JP2019067747A - OLED display device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress deterioration of image quality due to crosstalk between sub-pixels. An OLED display device includes a plurality of sub-pixels arranged on a surface of a substrate, and a pixel definition layer surrounding a light emitting region of each of the plurality of sub-pixels. Each of the plurality of sub-pixels has an upper electrode, a lower electrode, an organic light emitting layer laminated with the upper electrode and the lower electrode between the upper electrode and the lower electrode, and a lower portion between the lower electrode and the organic light emitting layer. It includes an electrode and a lower carrier supply layer laminated with an organic light emitting layer. The lower carrier supply layer comes into contact with each of the lower electrode and the organic light emitting layer, supplies carriers from the lower electrode to the organic light emitting layer, covers the entire surface in the opening of the pixel definition layer of the lower electrode, and surrounds the lower electrode. Has an edge on the top surface of the. The organic light emitting layer covers the entire surface of the lower carrier supply layer including the end of the lower carrier supply layer. [Selection diagram] FIG. 2B

Description

  The present disclosure relates to an OLED display device and a method of manufacturing the same.

  OLEDs (Organic Light-Emitting Diodes) are current-driven self-luminous elements, so there is no need for backlighting and there are advantages such as low power consumption, high viewing angle, and high contrast ratio, etc. It is expected in the development of flat panel displays.

  A typical OLED display includes a plurality of sub-pixels arranged in a matrix. Each sub-pixel includes an organic light emitting layer emitting light of any of blue, red or green, and an anode and a cathode sandwiching the organic light emitting layer. For example, patent documents 1 and 2 show an example of composition of an OLED display.

US Patent Application Publication No. 2013/0248867 JP, 2016-103395, A

  In an OLED display device, image quality is degraded due to various causes, and it is desirable to suppress the degradation.

  The OLED display device according to an aspect of the present disclosure includes a plurality of sub-pixels arranged on the surface of a substrate, and a pixel definition layer surrounding a light emitting area of each of the plurality of sub-pixels. Each of the plurality of sub-pixels includes an upper electrode, a lower electrode, an organic light emitting layer laminated with the upper electrode and the lower electrode between the upper electrode and the lower electrode, the lower electrode, and the organic And a lower carrier supply layer stacked with the lower electrode and the organic light emitting layer between the light emitting layer and the lower light emitting layer. The lower carrier supply layer is in contact with the lower electrode and the organic light emitting layer, supplies carriers from the lower electrode to the organic light emitting layer, and covers the entire surface in the opening of the pixel defining layer of the lower electrode. It has an end on the top surface of the pixel definition layer surrounding the lower electrode. The organic light emitting layer covers the entire surface of the lower carrier supply layer including the end of the lower carrier supply layer.

  According to one aspect of the present disclosure, it is possible to suppress deterioration in image quality due to crosstalk between sub-pixels.

In Embodiment 1, an exemplary configuration of an OLED display device is schematically shown. In Embodiment 1, the top view of a part of display area is shown. Sectional drawing in the IIB-IIB cutting plane line in FIG. 2A is shown. In Embodiment 1, the cross-sectional structure of the TFT substrate is schematically shown. It is an enlarged view of the part enclosed with the circular broken line D in FIG. 2B. In Embodiment 1, an example of the metal mask corresponding to the pattern of the red sub pixel R is shown. Sectional drawing in the IIIB-IIIB cutting plane line in FIG. 3A is shown. Sectional drawing in the IIIC-IIIC cutting plane line in FIG. 3A is shown. In Embodiment 1, the state in which the organic material of each color was vapor-deposited by the pixel definition layer is shown typically. Sectional drawing in the IVB-IVB cutting plane line in FIG. 4A is shown. Sectional drawing in the IVC-IVC cutting plane line in FIG. 4A is shown. The flowchart of the manufacturing process after forming a pixel definition layer in Embodiment 1 is shown. In Embodiment 1, the relationship between a metal mask for a hole supply layer and a metal mask for an organic light emitting layer is schematically shown. In Embodiment 1, the cross-sectional structure of the TFT substrate manufactured using the metal mask for hole supply layers and the metal mask for organic light emitting layers which have the relationship shown in FIG. 6 with respect to the sub-pixel of each color is shown typically. . In Embodiment 2, the top view of a part of display area is shown. In Embodiment 2, the relationship between the hole supply layer of a blue sub pixel and a blue organic light emitting layer is shown typically. A part of cross-sectional structure in the VIIIC-VIIIC cutting plane line in Drawing 8A is shown. In Embodiment 2, a flowchart of a manufacturing method is shown. In Embodiment 3, the structural example of the metal mask used for formation of a positive hole supply layer is shown typically. FIG. 11 shows a flowchart of a manufacturing method for forming a hole supply layer using the metal mask shown in FIG. The example of the cross-section of a TFT substrate is shown typically. The example of the cross-section of a TFT substrate is shown typically. The example of the cross-section of a TFT substrate is shown typically. The example of the cross-section of a TFT substrate is shown typically. The example of the cross-section of a TFT substrate is shown typically. The top view of a part of display area in a 4th embodiment is shown. FIG. 18 shows a first cross-sectional view taken along a line XVIII-XVIII in FIG. FIG. 18 shows a second cross-sectional view taken along a line XVIII-XVIII in FIG. FIG. 19 is a view for explaining a metal mask used to form the layer structure described in the cross-sectional view of FIG. 18; FIG. 19 is a view for explaining a metal mask used to form the layer structure described in the cross-sectional view of FIG. 18; The flowchart of the manufacturing process after forming a pixel definition layer in Embodiment 4 is shown.

  In the following, the structure of an OLED (Organic Light-Emitting Diode) and a method of manufacturing the same will be disclosed. The inventors of the OLED display device described in this embodiment show that in the OLED display panel, when only blue sub-pixels emit light, the red and green sub-pixels which should not emit light emit weakly I found out that there is something to do. The unintended sub-pixel light emission causes a reduction in color purity of the displayed image, in particular, a low gradation display abnormality. Therefore, it is desirable to prevent light emission of unintended sub-pixels.

  According to the inventors' research, in the OLED display panel, when the carrier supply layer having carrier mobility is formed between the electrode and the organic light emitting layer in the sub-pixel, the unintended sub-pixel is formed. It was found that luminescence occurred. The carrier supply layer is, for example, a hole supply layer including a hole injection layer and / or a hole transport layer.

  When there is a difference in applied voltage between adjacent sub-pixels, carrier leak occurs between the adjacent sub-pixels via the carrier supply layer. For example, in the case where only the blue sub-pixel emits light, a minute current in the current supplied to the blue sub-pixel flows through the carrier supply layer to the adjacent red and green sub-pixels not intended to emit light. The path through which this minute current flows is also called a leak path.

  This minute current causes the red and green adjacent sub-pixels to slightly emit light (so-called crosstalk). This phenomenon is more pronounced as the distance between adjacent sub-pixels is shorter, and is particularly easily recognized in the case of low gradation display. Therefore, in the present embodiment, a structure of the OLED display device will be described in which the leak path is reduced or eliminated in order to suppress the carrier leak.

  In the OLED display disclosed below, the lower carrier supply layer for supplying carriers from the lower electrode to the organic light emitting layer covers the entire surface of the lower electrode within the opening of the pixel definition layer and a top surface of the pixel definition layer surrounding the lower electrode. Have ends. The organic light emitting layer covers the entire surface of the lower carrier supply layer including the end of the lower carrier supply layer. As a result, the leak path in the lower carrier supply layer between adjacent subpixels can be reduced or eliminated, and carrier leak between adjacent subpixels of different colors can be suppressed.

  Hereinafter, embodiments will be described with reference to the attached drawings. The embodiments are merely examples for realizing the present invention, and do not limit the technical scope of the present invention. The same reference numerals are given to the same configuration in each drawing. In order to make the description easy to understand, the dimensions and shapes of the illustrated objects may be exaggerated.

First Embodiment
[Device configuration]
FIG. 1 schematically shows a configuration example of an OLED display device 10 according to the present embodiment. The OLED display device 10 includes a TFT (Thin Film Transistor) substrate 100 on which an OLED element is formed, a sealing substrate 200 for sealing the OLED element, and a bonding portion for bonding the TFT substrate 100 and the sealing substrate 200 (glass A frit seal portion 300 is included. For example, nitrogen is sealed between the TFT substrate 100 and the sealing substrate 200, and sealed by the bonding portion 300.

  A scan driver 131, an emission driver 132, a protection circuit 133, and a driver IC 134 are disposed around the cathode electrode formation region 114 outside the display region 125 of the TFT substrate 100. These are connected to an external device through a flexible printed circuit (FPC) 135.

  The scan driver 131 drives the scan lines of the TFT substrate 100. The emission driver 132 drives the emission control line to control the light emission period of each sub-pixel. The driver IC 134 is mounted using, for example, an anisotropic conductive film (ACF).

  The driver IC 134 supplies power and timing signals (control signals) to the scan driver 131 and the emission driver 132, and further supplies a data voltage corresponding to the video data to the data line. That is, the driver IC 134 has a display control function.

  The sealing substrate 200 is a transparent insulating substrate, for example, a glass substrate. A λ / 4 retardation plate and a polarizing plate are disposed on the light emission surface (front surface) of the sealing substrate 200 to suppress reflection of light incident from the outside.

