GB2511367A - Bi-directional heat dissipation structure - Google Patents
Bi-directional heat dissipation structure Download PDFInfo
- Publication number
- GB2511367A GB2511367A GB1308708.5A GB201308708A GB2511367A GB 2511367 A GB2511367 A GB 2511367A GB 201308708 A GB201308708 A GB 201308708A GB 2511367 A GB2511367 A GB 2511367A
- Authority
- GB
- United Kingdom
- Prior art keywords
- heat
- heat dissipation
- dissipation structure
- bidirectional
- cooling fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 26
- 238000001816 cooling Methods 0.000 claims abstract description 47
- 230000002457 bidirectional effect Effects 0.000 claims abstract description 24
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000007664 blowing Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- Geometry (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A bidirectional heat dissipation structure 1 includes a base 11, a plurality of heat pipes 12 and a heat sink 14 having a plurality of cooling fins 13. The cooling fins 13 are stacked with each other above the base 11 and have a plurality of holes 131 for the heat pipes 12 to pass through. Each cooling fin has at least one guide slat 132. When assembled, a horizontal diversion channel 136 is formed between the cooling fins 13, and the guide slats 132 form a downward diversion channel 137. When used, a portion of the air current from a fan unit (3, fig. 3) located on one side of the structure 1 dissipates the heat of the heat sink 14 through the horizontal diversion channel 136. A portion of the air current is also diverted downwards through the downward diversion channel 137 to dissipate the heat around the electronic device (2, fig. 7) directly.
Description
BIDIRECTIONAL HEAT DISSIPATION STRUCTURE
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to the field of heat dissipation equipments applied in electronic devices, in particular to a bidirectional heat dissipation structure capable of generating horizontal airflow and downward airflow simultaneously to dissipate heat from an electronic device and its surrounding.
2. Description of the Related Art
As science and technology advance, computers and information technology are developed rapidly, and the computing speed of the electronic devices installed in a computer comes with an increasingly higher speed. Among the heat-generating components of the computer, central processing units (CPU) produce more heat than any other components of the computer, and thus a heat dissipating device is generally installed for dissipating heat to assure stability and performance.
A general heat dissipating device comprises a heat dissipating body and a fan, wherein the heat dissipating body is a structure with a plurality of fins stacked onto one another, an aluminum extruded heat dissipating body, at least one heat pipe, at least one vapor chamber, or any combination of the above. The fan is mounted to the top or a side of the heat dissipating body, and the bottom of the heat dissipating body is attached onto a heat-generating electronic device, so that the hcat generated by the electronic device can be transferred to the heat dissipating body by means of thermal conduction and then dissipated by airflow of the fan.
Due to the limitations of the shape of the heat dissipating body and the installation method of the fan, the airflow cannot be blown at the electronic device and its surrounding directly if the fan is blowing wind downwardly or sideway, and there is insufficient space between the heat dissipating body and the electronic device.
Therefore, most heat dissipating devices can only dissipate the heat generated by the electronic device by a direct-contact conduction method only, and the design of such heat dissipating device cannot meet the heat dissipation requirements of the electronic devices that produce a large quantity of heat in a short time.
SUMMARY OF THE INVENTION
Therefore, it is a primary objective of the present invention to provide a bidirectional heat dissipation structure comprising a heat sink, and the heat sink is having a plurality of cooling fins with at least one guide slat installed on the cooling fin, wherein the guide slats are installed at appropriate positions and extended upwardly or downwardly from the heat sink to form a downward divcrsion channel, so that whcn a horizontal airflow of a wind source is blown sideway into the heat sink, horizontal and downward airfiows are produced for dissipating the heat from an electronic device and its surrounding.
To achieve the foregoing objective, the present invention provides a bidirectional heat dissipation structurc installed onto an electronic device and having a wind source disposed on a side of thc bidirectional heat dissipation structure, and thc bidirectional heat dissipation structure comprises: a base, disposed on the electronic device; a plurality of heat pipes, extended in a direction from the base; and a heat sink, having a plurality of cooling fins, each cooling fin scqucntially passing through thc hcat pipcs, and stackcd with cach othcr abovc thc basc, and the cooling fin having a plurality of through holes for passing the heat pipes, and the cooling fin having at least one guide slat; thereby a horizontal diversion channel is formed between the cooling fins when the bidirectional heat dissipation structure is assembled, and the guide slats form a downward diversion channel between the cooling fins; and the wind source supplies wind from a lateral side, and a portion of wind current dissipates heat through the horizontal diversion channel, and the other portion of the wind current blows downwardly to dissipate heat of the electronic device through the downward diversion channel.
