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DE10346458A1 - Method for laser microdissection - Google Patents

Method for laser microdissection Download PDF

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Publication number
DE10346458A1
DE10346458A1 DE2003146458 DE10346458A DE10346458A1 DE 10346458 A1 DE10346458 A1 DE 10346458A1 DE 2003146458 DE2003146458 DE 2003146458 DE 10346458 A DE10346458 A DE 10346458A DE 10346458 A1 DE10346458 A1 DE 10346458A1
Authority
DE
Germany
Prior art keywords
laser
cutting
last
cut
laser pulse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE2003146458
Other languages
German (de)
Inventor
Dieter Baeuerle
Lucius Remer
Dagmar Elvers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leica Microsystems CMS GmbH
Original Assignee
Leica Microsystems Wetzlar GmbH
Leica Microsystems CMS GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leica Microsystems Wetzlar GmbH, Leica Microsystems CMS GmbH filed Critical Leica Microsystems Wetzlar GmbH
Priority to DE2003146458 priority Critical patent/DE10346458A1/en
Priority to PCT/EP2004/052406 priority patent/WO2005033669A1/en
Publication of DE10346458A1 publication Critical patent/DE10346458A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/2813—Producing thin layers of samples on a substrate, e.g. smearing, spinning-on
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/02—Devices for withdrawing samples
    • G01N1/04—Devices for withdrawing samples in the solid state, e.g. by cutting
    • G01N2001/045—Laser ablation; Microwave vaporisation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/2813—Producing thin layers of samples on a substrate, e.g. smearing, spinning-on
    • G01N2001/2833—Collecting samples on a sticky, tacky, adhesive surface
    • G01N2001/284—Collecting samples on a sticky, tacky, adhesive surface using local activation of adhesive, i.e. Laser Capture Microdissection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • G01N2001/2873—Cutting or cleaving
    • G01N2001/2886—Laser cutting, e.g. tissue catapult

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Immobilizing And Processing Of Enzymes And Microorganisms (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Laser Beam Processing (AREA)

Abstract

Es wird ein Verfahren zur Laser-Mikrodissektion eines interessierenden Probenbereiches (26) einer Probe (4) angegeben, bei dem die Laserpulse eines gepulsten Laserstrahls (7) auf die Probe (4) fokussiert werden, und bei dem der interessierende Probenbereich (26) durch Aneinanderreihen von durch die Laserpulse erzeugten Schnittlöchern entlang einer geschlossenen Schnittlinie (30) ausgeschnitten wird. Erfindungsgemäß wird die beim letzten, den Schnitt vollendenden Laserpuls ablatierte Masse an die Schnittbreite des letzten schneidenden Laserpulses angepasst und optimiert. Vorzugsweise wird das Endstück (28) der Schnittlinie (30), das mit dem letzten Laserpuls geschnitten wird, gleich der Schnittbreite des letzten schneidenden Laserpulses eingestellt. Eine Vorrichtung zur Durchführung des Verfahrens wird angegeben.The invention relates to a method for laser microdissection of a sample region of interest (26) of a sample (4) in which the laser pulses of a pulsed laser beam (7) are focused on the sample (4) and in which the sample region of interest (26) passes through Sequence of cut holes generated by the laser pulses along a closed cutting line (30) is cut out. According to the invention, the mass ablated at the last laser pulse that completed the cut is adapted and optimized to the cutting width of the last cutting laser pulse. Preferably, the end piece (28) of the cutting line (30) cut with the last laser pulse is set equal to the cutting width of the last cutting laser pulse. An apparatus for carrying out the method is given.

DE2003146458 2003-10-02 2003-10-02 Method for laser microdissection Withdrawn DE10346458A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE2003146458 DE10346458A1 (en) 2003-10-02 2003-10-02 Method for laser microdissection
PCT/EP2004/052406 WO2005033669A1 (en) 2003-10-02 2004-10-01 Laser micro-dissection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2003146458 DE10346458A1 (en) 2003-10-02 2003-10-02 Method for laser microdissection

Publications (1)

Publication Number Publication Date
DE10346458A1 true DE10346458A1 (en) 2005-05-12

Family

ID=34399317

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2003146458 Withdrawn DE10346458A1 (en) 2003-10-02 2003-10-02 Method for laser microdissection

Country Status (2)

Country Link
DE (1) DE10346458A1 (en)
WO (1) WO2005033669A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006134142A1 (en) * 2005-06-16 2006-12-21 Leica Microsystems Cms Gmbh Laser-micro-dissection method and device for laser-micro-dissection
DE102006030195A1 (en) * 2006-06-30 2008-01-03 P.A.L.M. Microlaser Technologies Gmbh Method and apparatus for laser microdissection and laser catapulting
DE102007016301A1 (en) * 2007-04-04 2008-10-09 P.A.L.M. Microlaser Technologies Gmbh Laser microdissection method and laser microdissection device
DE102009016512A1 (en) * 2009-04-08 2010-10-21 Forschungszentrum Jülich GmbH Method and apparatus for performing a quantitative spatially resolved local and distributional analysis of chemical elements and in situ characterization of the ablated surface regions
DE102007030320B4 (en) * 2007-06-29 2015-04-02 Carl Zeiss Microscopy Gmbh Laser microdissection method and laser microdissection system

