in the width direction (X-axis direction) of the sensing connection electrode (RCE). The second sensing electrode (RE2) may be arranged parallel to the first sensing electrode (RE1).

The second driving electrode (TE2) and the second sensing electrode (RE2) may be arranged on the same layer as the first driving electrode (TE1) and the first sensing electrode (RE1). The second driving electrode (TE2) and the second sensing electrode (RE2) may be formed of the same material as the first driving electrode (TE1) and the first sensing electrode (RE1). For example, the second driving electrode (TE2) and the second sensing electrode (RE2) may include a conductive material such as silver (Ag) or copper (Cu). The second driving electrode (TE2) and the second sensing electrode (RE2) may be formed on the first substrate (SUB1) by screen printing.

The second driving electrode (TE2) and the second sensing electrode (RE2) are arranged adjacent to each other, but are not connected to each other. The second driving electrode (TE2) and the second sensing electrode (RE2) may be arranged parallel to each other.

The second driving electrode (TE2) and the second sensing electrode (RE2) may not overlap with the first pressure sensing layer (PSL1) of the cover portion (520). The second sensing electrode (RE2) may be arranged between the second driving electrode (TE2) and the first driving electrode (TE1). In this case, the distance between the second driving electrode (TE2) and the second sensing electrode (RE2) may be closer than the distance between the first driving electrode (TE1) and the second sensing electrode (RE2).

The second pressure sensing layer (PSL2) can be in contact with the second driving electrode (TE2) and the second sensing electrode (RE2). That is, the second driving electrode (TE2) and the second sensing electrode (RE2) can be connected through the second pressure sensing layer (PSL2).

The second pressure sensing layer (PSL2) may be arranged to cover the second driving electrode (TE2) and the second sensing electrode (RE2) as shown in Fig. 8. The second pressure sensing layer (PSL2) may be arranged to cover the upper surface and side surfaces of the second driving electrode (TE2) and the second sensing electrode (RE2). The second pressure sensing layer (PSL2) may not overlap the first pressure sensing layer (PSL1).

The second pressure-sensitive layer (PSL2) may be formed of the same material as the first pressure-sensitive layer (PSL1). In this case, it may include a pressure-sensitive material and a polymer resin in which the pressure-sensitive material is disposed. The pressure-sensitive material may be a metal microparticle such as nickel, aluminum, titanium, tin, or copper. For example, the second pressure-sensitive layer (PSL2) may be a quantum tunneling composite (QTC).

The first pressure sensing cell (CE1) can be expressed as including a first resistor (R1) and a second resistor (R2) connected in parallel between the driving line (TL) and the first sensing line (RL1), as shown in FIG. 7. The first resistor (R1) refers to the resistance generated by the first pressure sensing layer (PSL1) disposed between the first driving electrodes (TE1) and the first sensing electrodes (RE1), and the second resistor (R2) refers to the resistance generated by the second pressure sensing layer (PSL2) disposed between the second driving electrodes (TE2) and the second sensing electrodes (RE2). Since the contact area of the first pressure sensing layer (PSL1) that comes into contact with the first driving electrodes (TE1) and the first sensing electrodes (RE1) changes depending on the pressure, the first resistor (R1) corresponds to a variable resistance.

That is, since each of the first to pth pressure sensing cells (CE1 to CEp) includes a second resistance (R2) that is unrelated to the applied pressure, the resistance (R) of each of the first to pth pressure sensing cells (CE1 to CEp) can be reduced.

Meanwhile, the second driving electrode (TE2) and the second sensing electrode (RE2) are connected to the second pressure sensing layer (PSL2) to form the second resistance (R2), and the number of the second driving electrodes (TE2) and the number of the second sensing electrodes (RE2) do not need to be large. In contrast, the first driving electrode (TE1) and the first sensing electrode (RE1) are preferably formed in plural since they are intended to detect pressure according to the area in contact with the first pressure sensing layer (PSL1). The number of the second driving electrodes (TE2) may be less than the number of the first driving electrodes (TE1), and the number of the second sensing electrodes (RE2) may be less than the number of the first sensing electrodes (RE1).