  FIG. 2A shows a plan view of a portion of the display area 125. FIG. 2A shows a plurality of sub-pixels arranged in a matrix. The at least three sub-pixels are sub-pixels that emit different first to third colors. The first color is, for example, blue, the second color is, for example, red, and the third color is, for example, green. FIG. 2A shows a red subpixel (light emitting region) 251R, a blue subpixel (light emitting region) 251B, and a green subpixel (light emitting region) 251G. Of the sub-pixels in FIG. 2A, only one of each of red, blue and green is designated by a code. Each sub-pixel displays a color of either red, blue or green. The red, blue, and green sub-pixels constitute one pixel (main pixel).

  In the example of FIG. 2A, the red sub-pixel 251R, the blue sub-pixel 251B, and the green sub-pixel 251G are circularly arranged in the row direction (horizontal direction in FIG. 2A). In the example of FIG. 2A, from left to right, the sub-pixels (light emitting regions) of different colors are arranged in the order of red sub-pixel 251R, blue sub-pixel 251B, and green sub-pixel 251G. Sub-pixels of the same color are arranged in the column direction (vertical direction in FIG. 2A). The order of the red sub-pixel, the blue sub-pixel, and the green sub-pixel is arbitrary, and may be, for example, the order of the red pixel, the green sub-pixel, and the blue sub-pixel.

  Each sub-pixel (light emitting area) is surrounded by an insulating pixel definition layer 253. The pixel definition layer 253 defines each of the sub-pixels (light emitting regions). The sub-pixels (light emitting regions) are formed in the openings of the pixel definition layer 253.

  The entire area of each sub-pixel (light emitting area) is covered with the organic light emitting layer of the same color. Specifically, the red sub-pixel 251R, the blue sub-pixel 251B, and the green sub-pixel 251G are completely covered with the organic light emitting layer 269R, the blue organic light emitting layer 269B, and the green organic light emitting layer 269G, respectively. Of the organic light emitting layers in FIG. 2A, only one organic light emitting layer of each of red, blue and green is designated by a symbol.

  FIG. 2B shows a cross-sectional view taken along the line IIB-IIB in FIG. 2A. The OLED display device 10 includes a TFT substrate 100 and a sealing substrate (transparent substrate) 200 facing the TFT substrate 100. FIG. 2C schematically shows a cross-sectional structure of the TFT substrate 100.

  The OLED display 10 includes a TFT circuit layer 263 and a plurality of separated lower electrodes (eg, anode electrodes 265B and 265G) disposed on an insulating substrate 261. The lower electrode separated is included in the lower electrode layer. The OLED display device 10 further includes an upper electrode (layer) (for example, a cathode electrode (layer) 273) and a plurality of organic light emitting layers 269B and 269G. Note that the layer may be composed of one continuous portion or a plurality of separate portions formed simultaneously. In the following, some of the layers may also be referred to as layers.

  The insulating substrate 261 is made of, for example, glass or resin, and is an inflexible or flexible substrate. The side closer to the insulating substrate 261 is referred to as the lower side, and the far side is referred to as the upper side. A cap layer (not shown) may be formed on the cathode electrode (upper electrode) 273.

  The anode electrodes 265B and 265G are anode electrodes of the blue sub-pixel 251B and the green sub-pixel 251G, respectively. The cathode electrode 273 is a transparent electrode that transmits part or all of visible light from the organic light emitting layer toward the sealing structure, and is common to all the sub-pixels.

  An organic light emitting layer is disposed between the cathode electrode and one anode electrode. The plurality of anode electrodes are disposed on the surface of the TFT circuit layer 263 (for example, on the planarization film), and one organic light emitting layer is disposed on one anode electrode.

  The TFT circuit layer 263 includes a plurality of sub-pixel circuits (hereinafter simply referred to as pixel circuits) each including a plurality of TFTs. Each of the pixel circuits is formed between the insulating substrate 261 and the anode electrode, and controls the current supplied to each of the anode electrodes. The anode electrode is connected to the pixel circuit by a contact portion formed in the contact hole of the planarization film.

  Arbitrary pixel circuits can be used. An example of the pixel circuit includes, for example, a switch TFT for selecting a sub-pixel, a TFT for driving an OLED element, a switch TFT for controlling supply and stop of a drive current to the OLED element, and a storage capacitor.

  In FIG. 2B, an organic light emitting layer 269B is disposed between the cathode electrode 273 and the anode electrode 265B. An organic light emitting layer 269G is disposed between the cathode electrode 273 and the anode electrode 265G. In the example of FIG. 2B, organic light emitting layers of different colors are formed.

  A hole supply layer is stacked between the anode electrode and the organic light emitting layer. The hole supply layer is in contact with the anode electrode and the organic light emitting layer to form an interface. The hole supply layer comprises, for example, a hole injection layer and a hole transport layer, or one or more layers having the function of these layers. The hole supply layer is also referred to as a lower carrier supply layer. In FIG. 2B, the hole supply layer of each sub-pixel is formed separately from the hole supply layer of the adjacent sub-pixel of different color.

  For example, the hole supply layer 267B is disposed between the anode electrode 265B and the organic light emitting layer 269B, and the hole supply layer 267G is disposed between the anode electrode 265G and the organic light emitting layer 269G. The hole supply layers 267B and 267G are separated.

  An electron supply layer is disposed between the cathode electrode and the organic light emitting layer. The electron supply layer is in contact with the cathode electrode and the organic light emitting layer to form an interface. In FIG. 2B, the electron supply layer 271 of each sub-pixel is a part of the layer common to the sub-pixels. The electron supply layer 271 is disposed between the cathode electrode 273 and the organic light emitting layer 269B and between the cathode electrode 273 and the organic light emitting layer 269G. The electron supply layer 271 includes, for example, an electron injection layer and an electron transport layer, or one or more layers having the function of these layers. The electron supply layer 271 is also referred to as an upper carrier supply layer.

  One OLED element includes an anode electrode as a lower electrode, a hole supply layer, an organic light emitting layer, an electron supply layer, and a cathode electrode as an upper electrode in the opening of the pixel definition layer 253.

  The pixel definition layer is a layer between the anode electrode and the hole supply layer. In FIG. 2B, the pixel definition layer 253 is formed between the anode electrodes 265B and 265G and the hole supply layers 267B and 267G. The pixel definition layer 253 includes a side surface in which the sub-pixel is formed and a top surface between the openings. In the example of FIG. 2B, the top surface is flat.

  As shown in FIG. 2B, the hole supply layer 267B is formed on and in contact with the anode electrode 265B and the pixel definition layer 253. Similarly, the hole supply layer 267G is formed on and in contact with the anode electrode 265G and the pixel definition layer 253.

  FIG. 2C schematically shows the positional relationship between the sub-pixel (the opening of the pixel definition layer), the hole supply layer, and the organic light emitting layer. As shown in FIGS. 2B and 2C, the hole supply layer 267B is formed so as to cover a part of the top surface of the pixel definition layer 253 surrounding the periphery thereof. That is, the hole supply layer 267B is formed only on part of the top surface, and the end of the hole supply layer 267B is present on the top surface of the pixel definition layer 253.

  Similarly, the hole supply layer 267G is formed so as to cover a part of the top surface of the pixel definition layer 253 surrounding the periphery thereof. That is, the hole supply layer 267G is formed only on part of the top surface, and the end of the hole supply layer 267G is present on the top surface of the pixel definition layer 253.

  The hole supply layer 267B and the hole supply layer 267G are separated in the in-plane direction (the direction in the main surface of the insulating substrate 261), and there is a gap between them. Specifically, on the pixel definition layer 253, the end of the hole supply layer 267B is separated from the end of the hole supply layer 267G, and there is a gap G between them. In this example, the hole supply layer of each sub-pixel is separated from the hole supply layer of the adjacent sub-pixel of different color. In this example, the hole supply layer of each subpixel is separated from the hole supply layers of all adjacent subpixels, but the hole supply layers of adjacent subpixels of the same color may be continuous.

  The hole supply layer of each sub-pixel has an appropriate thickness for the microcavity structure. In FIG. 2B, the hole supply layer 267G for the hole supply layer green sub-pixel is thicker than the hole supply layer 267B for the blue sub-pixel.

  Immediately above the hole supply layer 267B, that is, on the hole supply layer 267B, an organic light emitting layer 269B is stacked so as to be in contact with the hole supply layer 267B to form an interface. Similarly, an organic light emitting layer 269G is stacked on the hole supply layer 267G, that is, on the hole supply layer 267G so as to contact the hole supply layer 267G and form an interface. The organic light emitting layer 269B covers the entire surface including the entire outer peripheral end of the hole supply layer 267B. Similarly, the organic light emitting layer 269B covers the entire surface including the entire outer peripheral end of the hole supply layer 267B.

  FIG. 2D is an enlarged view of a portion surrounded by a broken circle D in FIG. 2B. In addition, about the plane position of the circle broken line D, it has shown by code | symbol D of FIG. 2C. FIG. 2D shows the end of the hole supply layer 267B and the organic light emitting layer 269B. FIG. 2D shows a pixel definition layer 253, a hole supply layer 267B on the pixel definition layer 253, and an organic light emitting layer 269B on the hole supply layer 267B. The organic light emitting layer 269B completely covers the hole supply layer 267B, and the hole supply layer 267B is not exposed at all from the organic light emitting layer 269B. The outer peripheral edge of the organic light emitting layer 269B is present on the top surface of the pixel defining layer 253 and surrounds the outer peripheral edge of the hole supply layer 267B.

  As shown in FIGS. 2B and 2C, it is preferable that the organic light emitting layer 269G completely covers the hole supply layer 267G and the hole supply layer 267G is not exposed at all from the organic light emitting layer 269G. The outer peripheral end of the organic light emitting layer 269G is present on the top surface of the pixel defining layer 253 and surrounds the outer peripheral end of the hole supply layer 267G.

