JPH09167896A - Electronic component housing device and method of cooling electronic component housing device - Google Patents

Abstract

(57) Abstract: Electronic components mounted on a printed circuit board 1 can be cooled uniformly by air passing between the printed circuit boards 1. Therefore, the mounting area on the printed circuit board 1 can be effectively used. A device is provided. An electronic component accommodating device is provided with a unit 4 in which a plurality of printed circuit boards 1 on which electronic components are mounted are arranged in parallel and accommodated, and is provided in the unit 4, and the electronic components are cooled by passing between the printed circuit boards 1. The air duct 5 for introducing the air to be introduced from the air duct inlet 8 and the printed board 1 by changing the traveling direction of the air introduced from the air duct inlet 8.
A plurality of rectification numbers 5 are provided in the air duct 5 so as to pass between them, and an exhaust port is provided in the unit 4 for discharging the air passing between the printed circuit boards 1 from the exhaust port 6b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention contains an electronic component housing device for housing a substrate on which electronic components such as semiconductor elements are mounted, and cooling the substrate by discharging internal air with a blower for blowing air. It is about.

[0002]

2. Description of the Related Art A conventional electronic component housing device is disclosed in Japanese Patent Laid-Open No. 63-
A description will be given based on Japanese Patent No. 70449. FIG. 13 is a perspective view showing the inside by partially cutting away a conventional electronic component housing device. In FIG. 13, 101 is a printed circuit board on which electronic components are mounted, 102 is a backplane for fixing the printed circuit board 101, 104 is a unit for housing the printed circuit board 101, the backplane 102, and the connector 103,
105 is an air duct having an air duct inlet 108,
Reference numeral 06 is an exhaust port portion having a cooling fan 107, 109 is a front surface of the unit closed by a panel attached to the printed circuit board 101, 110 is intake air, 111 is exhaust air, and 114 is induction air in the air duct 105. It is a convection guide plate. FIG. 14 shows the intake air 110 shown in FIG.
It is a cross-sectional configuration diagram showing a cross section cut in the incident direction of. FIG.
4, 112 and 113 are models showing the air flow in the unit 104, 112 is a laminar flow portion, and 113 is a turbulent or vortex flow portion.

Next, the operation will be described. When the cooling fan 107 operates, the intake air 110, which is cooling air, is taken into the air duct 105 from the air duct inlet 108 in the lower part of FIG. 13, and is guided into the unit 104 by the convection guide plate 114. The cooling air cools the electronic components mounted on the printed circuit board 101, and the warmed air enters the exhaust port 106 in the upper part of FIG. 13 and is discharged from the device by the cooling fan 107 from there. There is.

[0004]

Since the conventional electronic component accommodating device is constructed as described above, the unit 104 is
The cooling air passing between the printed circuit boards 101 in the unit 104 is a turbulent flow or a vortex flow 113, or the flow rate of the cooling air passing between the printed circuit boards 101 in the unit 104 is the intake air 110.
Was not uniform in the incident direction. Therefore, the printed circuit board 101 has a portion that is difficult to be cooled, and the electronic components cannot be cooled uniformly. For this reason, it is necessary to arrange the higher heat-generating electronic components while avoiding the turbulent flow or the vortex flow 113, which reduces the degree of freedom of component arrangement and limits the mounting area of the electronic components.

The present invention has been made in order to solve the above-mentioned problems, and an electronic component is evenly cooled by a cooling air passing between the substrates and the electronic component mounted on the substrate generates heat. An object of the present invention is to provide an electronic component accommodating device that can effectively use a mounting area on a substrate and can mount electronic components on the substrate at a high density without being restricted in arrangement.

[0006]

An electronic component accommodating apparatus according to the present invention includes a plurality of substrates on which electronic components are mounted, a container in which the plurality of substrates are arranged in parallel and accommodated, and the container is provided in the container. An air introducing portion having an inlet for introducing air for cooling the electronic component by passing between the substrates;
A plurality of rectifying members provided in the air introduction part so as to change the traveling direction of the air introduced from the introduction port so as to pass between the substrates and the container, and guide the air passing between the substrates. And an air outlet having an outlet.

