CN113838809A - A chip attachment device capable of realizing chip self-destruction and its control method - Google Patents
A chip attachment device capable of realizing chip self-destruction and its control method Download PDFInfo
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- CN113838809A CN113838809A CN202111109517.0A CN202111109517A CN113838809A CN 113838809 A CN113838809 A CN 113838809A CN 202111109517 A CN202111109517 A CN 202111109517A CN 113838809 A CN113838809 A CN 113838809A
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Abstract
本发明提供了一种可实现芯片自毁的芯片附属装置及其控制方法，芯片附属装置包括基板和电性集成在基板上的自毁模块，基板固定设置于目标芯片所在的系统电路中，并与系统电路电性连接；自毁模块包括与目标芯片接触的激发单元，激发单元通过密封部件与目标芯片形成密闭空间；激发单元上设置有能够以预设方式激发导通的加热电路，加热电路上涂敷有受热能够发生燃爆反应的含能材料并面向目标芯片。本发明提供的芯片附属装置在不改动原有系统电路结构基础上，通过激发电路导通加热电路并释放热量，使含能材料受热发生剧烈的燃爆反应，对目标芯片产生强大的冲击，致使目标芯片产生贯穿性或粉碎性的损毁效果。
The invention provides a chip attachment device capable of realizing chip self-destruction and a control method thereof. The chip attachment device includes a substrate and a self-destruction module electrically integrated on the substrate. The substrate is fixedly arranged in the system circuit where the target chip is located, and It is electrically connected with the system circuit; the self-destruction module includes an excitation unit that is in contact with the target chip, and the excitation unit forms a closed space with the target chip through a sealing component; the excitation unit is provided with a heating circuit that can be excited and turned on in a preset manner, and the heating circuit It is coated with an energetic material that can undergo a detonation reaction when heated and faces the target chip. The chip attachment device provided by the invention does not change the original system circuit structure. By exciting the circuit, the heating circuit is turned on and heat is released, so that the energetic material is heated to have a violent explosion reaction, which has a strong impact on the target chip, resulting in The target chip produces a penetrating or shattering damage effect.
Description
Technical Field
The invention relates to the field of information security and integrated circuits, in particular to a chip accessory device capable of realizing chip self-destruction and a control method thereof.
Background
With the rapid development of modern information technology, various microchips and micro-electromechanical system devices based on silicon-based semiconductor materials are widely applied to the field of civil and military information electronics, and relate to various links such as information acquisition, analysis, storage, transmission and the like, and a core component is a core chip containing key technology or information.
If the information equipment carrying such core chips is lost, stolen and the like, key technologies or important information can be stolen and divulged, so that a corresponding self-destruction function needs to be added in the product to ensure that the core chips can be timely and reliably destroyed in an emergency. However, for the formed product, the self-destruction structure designed in the chip is not different from the development of a new chip device, and the difficulty of product development is increased. If the internal structure of the core chip can not be changed, only the original circuit system is changed in a small degree, and the controllable self-destruction function of the core chip can be realized by adding the module with the self-destruction function, so that the application of the self-destruction technology can be effectively expanded.
At present, aiming at chip self-destruction, an instantaneous strong pulse current is mostly adopted to break down a chip circuit so as to cause the electrical function of the chip to be lost, but the physical structure of the chip is not completely damaged, and the stored information still has the possibility of partial recovery. The chip can be completely destroyed only by adopting a physical or chemical method to completely destroy the physical structure or the functional layer of the chip, and the information can not be recovered.
Therefore, a solution for physically destroying the chip without changing the internal structure of the core chip is needed to solve the above problems.
Disclosure of Invention
Based on the problems in the prior art, the invention provides a chip accessory device capable of realizing chip self-destruction and a control method thereof. The specific scheme is as follows:
a chip accessory device capable of realizing chip self-destruction comprises a substrate and a self-destruction module electrically integrated on the substrate, wherein the substrate is fixedly arranged in a system circuit where a target chip is located and is electrically connected with the system circuit;
the self-destruction module comprises an excitation unit which is in contact with the target chip, and the excitation unit and the target chip form a closed space through a sealing part;
the excitation unit is provided with a heating circuit capable of being excited and conducted in a preset mode, the heating circuit is coated with an energetic material which can be subjected to an explosion reaction when being heated, and the heating circuit is conducted through excitation to heat so as to excite the energetic material to generate the explosion reaction, so that the target chip is destroyed in the closed space.
