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GB2439001B - Method of forming organic compound layer, method of manufacturing organic el element and organic el element - Google Patents

Method of forming organic compound layer, method of manufacturing organic el element and organic el element

Info

Publication number
GB2439001B
GB2439001B GB0718024A GB0718024A GB2439001B GB 2439001 B GB2439001 B GB 2439001B GB 0718024 A GB0718024 A GB 0718024A GB 0718024 A GB0718024 A GB 0718024A GB 2439001 B GB2439001 B GB 2439001B
Authority
GB
United Kingdom
Prior art keywords
organic
compound layer
manufacturing
forming
organic compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0718024A
Other versions
GB0718024D0 (en
GB2439001A (en
Inventor
Nobuhiko Takashima
Yousuke Takashima
Masaaki Murayama
Seiichi Tobisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Inc
Original Assignee
Konica Minolta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Publication of GB0718024D0 publication Critical patent/GB0718024D0/en
Publication of GB2439001A publication Critical patent/GB2439001A/en
Application granted granted Critical
Publication of GB2439001B publication Critical patent/GB2439001B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H01L51/0002—
    • H01L51/50—
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
GB0718024A 2005-03-18 2006-02-23 Method of forming organic compound layer, method of manufacturing organic el element and organic el element Expired - Fee Related GB2439001B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005079146 2005-03-18
PCT/JP2006/303225 WO2006100868A1 (en) 2005-03-18 2006-02-23 Method of forming organic compound layer, process for producing organic el device, and organic el device

Publications (3)

Publication Number Publication Date
GB0718024D0 GB0718024D0 (en) 2007-10-24
GB2439001A GB2439001A (en) 2007-12-12
GB2439001B true GB2439001B (en) 2011-03-09

Family

ID=37023546

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0718024A Expired - Fee Related GB2439001B (en) 2005-03-18 2006-02-23 Method of forming organic compound layer, method of manufacturing organic el element and organic el element

Country Status (3)

Country Link
JP (1) JP5157440B2 (en)
GB (1) GB2439001B (en)
WO (1) WO2006100868A1 (en)

Families Citing this family (32)

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WO2009057464A1 (en) * 2007-11-01 2009-05-07 Konica Minolta Holdings, Inc. Coating method, and coating apparatus
JP5294141B2 (en) * 2008-03-25 2013-09-18 株式会社ニコン Display element manufacturing equipment
DE102008033017A1 (en) * 2008-07-14 2010-01-21 Osram Opto Semiconductors Gmbh Encapsulated optoelectronic component and method for its production
US8102119B2 (en) * 2008-12-17 2012-01-24 General Electric Comapny Encapsulated optoelectronic device and method for making the same
US8801307B2 (en) 2009-09-25 2014-08-12 Nikon Corporation Substrate cartridge, substrate processing apparatus, substrate processing system, control apparatus, and method of manufacturing display element
KR101777096B1 (en) * 2009-09-25 2017-09-08 가부시키가이샤 니콘 Substrate cartridge and its applications
TWI538861B (en) 2009-11-05 2016-06-21 尼康股份有限公司 A substrate processing system, and a circuit manufacturing method
JP2011098808A (en) 2009-11-05 2011-05-19 Nikon Corp Substrate cartridge, substrate processing device, substrate processing system, substrate processing method, control device and method of manufacturing display element
CN102598863B (en) 2009-11-19 2015-07-29 株式会社尼康 Guide member, substrate, substrate cartridge, substrate board treatment, guide member method of attachment, the manufacture method of display element and the manufacturing installation of display element
WO2011065478A1 (en) 2009-11-26 2011-06-03 株式会社ニコン Substrate processing apparatus and method for manufacturing display element
US20110135405A1 (en) 2009-12-04 2011-06-09 Akira Miyaji Roller apparatus and transportation apparatus
US10541160B2 (en) 2009-12-29 2020-01-21 Nikon Corporation Substrate case and substrate accommodation apparatus
JP5761034B2 (en) * 2010-02-12 2015-08-12 株式会社ニコン Substrate processing equipment
JP5567407B2 (en) * 2010-03-15 2014-08-06 ユー・ディー・シー アイルランド リミテッド Method for manufacturing organic electroluminescent device
TWI611500B (en) * 2010-04-09 2018-01-11 Nikon Corp Substrate processing device
WO2011126133A1 (en) 2010-04-09 2011-10-13 株式会社ニコン Substrate cartridge, substrate storage device, and substrate processing system
JP5852810B2 (en) * 2010-08-26 2016-02-03 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
WO2012026363A1 (en) * 2010-08-26 2012-03-01 コニカミノルタホールディングス株式会社 Method for manufacturing organic electroluminescent element
JP5401443B2 (en) * 2010-12-28 2014-01-29 日東電工株式会社 Method and apparatus for manufacturing organic EL element
JP5780291B2 (en) * 2011-02-24 2015-09-16 株式会社ニコン Substrate processing equipment
WO2012115037A1 (en) * 2011-02-24 2012-08-30 株式会社ニコン Device for transporting flexible substrate, and system for manufacturing display device or electrical circuit
CN103380483B (en) 2011-04-25 2016-11-02 株式会社尼康 Substrate processing equipment
WO2013025210A1 (en) * 2011-08-17 2013-02-21 Hewlett-Packard Development Company, L.P. Printing system and method
WO2013064941A1 (en) * 2011-11-03 2013-05-10 Koninklijke Philips Electronics N.V. Structuring of oleds
JPWO2013065451A1 (en) * 2011-11-04 2015-04-02 株式会社ニコン Substrate processing apparatus and substrate processing method
KR101623695B1 (en) 2011-11-04 2016-05-23 가부시키가이샤 니콘 Substrate processing apparatus and substrate processing method
CN104203779B (en) 2012-04-03 2016-04-20 株式会社尼康 The formation method of Handling device and electronics package
KR101787330B1 (en) * 2012-04-13 2017-10-18 가부시키가이샤 니콘 Cassette apparatus, substrate transfer apparatus, substrate processing apparatus, and substrate processing method
JP5743004B2 (en) * 2014-05-12 2015-07-01 株式会社ニコン Electric circuit manufacturing method
JP5743005B2 (en) * 2014-05-12 2015-07-01 株式会社ニコン Manufacturing method of display element
JP6405436B1 (en) 2017-10-23 2018-10-17 住友化学株式会社 Organic electronic device manufacturing method and organic electronic device
CN113441377B (en) * 2021-06-29 2022-10-28 辽宁分子流科技有限公司 Preparation method of nano silver wire electrode film

