CN201348413Y - Deep cold and hot refrigerator - Google Patents
Deep cold and hot refrigerator Download PDFInfo
- Publication number
- CN201348413Y CN201348413Y CNU2008202038111U CN200820203811U CN201348413Y CN 201348413 Y CN201348413 Y CN 201348413Y CN U2008202038111 U CNU2008202038111 U CN U2008202038111U CN 200820203811 U CN200820203811 U CN 200820203811U CN 201348413 Y CN201348413 Y CN 201348413Y
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- CN
- China
- Prior art keywords
- cooling device
- refrigerator
- semiconductor cooling
- heat
- layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000004065 semiconductor Substances 0.000 claims abstract description 57
- 238000009413 insulation Methods 0.000 claims abstract description 28
- 238000005057 refrigeration Methods 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 238000001816 cooling Methods 0.000 claims description 62
- 238000007789 sealing Methods 0.000 claims description 6
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 239000000969 carrier Substances 0.000 abstract 1
- 238000007599 discharging Methods 0.000 abstract 1
- 239000012528 membrane Substances 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 13
- 229910052782 aluminium Inorganic materials 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 229920002635 polyurethane Polymers 0.000 description 6
- 239000004814 polyurethane Substances 0.000 description 6
- 238000005457 optimization Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- LELOWRISYMNNSU-UHFFFAOYSA-N hydrogen cyanide Chemical compound N#C LELOWRISYMNNSU-UHFFFAOYSA-N 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- LVGUZGTVOIAKKC-UHFFFAOYSA-N 1,1,1,2-tetrafluoroethane Chemical compound FCC(F)(F)F LVGUZGTVOIAKKC-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to a semi-conductor refrigerator, and in particular to a deep cold and hot refrigerator, which aims at solving the weaknesses of prior art that the refrigerating capacity of the prior thermo-electric refrigerator is small, and the temperature difference inside and outside the refrigerator is small, and comprises an inner container, a semi-conductor refrigerating part and a blower, and is characterized in that the semi-conductor refrigerating part is divided into N layers; between two adjacent layers of semi-conductor refrigerating parts: cold end of the outer layer semi-conductor refrigerating part is close to the hot end of the inner layer semi-conductor refrigerating part, and an insulation plate of each layer of the semi-conductor refrigerating parts adopts an insulation metal plate with an oxidization membrane; N is a positive integer which is more than 1. The deep cold and hot refrigerator adopts electronic elements for the refrigeration, so that the temperature of the refrigerator is controllable and adjustable; moreover, the refrigerator has the under-voltage protection function for protecting the car storage battery against over-discharging. The deep cold and hog refrigerator is particularly applicable to sedans, cross-country cars and automobile carriers.
Description
Technical field
The utility model relates to a kind of semiconductor freezer, and particularly a kind of deep cooling thermoelectric refrigerator is mainly used in the device that carries out Food Freezing and Cold Storage or heating on automobile.This device also can use aspect other in steamer, medical treatment, beauty treatment etc.
Background technology
Existing automobile has two kinds with refrigerator, and a kind of is to adopt compressor cooling.Promptly by first compressed refrigerant, cold-producing medium expansion absorption heat is realized cooling then, and then realizes the adjustment in the refrigerator.Find through long-term the use: the conveying pipe of refrigerant pipeline connector is many, leaks easily, and contaminated environment needs often to replenish cold-producing medium; Refrigerant R134a suction now commonly used, with metal, oil, water coexistence the time, decompose aggravation: the one, produce copper facing at steel surface, the 2nd, produce the toxic gas hydrogen cyanide; Can only freeze, can not heat.Because the compressor environment for use is abominable, so the requirement on machining accuracy height, causes refrigerator to cost an arm and a leg.Another kind is a semiconductor freezer.The general substrate that just adopts ceramic wafer as refrigeration device, though make that these refrigerator prices are low, the temperature difference is no more than 20 ℃, performance does not satisfy people's needs.
The utility model content
The technical problems to be solved in the utility model is the above-mentioned defective that how to overcome prior art, and a kind of deep cooling thermoelectric refrigerator is provided.
