JP2000253115A - Portable electronic equipment - Google Patents
Portable electronic equipmentInfo
- Publication number
- JP2000253115A JP2000253115A JP11052423A JP5242399A JP2000253115A JP 2000253115 A JP2000253115 A JP 2000253115A JP 11052423 A JP11052423 A JP 11052423A JP 5242399 A JP5242399 A JP 5242399A JP 2000253115 A JP2000253115 A JP 2000253115A
- Authority
- JP
- Japan
- Prior art keywords
- housing
- portable electronic
- heating element
- heat
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Telephone Set Structure (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、例えば携帯電話
機などの携帯電子機器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a portable electronic device such as a portable telephone.
【０００２】[0002]
【従来の技術】パーソナルコンピュータやディスプレイ
など、機能上、発熱が起こりやすい電子機器において
は、従来から熱対策が施されている。すなわち、これら
の電子機器は、携帯型ではないので、ユーザが、直接、
手に触れるエリアが限定されていること、冷却のための
ファン等を配置するスペースが比較的とりやすいこと、
等を利用して、種々の熱対策手段が確立されており、幅
広く使用されている。2. Description of the Related Art Electronic devices such as a personal computer and a display, which easily generate heat in function, have conventionally been provided with a countermeasure against heat. That is, since these electronic devices are not portable, users can directly
The area that can be touched is limited, the space for cooling fans etc. is relatively easy to take,
Various heat countermeasures have been established by utilizing such methods, and are widely used.
【０００３】[0003]
【発明が解決しようとする課題】近年の情報通信技術の
急速な発展に伴い、携帯電話にて送受信できる情報量も
拡大し、そのため携帯電話の送信パワーを増大させる必
要性が高まっている。その場合、携帯電話における消費
電力も増大するため、携帯電話機内部の部品、特に送信
電力増幅器部品からの発熱量も従来に比較して大きく増
大し、携帯電話機の熱対策需要が、にわかに高まってい
る。With the rapid development of information communication technology in recent years, the amount of information that can be transmitted and received by mobile phones has also increased, and the need to increase the transmission power of mobile phones has increased. In that case, the power consumption of the mobile phone also increases, so that the heat generation from the components inside the mobile phone, especially the transmission power amplifier component, also greatly increases as compared with the related art, and the demand for heat countermeasures for the mobile phone rapidly increases. .
【０００４】しかしながら、携帯電話機などの、小型・
軽量であって表面積もあまり大きくすることができない
携帯電子機器においては、上述の従来の熱対策をそのま
ま転用することが困難であり、携帯電話機などの携帯電
子機器における熱対策として有効なものが嘱望されてい
る。[0004] However, such as small mobile phones,
In portable electronic devices that are lightweight and cannot have a very large surface area, it is difficult to divert the conventional thermal measures described above as they are, and it is expected that an effective thermal measure for portable electronic devices such as cellular phones will be effective. Have been.
【０００５】この発明は、以上の点にかんがみ、内部の
発熱体の熱を外部に良好に放熱することができる携帯電
子機器を提供することを目的とする。In view of the above, it is an object of the present invention to provide a portable electronic device capable of radiating heat from an internal heating element to the outside.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するた
め、この発明による携帯電子機器は、熱伝導率の高い材
料で筐体を構成すると共に、この筐体に、この筐体内に
配される発熱体を実質上直接的に接触させて、前記発熱
体の熱を前記筐体に伝導させるようにすることを特徴と
する。マグネシウム合金を射出成型したもので筐体を構
成すると、特によい。In order to solve the above-mentioned problems, a portable electronic device according to the present invention has a housing made of a material having high thermal conductivity and is disposed in the housing in the housing. A heating element is brought into substantially direct contact with the housing to conduct heat from the heating element. It is particularly preferable that the housing is formed by injection-molding a magnesium alloy.