Wherein, the base includes a plurality of grooves corresponsive to the heat pipes and the grooves parallelly and transversally penetrate a side of the base. The heat pipes are substantially U-shaped with the central position disposed in the grooves respectively, so that both ends of each heat pipe are vertically erected from the base.
Wherein, each of the through holes has a circular flange disposed around the through hole to facilitate the assembling process, not only providing a partitioning structure for the assembling, but also providing an effective support to enhance the stability of the assembly.
Similarly, the cooling fin has a baffle plate disposed on a side of the cooling fin to facilitate the assembling process, and the baffle plate is installed between the two cooling fins and forms a whole plane after the assembling. In addition, each guide slat has a predetermined included angle with respect to each baffle plate, wherein the predetermined included angle falls within a range from 30° to 89°, so that when the horizontal airflow enters, an air collecting structure is formed; or each guide slat has a predetermined gap from each baffle plate for passing a portion of the horizontal airflow to adjust the back pressure during use.
It is noteworthy that, the guide slat of each cooling fin is an are sheet structure or a rectangular sheet structure, and the guide slat is extended in a direction (upwardly or downwardly) towards a side of the cooling fin and an included angle is defined between the guide slat and the cooling fin.
To improve the smooth air discharge of the downward diversion channel, each cooling fin has at least one penetrating hole formed at a lateral edge of the guide slat and communicated with the downward diversion channel, so that the other portion of the wind current is blown downwardly through the downward diversion channel and the penetrating holes for dissipating heat around the electronic device.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a perspective view of a preferred embodiment of the present invention; FIG. 2 is a perspective exploded view of a preferred embodiment of the present invention; FIG. 3 is a schematic view of an application status of a preferred embodiment of the present invention; FIG. 4 is a perspective view of another implementation of a preferred embodiment of the present invent ion; FIG. 5 is a perspective exploded view of another implementation of a preferred embodiment of the present invention; FIG. 6 is a schematic view showing the structure of a cooling fin in a reverse side in accordance with another implementation of a preferred embodiment of the present invention; FIG. 7 is a schematic view of an application in accordance with another implementation of a preferred embodiment of the present invention; FIG. 8 is a first schematic view, showing the flow of a wind current in accordance with another implementation of a preferred embodiment of the present invention; and FIG. 9 is a second schematic view, showing the flow of a wind current in accordance with another implementation of a preferred embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The technical contents of the present invention will become apparent with the detailed description of preferred embodiments and the illustration of related drawings as follows.
With reference to FIGS. 1 and 2 for a perspective view and a perspective exploded view of a preferred embodiment of the present invention respectively, a bidirectional heat dissipation structure 1 of the invention is provided and installed to an electronic device 2, and a wind source 3 is disposed on a side of the bidirectional heat dissipation structure 1. The bidirectional heat dissipation structure 1 comprises a base 11, a plurality of heat pipes 12 and a heat sink 14 having a plurality of the cooling fins 13.
The base 11 is made of a thermally conductive metal such as aluminum or copper, and east or punched to form a rectangular block structure and a side of the base 11 can be mounted on the electronic device 2. In addition, the base II has a plurality of grooves 111 corresponsive to the heat pipes 12 respectively and the grooves 111 penetrate through a side of the base 11 parallelly and transversely. It is noteworthy that the width of the groove 111 is flexible and can be changed according to the requirement of containing one heat pipe 12 or a plurality of parallelly installed heat pipes 12.
Each of the heat pipes 12 is U-shaped, with the central position disposed in the grooves 111 respectively, so that both ends of each heat pipe 12 are vertically erected from the base 11. In other words, the heat pipes are extended upwardly from the base 11.
The cooling fins 13 are made of a thermally conductive metal such as aluminum or copper and punched to produce a plurality of plate structures, and each cooling fin 13 has a plurality of through holes 131 for passing the heat pipes 12 respectively, and both windward sides of each cooling fin 13 are bent into guide slats 132 respectively, wherein both guide slats 132 are extended upwardly or both guide slats 132 are extended downwardly, and the cooling fins 13 are sequentially passed and installed onto the heat pipes 12 to form a structure of the cooling fins stacked with each other above the base 11. It is noteworthy that when each guide slat 132 is extended in a direction from the cooling fin 13, an included angle is defined, wherein the included angle is smaller than 90 degrees.
During assembling, a horizontal diversion channel 136 is formed between the cooling fins 13, and after the guide slats 132 are stacked and installed, a downward diversion ehannell37 is formed between both windward sides of the cooling fins 13.