Further, the plurality of rectifying members are arranged so that there is a portion where the downstream orthogonal projection protrudes from the upstream orthogonal projection when viewed from the introduction direction of the air introduced from the inlet. . In addition, the plurality of rectifying members are arranged such that there is a portion where the downstream orthogonal projection protrudes in a direction distant from the substrate with respect to the upstream orthogonal projection.

Further, the rectifying member is arranged such that the incident surface of the air is inclined with respect to the introduction direction of the air introduced from the introduction port. Further, the rectifying member is arranged such that an angle formed by the introduction direction of air introduced from the introduction port and the direction of the air-incident surface on the substrate side is an obtuse angle.

Further, the air introducing portion is connected so as to be separable from the container. Further, the air outlet is provided with a blower for blowing a fixed amount of air. Further, the air lead-out portion has a chamber for preventing the air flow of the air passing between the substrates from being disturbed, and is formed so as to lead out the air through this chamber. Further, it has at least one of an angle adjusting means for adjusting the inclination direction of the rectifying member and a position adjusting means for adjusting the fixed position. Further, the traveling direction of the air introduced from the inlet and the traveling direction of the air passing between the substrates intersect.

Furthermore, the cooling method for the electronic component accommodating apparatus according to the present invention includes a plurality of substrates on which electronic components are mounted, a container in which the plurality of substrates are arranged in parallel and accommodated, and the container is provided with air. Method for cooling electronic component housing device including air introducing section having introduction port for introducing, rectifying member provided in plurality in this air introducing section, and air deriving section provided in the container and having deriving port for deriving air In, introducing air for cooling the electronic component from the inlet, rectifying so as to pass between the substrates while changing the traveling direction of the introduced air by the rectifying member, between the rectified between the substrates The electronic component is cooled by passing air, and the air that has cooled the electronic component is led out from the lead-out port.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. Hereinafter, a first embodiment of an electronic component housing device and a method of cooling the electronic component housing device according to the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing the inside by partially cutting out the external appearance of the electronic component housing device. In FIG.
Reference numeral 1 is a plurality of printed boards that are boards on which electronic components such as semiconductor elements are mounted, 2 is a backplane for fixing the printed boards 1, 4 is the printed boards 1 and 2
And a unit which is a container for housing the connector 3, 5 is an air duct which is an air introduction part having an air duct inlet 8 which is an introduction port, 6 is an exhaust port part which is an air outlet part which has an exhaust port 6b which is an outlet port, 7 Is a cooling fan 7 or 9 which is a blower provided at the exhaust port 6b of the exhaust port 6, a unit front surface closed by a panel attached to the printed circuit board 1,
Reference numeral 10 is intake air introduced from the air duct inlet 8, that is, the x-axis direction in FIG. 1, 11 is exhaust air introduced from the exhaust port 6b, that is, the y-axis direction in FIG. 1, and 15 is the air duct 5.
A plurality of straightening plates, which are straightening members for converting the traveling direction of the intake air introduced therein from the x-axis direction to the y-axis direction, 15b
Is an incident surface that forms a part of the straightening vane 15 and receives the intake air from the x-axis direction. Further, such an electronic component accommodating device has a sealed structure except for the air duct inlet 8 and the exhaust port 6b.

FIG. 2 shows the electronic component accommodating device shown in FIG.
It is a cross-section block diagram which shows the cross section cut | disconnected by the surface perpendicular | vertical to an axis. In FIG. 2, 12 is a model showing the air flow in the unit 4,
Reference numeral 16 is a vortex flow generated in the vicinity of the current plate 15. Here, as the current plate 15, four sheets having the same shape are provided. The rectifying plate 15 is arranged so that the incident surface 15b has a negative inclination on the xy coordinate axes. That is,
The straightening vanes 15 are arranged so that the angle formed by the introduction direction of the air introduced from the introduction port and the direction of the air incident surface on the substrate 1 side is an obtuse angle as shown in FIG. Further, the rectifying plate 15 has the air duct inlet 8 through which the intake air 10 is introduced.
Side is the upstream side, and the current plate 1 on the downstream side viewed from the x-axis direction
The orthogonal projection of No. 5 is arranged so that there is a portion that gradually protrudes in the negative direction of the y-axis from the orthogonal projection of the upstream rectifying plate 15 as it goes to the downstream rectifying plate. That is, the plurality of rectifying plates 15 are arranged so that there is a portion in which the downstream orthogonal projection protrudes away from the substrate 1 with respect to the upstream orthogonal projection.