【０００７】マグネシウム合金を射出成型したもの、つ
まり、いわゆるマグネチクソモールドにより成型された
筐体は、熱伝導率が、従来、携帯電話機などの携帯電子
機器に使用されてきたＡＢＳなどの樹脂に比べると、１
０００倍と非常に大きな値をとることができる。[0007] A case obtained by injection-molding a magnesium alloy, that is, a case formed by a so-called magnetic xo mold has a thermal conductivity lower than that of a resin such as ABS conventionally used in portable electronic devices such as a cellular phone. And 1
It can take a very large value of 000 times.
【０００８】この発明によれば、マグネチクソモールド
などの熱伝導率の高い材料により筐体が成型されている
とともに、この筐体が、発熱体に実質上直接的に接触し
ているので、発熱体の熱は筐体全体に伝導され、筐体と
外界との熱伝達により放熱される。したがって、筐体内
部の発熱体の熱を外部に良好に放熱することができる携
帯電子機器を提供することができる。According to the present invention, the housing is molded from a material having a high thermal conductivity such as a magnetic mold, and the housing is substantially directly in contact with the heating element. The heat of the body is conducted throughout the housing, and is dissipated by heat transfer between the housing and the outside world. Therefore, it is possible to provide a portable electronic device capable of satisfactorily radiating the heat of the heating element inside the housing to the outside.
【０００９】また、この発明は、前記筐体の、前記発熱
体の熱により高温となる部分は、熱伝導率の低い部材か
らなるカバーにより覆うことを特徴とする。Further, the invention is characterized in that a portion of the housing which is heated by the heat of the heating element is covered by a cover made of a member having low thermal conductivity.
【００１０】この発明の前記の構成により、発熱体と実
質上直接的に接触している筐体部分が、比較的高温にな
るが、熱伝導率の低い部材のカバーによりその部分が覆
われるので、ユーザが直接その高温部分に触れてしまう
ことを防止することができる。According to the above configuration of the present invention, the temperature of the housing portion which is substantially in direct contact with the heating element becomes relatively high, but the portion is covered by the cover of the member having low thermal conductivity. In addition, it is possible to prevent the user from directly touching the high-temperature portion.
【００１１】また、この発明は、前記筐体の外表面に露
呈する部分の一部は、冷却フィンとしての凹凸形状とさ
れてなることを特徴とする。Further, the present invention is characterized in that a part of the portion exposed on the outer surface of the housing is formed as a concave / convex shape as a cooling fin.
【００１２】この構成により、小型の携帯電子機器であ
っても、放熱のための筐体部分の表面積を大きくするこ
とができて、筐体による良好な放熱作用を期待すること
ができる。With this configuration, even in the case of a small-sized portable electronic device, the surface area of the housing portion for heat dissipation can be increased, and good heat dissipation action by the housing can be expected.
【００１３】[0013]
【発明の実施の形態】以下、この発明による携帯電子機
器の実施の形態を、携帯電話機の場合を例にとって、図
を参照しながら説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a portable electronic device according to the present invention will be described below with reference to the drawings, taking a case of a portable telephone as an example.
【００１４】図１（Ａ）は、この発明の実施の形態の携
帯電話機１の概略正面図、また、図１（Ｂ）は、その概
略側断面図である。また、図２は、図１（Ｂ）で、丸で
囲んだ部分の拡大図である。さらに、図３は、この実施
の形態の携帯電話機１の背面図である。FIG. 1A is a schematic front view of a mobile phone 1 according to an embodiment of the present invention, and FIG. 1B is a schematic side sectional view thereof. FIG. 2 is an enlarged view of a portion surrounded by a circle in FIG. FIG. 3 is a rear view of the mobile phone 1 according to this embodiment.
【００１５】図１（Ａ）に示すように、携帯電話機１
は、筐体２の内部にプリント配線基板３が配置され、こ
のプリント配線基板３上に、送信電力増幅器部品４のほ
か、送信信号処理部や受信信号処理部を構成する各電子
部品が配設されている。この例の携帯電話機１は、Ｗ−
ＣＤＭＡ方式の携帯電話機であって、送信パワーが大き
く、その送信電力増幅器部品４からの発熱は大きい。[0015] As shown in FIG.
