KR100751367B1 - Plasma display device - Google Patents

Abstract

A plasma display device is provided to improve air current for radiating electronic elements by using an array structure of adhesive members. A chassis(120) is arranged at a backside of a plasma display panel in order to support the plasma display panel. A circuit unit is arranged at a backside of the chassis and generates electrical signals for driving the plasma display panel. A plurality of signal transfer members are connected to the circuit unit and are extended through an upper side or a lower side of the chassis to the plasma display panel. The signal transfer members include electronic elements arranged apart from a side of the chassis. A plurality of adhesive members(123) are inserted between the plasma display panel and the chassis in order to attach the plasma display panel and the chassis to each other. The adhesive members are arranged along an edge of the chassis. A part of each electronic element is arranged in a space between the adhesive members.

Description

Plasma display apparatus

1 is a schematic exploded perspective view of a plasma display device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1.

FIG. 3 is a plan view illustrating an arrangement position between the adhesive members disposed on the chassis and the electronic elements of the signal transmission members in FIG. 1.

4 is a partially cutaway perspective view illustrating an example of the plasma display panel illustrated in FIG. 1.

FIG. 5 is a block diagram illustrating driving of a circuit unit shown in FIG. 1.

FIG. 6 is a diagram illustrating a plasma display device according to a comparative example, and is a plan view corresponding to FIG. 3.

<Brief description of symbols for the main parts of the drawings>

100: plasma display device 110: plasma display panel

120: chassis 123: adhesive member

127: thermal conductive sheet 130: circuit portion

160: cover plate 170: TCP

173: wiring unit 175: electronic device

199: spacing

The present invention relates to a plasma display device, and more particularly, to a plasma display device having improved heat radiation performance of a signal transmission member.

Plasma display device using plasma display panel is a flat panel display device that displays images by using gas discharge phenomenon. It is excellent in various displays such as brightness, contrast, afterimage, and viewing angle, and it is possible to display thin and large screens. It is attracting attention as a display device.

Typically, such a plasma display apparatus includes a plasma display panel, a chassis disposed substantially parallel to the plasma display panel, a circuit unit mounted at a rear of the chassis to drive the plasma display panel, the plasma display panel, the chassis. And a case accommodating the circuit portion.

In the plasma display apparatus as described above, the circuit unit and the plasma display panel are electrically connected by a signal transmitting member such as a tape carrier package (TCP) or a chip on film (COF). TCP is a package formed by mounting an element such as a driving IC in a tape form, and COF is an element mounted on a film constituting a flexible printed circuit (FPC). Such TCP and COF are widely used because they have flexibility and can reduce the size of a circuit part because many electronic devices can be mounted.

By the way, in the above TCP or COF, a lot of heat is generated from the electronic elements mounted on them when the plasma display panel is driven. However, when such heat is not smoothly discharged, the electronic devices are malfunctioned. Therefore, a problem occurs in the image display of the plasma display panel. In particular, when the plasma display panel is driven by a high definition (HD) single scan method, since a large amount of heat is generated in electronic elements mounted in TCP or COF connecting the address driver and the address electrodes of the circuit part, There is a need for means that can effectively release the heat generated from these electronic elements.

An object of the present invention is to provide a plasma display device having improved heat dissipation performance of a signal transmission member.

The present invention provides a plasma display panel, a chassis disposed behind the plasma display panel and supporting the plasma display panel, a circuit unit disposed behind the chassis and generating an electrical signal for driving the plasma display panel. One side is connected to the circuit unit and the other side extends to the plasma display panel surrounding the upper side or the lower side of the chassis so as to transmit an electrical signal from the circuit portion to the plasma display panel, and is spaced apart from the side of the chassis. And a signal transmission member including an electronic device disposed between the plasma display panel and the chassis to bond the plasma display panel and the chassis to be spaced apart from each other along an edge of the chassis. device A plasma display apparatus includes a plurality of adhesive members at least a portion of which corresponds to a spaced space between the adhesive members.

In the present invention, the signal transmission members are disposed along the lower edge of the chassis, and the adhesive members disposed along the lower edge of the chassis are preferably spaced apart at substantially the same interval.

In the present invention, at least one portion of each electronic device is preferably disposed to correspond to the spaced space between the chassis and the plasma display panel.

In addition, in the present invention, the signal transmission member is preferably a TCP (tape carrier package) or COF (chip on film).

In addition, in the present invention, the plasma display panel, the front substrate, spaced apart at a predetermined interval to face the front substrate, the rear substrate defining a plurality of discharge cells between the front substrate, and the Sustain electrode pairs causing discharge in discharge cells, address electrodes extending to intersect the sustain electrode pair, phosphor layers disposed in the discharge cells, and discharge gas filled in the discharge cells. It is preferable. In this case, it is preferable that the signal transmitting members transmit the electrical signals generated from the address driver of the circuit unit to the address electrodes, and the electrical signals are more preferably a single scan method.

Also in the present invention, the adhesive members are preferably double sided tapes.

Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 to 3 illustrate a plasma display apparatus 100 according to an embodiment of the present invention. FIG. 1 is a schematic separated perspective view of the plasma display apparatus 100, and FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1.