Next, the operation will be described. By operating the cooling fan 7 at a predetermined rotation speed, the intake air 10 that is cooling air is taken into the air duct 5 from the air duct inlet 8 in the lower stage of FIG. The taken-in air is incident on the entrance surface 15b of the rectifying plate 15, and is divided into an air current deflected in the positive y-axis direction and an air current deflected in the negative y-axis direction,
These merge in the vicinity of the surface on the opposite side of the incident surface 15b to generate a vortex flow 16. On the other hand, the airflow directed to the unit 4 by the suction of the cooling fan 7 is dispersed by the vortex flow 16 and uniformly enters the unit 4. That is, the straightening vanes 15 are arranged so that the traveling direction of the air introduced from the inlet and the traveling direction of the air passing between the substrates intersect, preferably substantially orthogonally to each other. Therefore, the electronic components mounted on the printed board 1 can be cooled uniformly. Unit 4
The airflow 12 warmed inside is guided by the cooling fan 7 and is exhausted to the outside of the apparatus through the exhaust port 6 in the upper part of FIG.

Embodiment 1 FIG. Hereinafter, Example 1 of Embodiment 1
Will be described. FIG. 3 is a model diagram for simulating cooling air passing through the inside of the electronic component housing device. In FIG. 3, the constituent elements other than the straightening vane 15 are the same as those in FIG. The height L of the housing including the unit 4, the air duct 5, and the exhaust port 6 is 500 mm, the depth M is 300 mm, and the width N is 210 mm.
Air duct inlet 8 height P is 120 mm, printed circuit board 1
The vertical and horizontal lengths Q and R are 260 mm, respectively. At this time, seven printed circuit boards 1 are arranged in parallel.
The fan characteristic of the cooling fan 7 is that the static pressure P ₀ = 80.9 N /
m ² , flow rate m ₀ = 0.317 kg / s (Sanyo Denki Co., Ltd.)
Manufactured by 109R1224H1D01; 27.6V). Under such conditions, the layout of the current plate 15 was changed and the simulation was performed. In the following description of the embodiments, x,
The direction of the y-axis differs from the direction described above.

FIG. 4 is a table showing the result of simulating the wind speed inside the node unit when the arrangement of the flow regulating plate 15 is changed. In FIG. 4, Nos. 1, 2, and 3 are each model when the arrangement of the current plate 15 is changed. The aperture ratio is the aperture ratio of the air duct inlet 8 in FIG. 3, and means what percentage of the area of the air duct inlet 8 the air passes through. That is, in an actual electronic component accommodating device, that is, a node unit, a filter or the like is often attached to the air duct inlet 8, so such a study is conducted. The flow rate is the amount of air passing through the inside of the node unit within a unit time. Internal wind speed means A, B, and
It shows the wind speed obtained by the simulation of the portions indicated by C, D, and E. Further, the hatched portion in FIG. 4 indicates the portion where the internal wind speed is slow and the portion where the vortex flow is formed. In such a portion where the wind velocity is slow or a portion where a vortex is generated, the printed circuit board 1 has a high temperature if there is a heating element such as an electronic component in the portion.

Next, a description will be given of a prior art in which the number of rectifying plates 15 of No. 1 and No. 2 in FIG. 4 is one, that is, it can correspond to the conventional technique. In these cases, it can be seen that a little less than half the area of the printed circuit board 1 is the portion that is difficult to cool. Then, it can be seen that in the case of No 1, both ends in the y-axis direction of the printed circuit board 1 and in the case of No 2, there are parts that are difficult to cool in the air duct inlet 8 side part of the printed circuit board 1. It can be said that the convection guide plate 114 of the conventional electronic component accommodating device described using the above-mentioned Japanese Patent Laid-Open No. 63-70449 is close to the arrangement of the No. 2 rectifying plate 15. And, like the convection straightening plate 14, the No. 2 straightening plate 1
If 5 is arranged, although not shown, the portion of the printed circuit board 1 on the side of the air duct inlet 8 that is difficult to cool becomes wider.