A printed wiring board 3 is disposed inside a housing 2. On the printed wiring board 3, in addition to a transmission power amplifier component 4, electronic components constituting a transmission signal processing unit and a reception signal processing unit are disposed. Have been. The mobile phone 1 of this example has W-
The mobile phone of the CDMA system has a large transmission power and generates a large amount of heat from the transmission power amplifier component 4.
【００１６】この携帯電話機１の筐体２は、前述したよ
うに、熱伝導率が非常に大きく、また、薄肉で強度の高
い材料であるマグネチクソモールドにより成型されてい
る。さらに、図１および図３にも示すように、この筐体
２の背面５には、表面積を実質的に大きくするように凹
凸形状に成型された冷却フィン部６が形成されている。As described above, the housing 2 of the mobile phone 1 is formed by a magnetic exomold, which is a material having a very high thermal conductivity and a small thickness and high strength. Further, as shown in FIGS. 1 and 3, a cooling fin portion 6 is formed on the rear surface 5 of the housing 2 so as to have a concave and convex shape so as to substantially increase the surface area.
【００１７】図１および図２に示されるように、送信電
力増幅器部品４は、通常、アンテナ７付近に配置されて
いる。この実施の形態では、このアンテナ７付近である
電話機筐体２の上側において、筐体２を、発熱体となる
送信電力増幅器部品４に直接的に接触させ、送信電力増
幅器部品４からの熱を直に筐体２に伝達するようにす
る。As shown in FIGS. 1 and 2, the transmission power amplifier component 4 is usually arranged near the antenna 7. In this embodiment, on the upper side of the telephone case 2 near the antenna 7, the case 2 is brought into direct contact with the transmission power amplifier component 4 serving as a heating element, and the heat from the transmission power amplifier component 4 is transferred. It is transmitted to the housing 2 directly.
【００１８】すなわち、図２に示すように、また、送信
電力増幅器部品４部分を、部品４側から見た図である図
４に示すように、プリント配線基板３の、送信電力増幅
器部品４の裏側と接触する領域であって、送信電力増幅
器部品４とプリント配線基板３との接続のための配線部
分を除く領域に、透孔１１を設けておく。そして、筐体
２の、当該プリント配線基板３のこの透孔１１に対応す
る部分であって、その透孔１１の大きさよりも若干小さ
い部分は、図２および図４に示すように、基板３側に突
出する突出部１２としておく。That is, as shown in FIG. 2, and as shown in FIG. 4, which is a view of the transmission power amplifier component 4 from the component 4 side, the transmission power amplifier component 4 A through hole 11 is provided in a region that is in contact with the back side, excluding a wiring portion for connecting the transmission power amplifier component 4 and the printed wiring board 3. The portion of the housing 2 corresponding to the through hole 11 of the printed wiring board 3 and slightly smaller than the size of the through hole 11 is, as shown in FIGS. The protrusion 12 protrudes to the side.
【００１９】そして、内部にプリント配線基板３を設置
して、筐体２を組み立てたときに、筐体の前記突出部１
２が、透孔１１に挿入され、突出部１２の先端の平坦部
が、送信電力増幅器部品４の底面に、直接、接触するよ
うにする。Then, when the printed circuit board 3 is installed inside and the housing 2 is assembled, the protrusion 1
2 is inserted into the through hole 11 so that the flat portion at the tip of the protrusion 12 directly contacts the bottom surface of the transmission power amplifier component 4.
【００２０】このため、この実施の形態では、図２に示
すように、筐体１２は、この突出部１２の部分では、プ
リント配線基板３に沿うような形状に構成される。そし
て、筐体１２は、突出部１２の裏側の部分には空間１３
が生じるように、折り曲げられた形状とされている。そ
して、前記空間１３はカバー８で覆われるように構成さ
れる。このカバー８は、空間１３を覆う形状で、熱伝導
率の低い、例えばプラスチックの成型品として構成され
る。For this reason, in this embodiment, as shown in FIG. 2, the housing 12 is formed in a shape along the printed wiring board 3 at the protruding portion 12. The housing 12 has a space 13 on the back side of the protrusion 12.