  In FIGS. 2B and 2C, the end of the organic light emitting layer is located between the end of the hole supply layer covered by the organic light emitting layer and the end of the hole supply layer of the adjacent sub-pixel of different color. For example, the end of the blue organic light emitting layer 269B is present between the end of the hole supply layer 267B of the blue sub-pixel and the hole supply layer 267G of the green sub-pixel. Similarly, the end of the green organic light emitting layer 269G is located between the end of the hole supply layer 267G of the green sub-pixel and the hole supply layer 267B of the blue sub-pixel.

  Substantial leak paths of carrier leaks between subpixels of different colors are formed in the hole supply layer. By separating the hole supply layers of the sub-pixels of different colors, it is possible to reduce the carrier leak between the sub-pixels of different colors. In addition, although the hole supply layers of the sub-pixels of different colors are separated and the electron supply layer is formed at the separated places, the organic light emitting layer is formed between the sub-pixels of different colors. It covers the entire surface of the hole supply layer including the end of the hole supply layer.

  That is, the hole supply layers of the subpixels of different colors are not in direct contact with the electron supply layer. Even if the carrier mobility of the hole supply layer and the organic light emitting layer is about the same, holes move easily from the hole supply layer to the organic light emitting layer, but from the organic light emitting layer due to the large energy barrier to the holes It hardly moves to the hole supply layer. Therefore, the second color sub-pixel passes from the hole supply layer of the first color sub-pixel to the organic light-emitting layer of the first color sub-pixel, the electron supply layer, and the organic light-emitting layer of the second color sub-pixel. The formation of a leak path leading to the hole supply layer of the pixel is suppressed. Therefore, carrier leak between sub-pixels of different colors can be more effectively prevented.

  As shown in FIG. 2A, in this example, the organic light emitting layer of each pixel is separated from the organic light emitting layer of the adjacent sub-pixel. For example, in FIG. 2B, the edge of the blue organic light emitting layer 269B is separated in the in-plane direction from the edge of the green organic light emitting layer 269G, and there is a gap between them.

  An electron supply layer 271 is present on the organic light emitting layers 269B and 269G in contact with the organic light emitting layers 269B and 269G. The electron supply layer 271 is a layer common to all the sub-pixels. In the example of FIG. 2B, the electron supply layer 271 is continuous between the two sub-pixels 251R and 251B without being cut on the pixel definition layer 253. The electron supply layer 271 may be formed for each sub-pixel color.

  The cathode electrode 273 is in contact with the electron supply layer 271 on the electron supply layer 271. The cathode electrode 273 is a layer common to all the sub-pixels. In the example of FIG. 2B, the cathode electrode 273 is continuous between the two sub-pixels 251R and 251B without being cut on the pixel definition layer 253.

  FIGS. 2B, 2C, and 2D show the structure between and in the vicinity of the blue subpixel 251B and the green subpixel 251G. The above description with reference to FIG. 2B, FIG. 2C and FIG. 2D corresponds to the hole supplying layer 267R and the organic light emitting layer 269R of the red sub-pixel, and between the red sub-pixel 251R and the sub-pixels 251B and 251G of other colors. Applied to relationships.

  Before describing an example of a method of manufacturing the OLED display device 10 according to the present embodiment, hole supply using a metal mask according to the present embodiment will be described with reference to FIGS. 3A to 3C and FIGS. 4A to 4C. The deposition of organic materials such as layers will be briefly described. The description of the vapor deposition is the same as in the case of an organic material, for example, a light emitting material.

  FIG. 3A shows an example of the metal mask 400R corresponding to the pattern of the red sub-pixel R. As shown in FIG. The metal mask 400R has an opening 401R laid out corresponding to the pattern of the red sub-pixel R. The X direction indicates the left-right direction of the paper surface, and the Y direction indicates the up-down direction of the paper surface.

  FIG. 3B shows a cross-sectional view taken along the line IIIB-IIIB in FIG. 3A. FIG. 3C shows a cross-sectional view taken along the line IIIC-IIIC in FIG. 3A. The substrate 101A of FIG. 3B schematically shows the substrate 261 on which the pixel definition layer 253 is formed. The metal mask 400R is disposed (aligned) such that the organic material of the red sub-pixel R is vapor-deposited on a predetermined portion of the substrate 101A.

  The deposition source 500 shown in FIGS. 3B and 3C accommodates an organic material to be deposited inside. The vapor deposition source 500 contains, for example, the organic material of the red sub pixel R. The organic material contained in the deposition source 500 is heated, and the heated organic material is vaporized. The vaporized organic material is jetted out of the jet nozzle of a nozzle (not shown). The jetted organic material passes through the opening 401R of the metal mask 400R, and is vapor-deposited on a predetermined portion of the substrate 101A to form a film.

  The shape of the vapor deposition source 500 is, for example, a rectangular shape. As shown in FIG. 3B, the longitudinal direction of the deposition source 500 is along the X direction of FIG. 3A. Moreover, as shown to FIG. 3C, the transversal direction of the vapor deposition source 500 is along the Y direction of FIG. 3B. The deposition source 500 moves along the Y direction of FIG. 3A. This movement is indicated by arrows in the left and right direction of the drawing in FIG. 3C.

  The vapor deposition source 500 ejects the organic material in one direction in the X direction of FIG. 3A, as shown in FIG. 3B. This spouting state is indicated by the dotted arrow in FIG. 3B. Further, as shown in FIG. 3C, the deposition source 500 ejects the organic material in a plurality of directions in the Y direction. This ejection state is indicated by the dotted arrow in FIG. 3C.

  The shape of the taper of the organic material in the X direction and the shape of the taper of the organic material in the Y direction are different after deposition of the organic material due to the moving direction and the ejection state of the deposition source 500.

  FIG. 4A schematically shows a state in which the organic material of each color is deposited on the pixel definition layer 253. The organic layers 402R and 402Ra of the red pixel schematically show the hole supply layer and the organic light emitting layer of the red pixel described in FIG. The organic layer 402B of the blue pixel schematically shows the hole supply layer of the blue pixel and the organic light emitting layer. The organic layer 402G of the green pixel schematically shows the hole supply layer of the green pixel and the organic light emitting layer. The organic layer 402B for the blue pixel and the organic layer 402G for the green pixel are each deposited by a metal mask having an opening pattern different from the opening pattern in the metal mask 400R for red sub-pixel described in FIG. 3A.

  FIG. 4B is a cross-sectional view taken along the line IVB-IVB in FIG. 4A, and shows the tapered shape of the organic layers 402R and 402B in the X direction which is a direction in which the deposition source 500 does not move. FIG. 4C is a cross-sectional view taken along the line IVC-IVC in FIG. 4B, and shows the tapered shape of the organic layers 402R and 402Ra in the Y direction in which the deposition source 500 moves.

  As shown in FIGS. 4B and 4C, the taper in the X direction is sharper than the taper in the Y direction. Specifically, the angle of the inclined surface 402Rx of the organic layer 402R in FIG. 4B (the angle with respect to the flat portion of the pixel definition layer 253) is larger than the angle of the inclined surface 402Ry (see FIG. 4C) of the same organic layer 402R.

  Note that the taper in the X direction is steeper than that in the Y direction even in the case of the organic layer 402B of the blue pixel and the organic layer 402Ra of the red pixel, for example. The reason for this is that the deposition source 500 moves in the Y direction, and the ejection direction of the organic material is a plurality of directions in the Y direction, so the amount of the organic material deposited in the X direction per unit time is in the Y direction. It is because it tends to be large compared with the quantity of the organic material laminated | stacked. As described above, the taper of the organic layer is steep in the X direction in which the sub-pixels of different colors are arranged, so that the sub-pixels of different colors can be prevented from being in contact with each other.

  3A to 4C illustrate the case where the deposition source moves in one direction (for example, Y direction), but the so-called rotation is performed by depositing the organic material on the substrate 101A by rotating the deposition source or the substrate 101A. There is also a film forming method. In the case of this rotational film forming method, the shape of the taper of the sub pixel is different depending on the position of the sub pixel in the display panel.

  The phenomenon that the taper shape of the organic layer is different in each direction even in the same pixel like this is different from the case where the organic material is formed by sputtering or chemical vapor deposition (CVD), and the organic material is deposited using a metal mask. Is an inherent phenomenon that occurs in

[Production method]
An example of a method of manufacturing the OLED display device 10 will be described. In the following description, elements formed (simultaneously) in the same process are elements of the same layer. In the manufacture of the OLED display device 10, first, the TFT circuit layer 263 is formed on the insulating substrate 261. The formation of the TFT circuit layer 263 can use a known technique, and the detailed description is omitted. Next, an anode electrode is formed on the TFT circuit layer 263. For example, sputtering is used to form an anode electrode on the planarizing film in which the contact holes are formed.

The anode electrode is composed of upper ITO / Ag alloy / lower ITO. Transparent films such as ITO, IZO, ZnO, In ₂ O ₃ or the like instead of upper ITO, Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or metal compounds thereof instead of upper ITO The above-described transparent film may be used instead of the reflective film and the lower ITO. The layer configuration of the anode electrode is optional, and, for example, Al may be one layer. The anode electrode is connected to the pixel circuit in the TFT circuit layer 263 via the contact portion.

  Next, for example, a photosensitive organic resin film is deposited by spin coating or the like, and patterning is performed to form a pixel definition layer 253. An opening is formed in the pixel definition layer 253 by patterning, and the anode electrode of each sub-pixel is exposed at the formed opening. The pixel definition layer 253 separates the sub-pixels (light emitting regions).