During the use of this invention, the wind source 3 is disposed on a side of the bidirectional heat dissipation structure 1 and capable of blowing wind from a lateral side, wherein a portion of the wind current can dissipate heat from surfaces of the cooling fins 13 through the horizontal diversion channell36, and the other portion of the wind current is induced by the guide slats and then blown directly downward through the downward diversion channell37, so as to achieve the effect of dissipating the heat of the electronic device 2.
With reference to FIGS. 4 to 7 for perspective views of another implementation, a schematic view of a heat sink 14 in a reverse side, and a schematic view of an application in accordance with another implementation of a preferred embodiment of the present invention respectively, each of the through holes 131 has a circular flange 133 disposed around the through hole 131 and provided for the partitioning and fixing functions during the assembling process of stacking the cooling fins 13, so that the cooling fins 13 have an appropriate partition space from one another to form the horizontal diversion channell3ó. In FIGS. 7 and 8, each cooling fin 13 has a baffle plate 134 for blocking airflow to prevent the airflow from escaping in a particular direction, or the baffle plate 134 can be used to assist forming the horizontal diversion ehannell36. The baffle plate 134 is installed between two adjacent cooling fins 13.
In this preferred embodiment, the baffle plate 134 is extended in a direction from both edges, but the invention is not limited to such arrangement only. Each guide slat 132 has a predetermined included angle with respect to each baffle plate 134, wherein the predetermined included angle falls within a range from 30° to 89°, and each guide slat 132 has a predetermined gap from each baffle plate 134 to form a part of the horizontal diversion channell36. To improve the circulation efficiency of the downward diversion channell37, each cooling fin 13 has a pair of penetrating holes 135 formed at positions corresponding to an edge of the guide slat 132 and communicated with the downward diversion channell37, so that the other portion of the wind current can be blown downwardly through the downward diversion channell37 and the penetrating holes 135 to dissipate the heat around the electronic device 2. It is noteworthy that cach guide slat 132 is made into an are sheet structure or a rcctangular sheet structurc.
As shown in FIG. 7, each guide slat 132 is substantially an arc sheet structure.
With reference to FIG. 8 for the first schematic view, showing the flow of a wind current in accordance with another implementation of a preferred embodiment of the present invention, the wind current flows along each baffle plate 134 and enters the horizontal diversion channell36, and a portion of the wind current passes through the predetermined gap, while colliding with the guide slats 132 to produce rotations and flow downwardly through the penetrating holes 135, so as to tbrm a downwardly blown vortex-like wind current. In this preferred embodiment, the baffle plate 134 can be bentintoanL-shape,andthebaffleplate l34canbeinaplateform(asshowninFlG.
9). However, the invention is not limited to such arrangements only.
With reference to FIG. 9 fbr the second schematic view, showing the flow of a wind current in accordance with another implementation of a preferred embodiment of the present invention, if there is no predetermined gap or a smaller predetermine gap between each guide slat 132 and each baffle plate 134, a substantially sealed partition is fbrmcd, and an acute anglc is %rmed on a side of the partition (which is the junction betweenthe guide slat 132 andthebaffleplate 134), sothatafterthewind currentis blocked by each guide slat 132 and each baffle plate 134, the wind current is blown downwardly from thc pcnetrating holes 135 to produce a straight wind current blowing downwardly. Both of the afbrementioned downwardly blown wind currents can achieve the effect of dissipating the heat generated by the electronic device 2.
Claims (10)
- WHAT IS CLAIMED IS: 1. A bidirectional heat dissipation structure, installed onto an electronic device, and having a wind source disposed on a side of the bidirectional heat dissipation structure, comprising: a base, disposed on the electronic device; a plurality of heat pipes, extended in a direction from the base; and a heat slit, having a plurality of cooling fins, each cooling fin sequentially passing through the heat pipes, and the cooling fins being stacked with each other above the base, and the cooling fin having a plurality of through holes for passing the heat pipes, and the cooling fin having at least one guide slat; thereby a horizontal diversion channel is formed between the cooling fins when the bidirectional heat dissipation structurc is assembled, and the guide slats form a downward diversion channel between the cooling fins; and the wind source supplies wind from a lateral side, and a portion of wind current dissipates heat through the horizontal diversion channel, and the other portion of the wind current blows downwardly to dissipate heat of the electronic device through the downward diversion channel.
- 2. The bidirectional heat dissipation structure of claim 1, wherein the base includes a plurality of grooves eorresponsive to the heat pipes and the grooves parallelly and transversely penetrate a side of the base.
- 3. The bidirectional heat dissipation structure of claim 2, wherein the heat pipes are substantially U-shaped with the central position disposed in the grooves respectively, so that both ends of each heat pipe are vertically erected from the base.