The shape is bent so that The space 13 is configured to be covered with the cover 8. The cover 8 has a shape covering the space 13 and has a low thermal conductivity, for example, is formed as a molded product of plastic.
【００２１】以上のように構成されている携帯電話機１
においては、送信電力増幅器部品４に発熱が生じたとき
には、最も、高温になると予想される送信電力増幅機部
品４の底面は、マグネチクソモールドの筐体２の突出部
１２に直に接触しているので、部品４の熱は、筐体２へ
伝達され、筐体２から外界へ放熱される。このとき、表
面積が大きい冷却フィン部６の存在により、放熱効果が
大きくなる。The mobile phone 1 configured as described above
In, when heat is generated in the transmission power amplifier component 4, the bottom surface of the transmission power amplifier component 4, which is expected to be the hottest, comes into direct contact with the protruding portion 12 of the housing 2 of the magnetic mold. Therefore, the heat of the component 4 is transmitted to the housing 2 and is radiated from the housing 2 to the outside. At this time, due to the presence of the cooling fin portion 6 having a large surface area, the heat radiation effect is increased.
【００２２】この熱伝達のために、発熱体である送信電
力増幅器部品４に直接に接触している筐体２の突出部１
２の裏側部分は高温になるが、空間１３を介してカバー
８により、その高温部分が覆われているので、ユーザ
は、直接、その部分に触れてしまうことなく、空間１３
を介したプラスチック成型品からなるカバー８に触れる
ことになり、違和感を覚えることなく携帯電話機を使用
することができる。For this heat transfer, the projecting portion 1 of the housing 2 which is in direct contact with the transmission power amplifier component 4 which is a heating element.
2 has a high temperature, but since the high-temperature portion is covered by the cover 8 via the space 13, the user does not directly touch the portion without having to touch the space 13.
Then, the user touches the cover 8 made of a plastic molded product via the portable telephone, and can use the mobile phone without feeling uncomfortable.
【００２３】なお、以上の実施の形態の説明では、マグ
ネチクソモールドの筐体２の突出部１２が直接、発熱体
である送信電力増幅器部品４に接触するようにしたが、
図５に示すように、突出部１２の先端に平坦部に、熱伝
導率がよい、クッション材１４を貼付して、そのクッシ
ョン材１４を介して送信電力増幅器部品４と、筐体２と
を実質上直接的に接触するように構成してもよい。In the above description of the embodiment, the projecting portion 12 of the magnetic mold housing 2 is directly in contact with the transmission power amplifier component 4 which is a heating element.
As shown in FIG. 5, a cushion material 14 having good thermal conductivity is attached to a flat portion at the tip of the protruding portion 12, and the transmission power amplifier component 4 and the housing 2 are connected via the cushion material 14. It may be configured to make substantially direct contact.
【００２４】また、熱伝導率のよい材料としては、マグ
ネチクソモールド材に限らないことは言うまでもない。
また、この発明による携帯電子機器は、携帯電話機に限
られるものではなく、筐体内に発熱体が設けられる携帯
電子機器の全てに、この発明は適用可能である。It is needless to say that the material having good thermal conductivity is not limited to the magnetic mold material.
Further, the portable electronic device according to the present invention is not limited to a portable telephone, and the present invention is applicable to all portable electronic devices in which a heating element is provided in a housing.
【００２５】[0025]
【発明の効果】以上説明したように、この発明によれ
ば、筐体を熱伝導率の良い材料、例えばマグネチクソモ
ールドにより構成すると共に、その筐体を発熱体に直接
的に接触するように構成したので、発熱体の熱を、筐体
を介して効率良く外部に放熱することができる。筐体に
冷却フィン部を設けた場合には、さらに放熱効果が大き
くなる。As described above, according to the present invention, the housing is made of a material having a good thermal conductivity, for example, a magnetic oxo mold, and the housing is brought into direct contact with the heating element. With this configuration, the heat of the heating element can be efficiently radiated to the outside via the housing. When the cooling fin portion is provided in the housing, the heat radiation effect is further increased.