  The manufacturing process after forming the pixel definition layer 253 will be described with reference to the flowchart of FIG. The hole supplying layer of the red sub-pixel is formed on the insulating substrate 261 on which the pixel defining layer 253 is formed (S101). Specifically, the material of the hole supply layer is attached to the substrate 261 on which the pixel definition layer 253 is formed by vapor deposition through a metal mask corresponding to the pattern of the red sub-pixel to supply the hole of the red sub-pixel. Deposit the layer. When the hole supply layer is formed of a plurality of layers including a hole injection layer and a hole transport layer, the layers are repeatedly formed. The thickness of the hole supply layer may be controlled due to the microcavity structure.

  Next, the hole supplying layer of the green sub pixel is formed on the insulating substrate 261 on which the pixel defining layer 253 is formed (S102). Specifically, the material of the hole supply layer is attached to the substrate 261 on which the pixel definition layer 253 is formed by vapor deposition through a metal mask corresponding to the pattern of the green sub-pixel to supply the hole of the green sub-pixel. Deposit the layer. When the hole supply layer is formed of a plurality of layers, the layers are repeatedly formed. The thickness of the hole supply layer may be controlled due to the microcavity structure.

  Next, the hole supplying layer of the blue subpixel is formed on the insulating substrate 261 on which the pixel defining layer 253 is formed (S103). Specifically, the material of the hole supply layer is attached to the substrate 261 on which the pixel definition layer 253 is formed by vapor deposition through a metal mask corresponding to the pattern of the blue sub-pixel to supply the hole of the blue sub-pixel. Deposit the layer. When the hole supply layer is formed of a plurality of layers, the layers are repeatedly formed. The thickness of the hole supply layer may be controlled due to the microcavity structure.

  As shown in FIGS. 2B and 2C, in the film formation of the hole supply layer of the sub-pixel of each color, the manufacturing step of this example has an area larger than the opening formed in the pixel definition layer 253 A hole supply layer is deposited. This takes into consideration the pattern accuracy of the metal mask, the deformation of the metal mask due to the heat during film formation, the alignment accuracy between the metal mask and the substrate, the incident angle of vapor deposition molecules, and the like. Steps S101, S102 and S103 are in random order.

  Next, an organic light emitting material is deposited on the hole supply layer to form an organic light emitting layer. An organic light emitting material is formed into a film for each of red, green and blue colors to form an organic light emitting layer on the hole supply layer. A metal mask is used to form an organic light emitting layer.

  First, an organic light emitting layer of a red subpixel is formed (S104). Specifically, the material of the red organic light emitting layer is deposited on the hole supplying layer of the red sub pixel by vapor deposition through a metal mask corresponding to the pattern of the red sub pixel to form a red organic light emitting layer Do.

  Next, the organic luminescent layer of the green subpixel is formed (S105). Specifically, the material of the green organic light emitting layer is deposited on the hole supplying layer of the green sub pixel by vapor deposition through a metal mask corresponding to the pattern of the green sub pixel to form a green organic light emitting layer Do.

  Next, the organic luminescent layer of the blue subpixel is formed (S106). Specifically, the material of the blue organic light emitting layer is deposited on the hole supplying layer of the blue sub pixel by vapor deposition through a metal mask corresponding to the pattern of the blue sub pixel to form a blue organic light emitting layer Do.

  Similarly to the hole supply layer, in forming the organic light emitting layers of the subpixels of each color, the organic light emitting layer is vapor-deposited on an area larger than the opening formed in the pixel defining layer 253. Further, the organic light emitting layer of each sub pixel is formed to cover the entire surface of the hole transport layer of the sub pixel. Steps S104, S105 and S106 are in random order.

  Next, the material of the electron supply layer 271 is attached onto the organic light emitting layer, and the electron supply layer 271 common to all the sub-pixels is formed (S107). The electron supply layer 271 is formed on the entire display region 125. The electron supply layer 271 is simultaneously formed on all the sub-pixels.

  Next, a metal material for the cathode electrode 273 is deposited on the electron supply layer 271 (S108). The cathode electrode 273 is formed on the entire display region 125. The cathode electrode 273 forms a film simultaneously on all the sub-pixels. The cathode electrode 273 is formed, for example, by depositing Li, Ca, LiF / Ca, LiF / Al, Al, Mg or an alloy of these. After the formation of the cathode electrode 273, an insulating film having a refractive index higher than that of glass may be deposited to form a cap layer in order to improve the light extraction efficiency.

  Next, a glass frit is coated on the outer periphery of the TFT substrate 100, and the sealing substrate 200 is placed thereon, and the glass frit portion is heated by a laser beam and melted to seal the TFT substrate 100 and the sealing substrate 200. Do.

  As described above, in the present embodiment, the organic light emitting layer of the sub-pixel of each color is formed to cover the whole surface of the hole supply layer. The hole supply layer and the organic light emitting layer can be formed by vapor deposition using different metal masks. FIG. 6 schematically shows the relationship between the metal mask 43 for the hole supply layer of the same color sub-pixel and the metal mask 45 for the organic light emitting layer.

  The metal mask 43 for the hole supply layer has an opening 432 laid out according to the pattern of the corresponding sub-pixel. The metal mask 45 for the organic light emitting layer has an opening 452 laid out according to the corresponding sub-pixel pattern. In FIG. 6, only one of the plurality of openings for the hole supply layer is indicated by the reference numeral 432, and only one of the plurality of openings for the organic light emitting layer is indicated by the reference numeral 452.

  As shown in FIG. 6, the openings 452 for the organic light emitting layer are larger than the openings 432 for the hole supply layer. The openings 452 for the organic light emitting layer have a shape and size that can accommodate the openings 432 for the hole supply layer. According to this relationship, the entire surface of the hole supply layer can be more reliably covered with the organic light emitting layer. For each of the red, blue and green sub-pixels, a metal mask 43 for the hole supply layer having the above relationship and a metal mask 45 for the organic light emitting layer are prepared.

FIG. 7 schematically shows a cross-sectional structure of a TFT substrate 100 manufactured using the metal mask for the hole supply layer and the metal mask for the organic light emitting layer having the above relationship with respect to the sub-pixels of each color.
Compared to the configuration example shown in FIG. 2B, the portion (margin) of the organic light emitting layer 269B of the blue subpixel outside the hole supply layer 267B of the blue subpixel is large. Similarly, the portion (margin) of the organic light emitting layer 269G of the green sub pixel outside the hole supply layer 267G of the green sub pixel is large.

Second Embodiment
The configuration and manufacturing method of the display area of Embodiment 2 will be described below. The differences from the first embodiment will be mainly described.

[Display area configuration]
FIG. 8A shows a plan view of a portion of the display area 125. FIG. 8A shows a plurality of sub-pixels arranged in a matrix. FIG. 8A shows a red subpixel (light emitting region) 251R, a blue subpixel (light emitting region) 251B, and a green subpixel (light emitting region) 251G. Of the sub-pixels in FIG. 8A, only one of each of red, blue and green is designated by a code.

  The layout of the sub-pixels shown in FIG. 8A is the same as the layout shown in FIG. 2A in the first embodiment. In this configuration example, the distance between the sub-pixels is short for high definition. The organic light emitting layers of subpixels of the same color are continuous. Specifically, the red organic light emitting layer 269R, the blue organic light emitting layer 269B, and the green organic light emitting layer 269G are not cut between the subpixels of the same color and are continuous.

  Although not shown in FIG. 8A, the same applies to the hole supply layer. That is, the hole supply layer of the red subpixel, the hole supply layer of the blue subpixel, and the hole supply layer of the green subpixel are not cut between the subpixels of the same color, but are continuous.

  Furthermore, adjacent organic light emitting layers of different colors are partially overlapped on the top surface of the pixel definition layer 253. In the example of FIG. 8A, the end of the red organic light emitting layer 269R is laminated on the end of the blue organic light emitting layer 269B, and the other end of the red organic light emitting layer 269R is on the end of the green organic light emitting layer 269G. Is stacked on. Further, the end of the green organic light emitting layer 269G is stacked on the end of the blue organic light emitting layer 269B.

  FIG. 8B schematically shows the relationship between the hole supplying layer 267B of the blue subpixel and the blue organic light emitting layer 269B. In this example, the hole supply layer 267B is continuous in the arrangement direction of the blue sub-pixels 251B. The hole supply layer 267B has one end between the blue sub-pixel 251B and the green sub-pixel 251G and has the other end between the blue sub-pixel 251B and the red sub-pixel 251R. The organic light emitting layer 269B is stacked on the hole supply layer 267B so as to cover the entire surface of the hole supply layer 267B including the ends on both sides of the hole supply layer 267B.

  FIG. 8C shows a part of the cross-sectional structure along the VIIIC-VIIIC cutting line in FIG. 8A. FIG. 8C schematically shows a stacking relationship of two hole supply layers 267B and 267G and two organic light emitting layers 269B and 269G between the blue sub-pixel 251B and the green sub-pixel 251G.

  As in the first embodiment, the hole supplying layer 267B of the blue subpixel is formed so as to cover a part of the top surface of the pixel defining layer 253 surrounding the periphery thereof. That is, the hole supply layer 267B is formed only on part of the top surface, and the end of the hole supply layer 267B is present on the top surface of the pixel definition layer 253. Immediately above the hole supply layer 267B, that is, on the hole supply layer 267B, a blue organic light emitting layer 269B is stacked so as to form an interface in contact with the hole supply layer 267B. The blue organic light emitting layer 269B covers the entire surface including both ends (entire ends) of the hole supply layer 267B.

  The green sub-pixel hole supply layer 267G is formed to cover a part of the top surface of the pixel definition layer 253 surrounding the periphery thereof. That is, the hole supply layer 267B is formed only on part of the top surface, and the end of the hole supply layer 267B is present on the top surface of the pixel definition layer 253.