Next, the present invention will be described when there are a plurality of No. 3 rectifying plates 15 in FIG. 4, that is, the present invention. Further, the current plate 15 is arranged so that the incident surface has a negative inclination on the xy coordinate axes. That is, the straightening vanes 15 are arranged according to the inclination of No. 3 in FIG. Further, the straightening vane 15 has the y-axis negative direction (intake air 1
The orthogonal projection of the current plate 15 on the downstream side when viewed in the (0 introduction direction) is
Upstream side straightening plate 15 as it goes to the downstream side straightening plate
Are arranged so that there is a portion that gradually protrudes in the negative direction of the x-axis from the orthographic projection of. At this time, the shaded portion, that is, the portion where the printed circuit board 1 is difficult to cool is on the air duct inlet 8 side, and the region is 1 to 2 of the printed circuit board 1.
It turns out that it is about a percent. By disposing the current plate 15 in this manner, the printed circuit board 1 can be cooled more uniformly. It should be noted that, as can be said for all of Nos. 1 to 3, if the opening ratio is lowered, the flow rate and the outlet wind speed are lowered.

Embodiment 2 FIG. Hereinafter, a second embodiment simulating the arrangement of the current plate 15 of the electronic component housing device described with reference to FIGS. 1 and 2 will be described with reference to FIGS. The simulation conditions are the same as in the first embodiment. FIG. 5 is a diagram showing an arrangement of the current plate 15 used in the simulation of the second embodiment. The straightening vanes 15 having the same shape are provided at equal intervals. Further, the current plate 15 is arranged so that the incident surface has a positive inclination on the xy coordinate axes. That is, the straightening vanes 15 shown in FIG. And the current plate 1
5 is an orthogonal projection of the downstream rectifying plate 15 viewed in the negative direction of the y-axis (introduction direction of the intake air 10) with the air duct inlet 8 side into which the intake air 10 is introduced as the upstream side. It is arranged so that as it goes to the plate, there is a portion that gradually protrudes in the negative direction of the x-axis from the orthogonal projection of the rectifying plate 15 on the upstream side.

FIG. 6 is a diagram showing the distribution of the progress of the cooling air inside the node unit when the straightening plate 15 of FIG. 5 is arranged. FIG. 7 shows the inside of the node unit, a on the x-axis of FIG.
b, c, d, e, f points and y, A, B, C, D, E,
It is a chart showing the wind speed of the cooling wind at the intersection of points F and G. In FIG. 7, xv is the wind speed in the x direction at each point,
yv is the wind speed in the y direction at each point, and xyv is the wind speed at each point, that is, ((xv) ² + (yv) ² ) ^0.5 . In FIG. 6, the direction of the arrow indicates the direction of the cooling air, and the size of the arrow indicates the speed of the cooling air. Except for the area from the origin of the y-axis to the point A, the surface of the printed circuit board 1 is almost evenly laminarly flowed. It can be seen that the cooling air of passes through. Here, the area from the origin of the y-axis to the point A is a connector portion with the backplane 2 of the printed board 1 and no electronic component can be arranged at this position, so cooling is not necessary, and it is illustrated in the first embodiment. It can be said that the shaded area, that is, the area where the printed circuit board 1 is difficult to cool is less than 10% of the printed circuit board 1. Therefore, it can be said that substantially the entire surface of the printed circuit board 1 is sufficiently cooled. In addition, in FIG.
A vortex is generated on the back surface side of the sheet of current plate 15, and this portion is also difficult to cool.

As described above, since the plurality of rectifying plates 15 are arranged in the electronic component accommodating device, the printed circuit board 1 is cooled more evenly, and the arrangement efficiency of the electronic components is improved. Then, it becomes more conspicuous if the traveling direction of the air introduced from the introducing port and the traveling direction of the air passing between the substrates intersect each other. Further, the orthographic arrangement of the straightening vanes 15 on the downstream side as viewed in the negative direction of the y-axis by arranging the straightening vanes 15 in a predetermined direction causes that of the straightening vanes 15 on the upstream side toward the straightening vanes on the downstream side. The printed circuit board 1 can be cooled more evenly if the printed circuit board 1 is arranged so that there is a portion that gradually protrudes in the negative direction of the x-axis rather than the orthogonal projection. Although not shown, a similar effect can be obtained by arranging one of the rectifying members corresponding to a convection guide plate and using the rectifying plate 15 as the other rectifying member.

