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GB2063561B - Semiconductor device and manufacturing method therefor - Google Patents

Semiconductor device and manufacturing method therefor

Info

Publication number
GB2063561B
GB2063561B GB8033736A GB8033736A GB2063561B GB 2063561 B GB2063561 B GB 2063561B GB 8033736 A GB8033736 A GB 8033736A GB 8033736 A GB8033736 A GB 8033736A GB 2063561 B GB2063561 B GB 2063561B
Authority
GB
United Kingdom
Prior art keywords
manufacturing
semiconductor device
method therefor
therefor
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8033736A
Other versions
GB2063561A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Publication of GB2063561A publication Critical patent/GB2063561A/en
Application granted granted Critical
Publication of GB2063561B publication Critical patent/GB2063561B/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/761PN junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/80FETs having rectifying junction gate electrodes
    • H10D30/83FETs having PN junction gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113Isolations within a component, i.e. internal isolations
    • H10D62/115Dielectric isolations, e.g. air gaps
    • H10D62/116Dielectric isolations, e.g. air gaps adjoining the input or output regions of field-effect devices, e.g. adjoining source or drain regions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/40Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
    • H10D84/401Combinations of FETs or IGBTs with BJTs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Element Separation (AREA)
GB8033736A 1979-10-18 1980-10-20 Semiconductor device and manufacturing method therefor Expired GB2063561B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13439679A JPS5658259A (en) 1979-10-18 1979-10-18 Semiconductor device and production thereof

Publications (2)

Publication Number Publication Date
GB2063561A GB2063561A (en) 1981-06-03
GB2063561B true GB2063561B (en) 1983-10-12

Family

ID=15127414

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8033736A Expired GB2063561B (en) 1979-10-18 1980-10-20 Semiconductor device and manufacturing method therefor

Country Status (3)

Country Link
JP (1) JPS5658259A (en)
DE (1) DE3039009C2 (en)
GB (1) GB2063561B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2070858B (en) * 1980-03-03 1985-02-06 Raytheon Co Shallow channel field effect transistor
US4523368A (en) * 1980-03-03 1985-06-18 Raytheon Company Semiconductor devices and manufacturing methods
IT1200725B (en) * 1985-08-28 1989-01-27 Sgs Microelettronica Spa INSULATION STRUCTURE IN MOS DEVICES AND ITS PREPARATION PROCEDURE
DE3620686C2 (en) * 1986-06-20 1999-07-22 Daimler Chrysler Ag Structured semiconductor body
JPH0234938A (en) * 1988-07-25 1990-02-05 Matsushita Electron Corp Semiconductor device
EP2369960B1 (en) 2008-12-12 2018-03-07 Kids II, Inc. Electromagnetic swing
CN103972302A (en) * 2014-05-26 2014-08-06 电子科技大学 JFET (junction field-effect transistor) device and manufacturing method thereof
CN103972295A (en) * 2014-05-30 2014-08-06 电子科技大学 JFET (junction field-effect transistor) device and manufacturing method thereof
CN204318176U (en) 2014-08-08 2015-05-13 儿童二代公司 For the control appliance of children's bouncer and baby support

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5729065B2 (en) * 1973-10-01 1982-06-21
JPS5364480A (en) * 1976-11-22 1978-06-08 Toshiba Corp Field effect semiconductor device

Also Published As

Publication number Publication date
GB2063561A (en) 1981-06-03
DE3039009C2 (en) 1985-12-19
JPS5658259A (en) 1981-05-21
DE3039009A1 (en) 1981-05-07

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Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19951020

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