  Furthermore, a part of the hole supply layer 267G of the green sub-pixel overlaps with a part of the hole supply layer 267B and the organic light emitting layer 269B of the blue sub-pixel on the top surface of the pixel definition layer 253. Specifically, the end of the hole supply layer 267G of the green sub-pixel is stacked directly on the end of the blue organic light emitting layer 269B. The end of the hole supply layer 267G of the green sub-pixel forms a laminated structure together with the end of the hole supply layer 267B of the blue sub-pixel and the end of the blue organic light emitting layer 269B.

  The end of the hole supply layer 267G of the green subpixel is between the end of the hole supply layer 267B of the blue subpixel and the end of the blue organic light emitting layer 269 and the blue subpixel 251B. The end of the hole supply layer 267B of the blue sub-pixel and the end of the blue organic light emitting layer 269 are between the end of the hole supply layer 267G of the green sub-pixel and the green sub-pixel 251G.

  An end of the blue organic light emitting layer 269B is present between an end of the hole supply layer 267B of the blue sub-pixel and an end of the hole supply layer 267B of the green sub-pixel. The end of the blue organic light emitting layer 269B completely covers the end of the hole supplying layer 267B of the blue subpixel, and the hole supplying layer 267B of the green subpixel is in contact with the hole supplying layer 267B of the blue subpixel Without being separated.

  As described above, in the configuration in which the hole supply layers of the adjacent subpixels partially overlap with high definition, the organic light emitting layer is present between the stacked hole supply layers of the adjacent subpixels. The organic light emitting layer covers the entire area including the end of the lower hole supply layer between the stacked hole supply layers, and separates the lower hole supply layer from the upper hole supply layer. ing. An organic light emitting layer having a low carrier mobility exists between the hole supplying layers of different colors, and blocks a leak path between the hole supplying layers.

  Also, as described in FIG. 2, even if the carrier mobility of the hole supply layer and the organic light emitting layer is approximately the same, holes move easily from the hole supply layer to the organic light emitting layer, but Since the energy barrier is large, the organic light emitting layer hardly moves from the organic light emitting layer to the hole supplying layer, so that the leak path between the stacked hole supplying layers is blocked. By these, the leak current between the hole supply layers can be prevented.

  A green organic light emitting layer 269G is stacked directly on the hole supplying layer 267G of the green sub-pixel, that is, on the hole supplying layer 267G to form an interface in contact with the hole supplying layer 267G. The green organic light emitting layer 269G covers the entire surface including both ends (entire ends) of the hole supply layer 267G.

  In the present example, the hole supply layer 267G is continuous in the arrangement direction of the green sub-pixels 251G. The hole supply layer 267B has one end between the blue sub-pixel 251B and the green sub-pixel 251G and has the other end between the blue sub-pixel 251B and the red sub-pixel 251R. The organic light emitting layer 269B is stacked on the hole supply layer 267B so as to cover the entire surface of the hole supply layer 267B including the ends on both sides of the hole supply layer 267B.

  The description with reference to FIGS. 8B and 8C applies to the relationship between the hole supplying layer 267R and the organic light emitting layer 269R of the red sub-pixel and the red sub-pixel 251R and the sub-pixels 251B and 251G of other colors. Ru. In the above example, the hole supplying layer 267R of the red sub-pixel is the upper layer of the green and blue organic light emitting layers 269G and 269B.

[Production method]
Hereinafter, a method of manufacturing the OLED display 1 having the above-described configuration according to the present embodiment will be described. FIG. 9 shows a flowchart of the manufacturing method of the present embodiment. The hole supply layer of the red sub-pixel is formed on the insulating substrate 261 on which the pixel definition layer 253 is formed (S131). Specifically, the material of the hole supply layer is attached to the substrate on which the pixel definition layer 253 is formed by vapor deposition through a metal mask corresponding to the pattern of the blue sub-pixel, and the hole supply layer of the blue sub-pixel is formed. To form a film.

  Next, a blue organic light emitting layer is formed (S132). Specifically, the material of the blue organic light emitting layer is deposited on the hole supplying layer of the blue sub pixel by vapor deposition through a metal mask corresponding to the pattern of the blue sub pixel to form a blue organic light emitting layer Do. As described above, the blue organic light emitting layer is stacked on the hole supplying layer of the blue sub-pixel so as to cover the entire surface including the end of the hole supplying layer of the blue sub-pixel.

  The metal mask of the hole supply layer of the blue subpixel and the metal mask of the blue organic light emitting layer may be the same or different. When a common metal mask is used, the film formation region of each of the hole supply layer and the organic light emitting layer can be controlled by controlling the incident angle of the material to the metal mask.

  Next, the hole supplying layer of the green sub-pixel is formed on the insulating substrate 261 on which the blue organic light emitting layer is formed (S133). Specifically, the material of the hole supply layer is attached onto the pixel definition layer 253 by vapor deposition through a metal mask corresponding to the pattern of the green subpixel, and the hole supply layer of the green subpixel is formed. .

  Next, a green organic light emitting layer is formed (S134). Specifically, the material of the green organic light emitting layer is deposited on the hole supplying layer of the green sub pixel by vapor deposition through a metal mask corresponding to the pattern of the green sub pixel to form a green organic light emitting layer Do. As described above, the green organic light emitting layer is stacked on the hole supplying layer of the green subpixel so as to cover the entire surface including the end of the hole supplying layer of the green subpixel. The metal mask of the hole supply layer of the green sub-pixel and the metal mask of the green organic light emitting layer may be common or different.

  Next, the hole supply layer of the red sub pixel is formed on the insulating substrate 261 on which the red organic light emitting layer is formed (S135). Specifically, the material of the hole supply layer is attached onto the pixel definition layer 253 by deposition through a metal mask corresponding to the pattern of the red sub-pixel to form a hole supply layer of the red sub-pixel. .

  Next, a red organic light emitting layer is formed (S136). Specifically, the material of the red organic light emitting layer is deposited on the hole supplying layer of the red sub pixel by vapor deposition through a metal mask corresponding to the pattern of the red sub pixel to form a red organic light emitting layer Do. As described above, the red organic light emitting layer is stacked on the hole supplying layer of the red sub pixel so as to cover the entire surface including the end of the hole supplying layer of the red sub pixel. The metal mask of the hole supply layer of the red sub-pixel and the metal mask of the red organic light emitting layer may be common or different.

  As described above, pairs of hole supply layers and organic light emitting layers of subpixels of different colors are sequentially formed. The formation order of the sub-pixel pairs of different colors is arbitrary. As described above, according to the manufacturing method of this embodiment, immediately after forming the hole supply layer of the subpixel of one color, before forming the hole supply layer of the other color, the subpixel of the same color is formed. Form an organic light emitting layer of Thereby, in the configuration in which the end portions of the hole supply layers of the sub-pixels of different colors overlap, an organic light emitting layer having a carrier mobility smaller than that of the hole supply layer can be formed between them. Leakage current between the hole supply layers can be effectively prevented.

  Next, the material of the electron supply layer 271 is attached, and the electron supply layer 271 common to all the sub-pixels is formed (S137). The electron supply layer 271 is formed on the entire display region 125. Next, a metal material for the cathode electrode 273 is deposited on the electron supply layer 271 (S138). The formation of the electron supply layer 271 and the cathode electrode 273 is the same as in the first embodiment. The manufacturing method of the present embodiment can also manufacture the OLED display device 1 having the configuration described in the first embodiment.

Embodiment 3
Below, the manufacturing method of Embodiment 3 is demonstrated. The differences from the other embodiments will be mainly described. In the present embodiment, the hole supply layers of subpixels of all colors are simultaneously formed. FIG. 10 schematically shows a configuration example of the metal mask 41 used for forming the hole supply layer. The metal mask 41 has an opening 412R for the hole supplying layer of the red sub-pixel, an opening 412B for the hole supplying layer of the blue sub-pixel, and an opening 412G for the hole supplying layer of the green sub-pixel. . FIG. 10 shows only one opening for each color. The aperture pattern matches the pattern of the sub-pixels.

  FIG. 11 shows a flowchart of a manufacturing method for forming a hole supply layer using the metal mask 41 shown in FIG. The hole supply layers of all the sub-pixels are formed on the insulating substrate 261 on which the pixel definition layer 253 is formed (S151). Specifically, the material of the hole supply layer is attached to the substrate 261 on which the pixel definition layer 253 is formed by vapor deposition through the metal mask 41 having the opening patterns for all the sub-pixels shown in FIG. , Forming the hole supply layers of all the sub-pixels. By using the common metal mask 41, the hole supply layer can be efficiently formed.

  Next, the organic light emitting layer of the blue sub-pixel, the organic light emitting layer of the green sub-pixel, and the organic light emitting layer of the red sub-pixel are sequentially formed on the hole supply layer by vapor deposition using different metal masks. S152, S153, and S154). As in the other embodiments, the organic light emitting layer of each color sub-pixel is formed to cover the entire surface of the corresponding hole supply layer. In addition, the order of forming the organic light emitting layers of three colors is arbitrary.

  Next, the material of the electron supply layer is attached, and an electron supply layer common to all the sub-pixels is formed (S155). The electron supply layer is formed on the entire display region 125. Next, the electron supply layer of the red sub-pixel (only) is formed, for example, by vapor deposition using a metal mask (S156). Next, an electron supply layer of green sub-pixels (only) is formed, for example, by vapor deposition using a metal mask (S157).