In addition, the second resistance (R2) can decrease as the thickness of the second driving electrode (TE2) and the thickness of the second sensing electrode (RE2) become thicker. In addition, the second resistance (R2) can decrease as the width of the second driving electrode (TE2) and the width of the second sensing electrode (RE2) become wider. In addition, the number of second driving electrodes (TE2) and the number of second sensing electrodes (RE2) in contact with the second pressure sensing layer (PSL2) increases, the contact area between the second pressure sensing layer (PSL2) and the second driving electrode (TE2) and the contact area between the second pressure sensing layer (PSL2) and the second sensing electrode (RE2) increases, and therefore the second resistance (R2) can decrease. In addition, the second resistance (R2) can decrease as the area of the second pressure sensing layer (PSL2) in contact with the second driving electrode (TE2) and the second sensing electrode (RE2) becomes wider. Therefore, the size of the second resistor (R2) can be designed by considering the thickness of the second driving electrode (TE), the thickness of the second sensing electrode (RE2), the width of the second driving electrode (TE), the width of the second sensing electrode (RE2), the number of second driving electrodes (TE2), the number of second sensing electrodes (RE2), and the area of the second pressure sensing layer (PSL2) in contact with the second driving electrode (TE2) and the second sensing electrode (RE2).

FIG. 12 is a schematic cross-sectional view of a display circuit board according to one embodiment.

Referring to FIG. 12, the display circuit board (310) may have a multilayer structure including a plurality of wiring layers. The display circuit board (310) may include a first insulating layer (IL1), a first wiring layer (CL1) disposed on the first insulating layer (IL1), a second insulating layer (IL2) disposed on the first wiring layer (CL1), a second wiring layer (CL2) disposed on the second insulating layer (IL2), a third insulating layer (IL3) disposed on the second wiring layer (CL2), a third wiring layer (CL3) disposed on the third insulating layer (IL3), and a fourth insulating layer (IL4) disposed on the third wiring layer (CL3).

However, Fig. 12 shows a cross-section of the first wiring layer (CL1), the second wiring layer (CL2), and the third wiring layer (CL3), and each of the first wiring layer (CL1), the second wiring layer (CL2), and the third wiring layer (CL3) may have a specific wiring pattern. That is, it should be noted that the electrical signal is conducted along the wiring pattern, and not that each of the first wiring layer (CL1), the second wiring layer (CL2), and the third wiring layer (CL3) is conducted as an entire layer.

The first insulating layer (IL1) may be disposed below the first wiring layer (CL1) to cover the first wiring layer (CL1) and protect the first wiring layer (CL1). The first insulating layer (IL1) may include an organic insulating material. Examples of the organic insulating material include polyacryCAtes resin, epoxy resin, phenolic resin, polyamides resin, polyimides rein, unsaturated polyesters resin, polyphenylene resin, polyphenylenesulfides resin, or benzocyclobutene (BCB).

The first insulating layer (IL1) may expose the first wiring layer (CL1) in the panel pad area (P_PA) and the area where the pressure sensor (500) is disposed. A signal wiring (PAD) may be disposed on the panel pad area (P_PA). The signal wiring (PAD) may include at least one of molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). The signal wiring (PAD) may be a single film made of the materials exemplified above. Without being limited thereto, the signal wiring (PAD) may be a laminated film.

The first wiring layer (CL1) exposed by the first insulating layer (IL1) can be coupled with a signal wiring (PAD) arranged on a panel pad area (P_PA). A first conductive coupling member (ACF1) can be arranged between the first wiring layer (CL1) and the signal wiring (PAD). That is, the first wiring layer (CL1) can be electrically coupled to the signal wiring (PAD) through the first conductive coupling member (ACF1). In some embodiments, the first wiring layer (CL1) can be directly connected to the signal wiring (PAD) without the first conductive coupling member (ACF1). That is, the first wiring layer (CL1) can be directly connected to the upper surface of the exposed signal wiring (PAD). For example, the first wiring layer (CL1) can be ultrasonically bonded to the signal wiring (PAD). The first wiring layer (CL1) can include a metal material. The first wiring layer (CL1) may include one or more metals selected from among molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu).

The first driving electrode (TE1), the first sensing electrode (RE1), the second driving electrode (TE2), the second sensing electrode (RE2), the driving line (TL), and the first to p-th sensing lines (RL1 to RLp) of the pattern portion (510) may be formed on the first wiring layer (CL1) by screen printing. An area excluding the first driving electrode (TE1), the first sensing electrode (RE1), the second driving electrode (TE2), the first sensing electrode (RE2), the driving line (TL), and the first to p-th sensing lines (RL1 to RLp) of the pattern portion (510) may be covered by the first insulating layer (IL1). That is, the first driving electrode (TE1), the first sensing electrode (RE1), the second driving electrode (TE2), the second sensing electrode (RE2), the driving line (TL), and the first to p-th sensing lines (RL1 to RLp) may be exposed without being covered by the first insulating layer (IL1). Due to this, when pressure is applied, it can come into contact with the first pressure sensing layer (PSL1) of the cover part (520).