If a mechanism for adjusting the position and angle of the current plate 15 is provided in the air duct 5, a more appropriate cooling effect can be obtained in the mounter. Further, it is desired that the cooling fan 7, which is a blower, use a fan that blows a substantially constant amount of air, for example, a fan that rotates at a constant speed. This is because the distribution of cooling air inside the node unit changes if the amount of air blown changes. Further, the rectifying member 15 is a plate and has a rectangular cross section, but the rectifying plate 15 has various shapes such as a wing shape and a semicircular shape. Further, although the container is the unit 4 and the one that houses the printed circuit board 1, the backplane 2 and the connector 3 has been described, the container may be configured by the backplane 2 and the unit 4.

Embodiment 2 FIG. Hereinafter, a second embodiment of the electronic component housing device and the method for cooling the electronic component housing device according to the present invention will be described with reference to the drawings. FIG. 8 is a perspective view showing the inside by partially cutting out the external appearance of the electronic component housing device. In FIG. 8, 17 is a filter attached to the air duct inlet 8. The other components and operations are similar to those of the first embodiment, and therefore their explanations are omitted. Since the electronic component storage device has the filter 17 attached thereto, the cooling fan 7 operates to remove the dust-containing cooling air 10 through the filter 17.
Therefore, it is possible to prevent dust from entering the air duct 5 and evenly cool the inside of the unit 4.

Embodiment 3 FIG. Hereinafter, a third embodiment of an electronic component housing device and a method for cooling the electronic component housing device according to the present invention will be described with reference to the drawings. FIG. 9 is a perspective view showing the inside by partially cutting away the external appearance of the electronic component housing device. In FIG. 9, 18 is an exhaust guide plate attached to the exhaust port 6. The other components and operations are similar to those of the first embodiment, and therefore their explanations are omitted. Since the electronic component housing device has the exhaust guide plate 18 attached,
By operating the cooling fan 7, the exhaust air 11 exhausted from the exhaust port portion 6 can be guided to the exhaust guide plate 18 and exhausted to the rear of the electronic component housing device. Therefore, it is possible to cool even if another device is stacked on the upper stage with a space. Here, the front surface of the electronic component housing device is the air duct inlet 8 side.

Embodiment 4 Hereinafter, a fourth embodiment of an electronic component housing device and a method of cooling the electronic component housing device according to the present invention will be described with reference to the drawings. FIG. 10 is a perspective view showing the inside by partially cutting away the appearance of the electronic component housing device.
In FIG. 10, the air duct 5 which is an air introduction part is configured to be separable from the unit 4 which is a container, and 19 is an intake port when the air duct 5 is removed. The operation when other components and the air duct 5 are attached is as follows.
Since it is similar to the first embodiment, its explanation is omitted.

Next, the operation when the air duct 5 is separated from the unit 4 will be described. When the air duct 5 is removed, the cooling air 10 can be taken in through the intake port 19, so that the turbulent flow and the vortex are less likely to occur inside the unit 4, and the printed circuit board 1 can be cooled uniformly. Therefore, by attaching and detaching the air duct 5, the direction in which the cooling air 10 is taken in can be selected, and the unit 4
The inside can be cooled evenly. In addition, the current plate 15
It is easy to perform regular inspection, cleaning, adjustment, etc.

Embodiment 5 Hereinafter, a fifth embodiment of the electronic component housing device and the method for cooling the electronic component housing device according to the present invention will be described with reference to the drawings. FIG. 11 is a perspective view showing the inside by partially cutting out the external appearance of the electronic component housing device.
In FIG. 11, 20 is an air chamber for preventing the air flow from being disturbed. The other components are the same as those in the first embodiment, and therefore their explanations are omitted. FIG.
2 is an enlarged view of the cooling fan 7 of FIG. 11.
In FIG. 12, 21 is a motor part of the cooling fan 7, 1
Reference numeral 2 is an air flow in the air chamber 20 in FIG.

Next, the operation will be described. Cooling fan 7
Is operated, the air warmed in the unit 4 is guided to the exhaust port 6 through the upper air chamber 20. When the air chamber 20 is not provided, the cooling air that has passed between the printed circuit boards 1 collides with the motor 21 to generate a dead space.
Since the air chamber 20 having a distance between the air chambers is provided, the dead space does not occur. Therefore, the air flow of the cooling air in the unit 4 can be exhausted to the outside of the unit 4 without disturbing it, and efficient cooling can be performed.