For solving the problems of the technologies described above, this deep cooling thermoelectric refrigerator comprises inner bag, semiconductor cooling device and blower fan, wherein inner bag is covered with heat-insulation layer outward, blower fan is arranged on outside the heat-insulation layer, semiconductor cooling device is arranged between blower fan and the inner bag, its cold junction is near the outer surface of inner bag, its hot junction is near air blower, it is characterized in that: described semiconductor cooling device is divided into the N layer, in the adjacent two layers semiconductor cooling device: the cold junction of outer semiconductor cooling device is near the hot junction of internal layer semiconductor cooling device, the insulation board of each layer semiconductor cooling device all adopts the insulator-metal board of oxide skin, and N is the positive integer greater than 1.So design, N layer semiconductor cooling device is stacked together, and the temperature difference of the generation of each layer semiconductor cooling device is accumulated, and can form the big temperature difference.The individual layer semiconductor cooling device can only produce 20 ℃ of temperature difference, after the two-layer semiconductor cooling device stack, just can produce 40 ℃ of temperature difference.
Attention: general semiconductor refrigeration device insulation board adopts ceramic wafer, can not push after the stack; And pottery is the non-conductor of heat, and after the stack, insulation board thickness increases, and heat conductivility is poorer.
The insulator-metal board of the utility model select tape oxide-film is each layer semiconductor cooling device insulation board, and the metal material good heat conductivity is after the stack, little to the thermal conductivity influence on the one hand; Be squeezed can be broken for metal material on the other hand, and contact is good.(the applicant at application number is: the semiconductor cooling device that is proposed in 200820044590.8 the Chinese utility application adopts this design exactly.)
As optimization, be provided with heat-conducting block between inner bag and the innermost layer semiconductor cooling device, this heat-conducting block is embedded in the heat-insulation layer, its inner surface closely contacts with the inner bag inner surface, its outer surface exposes heat-insulation layer, and closely contact with the cold junction of innermost layer semiconductor cooling device, heat-conducting block can be elected to be the metal derby of good heat conductivity such as copper or aluminium.So design, heat-conducting block only with the cold junction of innermost layer semiconductor cooling device and inner bag with contact, external heat can not imported inner container of icebox.
As optimization, N layer semiconductor cooling device is provided with the heat-insulating and sealing circle outward.So design can prevent from extraneously to dispel the heat in refrigerator on the one hand; Can prevent on the one hand dewfall or frosting behind the extraneous water vapour contact semiconductor refrigeration device.
As optimization, it also comprises the low-voltage protection device.So design as car refrigerator, can prevent the vehicular power-bottle discharge excessively, the fault that causes vehicle to start.
As optimization, described low-voltage protection device is made up of Zener diode and relay switch, and wherein relay switch is made up of relay coil and normal open switch, and Zener diode and circuit breaker coil, normal open switch seal in the electric loop of refrigeration jointly.During use, the manual closing normal open switch, the relay coil energising can be kept normal open switch and be in closure state.When input voltage was not enough, relay coil can't obtain enough electric currents, caused, and normal open switch disconnects, and the refrigerator refrigeration circuit is cut off, thereby keeps a part of electric weight, in order to starting the usefulness of vehicle.So design is simple in structure.
As optimization, the shared insulation board of adjacent two-layer semiconductor cooling device, outermost semiconductive refrigeration device hot junction is provided with radiating fin, and this radiating fin is over against air blower.Insulation board is saved in so design, and good heat conduction effect.Radiating fin can directly be done on the insulation board in outermost layer band semiconductor cooling device hot junction, but also adds the heat sink of being with radiating fin on the insulation board.
This deep cooling thermoelectric refrigerator adopts electronic component (semiconductor element) refrigeration, and refrigerator temperature can be controlled adjustment, and has the low-voltage protection function of protection automobile storage battery over-discharge.This deep cooling thermoelectric refrigerator is particluarly suitable for using on car, offroad vehicle and the automobile carrier.