【００２６】このように内蔵する発熱体による熱の問題
が解決されるため、発熱の問題がある送信出力の高い送
信電力増幅器部品を筐体内に内蔵することが可能にな
り、従来以上の大きな情報量の送受信が可能になる無線
通信機に、この発明を適用するとその効果は大きい。Since the problem of heat caused by the built-in heating element is solved as described above, it is possible to incorporate a transmission power amplifier part having a high transmission output having a problem of heat generation into the housing, and to obtain larger information than before. When the present invention is applied to a wireless communication device capable of transmitting and receiving a large amount, the effect is great.
【００２７】そして、筐体の、発熱体と直接的に接触す
る部分は、ユーザが直接触れることがないようにカバー
によって覆うようにしたので、違和感を覚えることな
く、携帯電子機器を使用することができる。The portion of the housing that comes into direct contact with the heating element is covered with a cover so that the user does not directly touch the housing, so that the user can use the portable electronic device without feeling uncomfortable. Can be.
【図１】この発明による携帯電子機器の実施の形態の概
略的な正面図および側断面図を示す図である。FIG. 1 is a diagram showing a schematic front view and a side sectional view of an embodiment of a portable electronic device according to the present invention.
【図２】図１の側断面図の一部拡大図である。FIG. 2 is a partially enlarged view of the sectional side view of FIG.
【図３】この発明による携帯電子機器の実施の形態の概
略的な背面図である。FIG. 3 is a schematic rear view of the embodiment of the portable electronic device according to the present invention.
【図４】実施の形態の要部の説明のための図である。FIG. 4 is a diagram for explaining a main part of the embodiment.
【図５】実施の形態の要部の他の例を説明するための図
である。FIG. 5 is a diagram for explaining another example of a main part of the embodiment.
１…携帯電話機、２…筐体、３…プリント配線基板、４
…送信電力増幅器部品、５…携帯電話機の背面、６…冷
却フィン部、７…アンテナ、８…カバー、１１…プリン
ト配線基板３の透孔、１２…筐体２の突出部、１３…空
間、１４…クッション材DESCRIPTION OF SYMBOLS 1 ... Mobile telephone, 2 ... Housing, 3 ... Printed wiring board, 4
... Transmission power amplifier parts, 5 ... Back of mobile phone, 6 ... Cooling fin part, 7 ... Antenna, 8 ... Cover, 11 ... Through hole of printed wiring board 3, 12 ... Protrusion of housing 2, 13 ... Space, 14 ... Cushion material
Claims (6)
に、この筐体に、この筐体内に配される発熱体を実質上
直接的に接触させて、前記発熱体の熱を前記筐体に伝導
させるようにすることを特徴とする携帯電子機器。A housing is made of a material having a high thermal conductivity, and a heating element disposed in the housing is brought into substantially direct contact with the housing, so that heat of the heating element is transferred to the housing. A portable electronic device characterized in that it is made to conduct to a housing.
したもので構成することを特徴とする請求項１に記載の
携帯電子機器。2. The portable electronic device according to claim 1, wherein the housing is formed by injection-molding a magnesium alloy.
ており、 前記配線基板の前記発熱体の取付部分には透孔が穿がれ
て、前記筐体が、前記透孔を介して、前記発熱体に実質
上直接的に接触するようにされてなる請求項１または請
求項２に記載の携帯電子機器。3. The heating element is mounted on a wiring board, and a through-hole is formed in a mounting portion of the wiring board where the heating element is mounted, and the housing is formed through the through-hole. The portable electronic device according to claim 1, wherein the portable electronic device is configured to substantially directly contact the heating element.
なる部分は、熱伝導率の低い部材からなるカバーにより
覆うことを特徴とする請求項１、請求項２または請求項
３に記載の携帯電子機器。4. The housing according to claim 1, wherein a portion of the housing which is heated by the heat of the heating element is covered by a cover made of a member having low thermal conductivity. A portable electronic device as described.