In a specific embodiment, the heating circuit includes an electrode pad, a wire, and a heating element;
two ends of the heating element are respectively connected with one lead;
one end of the wire is connected with the heating element, and the other end of the wire is connected with the electrode pad.
In one embodiment, the self-destruction module further comprises a trigger unit for preventing false triggering, and the trigger unit is electrically connected with the excitation unit;
and a power isolating switch or a fuse is arranged in the trigger unit.
In a specific embodiment, the device further comprises an acquisition module and a control module, wherein the control module is electrically integrated on the substrate;
the control module is respectively connected with the acquisition module and the self-destruction module and is used for controlling the operation of the self-destruction module according to the information acquired by the acquisition module.
In a specific embodiment, a photodiode is integrated in the acquisition module, and a triode switch, a power triode and a series resistor are integrated in the control module;
the base electrode of the triode switch is connected with the positive electrode of the photosensitive diode, the emitting electrode of the triode switch is connected with the series resistor and the base electrode of the power triode, and the collecting electrode of the triode switch is connected with the negative electrode of the photosensitive diode and the emitting electrode of the power triode.
In a specific embodiment, when the light intensity is less than 50lux, the resistance value of the photodiode is reduced, the triode switch is turned on, the power triode is further turned on, and the self-destruction module is started.
In a particular embodiment, the acquisition module comprises a light-sensitive sensor, and/or a force-sensitive sensor, and/or a gravity sensor;
and/or the energetic material comprises a stevensite lead sol and a thermite.
A control method of a chip auxiliary device capable of realizing chip self-destruction is suitable for any one of the chip auxiliary devices, and comprises the following steps:
the self-destruction module is electrically integrated on the substrate, the substrate is fixedly arranged in a system circuit of a target chip, the excitation unit and the target chip form a closed space through the sealing part, and the heating circuit coated with the energetic material faces the target chip;
after a preset self-destruction condition is met, the heating circuit is excited and conducted on the excitation unit in a preset mode;
after the heating circuit is heated to a preset temperature, the energetic material coated on the heating circuit is subjected to an explosion reaction, so that impact is formed in the closed space, and the target chip is destroyed.
In a specific embodiment, the chip attachment further includes a triggering device, a collecting device, and a control device, and the control method further includes:
the information of the system circuit is acquired through the acquisition module and is sent to the control device;
the control module analyzes the information acquired by the acquisition module and sends a self-destruction instruction after meeting a preset self-destruction condition;
and releasing the false trigger setting of the trigger device and triggering the self-destruction of the trigger module.
In a specific embodiment, a photodiode is integrated in the acquisition module, and a triode switch, a power triode and a series resistor are integrated in the control module;
when the light intensity is less than 50lux, the resistance value of the photosensitive diode is reduced, the triode switch is conducted, the power triode is further conducted, and the self-destruction module is started.
The invention has the following beneficial effects:
the invention provides a chip auxiliary device capable of realizing chip self-destruction and a control method thereof, which can realize the thorough destruction of a target chip by adding an auxiliary module with a self-destruction device on the basis of not changing the circuit structure of an original system, thereby ensuring the information safety of the chip. The substrate is integrated with the self-destruction module, and the secondary excitation structure design of weak current excitation-chemical blasting is adopted, so that the influence of large current output on the original system load can be effectively reduced. The heating circuit is conducted through the exciting circuit and heat is released, so that the energetic material is heated to generate violent explosion reaction, and strong impact is generated on the target chip in a narrow closed space instantly, so that the target chip generates a penetrating or crushing damage effect, and the physical damage has non-restorability, and the damage effect is more thorough.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic structural diagram of a chip attach apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a complete structure of a chip attachment according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a heating circuit according to an embodiment of the present invention;
FIG. 4 is a flow chart illustrating a control method according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a control method according to an embodiment of the present invention.