- 4. The bidirectional heat dissipation structure of claim 1, wherein each of the through holes has a circular flange disposed around the through hole.
- 5. The bidirectional heat dissipation structure of claim 1, wherein the cooling fin has a baffle plate disposed on a side of the cooling fin.
- 6. The bidirectional heat dissipation structure of claim 5, wherein each guide slat has a predetermined included angle with respect to each baffle plate, and the predetermined included angle falls within a range from 300 to 89°.
- 7. The bidirectional heat dissipation structure of claim 5, wherein each guide slat has a predetermined gap from each baffle plate.
- 8. The bidirectional heat dissipation structure of claim 1, wherein the guide slat is an arc sheet structure or a rectangular sheet structure.
- 9. The bidirectional heat dissipation structure of claim 1, wherein thc guide slat is extended in a direction towards a side of the cooling fin and an included angle is defined between the guide slat and the cooling fin.
- 10. The bidirectional hcat dissipation structure of claim 1, wherein the cooling fin has at least one penetrating hole formcd at a lateral edge of the guide slat and communicated with the downward diversion channel, so that the other portion of the wind current is blown downwardly through the downward diversion channel and the penetrating holes for dissipating heat around the electronic device.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101120092A TW201350683A (en) | 2012-06-05 | 2012-06-05 | Heat dissipation structure with double wind directions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB201308708D0 GB201308708D0 (en) | 2013-06-26 |
| GB2511367A true GB2511367A (en) | 2014-09-03 |
Family
ID=48700802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1308708.5A Withdrawn GB2511367A (en) | 2012-06-05 | 2013-05-15 | Bi-directional heat dissipation structure |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE102013105572A1 (en) |
| FR (1) | FR2991444A1 (en) |
| GB (1) | GB2511367A (en) |
| TW (1) | TW201350683A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105737656B (en) * | 2014-07-25 | 2017-07-11 | 东莞市闻誉实业有限公司 | Heat-pipe radiator |
| EP3293477A1 (en) * | 2016-09-12 | 2018-03-14 | Siemens Aktiengesellschaft | Cooling device for cooling a connection between two components |
| CN108398993B (en) * | 2018-04-28 | 2023-12-05 | 中科寒武纪科技股份有限公司 | Heat dissipation device |
| HUP1800157A1 (en) * | 2018-05-11 | 2020-01-28 | Heatventors Kft | Heat storage apparatus filled with phase-change material |
| TWI673943B (en) * | 2018-08-29 | 2019-10-01 | Micro-Star Int'l Co.,Ltd. | Heat dissipating device |
| CN114302617B (en) * | 2021-12-24 | 2023-12-26 | 广东逸动科技有限公司 | Heat dissipation shell, case, marine electric propeller and heat dissipation control method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070254584A1 (en) * | 2005-10-14 | 2007-11-01 | Cooler Master Co., Ltd. | Heat-dissipation structure |
| US20070261822A1 (en) * | 2006-05-12 | 2007-11-15 | Kuo-Len Lin | Heat-Dissipating Device having Air-Guiding Structure |
| US20100149749A1 (en) * | 2008-12-17 | 2010-06-17 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation apparatus |
| EP2299488A1 (en) * | 2009-08-06 | 2011-03-23 | Cpumate Inc. | Heat-dissiping fin assembly with heat-conducting structure |
-
2012
- 2012-06-05 TW TW101120092A patent/TW201350683A/en unknown
-
2013
- 2013-05-15 GB GB1308708.5A patent/GB2511367A/en not_active Withdrawn
- 2013-05-29 DE DE102013105572A patent/DE102013105572A1/en not_active Ceased
- 2013-06-05 FR FR1355183A patent/FR2991444A1/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070254584A1 (en) * | 2005-10-14 | 2007-11-01 | Cooler Master Co., Ltd. | Heat-dissipation structure |
| US20070261822A1 (en) * | 2006-05-12 | 2007-11-15 | Kuo-Len Lin | Heat-Dissipating Device having Air-Guiding Structure |
| US20100149749A1 (en) * | 2008-12-17 | 2010-06-17 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation apparatus |
| EP2299488A1 (en) * | 2009-08-06 | 2011-03-23 | Cpumate Inc. | Heat-dissiping fin assembly with heat-conducting structure |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102013105572A1 (en) | 2013-12-05 |
| TW201350683A (en) | 2013-12-16 |
| GB201308708D0 (en) | 2013-06-26 |
| FR2991444A1 (en) | 2013-12-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |