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DE102004030915A1 - Electrical module antenna and circuit carrier e.g. for high frequency transmission path, uses stamped-grid structure as circuit carrier - Google Patents

Electrical module antenna and circuit carrier e.g. for high frequency transmission path, uses stamped-grid structure as circuit carrier Download PDF

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Publication number
DE102004030915A1
DE102004030915A1 DE102004030915A DE102004030915A DE102004030915A1 DE 102004030915 A1 DE102004030915 A1 DE 102004030915A1 DE 102004030915 A DE102004030915 A DE 102004030915A DE 102004030915 A DE102004030915 A DE 102004030915A DE 102004030915 A1 DE102004030915 A1 DE 102004030915A1
Authority
DE
Germany
Prior art keywords
circuit carrier
antenna
grid structure
electrical module
high frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102004030915A
Other languages
German (de)
Inventor
Jakob Dipl.-Ing. Dr. Schillinger
Dietmar Dipl.-Ing. Huber
Wilfried Dipl.-Ing. Babutzka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Priority to DE102004030915A priority Critical patent/DE102004030915A1/en
Publication of DE102004030915A1 publication Critical patent/DE102004030915A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/362—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith for broadside radiating helical antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Landscapes

  • Details Of Aerials (AREA)

Abstract

An electrical module has an antenna and a circuit board which comprises a stamped-grid structure as the circuit carrier (lead-frame), and the antenna is formed likewise from the stamped-grid structure. An independent claim is included for a method for manufacturing an electrical module.

Description

Hochfrequente Übertragungsstrecken benötigen Antennenstrukturen, die mit dem Sende- und/oder Empfangsbaustein direkt und exakt reproduzierbar verbunden sind. Andererseits sind für eine Reihe von Anwendungen hohe thermische und mechanische Beanspruchungen der Baugruppe und damit auch der Antenne zu erwarten.High-frequency transmission links need Antenna structures that communicate with the transmitting and / or receiving module directly and are connected exactly reproducible. On the other hand, for a number of applications high thermal and mechanical stresses the assembly and thus the antenna to be expected.

Daher wird vorgeschlagen, den HF-Baustein auf einem Lead-Frame-Material anzuordnen, also auf einer oder mehreren Metallflächen, aus denen durch Freistanzen Leiterbahnstrukturen erzeugt werden. Lead-Frames sind an sich als mechanisch stabile Leiterbahnstrukturen bekannt.Therefore It is proposed to use the RF device on a lead frame material to arrange, so on one or more metal surfaces, from which are generated by free-punching conductor tracks. Lead frames are known per se as mechanically stable interconnect structures.

Erfindungsgemäß soll nun beim Freistanzen auch die Antennenstruktur aus dem Lead-Frame-Material erzeugt, die dann vorzugsweise mit dem IC-Körper mechanisch fest verbunden ist und elektrisch, analog zu einem Lötpin, direkt mit dem Schaltkreis verbunden ist.According to the invention should now when free punching also generates the antenna structure from the lead frame material, which then preferably mechanically firmly connected to the IC body is and electrically, analogous to a solder pin, directly to the circuit connected is.

Vorteile dieses Verfahrens:Advantages of this procedure:

  • • Kostengünstig, da ein Teil des zu entsorgenden Lead-Frame-Materials als Antenne Verwendung findet.• Cost effective, since a portion of the lead frame material to be disposed of as an antenna use place.
  • • Optimale Anbindung der Antennenstruktur an den Schaltkreis.• Optimal Connection of the antenna structure to the circuit.
  • • Zusätzlicher Montageprozeß für eine Antennenstruktur entfällt.• Additional Assembly process for an antenna structure eliminated.
  • • Reproduzierbare elektrische Verhältnisse, da die Antenne im definierten Abstand zur Leiterplatte verläuft und mit identischer Kontur ausgeführt ist.• Reproducible electrical conditions, because the antenna runs at a defined distance to the PCB and executed with identical contour is.