1 and 2, the plasma display apparatus 100 includes a plasma display panel 110, a chassis 120, and a circuit unit 130.

In the plasma display apparatus 100, a plasma display panel 110 in which an image is implemented by gas discharge is illustrated. Various types of plasma display panels may be adopted as the plasma display panel 110. As an example, an AC plasma display panel having a surface discharge type three electrode structure as shown in FIG. 4 may be selected.

Referring to FIG. 4, the plasma display panel 110 includes a front panel 111 and a rear panel 112 that is coupled to face the front panel 111. The front panel 111 includes a front substrate 21 disposed in front and a storage electrode pair 22 formed on a rear surface of the front substrate 21 and having an X electrode 23 and a Y electrode 24, respectively. And a front dielectric layer 25 formed to cover the sustain electrode pairs 22, and a passivation layer 26 formed on a rear surface of the front dielectric layer 25. The X electrode 23 and the Y electrode 24 serve as sustain electrodes and scan electrodes, respectively, and are spaced apart from each other by a discharge gap. The X electrode 23 includes an X transparent electrode 23a and an X bus electrode 23b formed to be connected thereto. Similarly, the Y electrode 24 is also connected to the Y transparent electrode 24a. The formed Y bus electrode 24b is provided.

The rear panel 112 has a rear substrate 31 disposed at a rear side and address electrodes 32 formed on the front surface of the rear substrate 31 and extending in a direction crossing the sustain electrode pairs 22. A back dielectric layer 33 formed to cover the address electrodes 32, barrier ribs 34 formed on the back dielectric layer 33 to define discharge cells 35, and discharge cells 35. Phosphor layers 36 disposed therein and a discharge gas filled in the discharge cells 35.

The chassis 120 may be manufactured by casting, press working, or the like. The chassis 120 supports the plasma display panel 110 and the circuit unit 130. The chassis 120 may be formed using a metal having high thermal conductivity such as aluminum to effectively release heat transferred from the plasma display panel 110 to the outside. However, to reduce weight and reduce cost, the chassis 120 may be formed using plastic.

Adhesive members 123 are interposed between the plasma display panel 110 and the chassis 120. Various kinds of adhesive members may be selected as the adhesive members 123. In this embodiment, a face tape is used as the adhesive member. The adhesive members 123 are spaced apart from each other along an edge of the chassis 120. The adhesive members 123 disposed along the lower edge of the chassis are disposed at substantially equal intervals. Details of the arrangement positions of the adhesive members 123 will be described later.

A thermal conductive sheet 127 having a high thermal conductivity is interposed between the plasma display panel 110 and the chassis 120. In more detail, one side of the thermal conductive sheet 127 is in contact with the plasma display panel 110, and the other side thereof is spaced apart from the chassis 120. The thermal conductive sheet 127 disperses heat generated locally in the plasma display panel 110 and transmits a part of heat generated in the plasma display panel 110 to the chassis 120. It is a heat insulating sheet of the heat conductive sheet 127. In addition, the thermally conductive sheet 127 preferably includes carbon such as graphite, and the thermally conductive sheet of graphite material is also called an e-graf.

The circuit unit 130 is disposed at the rear of the chassis 120, and the circuit unit 130 includes a plurality of electronic components 135. The circuit unit 130 drives the plasma display panel 110. As shown in FIG. 5, the circuit unit 130 includes an image processor 151, a logic controller 152, an address driver 153, and an X driver. 154, Y drive unit 155, power supply unit 156, and the like.

The image processor 151 converts an external analog image signal into a digital signal to generate internal image signals, for example, 8-bit red, green and blue image data, clock signals, and vertical and horizontal synchronization signals. The logic controller 152 generates driving control signals S _A , S _Y , and S _X according to an internal image signal from the image processor 151. The address driver 153 processes the address signal S _A among the drive control signals S _A , S _Y , and S _X from the logic controller 152 to generate a display data signal, and generates the displayed display. A data signal is applied to the address electrodes 32. The X driver 154 processes the X driving control signal S _X from the driving control signals S _A , S _Y , and S _X from the logic controller 152 and applies the X driving control signal S _X to the X electrodes 23. do. The Y driver 155 processes the Y driving control signal S _Y among the driving control signals S _A , S _Y , and S _X from the logic controller 152 and applies the Y driving control signal S _Y to the Y electrodes 24. do. The power supply unit 156 may include an operating voltage required by the image processor 151 and the logic controller 152, the address driver 153, the X driver 154, and the Y driver 155. To generate and supply the required operating voltage.

Meanwhile, the circuit unit 130 transmits an electrical signal to the plasma display panel 110 by signal transmission members. TCP (Tape Carrier Package), COF (Chip On Film) may be used as the signal transmission member.

According to the present exemplary embodiment, TCP 170 having two electronic elements 175 mounted on a tape-shaped wiring 173 as a signal transfer member is disposed at the lower edge of the chassis 120. And, as shown in Figure 1, TCP 170 are arranged spaced apart at predetermined intervals along the lower edge of the chassis 120, respectively.