Reference numerals:
1-a substrate; 2-self-destruction module; 3-an acquisition module; 4-a control module; 5-an excitation unit; 7-system circuit; 8-target chip; 9-a heating circuit; 10-a self-destruction device; 11-a photodiode; 12-a triode switch; 13-a power transistor; 14-series resistance; 15-energetic material; 16-a sealing member; 17-flexible flat cable; 18-copper foil circuitry; 91-electrode pads; 92-a wire; 93-heating element.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The embodiment provides a chip attachment capable of realizing chip self-destruction, and a schematic structural diagram of the chip attachment is shown in the attached figure 1 of the specification. The specific scheme is as follows:
a chip accessory device capable of realizing chip self-destruction comprises a substrate 1 and a self-destruction module 2 electrically integrated on the substrate 1, wherein the substrate 1 is fixedly arranged in a system circuit 7 where a target chip 8 is located and is electrically connected with the system circuit 7. In addition, the substrate 1 can also be integrated with an acquisition module 3, a control module 4 and the like, and the control module 4 is respectively connected with the acquisition module 3 and the self-destruction module 2 and is used for controlling the operation of the self-destruction module 2 according to the information acquired by the acquisition module 3. Specifically, functional devices such as sensors and logic chips can be integrated according to application requirements to realize a quick self-destruction function under a specific condition.
The chip attachment provided by the embodiment can realize the self-destruction of the target chip 8 by only slightly changing the system circuit 7 where the chip is located without changing the internal structure of the chip and connecting the chip attachment to the system circuit 7 where the chip is located.
Specifically, the circuit of the substrate 1 is a printed circuit board, which can be electrically connected to the system circuit 7 on which the target chip 8 is located. In this embodiment, the substrate 1 may be fixedly connected to the bottom or top of the target chip 8 by a connector, and is connected to the system circuit 7 by a connector to obtain power support. Such as by screws or connectors, on the surface of the target chip 8 of the system circuit 7, and a sealing member 16 is added between the target chip 8 and the self-destruct module 2 to form a narrow sealed space. According to the overall structure of the system circuit 7, the substrate 1 is connected to the system circuit 7 by a flexible flat cable 17 and is electrically supported. Preferably, the circuit of the substrate 1 is manufactured by adopting a PCB process, a circuit diagram is planned according to the integrated hardware configuration requirement, and the sensor, the logic chip and the self-destruction device can be connected in series.
The acquisition module 3 comprises a light-sensitive sensor, and/or a force-sensitive sensor, and/or a gravity sensor. The control module 4 is provided with a logic processor, which includes but is not limited to any known logic chip, and is mainly used for analyzing and verifying data information collected by the sensor, and comparing the data information with a preset threshold value to determine whether to start a self-destruction program. When the environmental information of the system circuit 7 acquired by the sensor reaches a certain preset triggering condition, the logic chip analyzes and confirms the environmental information and activates the self-destruction program, and then the excitation circuit is conducted and the heat is released, so that the pre-buried energetic material 15 is heated to generate violent explosion reaction, and strong impact is generated on the target chip 8 in a narrow closed space instantly, so that the target chip 8 is thoroughly destroyed in a penetrating or crushing way. Such penetrating or shattering physical destruction is irreversible and thus the destruction effect is more complete.
Specifically, the self-destruction module 2 includes a trigger unit and an excitation unit 5, and the trigger unit is electrically connected to the excitation unit 5. The excitation unit 5 is in contact with the target chip 8 and forms a closed space with the target chip 8 through the sealing member 16. The trigger unit is mainly used for preventing false triggering, and a power isolating switch or a fuse can be arranged in the trigger unit so as to prevent false triggering.
Wherein, be provided with on the excitation unit 5 and can stimulate the heating circuit 9 that switches on with the preset mode, be coated with on the heating circuit 9 and be heated the energetic material 15 that can take place the blasting reaction, and the one side that coats and is scribbled energetic material 15 is to target chip 8, switches on heating circuit 9 through the excitation and heats to impel energetic material 15 to take place the blasting reaction, and then destroy target chip 8 in airtight space. In this embodiment, the predetermined mode is a weak current conduction. The structure of the excitation unit 5 is shown in the specification and the attached figure 2. The primary function of the energetic material 15 is chemical explosion, which may be any energetic material 15 known in the art, preferably stevensite lead sol and thermite. Compared with the prior art in which the chip circuit is broken down by adopting instantaneous strong pulse current to cause the electrical function of the chip circuit to be lost, the chemical explosion mode provided by the embodiment thoroughly destroys the physical structure of the chip, the possibility of recovering the stored information does not exist, the destructiveness of the chip circuit is stronger, the destroying effect is more thorough, and the information safety of the chip is ensured.