Description of drawings
Below in conjunction with accompanying drawing this deep cooling thermoelectric refrigerator is described further:
Fig. 1 is the utility model deep cooling thermoelectric refrigerator structural representation:
Fig. 2 is the utility model deep cooling thermoelectric refrigerator circuit diagram:
Among the figure: 1 is inner bag (aluminium), and 2 is polyurethane insulation coating, and 3 is the refrigerator plastic casing; 4 is last cover, and 5 is blower fan, and 6 are aluminium radiator (having radiating fin); 7 is oxidation insulating layer, and 8 is the one-level aluminium sheet, and 9 is the copper brace; 10 is n; the p semiconductor element, 11 is fluid sealant, 12 is middle aluminium sheet; 13 is the secondary aluminium sheet, and 14 is heat-conducting block (aluminium), and 15 are the low-voltage protection device; 16 is temperature controller; 17 refrigerator doors for the band sealing ring, 18 is trip bolt, 19 is fastening foundation; 20 is sealing ring; 21 is lead, and 22 is semiconductor cooling device, and 23 is the temperature controller temperature-sensing probe; 24 is Zener diode, and 25 is relay switch.
The specific embodiment
Embodiment one: as shown in Figure 1, this deep cooling thermoelectric refrigerator comprises inner bag 1, semiconductor cooling device 22, blower fan 5 and low-voltage protection device 15.Wherein be covered with polyurethane insulation coating 2 outside the inner bag 1, blower fan is arranged on outside the polyurethane insulation coating 2, and semiconductor cooling device 22 is arranged between blower fan 5 and the inner bag 1, and its cold junction is near the outer surface of inner bag 1, and its hot junction is near the air port of blower fan 5.Described semiconductor cooling device 22 is divided into two-layer (can certainly be multilayer), in the adjacent two layers semiconductor cooling device 22: the cold junction of outer semiconductor cooling device 22 is near the hot junction of internal layer semiconductor cooling device 22, and a shared insulation board, i.e. middle aluminium sheet 12 among Fig. 1.
All there is oxidation insulating layer 7 on one-level aluminium sheet 8, middle aluminium sheet 12, secondary aluminium sheet 13 surfaces.
Be provided with heat-conducting block 14 between inner bag 1 and the innermost layer semiconductor cooling device 22, this heat-conducting block embedding 14 is in polyurethane insulation coating 2, its inner surface closely contacts with inner bag 1 inner surface, and its outer surface exposes polyurethane insulation coating 2, and closely contacts with the cold junction of innermost layer semiconductor cooling device 22.The two-layer semiconductor cooling device 22 outer heat-insulating and sealing circles 20 that are provided with.
Temperature controller temperature-sensing probe 23 and closely contacts with inner bag 1 between inner bag 1 and polyurethane insulation coating 2.Temperature controller 16 links to each other with semiconductor cooling device 22 by lead 21.
When the power supply of vehicle was powered according to rated voltage, low-voltage protection device 15, temperature controller 16 were connected refrigeration circuit according to design temperature work, and refrigeration device 22 begins refrigeration, and refrigerator temperature constantly descends.When temperature dropped to design temperature, temperature controller 16 cut off the power supply circuits of refrigeration device 22, stops power supply, and refrigerator temperature no longer descends.When temperature recovery behind design temperature, temperature controller 16 is according to design temperature work, connects refrigeration circuit, refrigeration device 22 begins refrigeration again, and enters keeping warm mode.When supply voltage dropped to battery and starts the required protection voltage of automobile, Zener diode 24 ended, and the relay switch of series connection stops to the refrigerator power supply, in order to avoid battery over-discharge vehicle can't start.When supply voltage reaches rated voltage behind the vehicle launch, Zener diode 24 work, relay 25 is connected circuit, and refrigerator restarts refrigeration.
Embodiment two: as shown in Figure 2: described low-voltage protection device 15 is made up of Zener diode 24 and relay switch 25; wherein relay switch 25 is made up of relay coil and normal open switch, and Zener diode 24 seals in the refrigeration circuit jointly with circuit breaker coil, normal open switch.All the other structures are as described in the enforcement mode one.
Claims (6)
1, a kind of deep cooling thermoelectric refrigerator, comprise inner bag, semiconductor cooling device and blower fan, wherein inner bag is covered with heat-insulation layer outward, blower fan is arranged on outside the heat-insulation layer, semiconductor cooling device is arranged between blower fan and the inner bag, its cold junction is near the outer surface of inner bag, its hot junction is near air blower, it is characterized in that: described semiconductor cooling device is divided into the N layer, in the adjacent two layers semiconductor cooling device: the cold junction of outer semiconductor cooling device is near the hot junction of internal layer semiconductor cooling device, the insulation board of each layer semiconductor cooling device all adopts the insulator-metal board of oxide skin, and N is the positive integer greater than 1.