In the present embodiment, the circuit unit 130 is formed so that the plasma display panel 110 can be driven by a high definition single scan (HD) single scan, and the TCPs 170 are formed of the circuit unit 130. The electrical signal generated from the address driver 153 is transmitted to the address electrodes 32. That is, one end 170a of the TCP 170 is connected to the circuit unit 130, and the other end 170b is connected to the plasma display panel 110 while surrounding the lower side 120a of the chassis. An electronic device 175 such as an address driver IC is mounted on the wiring unit 173 of the TCP 170. The electronic devices 175 are disposed at positions corresponding to the lower surface 120a of the chassis 120. In addition, at least a portion of the depreciation electronic device is disposed to substantially correspond to the separation space 125 between the chassis and the plasma display panel, which is formed by the air flowing into the separation space 125. 175) to promote heat dissipation.

1 and 2, cover plates 160 are disposed to surround portions of the TCP 170 in which the electronic devices 175 are mounted. The cover plate 160 discharges heat generated from the electronic devices 175 to the outside and prevents damage to the TCPs 170 from the outside. The cover plate 160 is disposed at the lower edge of the chassis 120. The cover plate 160 is fixed to the chassis 120 by screws 190. In addition, a heat conductive sheet 182 may be interposed between the cover plate 160 and the electronic device 175 to promote heat dissipation of the electronic device 175.

In order to explain the heat dissipation characteristics of the electronic devices 175 by the adhesive members 123 disposed on the chassis 120, a schematic plan view showing a state in which the plasma display panel 110 is removed from FIG. 1. Is shown in FIG. 3. 6 is a plan view corresponding to FIG. 3, which is a comparative example for comparison with the present embodiment. In Fig. 6, the same reference numerals as in the above-described embodiment indicate the same members.

First, referring to FIG. 6, adhesive members 223 are disposed to surround the edge of the chassis 120. In particular, the electronic elements 277 of the signal transmission members are disposed to correspond to the lower side of the chassis. When the plasma display panel is driven, the temperature of the plasma display panel is increased to generate a rising air flow in the space between the plasma display panel and the chassis. However, since the adhesive members block the separation space, air does not flow smoothly to the portions corresponding to the adhesive members 223. Accordingly, the first group 275 corresponding to the spaced space 299 between the adhesive members among the electronic elements has excellent heat dissipation due to the smooth flow of air (f2). The second group 276 blocked by the upper part has a disadvantage in that heat dissipation is greatly deteriorated because the air flow f3 is not smooth. In particular, even when only some of the electronic elements do not radiate heat, the entire plasma display panel may be defective. Thus, the plasma display device according to the comparative example has a problem in heat dissipation performance.

However, as shown in FIG. 3, at least a portion of the electronic device is disposed to correspond to the spaced space 199 between the adhesive members 123. Therefore, since the air f1 having a relatively low temperature exchanges heat with the electronic elements 175 and then flows upward through the separation space 199, the heat dissipation capability of the electronic element 175 is achieved. This is improved.

In the plasma display device according to the present invention, since the flow of air for radiating the electronic elements is smooth by the arrangement of the adhesive members, the heat radiation performance of the signal transmission member is improved.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (12)

A plasma display panel; A chassis disposed behind the plasma display panel and supporting the plasma display panel; A circuit unit disposed at the rear of the chassis and configured to generate an electrical signal for driving the plasma display panel; One side is connected to the circuit portion and the other side extends to the plasma display panel surrounding the upper side or the lower side of the chassis and is spaced apart from the side of the chassis so as to transfer electrical signals from the circuit portion to the plasma display panel. Signal transmission members having an electronic device to be; And A plurality of adhesive members interposed between the plasma display panel and the chassis to bond the plasma display panel and the chassis and are spaced apart from each other along an edge of the chassis; And at least a portion of each of the electronic devices corresponds to the spaced space between the adhesive members. The method of claim 1, The signal transmission members are disposed along the lower edge of the chassis, Adhesive members disposed along the lower edge of the chassis are spaced apart at substantially the same intervals. The method of claim 1, At least a portion of each of the electronic devices is disposed to substantially correspond to a space between the chassis and the plasma display panel. The method of claim 1, And a heat conduction sheet interposed between the plasma display panel and the chassis. The method of claim 4, wherein And the thermally conductive sheet is disposed to be surrounded by the adhesive members. The method of claim 5, And the thermal conductive sheet is a single sheet. The method of claim 4, wherein The thermally conductive sheet includes carbon. The method of claim 1, The signal transmission member is a plasma carrier device (TCP) or a chip on film (COF). The method of claim 1, wherein the plasma display panel, A rear substrate which is spaced apart from the front substrate at predetermined intervals to face the front substrate, and defines a plurality of discharge cells between the front substrate and sustain electrode pairs that cause discharge in the discharge cells; And an address electrode extending to cross the sustain electrode pair, phosphor layers disposed in the discharge cells, and a discharge gas filled in the discharge cells. The method of claim 9, And the signal transfer members transfer electrical signals generated from an address driver of the circuit unit to the address electrodes. The method of claim 10, And the address driver transfers a single scan type electrical signal to the address electrodes. The method of claim 1, And the adhesive members are double sided tapes.

Images