GB2149965B - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- GB2149965B GB2149965B GB08500267A GB8500267A GB2149965B GB 2149965 B GB2149965 B GB 2149965B GB 08500267 A GB08500267 A GB 08500267A GB 8500267 A GB8500267 A GB 8500267A GB 2149965 B GB2149965 B GB 2149965B
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/112—Constructional design considerations for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layers, e.g. by using channel stoppers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/0217—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58085519A JPH0630355B2 (en) | 1983-05-16 | 1983-05-16 | Semiconductor device |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8500267D0 GB8500267D0 (en) | 1985-02-13 |
GB2149965A GB2149965A (en) | 1985-06-19 |
GB2149965B true GB2149965B (en) | 1986-12-31 |
Family
ID=13861153
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08500267A Expired GB2149965B (en) | 1983-05-16 | 1984-05-16 | Semiconductor device |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPH0630355B2 (en) |
KR (1) | KR840009182A (en) |
DE (1) | DE3490241T1 (en) |
GB (1) | GB2149965B (en) |
WO (1) | WO1984004628A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8401250D0 (en) * | 1984-01-18 | 1984-02-22 | British Telecomm | Semiconductor fabrication |
JPH0691075B2 (en) * | 1985-06-17 | 1994-11-14 | 新日本無線株式会社 | Semiconductor device |
KR100266045B1 (en) * | 1990-08-07 | 2000-09-15 | 야스카와 히데아키 | Semiconductor device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3660735A (en) * | 1969-09-10 | 1972-05-02 | Sprague Electric Co | Complementary metal insulator silicon transistor pairs |
US3700507A (en) * | 1969-10-21 | 1972-10-24 | Rca Corp | Method of making complementary insulated gate field effect transistors |
DE2102918A1 (en) * | 1970-01-26 | 1971-08-05 | Itt Ind Gmbh Deutsche | Method for producing field insulation for semiconductor components |
US3834959A (en) * | 1972-06-30 | 1974-09-10 | Ibm | Process for the formation of selfaligned silicon and aluminum gates |
JPS4979782A (en) * | 1972-12-08 | 1974-08-01 | ||
JPS582866A (en) * | 1981-06-29 | 1983-01-08 | Ricoh Co Ltd | Discharging method for recording body |
-
1983
- 1983-05-16 JP JP58085519A patent/JPH0630355B2/en not_active Expired - Lifetime
-
1984
- 1984-05-15 KR KR1019840002622A patent/KR840009182A/en not_active Application Discontinuation
- 1984-05-16 GB GB08500267A patent/GB2149965B/en not_active Expired
- 1984-05-16 DE DE19843490241 patent/DE3490241T1/en not_active Withdrawn
- 1984-05-16 WO PCT/JP1984/000243 patent/WO1984004628A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
GB8500267D0 (en) | 1985-02-13 |
JPH0630355B2 (en) | 1994-04-20 |
DE3490241T1 (en) | 1985-05-15 |
KR840009182A (en) | 1984-12-24 |
WO1984004628A1 (en) | 1984-11-22 |
GB2149965A (en) | 1985-06-19 |
JPS59211235A (en) | 1984-11-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PE20 | Patent expired after termination of 20 years |
Effective date: 20040515 |