The fourth insulating layer (IL4) can expose the third wiring layer (CL3) in the area where the display driver (320) is arranged. The fourth insulating layer (IL4) can be coupled with a circuit signal wiring (C_PAD) arranged on a circuit pad area on the third wiring layer (CL3) exposed by the fourth insulating layer (IL4). A second conductive coupling member (ACF2) can be arranged between the third wiring layer (CL3) and the circuit signal wiring (C_PAD). That is, the third wiring layer (CL3) can be electrically coupled to the circuit signal wiring (C_PAD) through the second conductive coupling member (ACF2). The fourth insulating layer (IL4) can be formed including the same organic insulating material as the first insulating layer (IL1). The third wiring layer (CL3) can be formed including the same metal material as the first wiring layer (CL1).

In some embodiments, the third wiring layer (CL3) can be directly connected to the circuit signal wiring (C_PAD) without the second conductive bonding member (ACF2). That is, the third wiring layer (CL3) can be directly connected to the upper surface of the exposed circuit signal wiring (C_PAD). For example, the third wiring layer (CL3) can be ultrasonically bonded to the circuit signal wiring (C_PAD).

The second wiring layer (CL2) can be electrically connected to the first wiring layer (CL1) or the third wiring layer (CL3) through via holes (VIA1, VIA2) formed in the second insulating layer (IL2) and the third insulating layer (IL3). The second insulating layer (IL2) is disposed between the first wiring layer (CL1) and the second wiring layer (CL2), and the third insulating layer (IL3) is disposed between the second wiring layer (CL2) and the third wiring layer (CL3) to physically separate the first wiring layer (CL1) to the third wiring layer (CL3) from each other in an area excluding the via holes (VIA).

The first via hole (VIA1) may be arranged near the panel pad area (P_PA). Accordingly, each of the first wiring layer (CL1) to the third wiring layer (CL3) may be electrically connected to the signal wiring (PAD). For convenience of explanation, the first via hole (VIA1) is illustrated as one, but the via hole connecting the first wiring layer (CL1) and the signal wiring (PAD) on a plane, the via hole connecting the second wiring layer (CL2) and the signal wiring (PAD), and the via hole connecting the third wiring layer (CL3) and the signal wiring (PAD) may be formed in different locations, respectively.

The second via hole (VIA2) may be arranged to overlap with the display driver (320). As a result, each of the first driving electrode (TE1), the first sensing electrode (RE1), the second driving electrode (TE2), the second sensing electrode (RE2), the driving line (TL), and the first to p-th sensing lines (RL1 to RLp) formed on the first wiring layer (CL1) may be electrically connected to the circuit signal wiring (C_PAD) on which the circuit pad is arranged.

According to one embodiment, the driving line (TL) and the first to p-th sensing lines (RL1 to RLP) may each extend along the wiring formed on the first wiring layer (CL1) to an area overlapping the circuit signal wiring (C_PAD). In this case, when the wiring disposed on the second wiring layer (CL2) and/or the third wiring layer (CL3) does not overlap the driving line (TL) and the first to p-th sensing lines (RL1 to RLP) that extend along the first wiring layer (CL1) to an area overlapping the circuit signal wiring (C_PAD), the second via hole (VIA2) may be formed in a straight line in the thickness direction (Z-axis direction). For convenience of explanation, the second via hole (VIA2) is illustrated as one, but a plurality of via holes connecting the planar driving line (TL) and the circuit signal wire (C_PAD), and connecting each of the first to pth sensing lines (RL1 to RLp) and the signal wire (C_PAD) may be formed in different locations.

The second insulating layer (IL2) and the third insulating layer (IL3) may be formed by including at least one of a silicon compound and a metal oxide. For example, the second insulating layer (IL2) and the third insulating layer (IL3) may be formed by including at least one of silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, and the like. These may be used alone or in combination with each other.

Hereinafter, a display device according to another embodiment will be described. In the following embodiments, the same components as those in the embodiments already described are referred to by the same reference numerals, and the description thereof is omitted or simplified.

Fig. 13 is a cross-sectional view showing a section cut along line II-II’ of Fig. 7 according to another embodiment. Fig. 14 is a cross-sectional view showing a pattern portion of Fig. 13 according to another embodiment. Fig. 15 is a cross-sectional view showing a cover portion of Fig. 13 according to another embodiment. Fig. 16 is a schematic cross-sectional view of a display circuit board according to another embodiment.