2, deep cooling thermoelectric refrigerator according to claim 1, it is characterized in that: be provided with heat-conducting block between inner bag and the innermost layer semiconductor cooling device, this heat-conducting block is embedded in the heat-insulation layer, its inner surface closely contacts with the inner bag inner surface, its outer surface exposes heat-insulation layer, and closely contacts with the cold junction of innermost layer semiconductor cooling device.
3, deep cooling thermoelectric refrigerator according to claim 2 is characterized in that: N layer semiconductor cooling device is provided with the heat-insulating and sealing circle outward.
4, deep cooling thermoelectric refrigerator according to claim 3, it is characterized in that: it also comprises the low-voltage protection device.
5, deep cooling thermoelectric refrigerator according to claim 4; it is characterized in that: described low-voltage protection device is made up of Zener diode and relay switch; wherein relay switch is made up of relay coil and normal open switch, and Zener diode and circuit breaker coil, normal open switch seal in the electric loop of refrigeration jointly.
6, according to the arbitrary described deep cooling thermoelectric refrigerator of claim 1-5, it is characterized in that: the shared insulation board of adjacent two-layer semiconductor cooling device, outermost semiconductive refrigeration device hot junction is provided with radiating fin, and this radiating fin is over against air blower.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202038111U CN201348413Y (en) | 2008-11-21 | 2008-11-21 | Deep cold and hot refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008202038111U CN201348413Y (en) | 2008-11-21 | 2008-11-21 | Deep cold and hot refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201348413Y true CN201348413Y (en) | 2009-11-18 |
Family
ID=41367879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008202038111U Expired - Lifetime CN201348413Y (en) | 2008-11-21 | 2008-11-21 | Deep cold and hot refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201348413Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104048474A (en) * | 2013-03-15 | 2014-09-17 | 徐文炎 | Car-mounted refrigerator and dispenser all-in-one machine |
| WO2015144080A1 (en) * | 2014-03-28 | 2015-10-01 | 海尔集团公司 | Refrigerator |
| US10941955B2 (en) | 2017-10-27 | 2021-03-09 | Dometic Sweden Ab | Systems, methods, and apparatuses for providing communications between climate control devices in a recreational vehicle |
| US11254183B2 (en) | 2017-08-25 | 2022-02-22 | Dometic Sweden Ab | Recreational vehicle, cooling device, controlling system and method for controlling the cooling device |
| US12344265B2 (en) | 2020-09-18 | 2025-07-01 | Dometic Sweden Ab | System and method for controlling at least one function of a recreational vehicle |
-
2008
- 2008-11-21 CN CNU2008202038111U patent/CN201348413Y/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104048474A (en) * | 2013-03-15 | 2014-09-17 | 徐文炎 | Car-mounted refrigerator and dispenser all-in-one machine |
| CN104048474B (en) * | 2013-03-15 | 2016-12-28 | 徐文炎 | A kind of car refrigerator drinking all-in-one machine |
| WO2015144080A1 (en) * | 2014-03-28 | 2015-10-01 | 海尔集团公司 | Refrigerator |
| US11254183B2 (en) | 2017-08-25 | 2022-02-22 | Dometic Sweden Ab | Recreational vehicle, cooling device, controlling system and method for controlling the cooling device |
| US11919363B2 (en) | 2017-08-25 | 2024-03-05 | Dometic Sweden Ab | Recreational vehicle, cooling device, controlling system and method for controlling the cooling device |
| US10941955B2 (en) | 2017-10-27 | 2021-03-09 | Dometic Sweden Ab | Systems, methods, and apparatuses for providing communications between climate control devices in a recreational vehicle |
| US12344265B2 (en) | 2020-09-18 | 2025-07-01 | Dometic Sweden Ab | System and method for controlling at least one function of a recreational vehicle |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20091118 |
|
| CX01 | Expiry of patent term |