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011001474A1 (en) * 2011-03-22 2012-09-27 Carl Zeiss Microimaging Gmbh Laser microdissection method and laser microdissection device
CZ305856B6 (en) * 2012-11-02 2016-04-13 Univerzita Karlova v Praze, Lékařská fakulta v Plzni Optimization method of laser trajectory at laser microdissection
CN113916624B (en) * 2021-09-08 2023-05-26 华中科技大学 Tissue cutting and collecting device and collecting method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10015157A1 (en) * 2000-03-27 2001-10-18 P A L M Gmbh Collecting device for objects dissolved out of mass, especially by laser radiation, has control system automatically generating accommodation unit displacement signals
DE10015156A1 (en) * 2000-03-27 2001-10-18 P A L M Gmbh Recovering biological object from biological material located on support, comprises dissolving away object from material by irradiating it using laser beam, and catapulting from support to collecting device
DE10043506C1 (en) * 2000-09-01 2001-12-06 Leica Microsystems Laser micro dissection of tissue samples for culture uses a laser beam to cut border around section, leaving connecting strip which is cut using single, focused laser impulse which is wider than previous cut, so that section falls out
DE10039979A1 (en) * 2000-08-16 2002-03-07 P A L M Gmbh Carrier device for a preparation for separating individual objects from the preparation by means of laser radiation
DE10043504A1 (en) * 2000-09-01 2002-03-28 Leica Microsystems Method for laser microdissection and use of a device for laser microdissection
DE10152404A1 (en) * 2001-10-24 2003-05-15 Palm Microlaser Tech Gmbh Laser microdissection

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997029354A1 (en) * 1996-02-05 1997-08-14 Bayer Aktiengesellschaft Process and device for sorting and for extraction of biological objects arranged on planar means, such as biological cells or cell organelles, histological sections, chromosome particles etc. using laser beams
US6733987B2 (en) * 2000-10-31 2004-05-11 Fuji Photo Film Co., Ltd. Method for cutting a biological sample and a device used therefor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10015157A1 (en) * 2000-03-27 2001-10-18 P A L M Gmbh Collecting device for objects dissolved out of mass, especially by laser radiation, has control system automatically generating accommodation unit displacement signals
DE10015156A1 (en) * 2000-03-27 2001-10-18 P A L M Gmbh Recovering biological object from biological material located on support, comprises dissolving away object from material by irradiating it using laser beam, and catapulting from support to collecting device
DE10039979A1 (en) * 2000-08-16 2002-03-07 P A L M Gmbh Carrier device for a preparation for separating individual objects from the preparation by means of laser radiation
DE10043506C1 (en) * 2000-09-01 2001-12-06 Leica Microsystems Laser micro dissection of tissue samples for culture uses a laser beam to cut border around section, leaving connecting strip which is cut using single, focused laser impulse which is wider than previous cut, so that section falls out
DE10043504A1 (en) * 2000-09-01 2002-03-28 Leica Microsystems Method for laser microdissection and use of a device for laser microdissection
DE10152404A1 (en) * 2001-10-24 2003-05-15 Palm Microlaser Tech Gmbh Laser microdissection

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006134142A1 (en) * 2005-06-16 2006-12-21 Leica Microsystems Cms Gmbh Laser-micro-dissection method and device for laser-micro-dissection
DE102005028062A1 (en) * 2005-06-16 2006-12-28 Leica Microsystems Cms Gmbh Laser microdissection method and apparatus for laser microdissection
DE102005028062B4 (en) * 2005-06-16 2010-11-25 Leica Microsystems Cms Gmbh Laser microdissection method and apparatus for laser microdissection
US8535876B2 (en) 2005-06-16 2013-09-17 Leica Microsystems Cms Gmbh Laser-micro-dissection method and device for laser-micro-dissection
DE102005028062C5 (en) * 2005-06-16 2015-10-22 Leica Microsystems Cms Gmbh Laser microdissection method and apparatus for laser microdissection
DE102006030195A1 (en) * 2006-06-30 2008-01-03 P.A.L.M. Microlaser Technologies Gmbh Method and apparatus for laser microdissection and laser catapulting
DE102007016301A1 (en) * 2007-04-04 2008-10-09 P.A.L.M. Microlaser Technologies Gmbh Laser microdissection method and laser microdissection device
DE102007030320B4 (en) * 2007-06-29 2015-04-02 Carl Zeiss Microscopy Gmbh Laser microdissection method and laser microdissection system
DE102009016512A1 (en) * 2009-04-08 2010-10-21 Forschungszentrum Jülich GmbH Method and apparatus for performing a quantitative spatially resolved local and distributional analysis of chemical elements and in situ characterization of the ablated surface regions
DE102009016512B4 (en) * 2009-04-08 2011-05-12 Forschungszentrum Jülich GmbH Method and apparatus for performing a quantitative spatially resolved local and distributional analysis of chemical elements and in situ characterization of the ablated surface regions
US8497470B2 (en) 2009-04-08 2013-07-30 Forschungszentrum Juelich Gmbh Method and device for carrying out a quantitative spatially-resolved local and distribution analysis of chemical elements and in situ characetrization of the ablated surface regions
US8735813B2 (en) 2009-04-08 2014-05-27 Forschungszentrum Juelich Gmbh Method and device for carrying out a quantitative spatially resolved local analysis and distribution analysis of chemical elements and in situ characterization of ablated surface regions

Also Published As

Publication number Publication date
WO2005033669A1 (en) 2005-04-14

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