Referring to FIGS. 13 to 16, there is a difference from the embodiments illustrated in FIGS. 8 to 10 in that the second pressure sensing layer (PSL_1) is positioned on the cover portion (520_1) rather than the pattern portion (510_1).

More specifically, the pressure sensor (500_1) may include a pattern portion (510) formed on a display circuit board (310), and a cover portion (520) arranged to overlap the pattern portion (510). According to one embodiment, the pattern portion (510) may include a first driving electrode (TE1), a first sensing electrode (RE1), a second driving electrode (TE2), a second sensing electrode (RE2), a driving line (TL), and first to p-th sensing lines (RL1 to RLp, where p is an integer greater than or equal to 2). The cover portion (520) may include a substrate (SUB) as a base layer, and a first pressure sensing layer (PSL1), a second pressure sensing layer (PSL2_1), and a spacer (SPC) may be arranged on one surface of the substrate (SUB), and an adhesive layer (PSA) may be arranged on the other surface of the substrate (SUB).

The second pressure sensing layer (PSL2_1) can contact the second driving electrode (TE2) and the second sensing electrode (RE2) respectively when the pattern portion (510_1) and the cover portion (520_1) are combined. As illustrated in FIG. 13, one surface of the second pressure sensing layer (PSL2_1) may contact the upper surfaces of the second driving electrode (TE2) and the second sensing electrode (RE2), but may not contact the side surfaces of the second driving electrode (TE2) and the second sensing electrode (RE2). Since the embodiments illustrated in FIGS. 8 to 10 form the second pressure sensing layer (PSL2) directly on the second driving electrode (TE2) and the second sensing electrode (RE2), the second pressure sensing layer (PSL2) can contact the upper surfaces and side surfaces of the second driving electrode (TE2) and the second sensing electrode (RE2).

Meanwhile, as illustrated in FIG. 13, the second pressure sensing layer (PSL2_1) may have a greater height than the first pressure sensing layer (PSL1). This is because, when the pattern portion (510_1) and the cover portion (520_1) are combined, the second pressure sensing layer (PSL2_1) must be in contact with the second driving electrode (TE2) and the second sensing electrode (RE2), but the first pressure sensing layer (PSL1) must be positioned so as to be spaced apart from the first driving electrode (TE1) and the first sensing electrode (RE1).

Referring to FIG. 16, there is a difference from the embodiment of FIG. 12 in that the drive line (TL) of the pressure sensor (500) and the first to pth sensing lines (RL1 to RLp) and the circuit signal wiring (C_PAD) are connected through via holes (VIA3, VIA4) that are not in a straight line in the thickness direction, and are connected through a via hole (VIA2) formed in a straight line.

More specifically, the third via hole (VIA3) and the fourth via hole (VIA4) may be arranged to overlap with the display driver (320). As a result, each of the first driving electrode (TE1), the first sensing electrode (RE1), the second driving electrode (TE2), the second sensing electrode (RE2), the driving line (TL), and the first to p-th sensing lines (RL1 to RLp) formed on the first wiring layer (CL1) may be electrically connected to the circuit signal wiring (C_PAD) on which the circuit pad is arranged.

According to one embodiment, the driving line (TL) and the first to p-th sensing lines (RL1 to RLp) may each extend along the wiring formed on the first wiring layer (CL1) to an area overlapping the circuit signal wiring (C_PAD). At this time, when the wiring disposed on the second wiring layer (CL2) and/or the third wiring layer (CL3) overlaps the driving line (TL) and the first to p-th sensing lines (RL1 to RLp) that extend along the first wiring layer (CL1) to an area overlapping the circuit signal wiring (C_PAD), the wiring disposed on the second wiring layer (CL2) and the third wiring layer (CL3) may be bypassed by a bridge wiring (BR) connecting the third via hole (VIA3) and the fourth via hole. The bridge wiring (BR) may be disposed on the second wiring layer (CL2). For convenience of explanation, each of the third via hole (VIA3) and the fourth via hole (VIA4) is illustrated, but via holes connected through a bridge wiring (BR) to connect a planar driving line (TL) and a circuit signal wiring (C_PAD), and multiple via holes connected through a bridge wiring (BR) to connect each of the first to pth sensing lines (RL1 to RLp) and a signal wiring (C_PAD) may be formed in different locations.