  By selectively adding the electron supply layers of the red sub-pixel and the green sub-pixel, it is possible to control the thickness of the electron supply layer of each color sub-pixel due to the microcavity structure. The order of the formation of the electron supply layer of the red sub-pixel and the formation of the electron supply layer of the green sub-pixel is arbitrary. After forming the electron supply layer common to all the sub-pixels, form the electron supply layer common to the red sub-pixel and the green sub-pixel (except for the blue sub-pixel), and then the electron supply layer of the red sub-pixel (only) May be formed. If the microcavity structure is unnecessary, only a common electron supply layer may be formed for all the sub-pixels.

  Next, a metal material for the cathode electrode is deposited on the electron supply layer (S158). The formation of the cathode electrode is the same as in the first embodiment.

  Various cross sectional structures of the OLED device will be described with reference to FIGS. 12 to 16. Although a pixel circuit for driving the OLED device of the sub-pixel is formed under the anode electrode of the sub-pixel, illustration of the pixel circuit is omitted. FIG. 12 schematically shows an example of the cross-sectional structure of the TFT substrate 100. As shown in FIG. A hole injection layer 266R and a hole transport layer 268R are formed on the anode electrode 265R of the red sub-pixel. A hole injection layer 266G and a hole transport layer 268G are formed on the anode electrode 265G of the green subpixel. A hole injection layer 266B and a hole transport layer 268B are formed on the anode electrode 265B of the blue subpixel.

  As the dashed circle Fa indicates, the organic light emitting layer 269R of the red sub-pixel covers the hole injection layer 266R and the hole transport layer 268R. Furthermore, the organic light emitting layer 269G of the green sub-pixel covers the hole injection layer 266G and the hole transport layer 268G. Also, the organic light emitting layer 269B of the blue sub-pixel covers the hole injection layer 266B and the hole transport layer 268B. This makes it possible to prevent carrier leak even when part of the hole injection layer / hole transport layer of the sub-pixels of different colors overlap due to misalignment of the metal mask or the like. That is, when the distance between the two subpixels is shortened to realize high definition, the hole supply layers of adjacent subpixels may partially overlap. However, even in this case, as described in FIG. 8C, the leak path can be blocked by laminating the organic light emitting layer having a small carrier mobility between the hole supplying layers of different colors.

  FIG. 13 schematically shows an example of the cross-sectional structure of the TFT substrate 100. As shown in FIG. An electron supply layer is formed for each sub-pixel. The red sub-pixel, the green sub-pixel, and the blue sub-pixel each include an electron supply layer 271R, an electron supply layer 271G, and an electron supply layer 271B, which are separated.

  As indicated by the dashed circle Fb, the cathode electrode 273 is in contact with the pixel definition layer 253. The cathode electrode 273 is formed between the hole transport layer 268R and the hole transport layer 268G. With this structure, for example, the current leaked from the hole transport layer 268R is drawn to the cathode electrode 273 and therefore does not flow to the hole transport layer 268G of the green sub-pixel next to the red sub-pixel. That is, leakage current does not flow between adjacent subpixels. If the hole injection layer / hole transport layer of adjacent pixels do not overlap at all (if separated), the layer structure on the pixel definition layer 253 is optional.

  FIG. 14 schematically shows an example of the cross-sectional structure of the TFT substrate 100. As shown in FIG. The electron supply layer 271 is common to all the sub-pixels. As indicated by the dashed circle Fc, the electron supply layer 271 is in contact with the pixel definition layer 253. The electron supply layer 271 is formed between the hole transport layer 268R and the hole transport layer 268G. This structure suppresses, for example, the flow of current in the hole transport layer 268R to the hole transport layer 268G of the green sub-pixel next to the red sub-pixel.

  That is, it is suppressed that the leak current flows between the adjacent sub-pixels via the electron supply layer 271. Since the resistance of the electron supply layer 271 is large (energy barrier), such suppression can be realized. If the hole injection layer / hole transport layer of adjacent pixels do not overlap at all (if separated), the layer structure on the pixel definition layer 253 is optional.

  FIG. 15 schematically shows an example of the cross-sectional structure of the TFT substrate 100. As shown in FIG. The red sub-pixel includes a lower hole transport layer 681R and an upper hole transport layer 682R, which are two hole transport layers, between the organic light emitting layer 269R and the hole injection layer 266R. The green sub-pixel includes a lower hole transport layer 681G and an upper hole transport layer 682G, which are two hole transport layers, between the organic light emitting layer 269G and the hole injection layer 266G. The blue sub-pixel includes only one hole transport layer 681 B between the organic light emitting layer 269 B and the hole injection layer 266 B. The cathode electrode and the electron supply layer 273a are in contact with the organic light emitting layers 269R, 269G, and 269B. As described above, the electron supply layer is composed of the electron injection layer and the electron transport layer, or is composed of one or more layers having the function of these layers.

  The hole injection layer (266R, 266G, 266B) of each color, the lower hole transport layer (681R, 681G), and the blue hole transport layer 681B are formed separately using the same metal mask. There is. The organic light emitting layer 269R and the hole transport layer 682R of the red subpixel are formed using the same metal mask. The organic light emitting layer 269G and the hole transport layer 682G of the green subpixel are formed using the same metal mask. The organic light emitting layer 269R of the blue subpixel is formed alone without sharing the metal mask with other layers.

  As described above, the lower hole transport layer (681R, 681G) for the red and green subpixels and the single hole transport layer 681B for the blue pixel are formed in common, and red and green are further formed. For the sub-pixel, the upper hole transport layer (266R, 266G) is formed. By this formation, the film thickness of the hole transport layer of each color is adjusted to realize the microcavity structure. The cathode electrode and the electron supply layer 273a are formed in the state of not being separated (so-called common layer) using the same metal mask.

  Here, a shift that occurs when the metal mask is disposed on the substrate, that is, a shift that occurs when the substrate and the metal mask are superimposed will be described. When disposing a metal mask on a substrate, it is difficult to eliminate the misalignment. Therefore, in the design of this arrangement, an allowable condition for the misalignment is defined. Examples of acceptable conditions include tight tolerance conditions (e.g., deviation less than +/- 2 um) and loose allowance conditions (e.g., less than +/- 5 um).

  The organic light emitting layer 269R and the hole transport layer 682R of the red sub-pixel are formed using a metal mask which can be positioned so as to satisfy the strict tolerance condition. The organic light emitting layer 269G and the hole transport layer 682G of the green sub-pixel are misaligned on the blue sub-pixel side (right side in FIG. 15), and are not positioned so as to meet strict tolerance conditions It is formed using a metal mask. Similarly, the organic light emitting layer 269R of the red sub-pixel is misaligned on the green sub-pixel side (the right side of FIG. 15), and a metal mask is positioned so as not to meet strict tolerance conditions but to loose tolerance conditions. It is formed using.

  In the adjacent sub-pixels, the end of the anode electrode of the first sub-pixel (for example, red sub-pixel) and the end of the anode electrode of the second sub-pixel (for example, green sub-pixel) adjacent to the first sub-pixel The hole supply layer and the organic light emitting layer are vapor-deposited so that the separated portions of the hole supply layer and the organic light emitting layer fit in the region RNG1 between them.

  FIG. 16 schematically shows an example of the cross-sectional structure of the TFT substrate 100. As shown in FIG. The cathode electrode and the electron supply layer 273a are in contact with the organic light emitting layers 269R, 269G, and 269B. The organic light emitting layer 269R, the hole transport layer 268R, and the hole injection layer 266R of the red subpixel are formed using the same metal mask. The organic light emitting layer 269G, the hole transport layer 268G, and the hole injection layer 266G of the green subpixels are formed using the same metal mask.

  The organic light emitting layer 269B, the hole transport layer 268B, and the hole injection layer 266B of the blue subpixel are formed using the same metal mask. Note that the cathode electrode and the electron supply layer 273a are formed in the state of not being separated (so-called common layer) using the same metal mask.

  The organic light emitting layer 269R, the hole transport layer 268R, and the hole injection layer 266R of the red sub-pixel cause misalignment on the green sub-pixel side (right side of FIG. It is formed using a metal mask which can be positioned to meet the conditions.

  The organic light emitting layer 269G, the hole transport layer 268G, and the hole injection layer 266G of the green sub-pixel are formed using a metal mask that can be positioned to meet strict tolerance conditions. The organic light emitting layer 269B, the hole transport layer 268B, and the hole injection layer 266B of the blue subpixel do not satisfy the misalignment condition on the green subpixel side (the left side of FIG. 15). It is formed using a metal mask positioned to satisfy the conditions.

  Even in the case where the misalignment described above occurs, conventionally, a non-defective product can not be manufactured unless the strict tolerance condition is satisfied. However, if the loose tolerance condition is satisfied by adopting the configuration of the present application, Since the organic light emitting layers of different colors can be separated, a non-defective product can be obtained and the manufacturing yield can be improved.

Fourth Embodiment
First, an outline of the fourth embodiment will be described. In order to realize high definition, the distance between subpixels is shortened. When this distance becomes short, as shown in FIG. 8C, the organic light emitting layer of a certain sub pixel may enter the hole supply layer of the sub pixel adjacent to this sub pixel due to the misalignment of the metal mask or the like. is there. In the fourth embodiment, a laminated structure will be described in which the deterioration of the image quality due to the crosstalk between the sub-pixels is further suppressed even when the intruding occurs.