In the present embodiment, the heating circuit 9 is a bridge heating circuit 9. The bridge type heating circuit 9 comprises an electrode pad 91, a lead wire 92 and a heating element 93, wherein two ends of the heating element 93 are respectively connected with the lead wire 92; one end of the wire 92 is connected to the heating element 93, and the other end is connected to the electrode pad 91, and the specific structure is shown in fig. 3 in the specification. The excitation unit 5 adopts a secondary excitation structure of weak current excitation-chemical blasting, and can effectively reduce the influence of large current output on the load of the original system circuit 7. When the excitation current is conducted, the bridge type heating circuit 9 can form a hot area locally, so that the energetic material 15 coated on the bridge type heating circuit is excited to have an explosion reaction, and a huge impact force is formed in the sealed packaging shell instantly, so that the target chip 8 is rapidly and accurately destroyed, and the core information is prevented from being stolen.
In this embodiment, the chip attachment is taken as an example of collecting optical signals, that is, the chip attachment integrates a photosensor. A photosensitive diode 11 is integrated in the acquisition module 3, and a triode switch 12, a power triode 13 and a series resistor 14 are integrated in the control module 4; the base electrode of the triode switch 12 is connected with the positive electrode of the photosensitive diode 11, the emitting electrode is connected with the series resistor 14 and the base electrode of the power triode 13, and the collecting electrode is connected with the negative electrode of the photosensitive diode 11 and the emitting electrode of the power triode 13. The flexible flat cable 17, the photosensitive device and the self-destruction module 2 are connected through a copper foil circuit 18 inside the printed circuit board. The substrate 1 is a polyester fiber printed circuit board, is fixed on the surface of a target chip 8 of the system circuit 7 through screws, and a sealing part 16 is added between the target chip 8 and the self-destruction device to form a narrow sealing space. Depending on the overall configuration of the system circuit 7, the chip attachment is connected to and electrically supported by the system circuit 7 using a flex cable 17. The structure of the complete chip attachment is shown in figure 2 of the specification.
When the light intensity is less than 50lux, the resistance value of the photosensitive diode 11 is reduced, the triode switch 12 is conducted, the power triode 13 is further conducted, and the self-destruction module 2 is started. The photodiode 11 is preset to ensure that the resistance is significantly reduced when the light intensity is greater than 50lux, so as to conduct the triode and further conduct the triode, thereby starting the self-destruction unit and initiating the explosion of the energetic material 15. The power transistor 13 can control the circuit to pass larger current so as to realize the explosion of the energetic material 15. Meanwhile, the whole photosensitive control circuit adopts a diode and a triode design, and the leakage current is very small when the photosensitive control circuit is not in a working state, so that the ultralow standby power consumption is ensured, and the safety performance of the whole self-destruction system is improved.
The embodiment designs a chip accessory device capable of realizing chip self-destruction, and thoroughly destroys a target chip by adding an accessory module with a self-destruction device on the basis of not changing the circuit structure of an original system, thereby ensuring the information safety of the chip. The substrate is integrated with the self-destruction module, and the secondary excitation structure design of weak current excitation-chemical blasting is adopted, so that the influence of large current output on the original system load can be effectively reduced. The heating circuit is conducted through the exciting circuit and heat is released, so that the energetic material is heated to generate violent explosion reaction, and strong impact is generated on the target chip in a narrow closed space instantly, so that the target chip generates a penetrating or crushing damage effect, and the physical damage has non-restorability, and the damage effect is more thorough.