[0028]

The electronic component accommodating apparatus according to the present invention includes a plurality of substrates on which electronic components are mounted, a container in which the plurality of substrates are arranged in parallel and accommodated, and the container is provided in the container, and the space between the substrates is An air introduction part having an introduction port for introducing the air for cooling the electronic component by passing through the air introduction part so as to change the traveling direction of the air introduced from the introduction port so as to pass between the substrates. Since a plurality of rectifying members and an air lead-out portion provided in the container and having a lead-out port for leading out the air passing between the substrates are provided, it is possible to uniformly cool the electronic components mounted on the substrates. Therefore, electronic components can be mounted on the substrate with high density.

Further, the plurality of rectifying members are arranged so that there is a portion where the downstream orthogonal projection protrudes from the upstream orthogonal projection when viewed from the introduction direction of the air introduced from the inlet. The electronic components mounted on the substrate can be cooled evenly, and therefore, the electronic components can be mounted on the substrate with high density.

Further, since the plurality of rectifying members are arranged so that there is a portion where the downstream orthogonal projection protrudes in the direction distant from the substrate with respect to the upstream orthogonal projection, the electronic components mounted on the substrate are evenly distributed. Therefore, electronic components can be mounted on the substrate with high density.

Further, since the air-incident surface of the rectifying member is arranged so as to be inclined with respect to the introduction direction of the air introduced from the introduction port, it is possible to uniformly cool the electronic components mounted on the substrate. The electronic components can be mounted on the board with high density.

Further, since the rectifying member is arranged such that the angle formed by the introduction direction of the air introduced from the introduction port and the direction of the substrate side of the incident surface of the air is an obtuse angle, it is further mounted on the substrate. The components can be cooled evenly, so that electronic components can be densely mounted on the substrate.

Further, since the air introducing portion is detachably connected to the container, the direction in which the cooling air is taken in can be selected by attaching and detaching the air introducing portion, and the rectifying member can be easily maintained.

Further, since the blower for blowing a fixed amount of air is provided in the air outlet, a device in which the air distribution deflected by the straightening plate and passing between the substrates is stable can be obtained.

Further, since the air lead-out portion has a chamber for preventing the air flow of the air passing between the substrates from being disturbed and is formed to lead out the air through this chamber, the exhaust efficiency and the cooling efficiency are improved. Is improved.

Further, since at least one of the angle adjusting means for adjusting the inclination direction of the rectifying member and the position adjusting means for adjusting the fixed position is provided, appropriate cooling air can be supplied according to the design change of the container or the change of the atmosphere. Obtainable.

Further, since the advancing direction of the air introduced from the inlet and the advancing direction of the air passing between the substrates intersect, it is possible to uniformly cool the electronic components mounted on the substrates. Therefore, the electronic components can be cooled. Can be densely mounted on a substrate.

Furthermore, the cooling method for the electronic component accommodating apparatus according to the present invention includes a plurality of substrates on which electronic components are mounted, a container in which the plurality of substrates are arranged in parallel and accommodated, and the container is provided with air. Method for cooling electronic component housing device including air introducing section having introduction port for introducing, rectifying member provided in plurality in this air introducing section, and air deriving section provided in the container and having deriving port for deriving air In, introducing air for cooling the electronic component from the inlet, rectifying so as to pass between the substrates while changing the traveling direction of the introduced air by the rectifying member, between the rectified between the substrates Since the electronic components are cooled by the passing air and the air that has cooled the electronic components is exhausted from the exhaust port, the electronic components mounted on the board can be cooled evenly. The electronic components can be mounted densely on the substrate.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a partially cutaway external view of an electronic component housing device according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional configuration diagram showing a cross section of the electronic component housing device according to the first embodiment of the present invention, taken along a plane perpendicular to the z-axis.

FIG. 3 is a model diagram for simulating cooling air passing through the inside of the electronic component housing device according to the first example of the first embodiment of the present invention.

FIG. 4 is a table showing the result of simulating the wind speed inside the node unit in Example 1 of the first embodiment of the present invention in comparison with related art.