  In order to make the OLED element emit light, it is necessary to flow a current to the OLED element above the emission threshold voltage. The light emission threshold voltage means a voltage at which the OLED element emits light when current flows above this voltage. For example, in order to cause the blue subpixel 251B to emit light, it is necessary to flow a current from the anode electrode 265B to the cathode electrode 273 (see FIG. 8) at a light emission threshold voltage or more of the blue subpixel 251B. The light emission threshold voltages (hereinafter referred to as threshold voltages as appropriate) of the sub-pixels of different colors are different. For example, the threshold voltage of the blue OLED device is higher than the threshold voltage of the green OLED device. And, the threshold voltage of the green OLED element is higher than the threshold voltage of the red OLED element.

  In the fourth embodiment, crosstalk between subpixels is suppressed by devising the layer structure of the organic luminescent layer or the like of each color by utilizing the fact that the luminescence threshold voltages of the subpixels of different colors are different. The configuration and manufacturing method of the display area of the fourth embodiment will be described below. The differences from the first embodiment will be mainly described.

  FIG. 17 shows a plan view of part of the display area 125. FIG. 17 shows a plurality of sub-pixels arranged in a matrix. FIG. 17 shows a red sub-pixel (light emitting area) 251R, a blue sub-pixel (light emitting area) 251B, and a green sub-pixel (light emitting area) 251G. Of the subpixels in FIG. 17, only one subpixel of red, blue and green is designated by a code.

  In the layout of the subpixels shown in FIG. 17, the plurality of subpixels are arranged in a matrix. Unlike the layout shown in FIG. 2A in the first embodiment, sub-pixels of the same color are not arranged in the column direction (vertical direction in FIG. 17). That is, the red subpixel 251R is adjacent to the blue subpixel 251B in the matrix direction, and the green subpixel 251G is adjacent to the blue subpixel 251B in the matrix direction. The row direction is the X direction, and the column direction is the Y direction.

  In other words, in the pixel layout of FIG. 17, the blue subpixel 251B having the highest threshold voltage among the threshold voltages of the red subpixel 251R, the blue subpixel 251B, and the green subpixel 251G is the red subpixel 251R and the green subpixel. It is arranged to surround 251G. In addition, one main pixel is configured by two blue sub-pixels adjacent in the diagonal direction, one red sub-pixel similarly adjacent in the diagonal direction, and one green sub-pixel. In FIG. 17, one main pixel 600 is indicated by an alternate long and short dash line.

  FIG. 18 shows a first cross-sectional view taken along line XVIII-XVIII in FIG. Embodiment 4 schematically shows a layer structure in which a red organic light emitting layer 269R and a green organic light emitting layer 269G are stacked on the upper layer (upper layer) of the blue organic light emitting layer 269B. In other words, the blue organic light emitting layer 269B is stacked on the lower layer (lower layer) of the red organic light emitting layer 269R and the green organic light emitting layer 269G. The upper side is indicated by an arrow UP, and the lower side is indicated by an arrow DW.

  For example, as indicated by a symbol RB1 indicated by an alternate long and short dash line, the upper side of the top surface 253a1 of the first pixel definition portion 253a disposed between the blue subpixel 251B and the red subpixel 251R adjacent to the blue subpixel 251B. , The end of the blue organic light emitting layer 269B of the blue sub-pixel 251B is in contact with the hole supply layer of the red sub-pixel 251R (for example, the hole injection layer 266R and the hole transport layer 268R of the red sub-pixel). .

  Furthermore, as indicated by a symbol RB2 indicated by an alternate long and short dash line, the upper side of the top surface 253b2 of the second pixel definition portion 253b1 disposed between the blue subpixel 251B and the green subpixel 251G adjacent to the blue subpixel 251B. , The edge of the blue organic light emitting layer 269B of the blue sub-pixel 251B is in contact with the hole supply layer of the green sub-pixel 251G (for example, the hole injection layer 266G and the hole transport layer 268G of the green sub-pixel). .

  When the red subpixel 251R is made to emit light and the blue subpixel 251B (or the green subpixel 251G) is not made to emit light, the pixel circuit (not shown) of the red subpixel 251R is not less than the threshold voltage of the red subpixel 251R. A current less than the threshold voltage (hereinafter referred to as a drive current for the red sub-pixel) is allowed to flow from the anode electrode 265R to the cathode electrode 273a. The red organic light emitting layer 269R emits light by this current.

  As indicated by symbol RB1, the left end of the blue organic light emitting layer 269B is in contact with the hole injection layer 266R and the hole transport layer 268R. Therefore, even if the contact area is small, the drive current of the red sub-pixel 251R may flow into the blue organic light-emitting layer 269B when the red pixel 251R emits light. However, since the voltage of the drive current of the red sub-pixel 251R is smaller than the threshold voltage of the blue pixel 251B, the blue pixel 251B does not emit light.

  That is, it is possible to suppress unintended light emission of the adjacent blue pixel 251B when the red sub-pixel 251R emits light. Here, it is assumed that the blue sub-pixel 251B emits light and the red sub-pixel 251R does not emit light. In this case, as described in FIG. 2, the holes hardly move from the organic light emitting layer to the hole supply layer because the energy barrier to the holes is large. Therefore, the drive current of the blue sub-pixel 251B does not flow to the hole injection layer 266R.

  In order to form the layer structure shown in FIG. 18, a hole transport layer and an organic light emitting layer are vapor-deposited using a metal mask for each color. That is, a hole injection layer, a hole transport layer, and an organic light emitting layer of the same color are vapor-deposited using one metal mask. See FIG. 3A for the metal mask for the red sub-pixel.

  However, in production, the hole injection layer and the hole transport layer may be deposited in the first chamber, and the organic light emitting layer may be deposited in the second chamber different from the first chamber. In addition, it is preferable to reliably cover the end of the hole supply layer including the hole injection layer and / or the hole transport layer with the organic light emitting layer. Therefore, the same color hole supply layer and the organic light emitting layer are deposited using two different metal masks.

  FIG. 19 shows a second cross-sectional view taken along line XVIII-XVIII in FIG. FIG. 19 illustrates a structure in which the end of the hole supply layer is reliably covered with the organic light emitting layer. A layer structure in which a red organic light emitting layer 269R and a green organic light emitting layer 269G are laminated on the upper layer of the blue organic light emitting layer 269B as schematically described in the cross sectional view of FIG. 18 is schematically shown in FIG. . As shown in FIG. 19, the thickness of the end portion of the organic light emitting layer covering the entire surface of the end of the hole transport layer is increased. For example, as indicated by a symbol RB2, the thickness of the end 269R1 of the red organic light emitting layer 269R covering the entire right end of the hole transport layer 268R is increased. By thus increasing the thickness of the end portion of the organic light emitting layer, the leak path is surely cut off.

  20 and 21 are diagrams for explaining the metal mask used to form the layer structure described in the cross-sectional view of FIG. The metal mask 47 of FIG. 20 is a metal mask used to form, for example, a hole supply layer for blue. The metal mask 47 has an opening 461B for the hole supplying layer of the blue sub-pixel. The vertical length of the opening 461B is L1, and the horizontal length is W1.

  Next, the metal mask 49 of FIG. 21 is a metal mask used to form, for example, an organic light emitting layer for blue. The metal mask 49 has an opening 463 B for the organic light emitting layer of the blue sub-pixel. The vertical length of the opening 463B is L2 longer than the length L1. The horizontal length of the opening 463B is W2 longer than the length W1.

  Thus, the organic light emitting layer which covers the entire surface of the end of the hole transport layer by making the width and width of the opening of the metal mask for the hole supply layer larger than the width and width of the opening of the metal mask for the organic light emitting layer Increase the thickness of the end of the

  In the layer structure of the fourth embodiment, as described in FIGS. 18 and 19, the red organic light emitting layer 269R and the green organic light emitting layer 269G are stacked on the upper layer (upper layer) of the blue organic light emitting layer 269B. In order to realize this layer structure, first, the blue sub-pixel hole supply layer and the organic light emitting layer are formed, and then the green sub-pixel and the red sub-pixel hole supply layer and the organic light emitting layer are formed. Do.

  Hereinafter, the manufacturing process after forming the pixel definition layer 253 in the fourth embodiment will be described with reference to the flowchart of FIG. First, a hole supplying layer of blue subpixels is formed on the insulating substrate 261 on which the pixel defining layer 253 is formed (S161). Specifically, the material of the hole supply layer is attached to the substrate 261 on which the pixel definition layer 253 is formed by vapor deposition through the metal mask 47 corresponding to the pattern of the blue subpixel shown in FIG. The hole supply layer of the sub-pixel is formed. When the hole supply layer is formed of a plurality of layers including a hole injection layer and a hole transport layer, the layers are repeatedly formed. The thickness of the hole supply layer may be controlled due to the microcavity structure.

  Next, an organic light emitting layer of blue subpixels is formed (S162). Specifically, the material of the blue organic light emitting layer is deposited on the hole supplying layer of the blue sub pixel by vapor deposition through the metal mask 49 corresponding to the pattern of the blue sub pixel shown in FIG. An organic light emitting layer is formed.

  Next, the hole supplying layer of the green sub-pixel is formed on the insulating substrate 261 on which the pixel defining layer 253 is formed (S163), and the organic light emitting layer of the green sub-pixel is formed (S164). Forming a layer (S165), forming an organic light emitting layer of a red subpixel (S166), forming an electron supply layer 271 common to all the subpixels (S167), and forming a cathode electrode 273 on the electron supply layer 271. A metal material is attached (S168).

  The details of steps S163 to S168 have been described in S102, S105, S103, S106, S107, and S108 of FIG. 5, respectively, and thus detailed description of these steps is omitted. Note that the order of the formation of the hole supply layer and the organic light emitting layer of the green subpixel (S163, S164) and the formation of the hole supply layer of the red subpixel and the organic light emitting layer (S165, S166) are changed. Also good (in any order).

  As described above, in the fourth embodiment, since the organic layers of the respective colors are stacked focusing on the light emission threshold voltage of each color, even if overlapping of different light emitting layers occurs, deterioration of the image quality due to crosstalk between sub-pixels Can be further suppressed.

  The display area 125 described in each of the above embodiments has a top emission pixel structure. In the top emission type pixel structure, a cathode electrode 273 common to a plurality of pixels is disposed on the light emission side (upper side in the drawing). The cathode electrode 273 has a shape that completely covers the entire surface of the display area 125. The features of the present disclosure can also be applied to an OLED display having a bottom emission pixel structure. The bottom emission pixel structure has a transparent anode electrode and a reflective cathode electrode, and emits light to the outside through the TFT substrate 100.

  The pixel arrangement of the display area 125 described in each of the above-described embodiments is a so-called stripe arrangement in which sub-pixel rows of three colors are cyclically arranged. The features of the present disclosure can be applied to a pixel array composed of pixel columns including sub-pixels of different colors, and can be applied to various pixel arrays such as a mosaic array and a pental array.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to said embodiment. Those skilled in the art can easily change, add, or convert the elements of the above-described embodiment within the scope of the present invention. It is possible to replace part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment.

DESCRIPTION OF SYMBOLS 10 OLED display device, 41, 43, 45 metal mask, 100 TFT substrate, 114 cathode electrode formation area, 125 display area, 131 scanning driver, 132 emission driver, 133 protection circuit, 200 sealing board, 251 B blue sub pixel, 251 G Green subpixel, 251R red subpixel, 253 pixel definition layer, 261 insulating substrate, 263 circuit layer, 265R red subpixel anode, 265B blue subpixel anode, 265G green subpixel anode electrode, 266R red subpixel Hole injection layer, hole injection layer of 266G green subpixel, hole injection layer of 266B blue subpixel, hole supply layer of 267B blue subpixel, hole supply layer of 267G green subpixel, 267R red subpixel Hole supply layer, 268R red sub-pixel hole transport layer, 268G green sub-pixel hole transport layer, 268B Blue sub-pixel hole transport layer, 269 B Blue organic light-emitting layer, 269 G green organic light-emitting layer, 269 R red organic light-emitting layer, 271 electron supply layer, 273 cathode electrode, 300 junction, 412 B Blue sub-pixel opening, 412 G green Sub-pixel aperture, 412R red subpixel opening, 452 aperture

Claims (14)

A plurality of sub-pixels arranged on the surface of the substrate;
A pixel definition layer surrounding a light emitting area of each of the plurality of sub-pixels;
Each of the plurality of sub-pixels is
Upper electrode,
Lower electrode,
An organic light emitting layer laminated with the upper electrode and the lower electrode between the upper electrode and the lower electrode;
A lower carrier supply layer laminated with the lower electrode and the organic light emitting layer between the lower electrode and the organic light emitting layer;
The lower carrier supply layer is
Contact each of the lower electrode and the organic light emitting layer,
Supplying a carrier from the lower electrode to the organic light emitting layer;
Covering the entire surface within the opening of the pixel definition layer of the lower electrode;
Having an end on the top surface of the pixel definition layer surrounding the lower electrode;
The organic light emitting layer covers the entire surface of the lower carrier supply layer including the end of the lower carrier supply layer.
OLED display. An OLED display device according to claim 1, wherein
The first end including the end of the lower carrier supply layer overlaps the second end of the lower carrier supply layer of the adjacent sub-pixel of different color on the top surface of the pixel definition layer;
A portion of the organic light emitting layer is laminated between the first end and the second end such that the first end is separated from the second end.
OLED display. An OLED display device according to claim 1, wherein
The end of the lower carrier supply layer is spaced in the in-plane direction of the substrate from the lower carrier supply layer of an adjacent sub-pixel of different color,
An end of the organic light emitting layer is formed on the top surface of the pixel defining layer between the end of the lower carrier supply layer and a lower carrier supply layer of the adjacent sub-pixel of different color.
OLED display. An OLED display device according to claim 1, wherein
The at least three sub-pixels are sub-pixels that emit different first to third colors,
The organic light emitting layer of the first color sub-pixel covers the entire surface including the end of the lower carrier supply layer of the first color sub-pixel,
In the upper side of the top surface of the first pixel defining portion disposed between the first color sub-pixel and the second color sub-pixel adjacent to the first color sub-pixel, the first color Contacting an end portion of the organic light emitting layer of the sub pixel and the lower carrier supply layer of the second color sub pixel;
The light emission threshold voltage of the first color sub pixel is higher than the light emission threshold voltage of the second color sub pixel.
OLED display. An OLED display as claimed in claim 4, wherein
In the upper side of the top surface of the second pixel definition portion disposed between the first color sub-pixel and the third color sub-pixel adjacent to the first color sub-pixel, the first color Contacting an end portion of the organic light emitting layer of the sub pixel and a lower carrier supply layer of the third color sub pixel;
The light emission threshold voltage of the first color sub pixel is higher than the light emission threshold voltage of the third color sub pixel.
OLED display. An OLED display device according to claim 5, wherein
The plurality of sub-pixels are arranged in a matrix,
The second color sub-pixel is adjacent to the first color sub-pixel in the matrix direction,
The third color sub-pixel is adjacent to the first color sub-pixel in the matrix direction.
OLED display. An OLED display as claimed in claim 3, wherein
An upper carrier supply common to the plurality of sub-pixels stacked in contact with the organic light-emitting layer and the upper electrode between the organic light-emitting layer of the plurality of sub-pixels and the upper electrode of the plurality of sub-pixels Further include layers,
The upper electrode of each of the plurality of sub-pixels is a part of one common upper electrode layer,
The end of the organic light emitting layer of each of the plurality of sub-pixels is formed between the upper carrier supply layer and the end of the lower carrier supply layer on the top surface of the pixel definition layer. ,
OLED display. An OLED display device according to claim 1, wherein
An upper carrier supply common to the plurality of sub-pixels stacked in contact with the organic light-emitting layer and the upper electrode between the organic light-emitting layer of the plurality of sub-pixels and the upper electrode of the plurality of sub-pixels Further include layers,
The upper electrode of each of the plurality of sub-pixels is a cathode electrode, and is a part of one common cathode electrode layer,
The upper carrier supply layer is an electron supply layer,
The lower electrode is an anode electrode,
The lower carrier supply layer is a hole supply layer,
OLED display. A method of manufacturing an OLED display, comprising
Forming a lower electrode of the sub-pixel on the substrate;
Forming a pixel definition layer including an opening through which the lower electrode is exposed on the substrate on which the lower electrode is formed;
A first lower carrier supply layer is formed on the first lower electrode of the first color sub-pixel and the pixel defining layer, and each of the first lower carrier supply layers is formed with the first lower electrode at the opening. A third step contacting and covering the entire surface of the first lower electrode and having an end on the top surface of the pixel definition layer surrounding the first lower electrode;
A second lower carrier supply layer is formed on the second lower electrode of the second color sub-pixel and the pixel defining layer, and each of the second lower carrier supply layers is formed with the second lower electrode at the opening. A fourth step in contact with and covering the entire surface of the second lower electrode and having an end on the top surface of the pixel definition layer surrounding the second lower electrode;
A third lower carrier supply layer is formed on the third lower electrode of the third color sub-pixel and the pixel definition layer, and each of the third lower carrier supply layers is formed with the third lower electrode at the opening. A fifth step covering an entire surface of the third lower electrode in contact and having an end on a top surface of the pixel definition layer surrounding the third lower electrode;
The first organic light emitting layer of each of the first color sub-pixels is in contact with the first lower carrier supply layer and covers the entire surface of the first lower carrier supply layer including the end of the first lower carrier supply layer. Form the sixth step;
Forming a second organic light emitting layer in contact with the second lower carrier supply layer and covering the entire surface of the second lower carrier supply layer including the end of the second lower carrier supply layer;
Forming a third organic light emitting layer in contact with the third lower carrier supply layer and covering the entire surface of the third lower carrier supply layer including the end of the third lower carrier supply layer;
Method including. The method according to claim 9, wherein
Performing the sixth step after the third step;
Performing the fourth step after the sixth step;
Performing the seventh step after the fourth step;
Performing the fifth step after the seventh step;
Performing the eighth step after the fifth step;
Method. The method according to claim 9, wherein
After the third step, the fourth step and the fifth step, the sixth step, the seventh step and the eighth step are executed.
Method. The method according to claim 9, wherein
The third step, the fourth step and the fifth step are performed simultaneously by vapor deposition using one metal mask,
Method. The method according to claim 9, wherein
Performing the third step by deposition using a first metal mask;
Performing the sixth step by deposition using a second metal mask having an opening larger than the first metal mask;
Performing the fourth step by deposition using a third metal mask;
Performing the seventh step by deposition using a fourth metal mask having an opening larger than the third metal mask;
Performing the fifth step by vapor deposition using a fifth metal mask;
Performing the eighth step by deposition using a sixth metal mask having an opening larger than the fifth metal mask;
Method. The method according to claim 9, wherein
The at least three sub-pixels are sub-pixels that emit different first to third colors,
The organic light emitting layer of the first color sub-pixel covers the entire surface including the end of the lower carrier supply layer of the first color sub-pixel,
In the upper side of the top surface of the first pixel defining portion disposed between the first color sub-pixel and the second color sub-pixel adjacent to the first color sub-pixel, the first color Contacting an end portion of the organic light emitting layer of the sub pixel and the lower carrier supply layer of the second color sub pixel;
The light emission threshold voltage of the first color sub pixel is higher than the light emission threshold voltage of the second color sub pixel.
Method.

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