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GB1261378A - Improvements relating to the encapsulation of semiconductor devices and other electrical components - Google Patents

Improvements relating to the encapsulation of semiconductor devices and other electrical components

Info

Publication number
GB1261378A
GB1261378A GB3246768A GB3246768A GB1261378A GB 1261378 A GB1261378 A GB 1261378A GB 3246768 A GB3246768 A GB 3246768A GB 3246768 A GB3246768 A GB 3246768A GB 1261378 A GB1261378 A GB 1261378A
Authority
GB
United Kingdom
Prior art keywords
encapsulation
semiconductor devices
electrical components
improvements relating
flexible compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3246768A
Inventor
Brian James Gumm
Terence Thomas Hopkins
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Reigate Ltd
Original Assignee
International Rectifier Company Great Britain Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Company Great Britain Ltd filed Critical International Rectifier Company Great Britain Ltd
Priority to GB3246768A priority Critical patent/GB1261378A/en
Publication of GB1261378A publication Critical patent/GB1261378A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

1,261,378. Semi-conductor devices. INTERNATIONAL RECTIFIER CO. (GREAT BRITAIN) Ltd. 8 July, 1969 [8 July, 1968], No. 32467/68. Heading H1K. In a method of encapsulating an electrical component the component 2 has a layer 3 of varnish applied to it and is then coated with a layer 4 of a flexible compound after which it is embedded in an outer rigid casing 5 applied in a mould, the flexible compound where it coats the leads 1 of the component projecting through this outer casing. The flexible compound may be sprayed on as a solution of silicone rubber in toluene and the outer moulded easing may be of epoxy resin.
GB3246768A 1968-07-08 1968-07-08 Improvements relating to the encapsulation of semiconductor devices and other electrical components Expired GB1261378A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3246768A GB1261378A (en) 1968-07-08 1968-07-08 Improvements relating to the encapsulation of semiconductor devices and other electrical components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3246768A GB1261378A (en) 1968-07-08 1968-07-08 Improvements relating to the encapsulation of semiconductor devices and other electrical components

Publications (1)

Publication Number Publication Date
GB1261378A true GB1261378A (en) 1972-01-26

Family

ID=10339033

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3246768A Expired GB1261378A (en) 1968-07-08 1968-07-08 Improvements relating to the encapsulation of semiconductor devices and other electrical components

Country Status (1)

Country Link
GB (1) GB1261378A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2716419A1 (en) * 1976-04-14 1977-11-03 Ates Componenti Elettron PROCESS FOR PASSIVATING POWER SEMICONDUCTOR COMPONENTS
EP3451374A1 (en) * 2017-09-01 2019-03-06 TDK-Micronas GmbH Semiconductor device package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2716419A1 (en) * 1976-04-14 1977-11-03 Ates Componenti Elettron PROCESS FOR PASSIVATING POWER SEMICONDUCTOR COMPONENTS
EP3451374A1 (en) * 2017-09-01 2019-03-06 TDK-Micronas GmbH Semiconductor device package

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