FIG. 5 is a diagram showing an arrangement of straightening vanes used in a simulation according to a second example of the first embodiment of the present invention.

FIG. 6 is a diagram showing a distribution of progress of cooling air inside a node unit according to a second example of the first embodiment of the present invention.

FIG. 7 is a table showing the wind speed of the cooling air at each point inside the node unit according to the second example of the first embodiment of the present invention.

FIG. 8 is a perspective view showing a partially cutaway external view of an electronic component housing device according to a second embodiment of the present invention.

FIG. 9 is a perspective view showing a partially cutaway external view of an electronic component housing device according to a third embodiment of the present invention.

FIG. 10 is a perspective view showing a partially cutaway external view of an electronic component housing device according to a fourth embodiment of the present invention.

FIG. 11 is a perspective view showing a partially cutaway external view of an electronic component housing device according to a fifth embodiment of the present invention.

FIG. 12 is an enlarged view showing a cooling fan according to a fifth embodiment of the present invention.

FIG. 13 is a perspective view showing the inside by partially cutting away a conventional electronic component housing device.

FIG. 14 is a cross-sectional configuration diagram showing a cross section of a conventional electronic component housing device taken in the direction of incidence of intake air.

[Explanation of symbols]

 1 Printed Circuit Board 4 Unit 5 Air Duct 6 Exhaust Port 6b Exhaust Port 7 Cooling Fan 8 Air Duct Inlet 9 Unit Front 10 Intake Air 11 Exhaust Air 15 Rectifier 20 Air Chamber

Claims (11)

[Claims] 1. A plurality of substrates on which electronic components are mounted, a container in which the plurality of substrates are arranged and accommodated in parallel, and a container provided in the container, and the electronic components are cooled by passing between the substrates. An air introduction part having an introduction port for introducing air, a plurality of rectifying members provided in the air introduction part so as to change the traveling direction of the air introduced from the introduction port to pass between the substrates, and the container And an air lead-out portion having a lead-out port for leading out the air passing between the substrates. 2. The plurality of rectifying members are arranged so that there is a portion where a downstream orthogonal projection is projected with respect to an upstream orthogonal projection when viewed from the introduction direction of the air introduced from the introduction port. The electronic component housing device according to claim 1. 3. The electronic device according to claim 2, wherein the plurality of rectifying members are arranged such that there is a portion where the downstream orthogonal projection protrudes in a direction distant from the substrate with respect to the upstream orthogonal projection. Parts storage device. 4. The electron according to claim 1, wherein the rectifying member is arranged such that an incident surface of air is inclined with respect to an introduction direction of air introduced from an introduction port. Parts storage device. 5. The rectifying member is arranged such that an angle formed by an introduction direction of air introduced from an introduction port and a direction of a substrate side of an incident surface of the air is an obtuse angle. The electronic component housing device described. 6. The electronic component accommodating device according to claim 1, wherein the air introducing portion is detachably connected to the container. 7. The electronic component accommodating device according to claim 1, wherein the air outlet part is provided with a blower for blowing a fixed amount of air. 8. The air outlet part has a chamber for preventing the air flow of the air passing between the substrates from being disturbed, and is formed so as to lead out the air through this chamber. 7. The electronic component housing device according to 7. 9. The apparatus according to claim 1, further comprising at least one of an angle adjusting means for adjusting an inclination direction of the rectifying member and a position adjusting means for adjusting a fixed position.
The electronic component housing device according to claim 1. 10. The electronic component accommodating apparatus according to claim 1, wherein a traveling direction of the air introduced from the inlet and a traveling direction of the air passing between the substrates intersect with each other. . 11. A plurality of substrates on which electronic components are mounted, a container in which the plurality of substrates are arranged and accommodated in parallel, an air introduction unit provided in the container and having an introduction port for introducing air, and an air introduction unit. In a cooling method of an electronic component housing device provided with a plurality of rectifying members, and an air outlet provided in the container and having an outlet for delivering air, air for cooling the electronic component from the inlet is provided. The electronic component is introduced, and the flow direction of the introduced air is changed by the rectifying member and rectified so as to pass between the substrates, and the electronic component is cooled by the rectified air passing between the substrates. A method for cooling an electronic component accommodating device, characterized in that the cooled air is discharged from the outlet.