は、冷却フィンとしての凹凸形状とされてなることを特
徴とする請求項１、請求項２または請求項３に記載の携
帯電子機器。5. The portable device according to claim 1, wherein a part of a portion exposed on an outer surface of the housing is formed as an uneven shape as a cooling fin. Electronics.
求項１〜５のいずれかに記載の携帯電子機器。6. The portable electronic device according to claim 1, wherein the portable electronic device is a portable wireless communication device, and the heating element is a transmission power amplifier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11052423A JP2000253115A (en) | 1999-03-01 | 1999-03-01 | Portable electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11052423A JP2000253115A (en) | 1999-03-01 | 1999-03-01 | Portable electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000253115A true JP2000253115A (en) | 2000-09-14 |
Family
ID=12914385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11052423A Withdrawn JP2000253115A (en) | 1999-03-01 | 1999-03-01 | Portable electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000253115A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7330354B2 (en) | 2004-12-15 | 2008-02-12 | Nec Corporation | Mobile terminal device and method for radiating heat therefrom |
| WO2009003411A1 (en) * | 2007-07-02 | 2009-01-08 | Huawei Technologies Co., Ltd. | A mobile terminal preventing temperature rising of user-sensitive surface |
| JP2009022049A (en) * | 2005-08-25 | 2009-01-29 | Nec Corp | Casing for portable device, portable device, and method of manufacturing casing for portable device |
| JP2012050836A (en) * | 2005-01-10 | 2012-03-15 | Chongqing Haifu (Hifu) Technology Co Ltd | Integrated ultrasound therapy transducer assembly |
| WO2016173140A1 (en) * | 2015-04-28 | 2016-11-03 | 中兴通讯股份有限公司 | Heat control method and apparatus |
| DE102018103513A1 (en) * | 2018-02-16 | 2019-08-22 | Lydia Franzmann | Device for protecting an electronic device such as a mobile phone |
-
1999
- 1999-03-01 JP JP11052423A patent/JP2000253115A/en not_active Withdrawn
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2365415A1 (en) | 2004-12-15 | 2011-09-14 | NEC Corporation | Mobile terminal device and method for radiating heat therefrom |
| US7616446B2 (en) | 2004-12-15 | 2009-11-10 | Nec Corporation | Mobile terminal device and method for radiating heat therefrom |
| US7903422B2 (en) | 2004-12-15 | 2011-03-08 | Nec Corporation | Mobile terminal device and method for radiating heat therefrom |
| EP2365414A1 (en) | 2004-12-15 | 2011-09-14 | NEC Corporation | Mobile terminal device and method for radiating heat therefrom |
| US7330354B2 (en) | 2004-12-15 | 2008-02-12 | Nec Corporation | Mobile terminal device and method for radiating heat therefrom |
| JP2012050836A (en) * | 2005-01-10 | 2012-03-15 | Chongqing Haifu (Hifu) Technology Co Ltd | Integrated ultrasound therapy transducer assembly |
| JP2009022049A (en) * | 2005-08-25 | 2009-01-29 | Nec Corp | Casing for portable device, portable device, and method of manufacturing casing for portable device |
| US8989823B2 (en) | 2005-08-25 | 2015-03-24 | Nec Corporation | Casing for portable device |
| US9374445B2 (en) | 2005-08-25 | 2016-06-21 | Nec Corporation | Casing for portable device |
| WO2009003411A1 (en) * | 2007-07-02 | 2009-01-08 | Huawei Technologies Co., Ltd. | A mobile terminal preventing temperature rising of user-sensitive surface |
| WO2016173140A1 (en) * | 2015-04-28 | 2016-11-03 | 中兴通讯股份有限公司 | Heat control method and apparatus |
| US10528101B2 (en) | 2015-04-28 | 2020-01-07 | Xi'an Zhongxing New Software Co., Ltd. | Heat control method and device |
| DE102018103513A1 (en) * | 2018-02-16 | 2019-08-22 | Lydia Franzmann | Device for protecting an electronic device such as a mobile phone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20051118 |
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| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20070611 |