Although the embodiments of the present invention have been described with reference to the attached drawings, those skilled in the art will understand that the present invention can be implemented in other specific forms without changing the technical idea or essential features of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

TL: Drive lines RL1~RLp: 1st to pth sensing lines
SUB: substrate CE1~CEp: first to pth pressure sensing cells
TE1: First driving electrode TE2: Second driving electrode
RE1: First sensing electrode RE2: Second sensing electrode
TCE: Drive connection electrode RCE: Sense connection electrode
PSL1: First pressure sensing layer PSL2: Second pressure sensing layer
1: Display device 100: Cover window
200: Touch sensing device 210: Touch circuit board
220: Touch actuator 300: Display panel
310: Display circuit board 320: Display driver
400: Panel lower member 510: Pattern part
520: Cover 600: Lower bracket
710: Main circuit board 720: Main processor
800: Lower cover

Claims (20)

display panel;
A printed circuit board located beneath the above display panel;
A panel lower member positioned between the display panel and the printed circuit board; and
An adhesive member positioned between the lower member of the panel and the printed circuit board;
The above printed circuit board,
A pattern portion including a first driving electrode and a first sensing electrode arranged on a first surface; and
Including a cover portion facing the above pattern portion,
The above cover part,
A substrate including one side facing the pattern portion and the other side being the opposite side of the one side; and
A first pressure sensing layer is positioned on the one surface of the substrate and overlaps the first driving electrode and the first sensing electrode,
The above adhesive member is,
A display device adhered to the surface of the above substrate and the lower member of the above panel. In the first paragraph,
A display device having an insulating layer disposed on the first surface, the insulating layer exposing the first driving electrode and the first sensing electrode. In the first paragraph,
A display device wherein the pattern portion further includes a second driving electrode and a second sensing electrode. In the third paragraph,
A display device wherein the pattern portion further includes a second pressure sensing layer in contact with the second driving electrode and the second sensing electrode. In the fourth paragraph,
A display device wherein the second pressure sensing layer is disposed on at least one side of the second driving electrode and at least one side of the second sensing electrode. In the first paragraph,
A display device in which a gap exists between the first pressure sensing layer, the first driving electrode, and the first sensing electrode. In Article 6,
A display device wherein the cover part includes a spacer that maintains the gap. delete In the first paragraph,
A display device in which the above printed circuit board is bent and joined to one side of the display panel by the adhesive material. delete In the first paragraph,
A display device in which a plurality of first driving electrodes and first sensing electrodes are arranged on a first surface of the pattern portion, the first driving electrodes and the first sensing electrodes are formed long in a first direction, and the first driving electrodes and the first sensing electrodes are alternately arranged in a second direction intersecting the first direction. In Article 11,
A display device further comprising: a driving connection electrode connected to the first driving electrodes; and a sensing connection electrode connected to the first sensing electrodes. In Article 12,
A display device further comprising: a driving line connected to the driving connection electrode and to which a driving voltage is applied; and a sensing line connected to the sensing connection electrode. In Article 13,
A display device in which the printed circuit board includes a pressure-sensitive driving unit on a second surface opposite to the first surface, wherein the pressure-sensitive driving unit is electrically connected to the driving line and the sensing line through a contact hole. display panel;
A printed circuit board located beneath the above display panel;
A panel lower member positioned between the display panel and the printed circuit board; and
An adhesive member positioned between the lower member of the panel and the printed circuit board;
The above printed circuit board,
A pattern portion including a first driving electrode, a first sensing electrode, a second driving electrode, and a second sensing electrode arranged on a first surface; and
Including a cover portion facing the above pattern portion,
The above cover part,
A substrate including one side facing the pattern portion and the other side being the opposite side of the one side;
A first pressure sensing layer positioned on the one surface of the substrate and overlapping the first driving electrode and the first sensing electrode; and
A second pressure sensing layer positioned on the one surface of the substrate and overlapping the second driving electrode and the second sensing electrode;
The above adhesive member is,
A display device adhered to the surface of the substrate and the lower member of the panel. In Article 15,
A display device having an insulating layer disposed on the first surface, the insulating layer exposing the first driving electrode, the first sensing electrode, the second driving electrode, and the second sensing electrode. In Article 15,
A display device in which a gap exists between the first pressure sensing layer, the first driving electrode, and the first sensing electrode. In Article 17,
A display device wherein the cover part includes a spacer that maintains the gap. In Article 17,
The second pressure sensing layer is a display device in contact with the second driving electrode and the second sensing electrode. delete

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