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1077467A (en) * 1996-09-04 1998-03-24 Sumitomo Chem Co Ltd Method for manufacturing organic electroluminescence device
EP0986112A2 (en) * 1998-09-11 2000-03-15 Hewlett-Packard Company An efficient method for fabricating organic light emitting diodes
JP2001006875A (en) * 1999-06-24 2001-01-12 Dainippon Printing Co Ltd Manufacture of el element
JP2003509817A (en) * 1999-09-03 2003-03-11 スリーエム イノベイティブ プロパティズ カンパニー Large area organic electronic device having conductive polymer buffer layer and method of manufacturing the same
JP2003077669A (en) * 2001-09-03 2003-03-14 Toppan Printing Co Ltd High polymer electroluminescent element and manufacturing method therefor
JP2004185951A (en) * 2002-12-03 2004-07-02 Dainippon Printing Co Ltd Production line for flexible polymer organic el display
JP2004247100A (en) * 2003-02-12 2004-09-02 Tokai Rubber Ind Ltd Manufacturing method of organic electroluminescent element, and organic electroluminescent element obtained by the same
JP2004305912A (en) * 2003-04-07 2004-11-04 Seiko Epson Corp Liquid material drying method, drying apparatus, device manufacturing method, device manufacturing apparatus, device and electric equipment
JP2004311111A (en) * 2003-04-03 2004-11-04 Fuji Photo Film Co Ltd Method for manufacturing organic electroluminescent element and organic electroluminescent element
JP2004534676A (en) * 2001-07-13 2004-11-18 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング Apparatus and method for continuously printing on a substrate-strip
JP2005327667A (en) * 2004-05-17 2005-11-24 Seiko Epson Corp Organic EL element manufacturing method, organic EL element manufacturing system, and electronic apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4226159B2 (en) * 1999-08-06 2009-02-18 シャープ株式会社 Manufacturing method of organic LED display
JP2002361742A (en) * 2001-06-12 2002-12-18 Pioneer Electronic Corp Laminating method and laminating device
JP4628656B2 (en) * 2002-07-09 2011-02-09 株式会社半導体エネルギー研究所 Light emitting device manufacturing apparatus and light emitting device manufacturing method

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1077467A (en) * 1996-09-04 1998-03-24 Sumitomo Chem Co Ltd Method for manufacturing organic electroluminescence device
EP0986112A2 (en) * 1998-09-11 2000-03-15 Hewlett-Packard Company An efficient method for fabricating organic light emitting diodes
JP2001006875A (en) * 1999-06-24 2001-01-12 Dainippon Printing Co Ltd Manufacture of el element
JP2003509817A (en) * 1999-09-03 2003-03-11 スリーエム イノベイティブ プロパティズ カンパニー Large area organic electronic device having conductive polymer buffer layer and method of manufacturing the same
US6593690B1 (en) * 1999-09-03 2003-07-15 3M Innovative Properties Company Large area organic electronic devices having conducting polymer buffer layers and methods of making same
JP2004534676A (en) * 2001-07-13 2004-11-18 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング Apparatus and method for continuously printing on a substrate-strip
JP2003077669A (en) * 2001-09-03 2003-03-14 Toppan Printing Co Ltd High polymer electroluminescent element and manufacturing method therefor
JP2004185951A (en) * 2002-12-03 2004-07-02 Dainippon Printing Co Ltd Production line for flexible polymer organic el display
JP2004247100A (en) * 2003-02-12 2004-09-02 Tokai Rubber Ind Ltd Manufacturing method of organic electroluminescent element, and organic electroluminescent element obtained by the same
JP2004311111A (en) * 2003-04-03 2004-11-04 Fuji Photo Film Co Ltd Method for manufacturing organic electroluminescent element and organic electroluminescent element
JP2004305912A (en) * 2003-04-07 2004-11-04 Seiko Epson Corp Liquid material drying method, drying apparatus, device manufacturing method, device manufacturing apparatus, device and electric equipment
JP2005327667A (en) * 2004-05-17 2005-11-24 Seiko Epson Corp Organic EL element manufacturing method, organic EL element manufacturing system, and electronic apparatus

Also Published As

Publication number Publication date
JPWO2006100868A1 (en) 2008-08-28
JP5157440B2 (en) 2013-03-06
GB0718024D0 (en) 2007-10-24
WO2006100868A1 (en) 2006-09-28
GB2439001A (en) 2007-12-12

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20190223

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