JP2012151418A - Suction stage - Google Patents

Abstract

A suction stage capable of holding a target workpiece in a flat state without causing an increase in work time or a reduction in product system.
A suction stage (40) that holds a target workpiece 22 on which a predetermined mask pattern is exposed by forming an exposure light image on a flat mounting surface 40b, the target workpiece 22 against the mounting surface 40b. The fixed suction mechanism 60 capable of sucking the target work 22 to fix the posture of the head and the flat suction mechanism 70 capable of sucking the target work 22 so as to come into surface contact with the placement surface 40b. The plurality of flat surface suction holes 71 that open the mounting surface 40b are provided, and the suction operation by the flat surface suction holes 71 is started sequentially from an arbitrary point on the mounting surface 40b toward the outer edge.
[Selection] FIG.

Description

  The present invention relates to a suction stage that holds a substrate such as a printed circuit board or a liquid crystal substrate by suction, and an exposure apparatus on which the suction stage is mounted.

  A photolithography method in which a predetermined mask pattern is exposed to the surface of a target work coated with a photosensitive material such as a photoresist by an exposure apparatus and then formed on the substrate by an etching process is widely applied in various fields. In addition, printed wiring boards, liquid crystal substrates, and the like are also manufactured using an exposure apparatus. Some exposure apparatuses form a predetermined mask pattern on the target work by forming an image of the exposure light transmitted through the mask on which the predetermined pattern is formed on the target work with a projection lens. In this exposure apparatus, in order to form an image at a desired position on the target workpiece, it is known to use a suction stage that holds the target workpiece by suction (for example, see Patent Document 1).

  In the suction stage of this conventional exposure apparatus, a substrate clamp table as a mounting table is provided with a receiving pin that can be moved up and down through a through hole and a suction pad formed by a hole. In this suction stage, the target workpiece transported by the transport arm is received by the upper end of the receiving pin protruding from the mounting surface of the substrate clamp table, and after the transport arm is retracted, the receiving pin is lowered to lower the target workpiece. It is possible to hold the work by placing the work on the placement surface of the substrate clamp table and sucking the target work with the suction pad.

JP 2004-186681 A

  By the way, in the exposure apparatus, since the mask pattern is formed on the target workpiece by imaging of exposure light, the target workpiece held on the mounting surface may be flat with respect to the imaging plane. Desired. However, in the above-described conventional suction stage, it is simply placed on the substrate clamp table (mounting surface) with high surface accuracy and sucked, so that it occurs in the target workpiece supported by the receiving pin. It is extremely difficult to eliminate the bending (whether swell or warp, whether it is whole or partial). In view of this, it is conceivable that the target work on the placement surface is pressed with a plurality of claws to make the target work flat and then sucked with a suction pad.

  However, with such a configuration, since it is necessary to put in and out the nail on the target work placed on the placement surface, the time (throughput) required for forming the mask pattern is increased. In addition, pressing the target workpiece with the nail may cause scratches on the surface of the target workpiece, and may cause dust to adhere to the target workpiece due to the movement of the nail, resulting in a decrease in product accuracy. May be invited.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a suction stage that can hold a target workpiece in a flat state without causing an increase in working time or a reduction in product system. There is to do.

  The invention according to claim 1 is a suction stage for holding a target work on which a predetermined mask pattern is exposed by forming an image of exposure light on a flat mounting surface, and the target work with respect to the mounting surface described above. A fixed suction mechanism capable of sucking the target work so as to fix the posture, and a flat suction mechanism capable of sucking the target work so as to be in surface contact with the mounting surface. It has a plurality of planar suction holes that open the placement surface, and the suction operation by each of the planar suction holes is started in order from an arbitrary point on the placement surface toward the outer edge.

  Invention of Claim 2 is the adsorption | suction stage of Claim 1, Comprising: The said plane adsorption | suction mechanism is a plurality of said plane adsorption | suction holes in which each said at least 1 or more plane adsorption hole is located on the mounting surface mentioned above. It has an adsorption | suction division, The adsorption | suction operation | movement of each said plane adsorption hole is started by this each adsorption | suction division unit, It is characterized by the above-mentioned.

  Invention of Claim 3 is the adsorption | suction stage of Claim 1 or Claim 2, Comprising: The said fixed adsorption | suction mechanism is at least 2 which can adsorb | suck to the said object workpiece | work in an upper end surface on the said mounting surface. It has one or more fixed adsorption parts.

  Invention of Claim 4 is the suction stage of Claim 3, Comprising: Each said fixed adsorption | suction part is a direction along the mounting surface of the said upper end surface in the state which attracted and hold | maintained the said object workpiece | work. Displacement is possible.

  The invention according to claim 5 is the suction stage according to claim 3 or claim 4, and is further movable forward and backward in an orthogonal direction perpendicular to the placement surface with respect to the placement surface, A lift pin having a suction surface at an upper end is provided, and each of the fixed suction portions can suck and hold the target workpiece with the upper end surface protruding in the orthogonal direction from the placement surface, and suck the target workpiece. It is characterized in that the upper end surface can be flush with the mounting surface in the held state.

  A sixth aspect of the present invention is the suction stage according to any one of the first to fifth aspects, wherein the flat surface suction mechanism is configured so that the placement surface is positioned from a center position on the placement surface. The suction operation by each of the flat suction holes is sequentially started toward the peripheral portion.

  A seventh aspect of the present invention is the suction stage according to any one of the first to fifth aspects, wherein the flat surface suction mechanism is configured so that the mounting surface is moved from an edge portion on the mounting surface. The suction operation by each of the planar suction holes is started in order toward the direction passing through the center position.

  The invention according to an eighth aspect is the suction stage according to any one of the first to seventh aspects, wherein the planar suction mechanism is in accordance with a suction state in the planar suction hole that has started the suction operation. Then, the suction operation by the next flat suction hole is started.

  A ninth aspect of the present invention is the suction stage according to any one of the first to eighth aspects, wherein the planar suction mechanism is bent by the target work held by the fixed suction mechanism. Accordingly, the order of the suction operation start in each of the planar suction holes is set.

  The invention described in claim 10 is a mounting stage that controls the position and orientation of the target workpiece with respect to a reference plane, and uses the suction stage according to any one of claims 1 to 9. Features.

  An exposure apparatus according to an eleventh aspect uses the suction stage according to any one of the first to ninth aspects.

  According to the suction stage of the present invention, since the flat suction mechanism starts the suction operation in order from an arbitrary point on the placement surface to the outer edge, even if the target workpiece is bent, Since the surplus due to the bending can be released to the outside (outer edge) of the placement surface, the target work can be appropriately adsorbed on the flat placement surface. Thereby, the target workpiece can be sucked and held in a flat state.

  Further, in the suction stage, the flat suction mechanism makes the target workpiece flat by sucking (evacuating) with a plurality of flat suction holes that open the mounting surface, resulting in a decrease in product accuracy. Can be prevented.

  Furthermore, in the suction stage, the target workpiece is placed on the surface because the target workpiece is placed in a flat state by suction (evacuation) with a plurality of plane suction holes that open the placement surface. Immediately after being placed on the placement surface, suction (evacuation) in each planar suction hole can be started, so that the time (throughput) required for forming the mask pattern can be shortened.

  In addition to the above-described configuration, the planar suction mechanism has a plurality of suction sections each having at least one planar suction hole on the placement surface, and each of the suction section units Assuming that the suction operation of the flat suction hole is started, the control for starting the suction operation in the flat suction mechanism can be performed for each suction section. can do.

  In addition to the configuration described above, the fixed suction mechanism can be fixed with a simple configuration on the placement surface with at least two or more fixed suction portions that can be suctioned to the target workpiece on the upper end surface. By holding the suction by the suction mechanism, it is possible to prevent the posture of the target workpiece from changing.

  In addition to the above-described configuration, each of the fixed suction portions can be displaced in a direction along the placement surface of the upper end surface in a state where the target workpiece is sucked and held. While maintaining the posture, it is possible to prevent the surplus due to the bending of the target workpiece from being hindered to escape outside by the stepwise suction operation by the flat suction mechanism.

  In addition to the above-described configuration, the fixed suction portion further includes a lift pin that is movable forward and backward in an orthogonal direction perpendicular to the placement surface with respect to the placement surface, and has a suction surface at an upper end. The target work can be sucked and held with the upper end surface protruding in the orthogonal direction from the placement surface, and the upper end surface is flush with the placement surface in a state where the target work is sucked and held. If this is possible, it is possible to suppress the load on the target workpiece during the transition of the holding state of the target workpiece between the lift pins.

  Further, the target workpiece can be quietly placed on the placement surface while maintaining the posture of the target workpiece.

  In addition to the above-described configuration, the planar suction mechanism is configured to start the suction operation by each of the planar suction holes in order from the center position on the placement surface to the peripheral portion of the placement surface. Since it is possible to further suppress the occurrence of bias in the surplus that is brought close to the work, it is possible to flatten while maintaining the position and posture determined by the suction of each fixed suction portion of the fixed suction mechanism more reliably. .

  In addition to the above-described configuration, the planar suction mechanism starts the suction operation by the planar suction holes in order from the edge on the placement surface to the direction passing through the center position of the placement surface; Then, since the surplus due to the bending of the target workpiece can be released to the other edge, the target workpiece can be appropriately sucked on the flat mounting surface, and the target workpiece is sucked and held in a flat state. Can do.

  In addition to the configuration described above, if the planar suction mechanism starts the next suction operation by the planar suction hole in accordance with the suction state in the planar suction hole that has started the suction operation, the suction operation is performed first. Since the target work can be started to be sucked in the next flat suction hole after the target work has been properly sucked to the placement surface at the start location (flat suction hole), the target work can be more appropriately flattened. State.

  In addition to the above-described configuration, the planar suction mechanism sets the order of the suction operation start in each of the planar suction holes according to the deflection of the target workpiece held by the fixed suction mechanism. Since the suction operation in each flat suction hole is started in the order corresponding to the bending of the workpiece, the target workpiece can be more appropriately flattened.

  In the mounting stage using the above-described suction stage, the target workpiece is in a flat state with extremely high accuracy on the suction stage. It can be positioned in an appropriate state.

  In the above-described exposure apparatus using the suction stage, the target workpiece is in a flat state with extremely high accuracy on the suction stage, so that the mask pattern image can be appropriately exposed on the target workpiece.

It is explanatory drawing which shows typically the structure of the exposure apparatus 10 which concerns on this invention. 4 is a perspective view schematically showing a configuration of a mounting stage 30. FIG. It is sectional drawing obtained along the II line of FIG. FIG. 3 is a perspective view similar to FIG. 2 showing the appearance of the base member 31, both Y-axis drive mechanisms 32, Y-axis slider 33, both X-axis drive mechanisms 34, and both X-axis sliders 35 in the mounting stage 30. FIG. 5 is a perspective view similar to FIG. 2 showing a state in which the XY adjustment plate 36 and the connecting portions (51, 52, 53, 54) are added to FIG. It is explanatory drawing for demonstrating the positional relationship of both the X-axis slider 35, the XY adjustment board 36, and each connection part (51, 52, 53, 54). 4 is a perspective view schematically showing a configuration of a first connecting portion 51. FIG. 4 is a perspective view schematically showing a configuration of a second connecting portion 52. FIG. 6 is a perspective view schematically showing a configuration of a third connecting portion 53. FIG. 6 is a perspective view schematically showing a configuration of a fourth connecting portion 54. FIG. FIG. 6 is a perspective view similar to FIG. 2 showing a state in which each Z-axis drive mechanism 37 is added to FIG. 5. FIG. 4 is a cross-sectional view similar to FIG. 3 showing an enlarged view of the periphery of the drive main body for explaining the configuration of the Z-axis drive mechanism 37A. 3 is a perspective view schematically showing a configuration of a lift mechanism 39. FIG. 3 is a block diagram showing a functional configuration of a mounting stage 30. FIG. It is a perspective view which shows typically the periphery structure of the chuck | zipper plate 40, and has shown the state by which each lift pin 39b protruded above the mounting surface 40b. It is a perspective view similar to FIG. 15 which expands and shows the range enclosed with the dashed-dotted line shown in FIG. FIG. 16 is a perspective view similar to FIG. 15 schematically showing the peripheral configuration of the chuck plate 40, and shows a state in which each lift pin 39b is pulled downward from the placement surface 40b. It is the typical front view which looked at the chuck | zipper plate 40 from upper direction. It is a front view similar to FIG. 17 for demonstrating three adsorption | suction divisions (77-79). It is the typical perspective view which looked at the chuck plate 40 from the back side. It is a front view similar to FIG. 17 for demonstrating the start direction of the adsorption | suction operation | movement of another example.

  Hereinafter, embodiments of the mounting stage 30 according to the present invention will be described with reference to the drawings.

  First, a schematic configuration of the exposure apparatus 10 using the mounting stage 30 according to the present invention will be described. FIG. 1 is an explanatory view schematically showing a configuration of an exposure apparatus 10 as an example of an exposure apparatus according to the present invention. As shown in FIG. 1, the exposure apparatus 10 includes a light source 11, a cold mirror 12, an exposure shutter 13, an ultraviolet bandpass filter 14, an integrator lens 15, and a collimator in order from the emission side along the optical axis direction. The lens 16, the plane mirror 17, the mask stage 18, the mask blind 19, the projection lens 20, the magnification correction unit 21, and the placement stage 30 (projection exposure stage) are included. The exposure apparatus 10 uses ultraviolet rays as exposure light.

  The light source 11 is provided for irradiation of ultraviolet rays as exposure light used for exposure. In this embodiment, the mercury lamp 11a is arranged at the first focal position of an elliptical reflecting mirror (elliptical mirror) 11b. ing. In the light source 11, the emitted light emitted from the mercury lamp 11 a is reflected by the elliptical reflecting mirror 11 b and proceeds to the cold mirror 12.

  The cold mirror 12 transmits infrared rays of the incident light and reflects light in other wavelength bands, and can separate the infrared rays from the incident light. For this reason, the emitted light from the light source 11 travels to the exposure shutter 13 or the ultraviolet band-pass filter 14 after the heat rays in the infrared region are separated by the cold mirror 12.

  The exposure shutter 13 can be taken in and out of an optical path (irradiation optical path to be described later) from the cold mirror 12 to the ultraviolet bandpass filter 14 so that transmission and blocking of the outgoing light reflected by the cold mirror 12 can be switched. It is said that. When the exposure shutter 13 is retracted from the optical path, the target work 22 can be exposed as described later, and when the exposure shutter 13 is positioned on the optical path, the exposure of the target work 22 is stopped.

  The ultraviolet bandpass filter 14 allows only the ultraviolet light of the incident light to pass through. In this embodiment, the ultraviolet bandpass filter 14 is configured by an i-line bandpass filter that allows the transmission of i-line, which is a spectral line of mercury having a wavelength of 365 nm. ing. For this reason, the outgoing light reflected by the cold mirror 12 is light only in the ultraviolet (i-line) wavelength band by the ultraviolet bandpass filter 14 (actually, light having a high intensity in the vicinity of the i-line wavelength band). Then, the process proceeds to the integrator lens 15.

  The integrator lens 15 cancels out the illuminance unevenness of the incident light to obtain a uniform and bright illuminance distribution up to the peripheral portion on the irradiated surface. For this reason, incident light that has been converted to light in the ultraviolet (i-line) wavelength band through the ultraviolet bandpass filter 14 is made uniform by the integrator lens 15 and travels to the collimator lens 16.

  The collimator lens 16 emits incident light as parallel light (light beam). Therefore, the emitted light having a uniform illuminance distribution through the integrator lens 15 is converted into parallel light by the collimator lens 16 and travels to the plane mirror 17, is reflected by the plane mirror 17 and travels to the mask stage 18.

  The mask stage 18 holds the mask 18a on which the pattern is formed so as to be movable in a direction perpendicular to the optical axis of the optical path while being positioned on the optical path of the emitted light reflected by the plane mirror 17. Although not shown, the mask stage 18 can be removed, and the mask stage 18 can be replaced with a mask having a pattern different from the mask 18a. For this reason, the outgoing light reflected by the plane mirror 17 passes through the mask 18a, is made to correspond to the shape of the pattern formed on the mask 18a, and proceeds to the projection lens 20.

  Therefore, in the exposure apparatus 10, the light path from the light source 11 through the cold mirror 12, the exposure shutter 13, the ultraviolet bandpass filter 14, the integrator lens 15, the collimator lens 16, and the plane mirror 17 causes ultraviolet rays with the mask 18 a as exposure light. It functions as an irradiation optical system for irradiation with (i-line).

  A mask blind 19 is provided between the mask stage 18 and the projection lens 20. The mask blind 19 is provided so as to freely advance and retreat on the optical path of the emitted light that has passed through the mask 18a, and a mask pattern image of only a desired region of the mask pattern of the mask 18a is mounted on the mounting stage 30 to be described later. In order to appropriately form on the target workpiece 22 to be performed, the optical path is appropriately advanced according to the mask pattern of the mask 18a.

  The projection lens 20 is for appropriately exposing a pattern formed on the mask 18a to a target workpiece 22 (to be described later) on the mounting stage 30, and an image of the pattern of the mask 18a held on the mask stage 18 ( (Hereinafter also referred to as a mask pattern image) is appropriately scaled and formed on the surface of a later-described target workpiece 22 placed on the placement stage 30. That is, the projection lens 20 uses the surface of the target workpiece 22 placed on the placement stage 30 as an imaging plane, and the imaging plane and the mask 18a are in an optically conjugate positional relationship. Since the exposure apparatus 10 uses ultraviolet rays (i-line) as exposure light as described above, the projection lens 20 is set by correcting aberrations with high accuracy with respect to ultraviolet rays (i-line) as exposure light. Yes. For this reason, the projection lens 20 appropriately forms the mask pattern image of the mask 18a on the imaging surface (on the target workpiece 22 described later) on the mounting stage 30 when the outgoing light transmitted through the mask 18a is incident. .

  A magnification correction unit 21 is provided between the projection lens 20 and the mounting stage 30. The magnification correction unit 21 deforms a mask pattern image formed on the imaging surface on the mounting stage 30 in accordance with distortion in a target workpiece 22 to be described later that is mounted on the mounting stage 30. The magnification correction unit 21 deforms the mask pattern image on the imaging plane by appropriately changing the magnification in an arbitrary direction when viewed on a plane orthogonal to the optical path. The magnification correction unit 21 can be realized, for example, by arranging a plurality of glass plates in parallel in the optical path direction and appropriately bending or rotating each glass plate.

  As described above, in the exposure apparatus 10, the mask blind 19, the projection lens 20, and the magnification correction unit 21 form an image on the mounting stage 30 with ultraviolet rays as exposure light transmitted through the mask 18 a on which a predetermined pattern is formed. It functions as a projection optical system that forms an image as a mask pattern image on a surface (on a target workpiece 22 described later).

  On the placement stage 30, the target work 22 is placed for exposure of the mask pattern. The mounting stage 30 can hold the target work 22 with the surface of the target work 22 to be placed in line with the imaging plane of the projection lens 20, and the held target work 22 is orthogonal to the projection optical path. It is possible to move along the surface. In this embodiment, the movement of the target work 22 on the placement stage 30 is performed under the control of a drive control unit 43 (see FIG. 14) provided inside the placement stage 30. The configuration of the mounting stage 30 will be described in detail later. In addition, the movement of the target workpiece 22 on the mounting stage 30 may be performed manually.

  In the present embodiment, the target work 22 is formed by applying or pasting a photosensitive material such as a photoresist that photoreacts to ultraviolet rays (i rays) to a silicon wafer, a glass substrate, a printed board, or the like. For this reason, the target workpiece 22 can be exposed by irradiation with ultraviolet rays (i rays).

  In this exposure apparatus 10, the emitted light emitted from the light source 11 reaches the mask stage 18 through the cold mirror 12, the ultraviolet bandpass filter 14, the integrator lens 15, the collimator lens 16 and the plane mirror 17 in the irradiation optical system. As a result, the mask 18a held on the mask stage 18 is uniformly irradiated with ultraviolet rays (i rays). Then, in the exposure apparatus 10, the mask pattern image by ultraviolet rays (i-line) is appropriately formed on the imaging surface on the mounting stage 30 by the functions of the projection optical system, that is, the mask blind 19, the projection lens 20 and the magnification correction unit 21. It is formed. Therefore, the exposure apparatus 10 can appropriately expose the mask pattern image on the target work 22 by setting the target work 22 to an appropriate position (posture) along the imaging plane. The position of the target workpiece 22 with respect to the mask pattern image, that is, the position of the target workpiece 22 with respect to the mask 18a that has optically passed through the projection optical system (mainly the projection lens 20) is connected to the target workpiece 22 held by the mounting stage 30. Adjustment (alignment) can be made by appropriately moving on the image plane.

  As shown in FIGS. 2 and 3, the mounting stage 30 used in the exposure apparatus 10 according to the present invention includes a base member 31, two Y-axis drive mechanisms 32, a Y-axis slider 33, and two X-axis drives. A mechanism 34, two X-axis sliders 35, an XY adjustment plate 36, three Z-axis drive mechanisms 37, a Z-axis adjustment plate 38, a lift mechanism 39, and a chuck plate 40 are included.

  The base member 31 is a plate-like member that extends along a reference plane serving as a reference when setting the positional relationship of the target workpiece 22 (see FIG. 1) with respect to the projection optical system described above. And fixedly provided. The reference plane is a position where a mask pattern image is formed by the projection optical system described above, that is, an image formation plane optically conjugate with the mask 18a by the projection lens 20. In this embodiment, the reference plane is a plane parallel to an XY plane that is a plane orthogonal to the Z axis, where the optical axis direction of the projection optical system is the Z axis direction. The positive side in the Z-axis direction is the side from the mounting stage 30 toward the projection optical system described above (upper side when FIG. 2 is viewed from the front), and is also referred to as the upper side of the mounting stage 30 in this specification. For this reason, the base member 31 extends along the XY plane. Two Y-axis drive mechanisms 32 are provided on the upper surface of the base member 31.

  As shown in FIGS. 2 to 4, the two Y-axis drive mechanisms 32 are provided on both ends of the upper surface of the base member 31 as viewed in the X-axis direction. The two Y-axis drive mechanisms 32 apply a drive force in the Y-axis direction to the base member 31 to the Y-axis slider 33. The Y-axis slider 33 has a plate shape having a through hole 33a in the center, and is provided along a reference plane.

  Each Y-axis drive mechanism 32 has basically the same configuration as an X-axis drive mechanism 34 described later, a Y-axis stator 32a, a pair of base-side Y-axis guide members 32b, and a Y-axis although not shown. A mover and a pair of slider-side Y-axis guide members are provided. The Y-axis stator 32a is formed with a plurality of permanent magnets arranged in the Y-axis direction so that different magnetic poles are adjacent to each other on the upper surface of the base member 31, and constitutes a so-called magnet track. Both base-side Y-axis guide members 32b are provided in pairs on the upper surface of the base member 31 so as to sandwich the Y-axis stator 32a, and extend in the Y-axis direction. Both the base-side Y-axis guide members 32b are slid in a extending direction (Y-axis direction) with a pair of slider-side Y-axis guide members (not shown) provided on the lower surface (back surface) of the Y-axis slider 33. A movable fitting is possible. The Y-axis movable element (not shown) is provided between a pair of slider-side Y-axis guide members (not shown) on the lower surface (back surface) of the Y-axis slider 33, and is Y in the Z-axis direction (vertical direction). It can be opposed to the shaft stator 32a. The Y-axis movable element (not shown) accommodates a coil that can be applied with a current.

  In each Y-axis drive mechanism 32, the Y-axis mover is fixed by appropriately applying an attractive repulsion force by a magnetic force between a Y-axis mover (not shown) and the Y-axis stator 32a. The axis slider 33 can be appropriately moved with respect to the base member 31 in the Y-axis direction. Therefore, in this embodiment, the Y-axis direction functions as a first direction along the reference plane, both Y-axis drive mechanisms 32 function as first drive mechanisms, and the Y-axis slider 33 functions as a first slider. In order to detect the position of the Y-axis slider 33 on the base member 31, a position detection element is provided although not shown. Since both the Y-axis drive mechanisms 32 move a single Y-axis slider 33, both are controlled in synchronization.

  In the mounting stage 30, the drive control unit 43 (see FIG. 14) provided in the inside controls the current applied to both Y-axis movers (not shown) synchronously, and both the Y-axis By appropriately applying an attractive repulsion force due to the magnetic force between the mover and both Y-axis stators 32a, the Y-axis slider 33 to which both Y-axis movers are fixed is appropriately moved with respect to the base member 31. . At this time, since this movement uses the attractive repulsion force due to the magnetic force, the drive control unit 43 uses a position detection element (not shown) so as to appropriately move to the set movement target position. Servo control is performed based on the position information. Two X-axis drive mechanisms 34 are provided on the Y-axis slider 33.

  The two X-axis drive mechanisms 34 are provided on the upper surface of the Y-axis slider 33 at both end positions as viewed in the Y-axis direction. Each X-axis drive mechanism 34 applies a driving force in the X-axis direction to the Y-axis slider 33 to the corresponding X-axis slider 35 (35A, 35B). The two X-axis sliders 35 have a plate shape having substantially the same length when viewed in the X-axis direction, and are provided along the reference plane at the same height position (up and down position) when viewed in the Z-axis direction. Yes.

  Each X-axis drive mechanism 34 includes an X-axis stator 34a, a pair of base-side X-axis guide members 34b, an X-axis movable element 34c, and a pair of slider-side X-axis guide members 34d. The X-axis stator 34a is formed with a plurality of permanent magnets arranged in the Y-axis direction so that different magnetic poles are adjacent to each other on the upper surface of the Y-axis slider 33, and constitutes a so-called magnet track. Both base side X-axis guide members 34b are provided in pairs on the upper surface of the Y-axis slider 33 so as to sandwich the X-axis stator 34a, and extend in the X-axis direction. Both the base-side X-axis guide members 34b can be slidably fitted in the extending direction of the corresponding slider-side X-axis guide member 34d. The X-axis movable element 34c is provided on the lower surface (back surface) of the X-axis slider 35, and can be opposed to the X-axis stator 34a in the Z-axis direction (vertical direction) (see FIG. 3). The X-axis movable element 34c accommodates a coil to which current can be applied. A pair of slider-side X-axis guide members 34d are provided on both sides of the X-axis movable element 34c.

  One of these two X-axis drive mechanisms 34 (34A when individually described) is provided corresponding to the X-axis slider 35A, and the other (34B when individually described) is the X-axis. It is provided corresponding to the slider 35B. That is, the X-axis drive mechanism 34A is provided to move one X-axis slider 35A in the X-axis direction, and the X-axis movable element 34c is provided on the lower surface of the X-axis slider 35A. The X-axis drive mechanism 34B is provided to move the other X-axis slider 35B in the X-axis direction, and the X-axis movable element 34c is provided on the lower surface of the X-axis slider 35B.

  In each X-axis drive mechanism 34, the corresponding X-axis slider 35 (35A or 35B) is moved to the Y-axis by appropriately applying an attractive repulsion force due to the magnetic force between the X-axis movable element 34c and the X-axis stator 34a. The slider 33 can be appropriately moved in the X-axis direction. For this reason, in this embodiment, the X-axis direction functions as the second direction along the reference plane and is inclined with respect to the first direction, each X-axis drive mechanism 34 functions as the second drive mechanism, and each X-axis The slider 35 functions as a second slider. In order to detect the position of each X-axis slider 35A, 35B on the Y-axis slider 33, a position detection element is provided although not shown. In this embodiment, the X-axis slider 35A and the X-axis slider 35B are in the center position of the movable range in the X-axis direction, that is, the X-axis slider 35A and the X-axis slider 35B are in the Y-axis slider 33. The state of alignment in the Y-axis direction at the center position in the X-axis direction on the upper surface (see FIG. 4 etc.) is used as the reference position for drive control (movement in the X-axis direction) by both X-axis drive mechanisms 34. .

  In the mounting stage 30, the drive control unit 43 (see FIG. 14) provided inside the mounting stage 30 individually controls the current applied to each X-axis movable element 34 c, thereby fixing the X-axis movable element 34 c and the X-axis fixed. The X-axis slider 35 (35A or 35B), to which the X-axis movable element 34c is fixed, is appropriately individually or integrally formed with the Y-axis slider 33 by appropriately applying an attractive repulsion force due to the magnetic force with the child 34a. Moved. At this time, since this movement uses the attractive repulsion force due to the magnetic force, the drive control unit 43 uses a position detection element (not shown) so as to appropriately move to the set movement target position. Servo control is performed based on the position information. An XY adjustment plate 36 is provided so as to bridge the two X-axis sliders 35 (see FIG. 5).

  The XY adjustment plate 36 is provided for setting (adjusting) the position of the target work 22 (see FIG. 1) in the XY direction and the rotational posture along the XY plane. As shown in FIG. 5, the XY adjustment plate 36 has a plate shape and bridges the X-axis slider 35 </ b> A and the X-axis slider 35 </ b> B along the reference plane above both the X-axis sliders 35. Has been extended. The XY adjustment plate 36 is basically connected to the X-axis slider 35 </ b> A by the first connecting portion 51 and is connected to the X-axis slider 35 </ b> B by the second connecting portion 52. In this embodiment, in addition to the first connecting portion 51 and the second connecting portion 52, the third connecting portion 53 is connected to the X-axis slider 35A, and the fourth connecting portion 54 is connected to the X-axis slider 35B. ing. Each of the connecting portions (51, 52, 53, 54) extends in the Z-axis direction, and is connected to the XY adjustment plate 36 at one upper end, and the X-axis slider 35 (35A) at the other lower end. , 35B).

  Here, as shown in FIG. 6, in the XY adjustment plate 36, a portion where the first connecting portion 51 is connected is a plate side first support point Sb <b> 1, and a portion where the second connecting portion 52 is connected is the plate side first. The second support point Sb2 is the plate side third support point Sb3 where the third connecting portion 53 is connected, and the plate side fourth support point Sb4 is the location where the fourth connecting portion 54 is connected. Further, in the X-axis slider 35A, a portion where the first connecting portion 51 is connected is referred to as a slider-side first support point Ss1, and a portion where the third connecting portion 53 is connected is referred to as a slider-side third support point Ss3. Further, in the X-axis slider 35B, a portion where the second connecting portion 52 is connected is a slider-side second support point Ss2, and a portion where the fourth connecting portion 54 is connected is a slider-side fourth support point Ss4. In this embodiment, the support points (Sb1, Sb2, Sb3, Sb4) on the XY adjustment plate 36 are arranged so as to draw a square when viewed from the Z-axis direction.

  The first connecting portion 51 is arranged in a state where the plate-side first support point Sb1 and the slider-side first support point Ss1 are positioned on the same straight line when viewed in the Z-axis direction and the relative positional relationship is fixed. The X-axis slider 35A and the XY adjustment plate 36 are coupled so as to allow the X-axis slider 35A and the XY adjustment plate 36 to rotate relative to each other around the reference axis line Ba including the support points Sb1 and Ss1. In the present embodiment, as shown in FIG. 7, the first connecting portion 51 rotates with respect to a connecting base portion 51a fixed to the X-axis slider 35A and extending in the Z-axis direction, and its extending end portion 51b. A rotating portion 51c provided in a possible manner. The connecting base portion 51a has a cylindrical shape as a whole, and its central axis (Ba) is along the Z-axis direction. The rotating portion 51c has an annular shape surrounding the extending end portion 51b of the connecting base portion 51a, and is rotatable about the central axis (Ba) of the connecting base portion 51a with respect to the extending end portion 51b. In the first connecting portion 51, the rotating portion 51 c is fixedly attached to the XY adjustment plate 36.

  In this 1st connection part 51, since the relative rotation of the connection base part 51a and the rotation part 51c is possible around the central axis (Ba) of the connection base part 51a, the connection base part 51a was provided. The X-axis slider 35A and the XY adjustment plate 36 are connected to each other while allowing relative rotation around the central axis (Ba) of the X-axis slider 35A and the XY adjustment plate 36 provided with the rotating portion 51c. ing. For this reason, in the 1st connection part 51, the center axis line of the connection base part 51a turns into the reference axis line Ba, the center position of the connection base part 51a becomes the slider side 1st support point Ss1, and the center position of the rotation part 51c is plate side 1st. One support point Sb1 is obtained.

  The second connecting portion 52 allows the relative position change of the plate-side second support point Sb2 and the slider-side second support point Ss2 in the third direction along the XY plane, and rotates around the Z-axis direction. The X-axis slider 35B and the XY adjustment plate 36 are coupled so that the X-axis slider 35B and the XY adjustment plate 36 are allowed to rotate relative to each other (see FIG. 6 and the like). In this embodiment, as shown in FIG. 8, the second connecting portion 52 is fixed to the X-axis slider 35B and extended in the Z-axis direction, and rotates with respect to the connecting base portion 52a. The connected rotation part 52b made possible, the rail holding part 52c fixed to the upper end surface thereof, the rail 52d slidably held by the rail holding part 52c, and the mounting part 52e fixed to the rail 52d And having. The connecting base portion 52a has a cylindrical shape as a whole, and its central axis is along the Z-axis direction. The connection rotation part 52b has a cylindrical shape with a smaller diameter than the connection base part 52a, and is provided at a concentric position on the connection base part 52a. The connection rotation portion 52b is rotatable about the central axis of the connection base portion 52a with respect to the connection base portion 52a. The rail holding portion 52c is a direction along the XY plane, and is slidable in a third direction inclined with respect to the X-axis direction (second direction) and the Y-axis direction (first direction). It is possible to hold. The rail 52d has a rod shape extending in the third direction, and is fixed to the attachment portion 52e. The attachment portion 52e has a columnar shape as a whole, and is fixedly attached to the XY adjustment plate 36. For this reason, the rail 52d is fixed to the XY adjustment plate 36 via the attachment portion 52e. In this embodiment, the extending direction of the rail 52d, that is, the third direction coincides with the extending direction of the line connecting the plate-side second support point Sb2 and the plate-side first support point Sb1 on the XY adjustment plate 36. It corresponds to a square diagonal line drawn by each support point (Sb1, Sb2, Sb3, Sb4). For this reason, in the third direction, when both the X-axis drive mechanisms 34 are set as the reference positions for drive control, the inclination is 45 degrees with respect to the X-axis direction (second direction) and the Y-axis direction (first direction). It will have. The third direction is fixed to the XY adjustment plate 36 in this embodiment, but may be fixed to the X-axis slider 35B.

  In the second connecting portion 52, the rail 52d and the rail holding portion 52c can move relative to each other in the third direction, and around the central axis of the connecting rotary portion 52b provided with the rail holding portion 52c. The relative rotation of the connection rotation portion 52b and the connection base portion 52a is possible. For this reason, the second connecting portion 52 has a relative relationship in the third direction between the X-axis slider 35B provided with the connecting base portion 52a and the XY adjusting plate 36 provided with the rail 52d (mounting portion 52e). The X-axis slider 35B and the XY adjustment plate 36 allow displacement and allow relative rotation between the X-axis slider 35B and the XY adjustment plate 36 around the central axis of the connection base portion 52a (connection rotation portion 52b). Are linked. For this reason, in the 2nd connection part 52, the center position of the connection base part 52a becomes slider side 2nd support point Ss2, and the center position of the rail 52d (attachment part 52e) becomes plate side 2nd support point Sb2. The second connecting portion 52 connects the plate-side second support point Sb2 and the slider-side second support point Ss2 in the Z-axis direction when the X-axis slider 35A and the X-axis slider 35B are set to the drive control reference positions. The X-axis slider 35B is set so as to be a reference position (the center position of the rail 52d (the center axis of the mounting portion 52e) and the center axis of the coupling base portion 52a coincide). And the XY adjustment plate 36.

  The third connecting portion 53 allows a relative position change between the plate-side third support point Sb3 and the slider-side third support point Ss3 in the direction along the XY plane, and X around the Z-axis direction. The X-axis slider 35A and the XY adjustment plate 36 are coupled so as to allow the shaft slider 35A and the XY adjustment plate 36 to rotate relative to each other (see FIG. 6 and the like). In the present embodiment, as shown in FIG. 9, the third connecting portion 53 includes a first rail 53a fixed to the X-axis slider 35A and a first rail holding portion that slidably holds the first rail 53a. 53b, a fixed plate portion 53c fixed to the first rail holding portion 53b, a second rail holding portion 53d fixed to the fixed plate portion 53c, and slidably held on the second rail holding portion 53d A second rail 53e, a rotary shaft portion 53f fixed to the second rail 53e, and a rotary portion 53g provided to be rotatable with respect to the rotary shaft portion 53f. The first rail 53a has a rod shape extending in the Y-axis direction. The first rail holding portion 53b can hold the first rail 53a so as to be slidable in the extending direction of the first rail 53a. The fixed plate portion 53c has a plate shape, the first rail holding portion 53b is provided on the lower surface side, and the second rail holding portion 53d is provided on the upper surface side, and the first rail holding portion 53b and the second rail are provided. The positional relationship with the holding portion 53d is fixed. The second rail holding portion 53d can hold the second rail 53e so as to be slidable in the X-axis direction. The second rail 53e has a rod shape extending in the X-axis direction, and is held by the second rail holding portion 53d so as to be movable in the extending direction. The rotation shaft portion 53f has a columnar shape as a whole, and is fixed to the second rail 53e so that the center axis is along the Z-axis direction. The rotating portion 53g has an annular shape surrounding the rotating shaft portion 53f, and is rotatable about the central axis of the rotating shaft portion 53f with respect to the rotating shaft portion 53f. In the third connecting portion 53, the rotating portion 53 g is fixedly attached to the XY adjustment plate 36.

  In the third connecting portion 53, relative movement in the Y-axis direction between the first rail 53a and the first rail holding portion 53b (the second rail holding portion 53d that is fixed via the fixing plate portion 53c). And the relative movement of the second rail holding portion 53d and the second rail 53e in the X-axis direction is possible, and the central axis of the rotary shaft portion 53f provided on the second rail 53e Around the rotating shaft portion 53f and the rotating portion 53g, relative rotation is possible. For this reason, the 3rd connection part 53 is relative to the direction along the XY plane of X axis slider 35A provided with the 1st rail 53a, and XY adjustment board 36 provided with rotation part 53g. The X-axis slider 35A and the XY adjustment plate 36 are connected while allowing displacement and allowing relative rotation around the central axis of the rotary shaft portion 53f. For this reason, in the 3rd connection part 53, the center position of the 1st rail 53a becomes the slider side 3rd support point Ss3, and the center position of the rotation part 53g becomes the board side 3rd support point Sb3. The third connecting portion 53 connects the plate-side third support point Sb3 and the slider-side third support point Ss3 in the Z-axis direction when the X-axis slider 35A and the X-axis slider 35B are set to the drive control reference position. The position is set to be a reference position (the center axis of the rotation shaft portion 53f and the straight line along the Z-axis direction including the center position of the first rail 53a coincide with each other). The slider 35A and the XY adjustment plate 36 are provided respectively. That is, the third connecting portion 53 does not change the distance between the plate-side third support point Sb3 and the slider-side third support point Ss3 as viewed in the Z-axis direction (the distance is maintained at a predetermined size). However, it is possible to change the relative positions of the plate-side third support point Sb3 and the slider-side third support point Ss3 in the direction along the XY plane.

  The fourth connecting portion 54 allows the relative position change of the plate-side fourth support point Sb4 and the slider-side fourth support point Ss4 in the direction along the XY plane, and X around the Z-axis direction. The X-axis slider 35B and the XY adjustment plate 36 are coupled so as to allow the shaft slider 35B and the XY adjustment plate 36 to rotate relatively (see FIG. 6 and the like). In the present embodiment, as shown in FIG. 10, the fourth connecting portion 54 includes a first rail 54a fixed to the X-axis slider 35B and a first rail holding portion that slidably holds the first rail 54a. 54b, a fixed plate portion 54c fixed to the first rail holding portion 54b, a second rail holding portion 54d fixed to the fixed plate portion 54c, and slidably held on the second rail holding portion 54d A second rail 54e, a rotary shaft portion 54f fixed to the second rail 54e, and a rotary portion 54g provided to be rotatable with respect to the rotary shaft portion 54f. The first rail 54a has a rod shape extending in the X-axis direction. The first rail holding portion 54b can hold the first rail 54a so as to be slidable in the extending direction of the first rail 54a. The fixed plate portion 54c has a plate shape, the first rail holding portion 54b is provided on the lower surface side, and the second rail holding portion 54d is provided on the upper surface side, and the first rail holding portion 54b and the second rail are provided. The positional relationship with the holding portion 54d is fixed. The second rail holding portion 54d can hold the second rail 54e so as to be slidable in the Y-axis direction. The second rail 54e has a rod shape extending in the Y-axis direction, and is held by the second rail holding portion 54d so as to be movable in the extending direction. The rotating shaft portion 54f has a cylindrical shape as a whole, and is fixed to the second rail 54e so that the center axis line is along the Z-axis direction. The rotating portion 54g has an annular shape surrounding the rotating shaft portion 54f, and is rotatable about the central axis of the rotating shaft portion 54f with respect to the rotating shaft portion 54f. In the fourth connecting portion 54, the rotating portion 54 g is fixedly attached to the XY adjustment plate 36.

  In the fourth connecting portion 54, the relative movement in the X-axis direction between the first rail 54a and the first rail holding portion 54b (the second rail holding portion 54d that is fixed via the fixing plate portion 54c). And the relative movement of the second rail holding portion 54d and the second rail 54e in the Y-axis direction is possible, and the central axis of the rotary shaft portion 54f provided on the second rail 54e. Around the rotating shaft portion 54f and the rotating portion 54g, relative rotation is possible. For this reason, the 4th connection part 54 is relative to the direction along the XY plane of X-axis slider 35B provided with the 1st rail 54a, and XY adjustment board 36 provided with rotation part 54g. The X-axis slider 35B and the XY adjustment plate 36 are connected while allowing displacement and allowing relative rotation around the central axis of the rotary shaft portion 54f. For this reason, in the 4th connection part 54, the center position of the 1st rail 54a becomes slider side 4th support point Ss4, and the center position of the rotation part 54g becomes plate | board side 4th support point Sb4. The fourth connecting portion 54 connects the plate-side fourth support point Sb4 and the slider-side fourth support point Ss4 in the Z-axis direction when the X-axis slider 35A and the X-axis slider 35B are set to the drive control reference positions. The position is set to be a reference position (the center axis of the rotating shaft portion 54f and the straight line along the Z-axis direction including the center position of the first rail 54a coincide with each other). The slider 35B and the XY adjustment plate 36 are provided respectively. In other words, the fourth connecting portion 54 does not change the distance seen in the Z-axis direction between the plate-side fourth support point Sb4 and the slider-side fourth support point Ss4 (the distance is maintained at a predetermined size). However, it is possible to change the relative positions of the plate-side fourth support point Sb4 and the slider-side fourth support point Ss4 in the direction along the XY plane.

  For this reason, the XY adjustment plate 36 can adjust the position in the Y-axis direction by appropriately moving the Y-axis slider 33 on the base member 31 in the Y-axis direction, and both the X-axis sliders 35 (35A, 35A, The position in the X-axis direction can be adjusted by appropriately moving the unit 35B) integrally in the X-axis direction, and can be moved along the XY plane. Further, as shown in FIG. 6, the XY adjustment plate 36 moves the X-axis slider 35A and the X-axis slider 35B individually on the base member 31 appropriately in the X-axis direction (relative relative to the X-axis direction). Therefore, the rotational posture viewed around the Z-axis direction with the reference axis Ba as the center of rotation can be appropriately adjusted (see arrow A1). At this time, in the XY adjustment plate 36, the plate-side second support point Sb2 and the slider-side second support point Ss2 resulting from the rotation with the reference axis Ba as the base point, the plate-side third support point Sb3, and the slider-side third support The variation in the direction along the XY plane of the point Ss3, the plate-side fourth support point Sb4, and the slider-side fourth support point Ss4 is the displacement in the third direction at the second connecting portion 52, and By being absorbed by the displacement in the direction along the XY plane in the third connecting portion 53 and the fourth connecting portion 54, support by both X-axis sliders 35 (35A, 35B) is possible. Further, in the XY adjustment plate 36, since the second connecting portion 52 is configured to allow only displacement in the third direction, the positional relationship of the X-axis slider 35B with respect to the X-axis slider 35A and the XY adjustment plate 36 The rotational attitude around the reference axis Ba can be made to correspond one-to-one. For this reason, in this embodiment, the XY adjustment plate 36 functions as a plane adjustment plate, and both the X-axis drive mechanism 34 and both the X-axis sliders 35 also have a function as a rotation drive mechanism.

  The XY adjustment plate 36 is provided with three support portion insertion holes 36a, 36b, 36c provided so as to surround the center position, and a central through hole 36d provided in the center thereof. The three support part insertion holes 36 a, 36 b, and 36 c are provided corresponding to the three Z-axis drive mechanisms 37. The central through hole 36d has a size smaller than that of the through hole 33a of the Y-axis slider 33 when viewed from the Z-axis direction, and the X-axis slider 35A and the X-axis slider 35B are used as reference positions for drive control. At this time, the center of the through hole 33a is located.

  The three Z-axis drive mechanisms 37 are provided on the lower side (back side) of the XY adjustment plate 36 (see FIGS. 11 and 12). Each Z-axis drive mechanism 37 is provided for setting (adjusting) the position of the target workpiece 22 (see FIG. 1) in the Z-axis direction and the inclination with respect to the Z-axis direction. In the present embodiment, as shown in FIG. 11, one of these three Z-axis drive mechanisms 37 (37A when individually described) is positioned above the X-axis slider 35A, and the remaining two Z-axis drive mechanisms 37 are two. Two (37B and 37C when individually described) are positioned above the X-axis slider 35B. Since each Z-axis drive mechanism 37 has the same basic configuration, a schematic configuration of the Z-axis drive mechanism 37A will be described, and the others will be omitted.

  As shown in FIG. 12, the Z-axis drive mechanism 37A includes a drive motor 37a, a conversion unit 37b, a transmission shaft 37c, a slide bearing unit 37d, a first moving unit 37e, a first guide unit 37f, 2 guide portion 37g, second guide holding portion 37h, second moving portion 37i, third guide portion 37j, third guide holding portion 37k, ball joint shaft 37l, spherical bearing portion 37m, Z axis And a moving part 37n.

  The drive motor 37a is rotationally controlled by appropriately controlling the applied current by a drive control unit 43 (see FIG. 14) provided inside the mounting stage 30. In this embodiment, a stepping motor is used as the drive motor 37a. The output shaft of the drive motor 37a is connected to the conversion unit 37b. A transmission shaft 37c is also connected to the conversion unit 37b, and the rotational movement of the drive motor 37a (its output shaft) is converted into a forward / backward movement of the transmission shaft 37c in the Y-axis direction. The transmission shaft 37c has a rod shape extending in the Y-axis direction, and is held by the slide bearing portion 37d so as to be movable back and forth in the Y-axis direction. The slide bearing portion 37d is fixed to the back surface (lower surface) of the XY adjustment plate 36, and assists the transmission shaft 37c applied with the driving force from the drive motor 37a to move forward and backward in the Y-axis direction. To do.

  The first moving part 37e is fixed to the transmission shaft 37c. The first moving portion 37e has a so-called wedge shape in which the upper surface is along the XY plane and the lower surface is inclined with respect to the XY plane, and the first guide portion 37f is slidably held on the upper surface portion. Yes. The first guide portion 37f has a rod shape extending in the Y-axis direction, and is fixed to the back surface (lower surface) of the XY adjustment plate 36. For this reason, the 1st moving part 37e can be moved forward and backward in the Y-axis direction as the transmission shaft 37c moves forward and backward in the Y-axis direction.

  A second guide portion 37g is fixed along the lower surface of the first moving portion 37e. The second guide portion 37g has a rod shape and extends in a direction along the YZ plane and inclined to the Y axis. The second guide portion 37g is held by the second guide holding portion 37h. The second guide holding portion 37h can hold the second guide portion 37g so as to be slidable in the extending direction, and is fixed to the second moving portion 37i.

  The second moving portion 37i has a columnar shape as a whole and has an arm portion 37o extending in the Y-axis direction. The upper surface of the arm portion 37o is parallel to the lower surface of the first moving part 37e. A second guide holding portion 37h is fixed to the upper surface of the arm portion 37o. A third guide portion 37j is fixed to the second moving portion 37i on the side opposite to the side on which the arm portion 37o is extended when viewed in the Y-axis direction. The third guide portion 37j has a rod shape and extends in the Z-axis direction. The third guide part 37j is held by the third guide holding part 37k. The third guide holding portion 37k can hold the third guide portion 37j so as to be slidable in the extending direction, and is fixed to the extending wall 36e of the XY adjusting plate 36. The extension wall 36e extends downward from the back surface (lower surface) of the XY adjustment plate 36 along the Z-axis direction.

  Therefore, the second moving part 37i is connected to the first moving part 37e via the second guide part 37g and the second guide holding part 37h when the first moving part 37e is moved forward and backward in the Y-axis direction. Thus, the third guide holding portion 37k and the third guide portion 37j are moved back and forth in the Z-axis direction, which is the guide direction. That is, the second moving part 37i moves downward in the Z-axis direction when the transmission shaft 37c is most advanced (the first moving part 37e is separated from the drive motor 37a), and the transmission shaft 37c is most retracted. When the first moving unit 37e approaches the drive motor 37a, the first moving unit 37e moves upward in the Z-axis direction. Therefore, each Z-axis drive mechanism 37 is a so-called wedge mechanism. The second moving portion 37i and the third guide portion 37j moved forward and backward in the Z-axis direction, the extending wall 36e fixed to the XY adjustment plate 36 and the height position in the Z-axis direction fixed, and the third guide The lower portion of the holding portion 37k is located in a space between the X-axis slider 35A and the X-axis slider 35B.

  A ball joint shaft 371 is provided above the second moving portion 37i. The ball joint shaft 37l is provided so as to extend in the Z-axis direction, and its extending end is spherical (37p). The spherical portion 37p of the ball joint shaft 37l is held by a spherical bearing portion 37m. The spherical bearing portion 37m holds the spherical portion 37p of the ball joint shaft 37l slidably along the spherical shape. A Z-axis moving part 37n is provided above the spherical bearing part 37m. The Z-axis moving part 37n has a columnar shape. The Z-axis moving part 37n is swingable around the center position of the spherical part 37p of the ball joint shaft 37l with respect to the second moving part 37i.

  Therefore, in the Z-axis drive mechanism 37A, when the drive motor 37a is appropriately driven to rotate, the first moving part 37e moves forward and backward in the Y-axis direction, and the first moving part 37e moves forward and backward in the Y-axis direction. Accordingly, the second moving portion 37i moves forward and backward in the Z-axis direction, and the Z-axis moving portion 37n attached to the second moving portion 37i via the ball joint shaft 37l and the spherical bearing portion 37m is a slide bearing portion. It moves forward and backward in the Z-axis direction with respect to the XY adjustment plate 36 attached via 37d, the first moving part 37e and the third guide holding part 37k.

  As described above, each Z-axis drive mechanism 37 is provided corresponding to each support portion insertion hole (36a, 36b, 36c) of the XY adjustment plate 36 individually. Specifically, as shown in FIG. 11, the Z-axis moving part 37n of the Z-axis driving mechanism 37A is inserted into the support part insertion hole 36a, and the Z-axis moving part 37n of the Z-axis driving mechanism 37B is supported. The Z-axis moving part 37n of the Z-axis drive mechanism 37C is inserted into the support part insertion hole 36c. In each Z-axis drive mechanism 37, adjustment plate support portions (37q, 37r, 37s) for supporting the Z-axis adjustment plate 38 are provided above the Z-axis moving portion 37n. For this reason, in this embodiment, the Z-axis direction is the fourth direction orthogonal to the reference plane, the Z-axis adjustment plate 38 functions as a fourth direction adjustment plate, and each Z-axis drive mechanism 37 serves as the fourth direction drive mechanism. Function. In each Z-axis drive mechanism 37, a drive motor 37a, a conversion unit 37b, a transmission shaft 37c, a slide bearing unit 37d, a first moving unit 37e, a first guide unit 37f, a second guide unit 37g, and a second guide holding unit. 37h, the second moving portion 37i, the third guide portion 37j, the third guide holding portion 37k, the ball joint shaft 37l, the spherical bearing portion 37m, and the Z-axis moving portion 37n function as a drive main body portion.

  The adjustment plate support portion 37q provided on the Z-axis movement portion 37n of the Z-axis drive mechanism 37A has a cylindrical shape as a whole and is fixed at a predetermined position with respect to the back surface (lower surface) of the Z-axis adjustment plate 38. Is done. That is, since the adjustment plate support portion 37q is provided on the Z-axis movement portion 37n that is swingable by the ball joint shaft 37l and the spherical bearing portion 37m, the XY plane of the Z-axis adjustment plate 38 is provided. A predetermined position of the Z-axis adjusting plate 38 is fixedly supported while allowing a change in inclination with respect to (allowing to change the support angle). For this reason, the adjustment plate support part 37q functions as a first support part in the fourth direction drive mechanism.

  The adjustment plate support portion 37r provided on the Z-axis moving portion 37n of the Z-axis drive mechanism 37B has a long guide rail, and although not shown, a guide rail holding portion provided on the back surface of the Z-axis adjustment plate 38. The guide rail is held so as to be slidable by the movement, so that it is connected to the back surface of the Z-axis adjusting plate 38. This guide rail extends so that the axis of the adjustment plate support portion 37q (Z-axis moving portion 37n) of the Z-axis drive mechanism 37A is positioned on the extension line in the extending direction, in other words, toward the axis. The position is set. Since the adjusting plate support portion 37r is provided on the Z-axis moving portion 37n that can be swung by the ball joint shaft 37l and the spherical bearing portion 37m, the adjusting plate support portion 37r with respect to the XY plane of the Z-axis adjusting plate 38 is provided. The rear surface of the Z-axis adjusting plate 38 is supported so as to be displaceable in the extending direction of the guide rail while allowing the change in inclination (the support angle can be changed freely). For this reason, the adjustment plate support part 37r functions as a second support part in the fourth direction drive mechanism.

  The adjustment plate support portion 37s provided on the Z-axis moving portion 37n of the Z-axis drive mechanism 37C has a cylindrical shape as a whole, and is slidably brought into contact with the back surface of the Z-axis adjustment plate 38. That is, since the adjustment plate support portion 37s is provided on the Z-axis movement portion 37n that is swingable by the ball joint shaft 37l and the spherical bearing portion 37m, the XY plane of the Z-axis adjustment plate 38 is provided. The Z-axis adjusting plate 38 is movably supported while allowing a change in inclination with respect to the angle (the support angle can be changed freely). For this reason, the adjustment plate support portion 37s functions as a third support portion in the fourth direction drive mechanism.

  As shown in FIG. 2, the Z-axis adjusting plate 38 is a plate-like member that enables a fixed placement of the chuck plate 40 that sucks and holds the target workpiece 22 (see FIG. 1). The Z-axis adjusting plate 38 adjusts the height position seen in the Z-axis direction by driving each Z-axis drive mechanism 37 in synchronization. Further, the Z-axis adjusting plate 38 adjusts the inclination with respect to the XY plane by appropriately driving each Z-axis drive mechanism 37 individually. At this time, in the Z-axis adjustment plate 38, a position where the adjustment plate support portion 37q of the Z-axis drive mechanism 37A is fixed becomes a base point, and the adjustment plate support portion 37q, the adjustment plate support portion 37r of the Z-axis drive mechanism 37B, and the Z Variations in the distances due to the difference in height position of the adjustment plate support portion 37s of the shaft drive mechanism 37C are caused by the displacement of the adjustment plate support portion 37r in the extending direction of the guide rail and the adjustment plate support portion 37s. By being absorbed by the displacement, the support by each Z-axis drive mechanism 37 is possible. Further, in the Z-axis adjustment plate 38, the adjustment plate support portion 37r of the Z-axis drive mechanism 37B is configured to permit only displacement in the extending direction of the guide rail, and therefore the adjustment plate of the Z-axis drive mechanism 37A. It is prevented that the support portion 37q is rotated around the Z-axis direction from the location where the support portion 37q is fixed.

  The Z-axis adjusting plate 38 is provided with a tool microscope 41 and an ultrasonic sensor 42 as shown in FIG. Although not shown, the tool microscope 41 and the ultrasonic sensor 42 are fixed to the inner peripheral edge of the central insertion hole 38a. The tool microscope 41 extends downward from the central insertion hole 38a into the central through hole 36d of the XY adjustment plate 36 and the space between the X-axis slider 35A and the X-axis slider 35B. The tool microscope 41 is a microscope used for adjusting the reference position of the Z-axis adjustment plate 38 (XY adjustment plate 36) with respect to the projection optical system of the exposure apparatus 10, and the optical axis direction is fixed through the central insertion hole 38a. In the state where the axis adjustment plate 38 is in the reference posture, it is equal to the Z-axis direction. The reference posture of the Z-axis adjustment plate 38 is a state in which the height positions of the supports by the respective Z-axis drive mechanisms 37 (adjustment plate support portions (37q, 37r, 37s)) are equal, that is, the base member 31 is used as a reference. The state along the XY plane. The tool microscope 41 has a Z-axis adjusting plate 38 (as viewed in the direction along the XY plane with respect to the projection optical system of the exposure apparatus 10 by matching the optical axis with the projection optical axis of the projection optical system of the exposure apparatus 10. The position of the XY adjustment plate 36) is arranged as a reference position. Further, the tool microscope 41 has a Z-axis of the Z-axis adjusting plate 38 to which the chuck plate 40 is attached so that the target work 22 is along the reference plane when the target work 22 is sucked and held on the chuck plate 40. It can also be used to adjust the position (height position) seen in the direction.

  The ultrasonic sensor 42 extends downward from the central insertion hole 38a of the Z-axis adjustment plate 38 into the central through hole 36d of the XY adjustment plate 36 and the space between the X-axis slider 35A and the X-axis slider 35B. Yes. The ultrasonic sensor 42 is provided for determining whether or not the target workpiece 22 is sucked and held (placed) on the chuck plate 40. The ultrasonic sensor 42 has a detection direction equal to the Z-axis direction when the Z-axis adjustment plate 38 is in the reference posture.

  As shown in FIGS. 2 and 3, a lift mechanism 39 (see FIGS. 2 and 3) is provided below the Z-axis adjusting plate 38. The lift mechanism 39 moves the target workpiece 22 (see FIG. 1) on the chuck plate 40 in the Z-axis direction (more precisely, the direction perpendicular to the Z-axis adjusting plate 38, that is, a mounting surface 40b described later). In the height direction including). As shown in FIG. 13, the lift mechanism 39 includes a lift base 39a, a plurality of lift pins 39b, a vertical drive unit 39c, a lift pin first suction unit 39d (see FIG. 14), and a lift pin second suction unit 39e (see FIG. 13). 14). The lift base 39a is a frame member that is held by the vertical drive unit 39c so as to be displaceable in the Z-axis direction. Although not shown, the upper and lower drive unit 39c is attached to the Z-axis adjustment plate 38 with its upper end surface fixed to the back surface (lower surface) of the Z-axis adjustment plate 38. For this reason, the lift base 39a is moved between the Z-axis adjustment plate 38 and the XY adjustment plate 36 by the vertical drive unit 39c regardless of the inclination of the Z-axis adjustment plate 38 with respect to the XY plane. The position relative to the Z-axis adjusting plate 38 (the position in the height direction including the Z-axis) viewed in a direction perpendicular to the plate surface is freely displaceable. Each lift pin 39b is provided on the lift base 39a.

  Each lift pin 39b is a cylindrical member protruding upward from the lift base 39a in the Z-axis direction, and a lift pin suction surface 39f is provided at the upper end. The lift pin adsorbing surface 39f is made of a flexible material and has a bowl shape (a bowl shape) that opens upward (see FIG. 15A and the like). Although not shown, each lift pin 39b is connected to a first lift pin suction portion 39d or a second lift pin suction portion 39e (see FIG. 14). The lift pin first suction portion 39d or the lift pin second suction portion 39e communicates with the inner space from the base end portion of each corresponding lift pin 39b, and the space can be evacuated and released. In each lift pin 39b, the inner space is evacuated by the lift pin first suction portion 39d or the lift pin second suction portion 39e in a state where the target work 22 (see FIG. 1) is placed on the lift pin suction surface 39f. Thus, the suction work of the target work 22 (see FIG. 1) can be held. In this embodiment, two lift pins 39b are arranged on the lift base 39a inward (also referred to as lift pins 39b1) and four outward (also referred to as lift pins 39b2). A lift pin first suction portion 39d is connected to 39b1, and a lift pin second suction portion 39e (see FIG. 14) is connected to the four lift pins 39b2. For this reason, in the lift mechanism 39, the two lift pins 39b1 and the four lift pins 39b2 can be evacuated separately.

  Each lift pin 39b passes through a pin insertion hole 38b (see FIG. 3 and the like) provided in the Z-axis adjusting plate 38 and a pin insertion hole 40a (see FIG. 3 and FIG. 15A and the like) provided in the chuck plate 40, thereby The plate 40 (the mounting surface 40b described later) can protrude upward. The lift mechanism 39 is controlled by a drive control unit 43 (see FIG. 14) provided inside the mounting stage 30. As shown in FIG. 14, the drive control unit 43 includes both Y-axis drive mechanisms 32, both X-axis drive mechanisms 34, each Z-axis drive mechanism 37, a lift mechanism 39, a fixed suction mechanism 60 and a plane suction mechanism 70 described later. And a detection signal from a posture acquisition mechanism 44 described later can be acquired. The lift mechanism 39 sucks and holds the target work 22 (see FIG. 1) placed on the upper end surface of each lift pin 39b in a state where each lift pin 39b protrudes above the chuck plate 40 (see FIG. 15). Thereafter, the lift base 39a is lowered and each lift pin 39b is pulled toward the chuck plate 40 (see FIG. 16), so that the target work 22 held by suction is placed on the chuck plate 40 (a mounting surface 40b described later). Can be placed.

  As shown in FIGS. 15 and 16, the chuck plate 40 has a rectangular plate shape as a whole and is placed on the upper surface which is flat with high accuracy for placing the target work 22 (see FIG. 1). Surface 40b is formed. The chuck plate 40 is set so that the mounting surface 40b is along the reference plane (XY plane) in a state where the Z-axis adjustment plate 38 is in the reference posture. The chuck plate 40 is provided with a fixed suction mechanism 60 and a flat suction mechanism 70.

  The fixed suction mechanism 60 basically serves to place the target work 22 (see FIG. 1) sucked and held by the lift mechanism 39 (the lift pins 39b) on the placement surface 40b of the chuck plate 40. The position relative to the mounting surface 40b is fixed and held without causing a change in posture. The fixed suction mechanism 60 has a plurality of lip suction portions 61 as fixed suction portions. As shown in FIG. 15A, each lip suction portion 61 is individually provided in each suction recess 40c provided in the chuck plate 40 so as to dent the mounting surface 40b. Each lip adsorbing portion 61 has a tubular shape as a whole, and an upper end is a lip adsorbing surface 61a. By the action of a lip adsorbing portion (62 to 65 (see FIG. 14)) to be described later, The target work 22 (see FIG. 1) can be sucked and held. Each lip suction portion 61 enables displacement of the lip suction surface 61a (holding position) in a direction along the placement surface 40b in a state where the target workpiece 22 is suctioned and held, and the lip suction surface 61a (holding position). Can be sucked and held from the mounting surface 40b in the orthogonal direction (the height direction including the Z axis), and the lip suction surface 61a ( The holding position) can be flush with the placement surface 40b. In the present embodiment, each lip adsorbing portion 61 is formed of a flexible resin material and is a bellows-like cylindrical member extending in a direction orthogonal to the placement surface 40b (a height direction including the Z axis). ing.

  As shown in FIGS. 15 and 16, in the present embodiment, three lip adsorbing portions 61 are provided along each side of the mounting surface 40b, that is, a total of twelve lip adsorbing portions 61. Divided into four groups. Hereinafter, when describing the lip adsorbing portion 61 for each group, as shown in FIG. 17, it is referred to as an n-th group lip adsorbing portion 61A, 61B, 61C, 61D (n is an integer of 1 to 4) for convenience. That is, the first group lip suction part 61A, the second group lip suction part 61B, the third group lip suction part 61C, and the fourth group lip suction part 61D each have three lip suction parts 61.

  Although not shown, each lip suction portion 61 is connected to a lip suction portion (62 to 65 (see FIG. 14)). The lip suction portions (62 to 65) communicate with the inner space from the base end portions of the corresponding lip suction portions 61, and the space can be evacuated and released. In each lip suction part 61, the inner space is evacuated by the lip suction part (62 to 65) in a state where the target work 22 (see FIG. 1) is placed on the lip suction surface 61a. The target work 22 (see FIG. 1) can be sucked and held. At this time, since each lip suction portion 61 is a flexible bellows-like cylindrical member, the lip suction surface 61a (holding position) can be displaced in the direction along the mounting surface 40b. At the same time, it can be shrunk so as to be folded in the axial direction by suction by the lip suction part (62 to 65). In the present embodiment, as described above, each lip adsorbing portion 61 is contracted to be folded so that the lip adsorbing surface 61a (holding position) can be flush with the mounting surface 40b.

  In the present embodiment, as shown in FIG. 14, the lip first suction part 62 is connected to the first group lip suction part 61A, and the lip second suction part 63 is connected to the second group lip suction part 61B. The lip third suction part 64 is connected to the third group lip suction part 61C, and the lip fourth suction part 65 is connected to the fourth group lip suction part 61D. For this reason, in the fixed suction mechanism 60, each of the n-th group lip suction portions 61A, 61B, 61C, 61D (n is an integer of 1 to 4) can be evacuated separately. In the fixed suction mechanism 60, as shown in FIGS. 15 and 16, the target work 22 is sucked and held by a plurality of lip suction portions 61 (at least two), thereby preventing the posture of the target work 22 from changing. be able to. Here, the posture of the target workpiece 22 refers to the inclination of the target workpiece 22 in the X, Y, and Z axis directions with respect to the reference plane. In addition, the displacement in the direction along the mounting surface 40b of the lip suction surface 61a (holding position) in each lip suction part 61 is as long as the force in the direction along the mounting surface 40b does not act on the suctioned and held target workpiece 22 itself. Since the moving directions are not uniform and elastic, the attracted and held target workpiece 22 is not moved in the direction along the XY plane. As a result, the fixed suction mechanism 60 is mounted in a direction perpendicular to the mounting surface 40b while allowing displacement of the holding location in each lip suction portion 61 holding the target workpiece 22 in the direction along the mounting surface 40b. It can be moved to the placement surface 40b side. For this reason, the fixed suction mechanism 60 can place the target work 22 that is attracted and held away from the placement surface 40b on the placement surface 40b.

  The flat suction mechanism 70 sucks and holds the target work 22 placed on the placement surface 40b on the placement surface 40b in a flat state. The flat suction mechanism 70 has a plurality of flat suction holes 71. Each flat suction hole 71 is a through-hole penetrating the chuck plate 40 in the height direction (see FIG. 3), and is provided over the entire area of the mounting surface 40b. In the present embodiment, each planar suction hole 71 is provided on a plurality of annular grooves 72 provided on the mounting surface 40b, and those located on the same annular groove 72 are communicated with each other (FIG. 15A etc.). Each annular groove 72 has a rectangular shape centered on the center position of the mounting surface 40b, and is provided so as to gradually increase the inner area from a position near the center of the mounting surface 40b to a position near each side. It has been. When each annular groove 72 is said individually, it is referred to as an annular groove 72A to an annular groove 72G in order from the inside.

  Each flat suction hole 71 is connected to a flat hole suction part (73 to 75 (see FIG. 14)), although not shown. These flat hole suction portions (73 to 75 (see FIG. 14)) communicate with the corresponding flat surface suction holes 71 on the back surface side of the chuck plate 40, and can evacuate and release the inner space. Has been. In each planar suction hole 71, the inner space is evacuated by the planar hole suction part (73 to 75 (see FIG. 14)) while the target work 22 (see FIG. 1) is placed on the placement surface 40b. As a result, the target workpiece 22 (see FIG. 1) can be sucked and held on the placement surface 40b. In the present embodiment, each planar suction hole 71 is provided on the annular groove 72A to the annular groove 72G. Therefore, each planar suction hole 71 has a planar hole suction portion (73 to 72-G). 75 (see FIG. 14)), the target workpiece 22 (see FIG. 1) can be sucked and held on the placement surface 40b. Therefore, the chuck plate 40 functions as a suction stage that can hold the target workpiece 22 (see FIG. 1) by suction on the placement surface 40b by the fixed suction mechanism 60 and the flat suction mechanism 70.

  In this embodiment, as shown in FIG. 18, each annular groove 72 includes three inner annular grooves 72A to 72C, an intermediate annular groove 72D to an annular groove 72F, and an outer annular groove 72G. It is divided into groups (see reference numerals 77, 78, 79). For this reason, in this embodiment, three plane hole suction portions 73, 74, and 75 (see FIG. 14) are provided corresponding to each group. A one-hole suction part 73 is connected, a planar second hole suction part 74 is connected to the intermediate annular groove 72D to the annular groove 72F, and a planar third hole suction part 75 is connected to the outer annular groove 72G. ing. For this connection, a plurality of suction chambers 76 (see FIG. 19) are formed on the back side of the chuck plate 40.

  As shown in FIG. 19, each suction chamber 76 is formed by closing a recess defined by a rib portion while the back surface of the chuck plate 40 is concave with a sealing member (not shown). In the present embodiment, each suction chamber 76 includes an inner suction chamber 76A, a suction chamber 76B surrounding the suction chamber 76A, and four suction chambers 76C surrounding each side. Although not shown, the suction chamber 76A communicates with each flat surface suction hole 71 (see FIG. 18 and the like) on the annular groove 72A to the annular groove 72C, and the suction chamber 76B includes each plane on the annular groove 72D to the annular groove 72F. The four suction chambers 76C communicate with the suction holes 71 (see FIG. 18 and the like) and communicate with the respective planar suction holes 71 (see FIG. 18 and the like) on the annular groove 72G. Although not shown in the drawing, the flat first hole suction part 73 is connected to the suction chamber 76A, the flat second hole suction part 74 is connected to the suction chamber 76B, and the flat third hole suction part 76C is connected to the suction chamber 76C. A hole suction portion 75 is connected (see FIG. 14).

  Therefore, in the flat surface suction mechanism 70, as shown in FIG. 18, the vacuum chamber 76A (see FIG. 19) and each plane communicating therewith are evacuated by the flat first hole suction part 73 (see FIG. 14). The inside of the annular grooves 72A to 72C can be evacuated through the suction holes 71. At this time, since the annular groove 72A to the annular groove 72C surround the center position while being adjacent to each other on the placement surface 40b, a predetermined region from the center position of the placement surface 40b to the peripheral position of the annular groove 72C. In (the first suction section 77), the space between the placement surface 40b and the target workpiece 22 placed thereon is evacuated. Thus, in the flat suction mechanism 70, the mounting surface 40b is placed in the first suction section 77 from the center position of the mounting surface 40b to the peripheral position of the annular groove 72C by evacuating the flat first hole suction part 73. The target workpiece 22 can be sucked and held in cooperation with the above. Similarly, in the flat surface suction mechanism 70, the inside of the annular grooves 72D to 72F is evacuated through the suction chamber 76B and the respective flat surface suction holes 71 communicated therewith by evacuating the flat second hole suction part 74. In the second suction section 78 from the outside of the first suction section 77 to the peripheral position of the annular groove 72F, the target work 22 can be sucked and held in cooperation with the placement surface 40b. Similarly, in the flat suction mechanism 70, the inside of the annular groove 72G is evacuated via the four suction chambers 76C and the flat suction holes 71 communicating therewith by vacuuming with the flat third hole suction part 75. In the third suction section 79 from the outside of the second suction section 78 to the peripheral position of the annular groove 72G, the target work 22 can be sucked and held in cooperation with the placement surface 40b.

  In the present embodiment, each suction part (39d, 39e, 62 to 65, 73 to 75) in the lift mechanism 39, the fixed suction mechanism 60, and the flat suction mechanism 70 is not illustrated, but is a single vacuum pump. A plurality of pipes connected thereto and valve mechanisms provided in the respective pipes are configured, and individual vacuuming and releasing thereof are performed in each suction portion by appropriately opening and closing the valve mechanisms. The operation of the flat suction mechanism 70 is performed under the control of the drive control unit 43 provided inside the mounting stage 30 together with the operations of the lift mechanism 39 and the fixed suction mechanism 60 (see FIG. 14). This control will be described in detail later.

  In the mounting stage 30, the target work 22 (see FIG. 1) placed on the upper end surface of each lift pin 39 b that protrudes upward from the chuck plate 40 is sucked and held, and the target work 22 is held by the lift mechanism 39. With this operation, the operation shifts to suction holding by the chuck plate 40. Thereafter, in the mounting stage 30, the target workpiece 22 is set to an appropriate posture along the imaging plane (reference plane) of the projection optical system of the exposure apparatus 10 according to the posture of the target workpiece 22 sucked and held by the chuck plate 40. However, the position is appropriate for the projection optical system. Specifically, on the base member 31, by moving both Y-axis sliders 33 in the Y-axis direction and both X-axis sliders 35 (35A, 35B) in the X-axis direction as appropriate, the chuck plate 40, Z-axis The position and rotational attitude of the target workpiece 22 provided on the XY adjustment plate 36 along the XY plane are adjusted via the adjustment plate 38 and each Z-axis drive mechanism 37. Further, by appropriately changing the support position by each Z-axis drive mechanism 37, the position (high height) of the target workpiece 22 provided on the XY adjustment plate 36 via the chuck plate 40 and the Z-axis adjustment plate 38 is increased. Position) and tilt relative to the XY plane. As a result, the exposure apparatus 10 can appropriately expose the mask pattern image on the target workpiece 22.

  Next, with reference to FIGS. 1 to 19, the process of sucking and holding the target workpiece 22 by the chuck plate 40 (the mounting surface 40 b) by the lift mechanism 39, the fixed suction mechanism 60 and the flat suction mechanism 70 will be described with reference to FIGS. 1 to 19. However, it will be explained. Note that this step is performed under the control of the drive control unit 43 (see FIG. 14) provided inside the placement stage 30 as described above. Further, in FIGS. 2, 3 and 15 to 18, the illustration of the target work 22 is omitted for easy understanding of the configuration and operation.

  The target workpiece 22 (see FIG. 1) placed on the placement stage 30 is transported onto the chuck plate 40 while being held by a transport hand (transport arm), although not shown. The transport hand has a known configuration, and can suck and hold the target work 22 so as to support it from below, and can move while maintaining the holding state. The ultrasonic sensor 42 (see FIG. 3) can detect that the target workpiece 22 has been transferred onto the chuck plate 40 by the transfer hand (transfer arm).

  When the target workpiece 22 is transferred onto the chuck plate 40, the lift mechanism 39 moves the lift pins 39b upward of the chuck plate 40 (mounting surface 40b) on the mounting stage 30, as shown in FIG. Each lift pin suction surface 39f is brought into contact with the back surface of the target workpiece 22 by projecting. Thereafter, the lift mechanism 39 sucks and holds the vicinity of the center of the target workpiece 22 with the two lift pins 39b1 by evacuation by the lift pin first suction portion 39d (see FIG. 14), and then the lift pin second suction portion 39e (FIG. 14). The four corners of the workpiece 22 are sucked and held by the four lift pins 39b2 by evacuation in (see). Thereby, the lift mechanism 39 can suck and hold each lift pin 39b (the lift pin suction surface 39f) while maintaining the posture of the target workpiece 22 sucked and held by the transport hand (not shown). In the exposure apparatus 10 of the present embodiment, the posture of the target workpiece 22 is acquired by the posture acquisition mechanism 44 (see FIG. 14) in a state where the target workpiece 22 is sucked and held by a transport hand (not shown). . Thereafter, as shown in FIG. 16, the lift mechanism 39 pulls each lift pin 39 b toward the chuck plate 40, and brings the lip suction surface 61 a of each lip suction portion 61 into contact with the back surface of the target work 22 held by suction. .

  Then, in the mounting stage 30, as shown in FIGS. 16 and 17, the fixed suction mechanism 60 performs evacuation by the lip suction parts 62 to 65 (see FIG. 14), and each lip suction part 61 ( The target work 22 is sucked and held by the lip suction surface 61a). Thereafter, the lift mechanism 39 releases the suction holding by the lift pins 39 b and pulls the lift pins 39 b into the chuck plate 40. The fixed suction mechanism 60 continues to be evacuated by each of the lip suction parts 62 to 65, and the height at which the lip suction surface 61a (holding position) is flush with the placement surface 40b in a state where the target workpiece 22 is suctioned and held. Each lip suction part 61 is contracted (folded) to the position. As a result, in the fixed suction mechanism 60, the target work 22 is placed on the placement surface 40b while being held by the lip suction portions 61 while maintaining the posture of the target work 22 held by the lift mechanism 39. can do. In addition, in the fixed adsorption | suction mechanism 60, although it was set as the structure divided into the nth group lip adsorption | suction part 61A, 61B, 61C, 61D (n is an integer of 1-4), in a present Example, all The adsorption operation is performed all at once.

  Thereafter, the stage 30 starts a stepwise suction operation by the flat suction mechanism 70. In the flat suction mechanism 70, in this embodiment, as shown in FIG. 18, first, the first suction section 77 of the mounting surface 40b is evacuated by evacuation in the flat first hole suction portion 73 (see FIG. 14). The target workpiece 22 is sucked and held. Thereby, in the plane suction mechanism 70, the target work 22 can be sucked to the first suction section 77 of the placement surface 40b while maintaining the posture of the target work 22 sucked and held by the fixed suction mechanism 60. . Next, in the flat suction mechanism 70, the target work 22 is sucked and held in the second suction section 78 of the placement surface 40b by evacuation by the flat second hole suction part 74 (see FIG. 14). Next, in the flat suction mechanism 70, the target workpiece 22 is sucked and held in the third suction section 79 of the placement surface 40b by evacuation by the flat third hole suction portion 75 (see FIG. 14). By the stepwise suction operation by the flat suction mechanism 70, the target work 22 is made flat while maintaining the posture held by the fixed suction mechanism 60 and sucked to the mounting surface 40b (chuck plate 40). Is done. This will be described below.

  The target workpiece 22 may be bent while being held by the lift mechanism 39 (the lift pins 39b). This bending means that the flat target workpiece 22 itself is curved regardless of whether it is whole or partial, and can also be called swell or warp. Since this bending hinders appropriate exposure of the mask pattern image by the projection optical system of the exposure apparatus 10, it is set in a canceled state, that is, the mounting surface 40b (chuck) with the target workpiece 22 in a flat state. It is desired to hold on the plate 40).

  In the flat suction mechanism 70, as described above, the target work 22 is first sucked into the first suction section 77 of the flat placement surface 40b. This is because the target work 22 is considered to be bent so that the center hangs down due to its own weight in a state where the target work 22 is sucked and held by the fixed suction mechanism 60. As a result, the posture of the target work 22 being sucked and held by the fixed suction mechanism 60 is maintained, and the vicinity of the center is sucked and flattened by the placement surface 40b. Thereafter, in the planar suction mechanism 70, the target work 22 is sucked to the second suction section 78 of the placement surface 40b while maintaining the suction in the first suction section 77. Then, in the target workpiece 22, the radially outer side from the vicinity of the center attracted first is attracted to the placement surface 40b, so that the surplus due to the deflection around the center near is released outward in the radial direction. In addition, a portion surrounding the center (a region corresponding to the second suction section 78) is sucked and flattened by the placement surface 40b. At this time, the target workpiece 22 is sucked and held by each lip sucking portion 61 of the fixed sucking mechanism 60, but each lip sucking portion 61 is a flexible bellows-like cylindrical member, and the lip sucking surface 61a. Since the displacement of the (holding position) in the direction along the mounting surface 40b is allowed, suction holding by each lip suction portion 61 does not become a problem. Thereafter, in the planar suction mechanism 70, the target workpiece 22 is sucked to the third suction section 79 of the placement surface 40b while maintaining the suction in the first suction section 77 and the second suction section 78. Then, in the object work 22, since the vicinity of the center previously sucked and the outside in the radial direction from the outside are sucked to the mounting surface 40b, the surplus due to the bending is radiated around the sucked portion. A portion (region corresponding to the third suction section 79) surrounding the vicinity of the center is attracted to the placement surface 40b so as to escape to the outside in the direction and is flattened. That is, in the present embodiment, the suction operation is started in order from the center position on the mounting surface 40b toward the outer peripheral edge on the radially outer side.

  Thereby, in the chuck plate 40, the target workpiece 22 is made to be in a flat state and sucked to the mounting surface 40b without changing the posture of the target workpiece 22 held by suction by a transport hand (not shown) ( Adsorption holding).

  In the mounting stage 30 of the present embodiment, as described above, the posture of the target workpiece 22 in a state of being held by suction by a transport hand (not shown) is acquired by the posture acquisition mechanism 44 (see FIG. 14). Yes. As described above, the acquired posture of the target workpiece 22 does not change even if the flat state is obtained by the flat suction mechanism 70 via the lift mechanism 39 and the fixed suction mechanism 60. For this reason, after the target workpiece 22 is sucked and held by the chuck plate 40 in the mounting stage 30, on the base member 31, based on the posture of the target workpiece 22 acquired by the posture acquisition mechanism 44 (see FIG. 14). By appropriately changing the support position by each Z-axis drive mechanism 37 while appropriately moving both Y-axis sliders 33 in the Y-axis direction and both X-axis sliders 35 (35A, 35B) in the X-axis direction, the target workpiece 22 is changed. In FIG. 5, the position where the projection optical system of the exposure apparatus 10 performs exposure can be positioned in an appropriate state on the reference plane serving as the imaging plane. As a result, the exposure apparatus 10 can appropriately expose the mask pattern image on the target workpiece 22.

  As described above, in the chuck plate 40 as the suction stage according to the present invention, the planar suction mechanism 70 has the third suction from the first suction section 77 including the center position on the placement surface 40b through the second suction section 78. Since the suction operation is started in order toward the outer peripheral edge portion toward the section 79, even if the target work 22 is bent, the surplus due to the bending can be released outward in the radial direction. Therefore, the target workpiece 22 can be appropriately adsorbed on the flat mounting surface 40b. Thereby, the target workpiece 22 can be sucked and held in a flat state.

  In the chuck plate 40, the flat suction mechanism 70 sucks (evacuates) the plurality of flat suction holes 71 that open the mounting surface 40b, thereby bringing the target workpiece 22 into a flat state. Therefore, it is possible to prevent the product accuracy from being lowered. This is because, for example, when the target work 22 is pressed down on the placement surface 40b with a nail to be in a flat state, the surface of the target work 22 may be scratched by the nail, or the operation of the nail This is because dust may adhere to the target work 22 due to the above, and the product accuracy may be reduced.

  Further, in the chuck plate 40, the flat suction mechanism 70 sucks (vacuums) the plurality of flat suction holes 71 that open the mounting surface 40b, thereby bringing the target workpiece 22 into a flat state. As soon as the target workpiece 22 is placed on the placement surface 40b, the suction (evacuation) in each flat suction hole 71 can be started, so that the time (throughput) required for forming the mask pattern can be shortened. Can be planned. For example, when the target work 22 is pressed down on the placement surface 40b with a nail so as to be in a flat state, the nail is put in and out of the target work 22 placed on the placement surface 40b. This is because it is necessary to increase the time required for forming the mask pattern.

  In the chuck plate 40, the flat suction mechanism 70 allows the surplus due to the bending of the target work 22 to escape to the outside of the rectangular third suction section 79, so that the surplus that is approached can be dispersed. Therefore, it is possible to flatten while maintaining the position and posture determined by the suction of each lip suction portion 61 of the fixed suction mechanism 60. In particular, in the present embodiment, since the surplus is released from the center position of the mounting surface 40b to the outside in the radial direction, it is possible to further suppress the occurrence of a bias in the surplus that is approached. The position and posture determined by the suction of each lip suction portion 61 of the fixed suction mechanism 60 can be flattened while maintaining more reliably.

  In the chuck plate 40, by providing a plurality of suction sections (77 to 79 in the above-described embodiments) in the flat surface suction mechanism 70, control for starting the suction operation can be performed for each suction section. Therefore, the target workpiece 22 can be made flat by simple control.

  In the chuck plate 40, each flat surface suction hole 71 as the flat surface suction mechanism 70 is provided over the entire area of the mounting surface 40b, so that the target workpiece 22 is suctioned and held while being more appropriately flat. be able to.

  In the chuck plate 40, in the flat surface suction mechanism 70, a plurality of flat surface suction holes 71 that open the mounting surface 40 b are communicated by the annular groove 72, so that each flat hole suction portion (73 to 75 (see FIG. 14)). ), The target workpiece 22 can be adsorbed in a wide area on the placement surface 40b.

  In the chuck plate 40, since the plurality of annular grooves 72 (72A to 72G in the above-described embodiments) are provided in the flat suction mechanism 70, at least one flat suction is provided on the mounting surface 40b with a simple configuration. A plurality of adsorption sections having holes 71 (77 to 79 in the above-described embodiments) can be formed.

  In the chuck plate 40, a plurality of annular grooves 72 (72A to 72G in the above-described embodiments) are provided concentrically in the flat surface suction mechanism 70. Therefore, the chuck plate 40 can be configured with a simple configuration from the center position on the mounting surface 40b. The adsorption operation can be started in order toward the outside in the radial direction.

  In the chuck plate 40, each lip suction portion 61 of the fixed suction mechanism 60 allows displacement of the lip suction surface 61a (holding position) in the direction along the mounting surface 40b in a state where the target workpiece 22 is suctioned and held. Therefore, while maintaining the posture of the target workpiece 22, it is possible to prevent the surplus due to bending in the target workpiece 22 from being prevented from escaping radially outward by the stepwise suction operation by the flat suction mechanism 70. it can.

  In the chuck plate 40, each lip suction portion 61 of the fixed suction mechanism 60 is a target in a state where the lip suction surface 61a (holding position) protrudes from the mounting surface 40b in the orthogonal direction (the height direction including the Z axis). Since the workpiece 22 can be sucked and held, it is possible to suppress a load on the target workpiece 22 during the transition of the suction holding state of the target workpiece 22 to and from the lift mechanism 39.

  In the chuck plate 40, each lip suction portion 61 of the fixed suction mechanism 60 is a target in a state where the lip suction surface 61a (holding position) protrudes from the mounting surface 40b in the orthogonal direction (the height direction including the Z axis). The workpiece 22 can be sucked and held, and the lip suction surface 61a (holding position) can be flush with the placement surface 40b in a state where the target workpiece 22 is sucked and held. The target workpiece 22 can be quietly placed on the placement surface 40b while maintaining the posture of 22.

  In the chuck plate 40, since the target workpiece 22 is sucked and held by the plurality of lip suction portions 61 in the fixed suction mechanism 60, the posture of the target workpiece 22 can be prevented from changing.

  In the chuck plate 40, the fixed suction mechanism 60 sucks and holds the target work 22 in a state of being sucked and held by the lift pins 39 b of the lift mechanism 39 by the plurality of lip suction parts 61. The target workpiece 22 can be sucked and held while maintaining the posture of the target workpiece 22.

  In the chuck plate 40, the flat suction mechanism 70 sucks and holds the target work 22 in a state of being sucked and held by the lip suction portions 61 of the fixed suction mechanism 60 through the plurality of flat suction holes 71. The target workpiece 22 can be sucked and held while maintaining the posture of the target workpiece 22 held by suction, that is, the posture of the target workpiece 22 sucked and held by the lift mechanism 39.

  In the chuck plate 40, the lift mechanism 39 sucks and holds the target work 22 in a state of being sucked and held by a transport hand (not shown) by a plurality of lift pins 39b, so that it is sucked and held by the transport hand (not shown). The target workpiece 22 can be sucked and held while the posture of the target workpiece 22 is maintained.

  In the chuck plate 40, each lip adsorbing portion 61 of the fixed adsorbing mechanism 60 is formed of a flexible resin material and is a bellows-like cylindrical member extending in a direction orthogonal to the placement surface 40b. With a simple configuration, the lip suction surface 61a (holding position) can be displaced in the direction along the mounting surface 40b in a state where the target workpiece 22 is sucked and held, and the lip suction surface 61a (holding position) is mounted. The target workpiece 22 can be sucked and held from the placement surface 40b in a state of projecting in the orthogonal direction (the height direction including the Z axis), and the lip suction surface 61a (holding position) can be held while the target workpiece 22 is sucked and held. ) Can be made flush with the mounting surface 40b.

  Since the ultrasonic sensor 42 is used in the chuck plate 40 to determine whether or not the target workpiece 22 has been conveyed upward, the height position on the chuck plate 40 (the position viewed in the Z-axis direction). ), The presence or absence of the target workpiece 22 can be detected.

  In the exposure apparatus 10, since the target work 22 is in a flat state with extremely high accuracy on the chuck plate 40, the mask pattern image can be appropriately exposed on the target work 22.

  In the exposure apparatus 10, the posture of the target workpiece 22 while being sucked and held by a transport hand (not shown) is acquired by the posture acquisition mechanism 44 (see FIG. 14), and the target workpiece 22 is sucked by the chuck plate 40. After the holding, based on the posture of the target workpiece 22 acquired by the posture acquisition mechanism 44, both the Y-axis sliders 33 are moved in the Y-axis direction and both the X-axis sliders 35 (35A, 35B) are X on the base member 31. By appropriately changing the support position by each Z-axis drive mechanism 37 while appropriately moving in the axial direction, a position on the target workpiece 22 where exposure is performed by the projection optical system of the exposure apparatus 10 becomes a reference plane serving as an imaging plane. Since it can be positioned in an appropriate state, the time (throughput) required for forming the mask pattern can be shortened.

  Therefore, in the chuck plate 40 (suction stage) according to the present invention, the target workpiece 22 can be held in a flat state without causing an increase in working time or a reduction in product system.

  In the above-described embodiment, the chuck plate 40 as an example of the suction stage according to the present invention has been described. However, a target workpiece on which exposure light is imaged and a predetermined mask pattern is exposed is placed on a flat mounting surface. A suction stage that holds the target workpiece with respect to the placement surface, and a fixed suction mechanism that can suck the target workpiece to fix the posture of the target workpiece with respect to the placement surface; A flat suction mechanism, the flat suction mechanism having a plurality of flat suction holes that open the placement surface, and each plane in order from an arbitrary point on the placement surface toward the outer edge. Any suction stage that starts the suction operation using the suction holes may be used, and the present invention is not limited to the above-described embodiment.

  Further, in the above-described embodiment, the flat suction mechanism 70 is configured to start the suction operation in order by dividing the placement surface 40b into the three suction sections 77 to 79. As long as the suction operation by each flat suction hole 71 is started in order from one point to the outer edge, the surplus due to bending can be released to the outside, so there is no need to provide a suction section. It is not limited to examples. The direction from the arbitrary point on the mounting surface 40b toward the outer edge means, for example, that the mounting surface 40b is rectangular as in the above-described embodiment, and the arbitrary one point is the center position of the mounting surface 40b. Then, it means that the distance from the central position is small to large (radiating direction from the central position), and if any one point is near the corner of the mounting surface 40b, FIG. As shown by the arrow A2, the heading is directed in the diagonal direction as a whole. If any one point is in the vicinity of the side portion of the mounting surface 40b, the whole is opposed thereto as shown by the arrow A3 in FIG. Say to head to the side.

  Furthermore, in the above-described embodiment, the flat surface suction mechanism 70 divides the placement surface 40b into three suction sections 77 to 79, and in the order of the first suction section 77, the second suction section 78, and the third suction section 79. Although the suction operation is configured to start, any suction section (however, at least one flat suction hole 71 may be used as long as the suction operation is started in order from one arbitrary point toward the outer edge on the placement surface 40b). And the direction of transition of the suction operation may be set as appropriate (for example, set in accordance with the tendency of bending generated in the target workpiece 22), and is not limited to the above-described embodiment.

  In the above-described embodiment, in the plane suction mechanism 70, each plane suction hole 71 is communicated with a plurality of annular grooves 72 (72A to 72G). However, each of the annular grooves 72 may not be provided. It is not limited to examples.

  In the above-described embodiment, the planar suction mechanism 70 is provided with a plurality of concentric annular grooves 72 (72A to 72G in the above-described embodiments). However, the annular grooves are provided with a plurality of flat surfaces to form suction sections. As long as the suction holes 71 communicate with each other, the shape and the number of the suction holes 71 may be set as appropriate, and are not limited to the above-described embodiments.

  In the above-described embodiment, in the planar suction mechanism 70, the suction operation is simply started in the order of the first suction section 77, the second suction section 78, and the third suction section 79, but the suction operation is started. It is good also as a structure which starts the adsorption | suction operation | movement of the next adsorption | suction division according to the adsorption | suction state in an adsorption | suction division. For example, as shown by a two-dot chain line in FIG. 14, an adsorption state acquisition mechanism 45 that can acquire an adsorption state in each adsorption section is provided, and an output signal from the adsorption state acquisition mechanism 45, that is, an appropriate adsorption is performed. This can be realized by the drive control unit 43 (see FIG. 14) driving and controlling the flat hole suction units 73, 74, and 75 (see FIG. 14) depending on whether or not there is. The suction state acquisition mechanism 45 can be realized with a simple configuration, for example, by detecting a pressure fluctuation in each flat suction hole 71, each flat hole suction part 73, 74, 75 or each suction chamber 76. In such a configuration, the suction operation in the next suction section can be started after the target work 22 is appropriately sucked on the placement surface 40b in the suction section where the suction operation has been started first. Therefore, the target workpiece 22 can be more appropriately flattened.

  In the above-described embodiment, in the plane suction mechanism 70, the placement surface 40b is divided into three concentric suction sections 77 to 79, and the first suction section 77, the second suction section 78, and the third suction section 79 are arranged in this order. While the suction operation is started, the placement surface 40b is divided into arbitrary suction sections on the premise that the suction operation is sequentially started from any one point toward the outer edge on the placement surface 40b. Further, the order of starting the suction operation in each suction section may be appropriately set according to the bending of the target work 22 sucked and held by the transport hand (not shown), the lift mechanism 39 or the fixed suction mechanism 60. . In this case, the placement surface 40b is partitioned so that at least two suction partitions include the outer edge of the placement surface 40b, or even if the distance from the center position of the placement surface 40b is the same, What is necessary is just to divide into the at least 2 or more adsorption | suction division from which the position in a Y-axis direction differs. Further, the bending of the target workpiece 22 may be detected using an attitude acquisition mechanism 44 (see FIG. 14) or an optical system (not shown) for adjusting the focus in the irradiation optical system. In the case of such a configuration, the drive control unit 43 (see FIG. 14) appropriately drives and controls the plane hole suction unit corresponding to each suction section according to the position and direction of bending in the target work 22, and this is realized. can do. In such a configuration, the suction operation in each suction section is started in the order corresponding to the bending of the target work 22, so that the target work 22 can be more appropriately flattened. This is the same even when the suction operation by the plurality of flat suction holes 71 is sequentially started without providing a suction section.

  In the above-described embodiment, the six suction lip suction portions 61 are provided in the fixed suction mechanism 60. However, the fixed suction mechanism 60 may have at least two lip suction portions 61 from the viewpoint of maintaining the posture of the target workpiece 22, The present invention is not limited to the above-described embodiments.

  In the above-described embodiment, in the fixed suction mechanism 60, the suction operation in the four n-th group lip suction portions 61A, 61B, 61C, 61D (n is an integer of 1 to 4) is performed all at once. The suction operation may be sequentially performed in accordance with the actual bending of the target workpiece 22 or the bending tendency of the target workpiece 22, and is not limited to the above-described embodiment.

  In the above-described embodiment, each lip adsorbing portion 61 of the fixed adsorbing mechanism 60 is formed of a flexible resin material and is a bellows-like cylindrical member extending in the direction perpendicular to the placement surface 40b. The lip suction surface 61a (holding position) can be displaced in the direction along the mounting surface 40b in a state where the target workpiece 22 is suctioned and held, and the lip suction surface 61a (holding position) is moved from the mounting surface 40b to The target workpiece 22 can be sucked and held in a state protruding in the orthogonal direction (the height direction including the Z axis), and the lip suction surface 61a (holding position) is placed on the mounting surface while the target workpiece 22 is sucked and held. For example, a hollow sphere that can be elastically deformed may be provided with a suction hole as a lip suction surface and a suction hole for vacuuming as long as it can be flush with 40b. Limited to the above embodiment Not intended to be.

  As described above, the suction stage of the present invention, the mounting stage using the suction stage, and the exposure apparatus using the same have been described based on the embodiments. However, the specific configuration is not limited to the embodiments. Design changes and additions are allowed without departing from the scope of the invention.

DESCRIPTION OF SYMBOLS 10 Exposure apparatus 22 Target workpiece 30 Placement stage 39b Lift pin 40 Chuck plate 40b (As adsorption stage) Placement surface 60 Fixed adsorption mechanism 61 Lip adsorption part (As fixed adsorption part) 70 Flat adsorption mechanism 71 Flat adsorption hole

Claims (11)

A suction stage that holds a target workpiece on which a predetermined mask pattern is exposed by forming an image of exposure light on a flat mounting surface,
A fixed suction mechanism capable of sucking the target work to fix the posture of the target work with respect to the placement surface; and a flat suction mechanism capable of sucking the target work to make surface contact with the placement surface. ,
The planar suction mechanism has a plurality of planar suction holes that open the placement surface, and starts the suction operation by each planar suction hole in order from an arbitrary point on the placement surface toward the outer edge. Characteristic adsorption stage.   The planar suction mechanism has a plurality of suction sections each having at least one planar suction hole positioned on the placement surface, and performs the suction operation of each planar suction hole in each suction section unit. The suction stage according to claim 1, wherein the suction stage starts.   The suction stage according to claim 1, wherein the fixed suction mechanism has at least two or more fixed suction portions that can be suctioned to the target workpiece at an upper end surface on the placement surface. .   4. The suction stage according to claim 3, wherein each of the fixed suction portions is capable of being displaced in a direction along the placement surface of the upper end surface in a state in which the target workpiece is sucked and held. The adsorption stage according to claim 3 or claim 4, wherein
Furthermore, it is capable of moving back and forth in a direction orthogonal to the placement surface with respect to the placement surface, and includes a lift pin having a suction surface at the upper end,
Each of the fixed suction units can suck and hold the target work in a state where the upper end surface protrudes in the orthogonal direction from the placement surface, and the upper end face is in the state of sucking and holding the target work. A suction stage characterized by being flush with a placement surface.   6. The flat surface suction mechanism starts a suction operation by each of the flat surface suction holes in order from a center position on the mounting surface to a peripheral portion of the mounting surface. The adsorption stage according to any one of the above.   2. The flat surface suction mechanism starts a suction operation by each of the flat surface suction holes in order from an edge portion on the placement surface to a direction passing through a center position of the placement surface. The adsorption stage according to claim 5.   8. The flat suction mechanism starts a next suction operation by the flat suction hole according to a suction state in the flat suction hole from which the suction operation has started. The adsorption stage described in the item.   9. The flat suction mechanism sets the order of the suction operation start in each of the flat suction holes according to the deflection of the target work held by the fixed suction mechanism. The adsorption stage according to any one of the above.   A mounting stage that controls the position and posture of the target workpiece with respect to a reference plane, wherein the suction stage according to any one of claims 1 to 9 is used. An exposure apparatus using the suction stage according to any one of claims 1 to 9.