• Anwendungen:• Applications:

  • • Antenne für Sensortransponder (Reifendruck-Sensor)• antenna for sensor transponder (Air pressure sensor)
  • • Antenne für Key-Less-Entry• antenna for key-less-entry

Bevorzugt sind möglich:

  • • Verwendung der Lead-Frame-Randzone als Antenne
  • • Verwendung von eisen- u/o nickelfreien Werkstoffen als Lead-Frame-Material
  • • Einseitig oder zweiseitig angeschlossene Antennenstruktur
  • • Mehrfach gegliederte Antennenstruktur
  • • Zusätzliche elektrische Anzapfungen zur Induktivitätsanpassung bei Mehrfrequenzbetrieb
  • • Punktuelle Verankerung der Antennenstruktur im Moldmaterial zur mechanischen Versteifung
  • • Antennenstrukturen zickzack-, mäander- oder serpentinenförmig mit/ohne zusätzlicher Moldversteifung
  • • Abstand der Antennenstruktur zur Leiterplatte/LeadFrame durch Formgebung der Lötpins und der Antennenstruktur festlegbar
  • • Verwendung des Dichtsteges als Antennenstruktur
Preference is possible:
  • • Using the lead frame fringe as an antenna
  • • Use of iron and / or nickel-free materials as lead frame material
  • • One-sided or two-sided connected antenna structure
  • • Multiple articulated antenna structure
  • • Additional electrical taps for inductance adjustment in multi-frequency operation
  • • Spot anchoring of the antenna structure in the mold material for mechanical stiffening
  • • Antenna structures zigzag, meandering or serpentine with / without additional mold stiffening
  • • Distance between the antenna structure and the PCB / LeadFrame can be determined by shaping the soldering pins and the antenna structure
  • • Use of the sealing bar as antenna structure

Claims (2)

Elektrische Baugruppe mit einer Antenne und einem Schaltungsträger, dadurch gekennzeichnet, daß als Schaltungsträger eine Stanzgitterstruktur (Lead-Frame) vorgesehen ist und die Antenne ebenfalls von der Stanzgitterstruktur gebildet ist.Electrical assembly with an antenna and a circuit carrier, characterized in that a punched grid structure (lead frame) is provided as a circuit carrier and the antenna is also formed by the stamped grid structure. Verfahren zur Herstellung einer elektrischen Baugruppe nach Anspruch 1, indem auf einem Stanzgitterträgermaterial die elektrischen Bauelemente der Baugruppe angeordnet und die Leiterbahnen aus dem Stanzgitterträgermaterial durch Freistanzen erzeugt werden, wobei beim Freistanzen aus dem Stanzgitterträgermaterial auch die Antenne gebildet wird.Method for producing an electrical assembly according to claim 1, characterized in that on a punched grid carrier material, the electric Components of the assembly arranged and the tracks from the Leadframe carrier material be created by free dancing, with the free dancing from the Leadframe carrier material also the antenna is formed.
DE102004030915A 2004-06-25 2004-06-25 Electrical module antenna and circuit carrier e.g. for high frequency transmission path, uses stamped-grid structure as circuit carrier Pending DE102004030915A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102004030915A DE102004030915A1 (en) 2004-06-25 2004-06-25 Electrical module antenna and circuit carrier e.g. for high frequency transmission path, uses stamped-grid structure as circuit carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102004030915A DE102004030915A1 (en) 2004-06-25 2004-06-25 Electrical module antenna and circuit carrier e.g. for high frequency transmission path, uses stamped-grid structure as circuit carrier

Publications (1)

Publication Number Publication Date
DE102004030915A1 true DE102004030915A1 (en) 2006-04-20

Family

ID=36120277

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102004030915A Pending DE102004030915A1 (en) 2004-06-25 2004-06-25 Electrical module antenna and circuit carrier e.g. for high frequency transmission path, uses stamped-grid structure as circuit carrier

Country Status (1)

Country Link
DE (1) DE102004030915A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1085597A2 (en) * 1999-09-15 2001-03-21 Lucent Technologies Inc. Antenna package for a wireless communications device
WO2003007232A1 (en) * 2001-07-12 2003-01-23 Sokymat S.A. Lead frame antenna
JP2003198248A (en) * 2001-12-26 2003-07-11 Sharp Corp Antenna-integrated package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1085597A2 (en) * 1999-09-15 2001-03-21 Lucent Technologies Inc. Antenna package for a wireless communications device
WO2003007232A1 (en) * 2001-07-12 2003-01-23 Sokymat S.A. Lead frame antenna
JP2003198248A (en) * 2001-12-26 2003-07-11 Sharp Corp Antenna-integrated package

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