Example 2
The embodiment provides a method for controlling a chip accessory device capable of realizing chip self-destruction, which is applicable to the chip accessory device in embodiment 1, and the method has a flow chart shown in the attached figure 4 of the specification, and a flow chart shown in the attached figure 5 of the specification. The specific scheme is as follows:
the self-destruction module is electrically integrated on the substrate, the substrate is fixedly arranged in a system circuit of the target chip, the excitation unit and the target chip form a closed space through the sealing part, and the heating circuit coated with the energetic material faces the target chip;
the control method comprises the following steps:
101. collecting information of a system circuit through a collecting module and sending the information to a control device;
102. the control module analyzes the information acquired by the acquisition module and judges whether the information is self-destructed, and if not, the original state is recovered;
103. if yes, removing the insurance on the trigger unit;
104. the excitation unit is excited to conduct the heating circuit in a preset mode, after the heating circuit heats the heating circuit to a preset temperature, the energetic material coated on the heating circuit generates an explosion reaction, impact is formed in a closed space, and a target chip is destroyed.
In this embodiment, the chip attachment is taken as an example of collecting optical signals, that is, the chip attachment integrates a photosensor. A photodiode is integrated in the acquisition module, and a triode switch, a power triode and a series resistor are integrated in the control module; the base electrode of the triode switch is connected with the positive electrode of the photosensitive diode, the emitting electrode of the triode switch is connected with the series resistor and the base electrode of the power triode, and the collecting electrode of the triode switch is connected with the negative electrode of the photosensitive diode and the emitting electrode of the power triode. The flexible flat cable, the photosensitive device and the self-destruction module are connected through a copper foil circuit in the printed circuit board. The substrate is a polyester fiber printed circuit board, is fixed on the surface of a target chip of a system circuit through screws, and a sealing part is added between the target chip and the self-destruction device to form a narrow sealing space. According to the overall structure of the system circuit, the chip attachment is connected with the system circuit by a flexible flat cable and obtains electric power support. When the light intensity is less than 50lux, the resistance value of the photosensitive diode is reduced, the triode switch is conducted, the power triode is further conducted, and then the self-destruction module is started. In order to control the system circuit to pass larger current, the triode is selected to be a power triode. Meanwhile, the whole photosensitive control circuit adopts a diode and a triode design, and the leakage current is very small when the photosensitive control circuit is not in a working state, so that the ultralow standby power consumption is ensured, and the safety performance of the whole self-destruction system is improved.
Wherein, be provided with on the excitation unit and can stimulate the heating circuit who switches on with the mode of predetermineeing, the coating is heated and can takes place the energetic material of the explosion reaction and towards target chip on the heating circuit, heats through arousing to switch on heating circuit to arouse energetic material to take place the explosion reaction, and then destroy target chip in airtight space. The main function of the energetic material is chemical explosion, and the energetic material in the field can be adopted, preferably stevensite lead sol and thermite.
This embodiment provides a method for controlling a chip attachment capable of realizing self-destruction of a chip, which is suitable for the chip attachment of embodiment 1, and the chip attachment of embodiment 1 is made into a method, so that the method is more practical.
The invention provides a chip auxiliary device capable of realizing chip self-destruction and a control method thereof, which can realize the thorough destruction of a target chip by adding an auxiliary module with a self-destruction device on the basis of not changing the circuit structure of an original system, thereby ensuring the information safety of the chip. The substrate is integrated with the self-destruction module, and the secondary excitation structure design of weak current excitation-chemical blasting is adopted, so that the influence of large current output on the original system load can be effectively reduced. The heating circuit is conducted through the exciting circuit and heat is released, so that the energetic material is heated to generate violent explosion reaction, and strong impact is generated on the target chip in a narrow closed space instantly, so that the target chip generates a penetrating or crushing damage effect, and the physical damage has non-restorability, and the damage effect is more thorough.
It will be understood by those skilled in the art that the modules or steps of the invention described above may be implemented by a general purpose computing device, they may be centralized on a single computing device or distributed across a network of computing devices, and optionally they may be implemented by program code executable by a computing device, such that it may be stored in a memory device and executed by a computing device, or it may be separately fabricated into various integrated circuit modules, or it may be fabricated by fabricating a plurality of modules or steps thereof into a single integrated circuit module. Thus, the present invention is not limited to any specific combination of hardware and software.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments illustrated herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
The above disclosure is only a few specific implementation scenarios of the present invention, however, the present invention is not limited thereto, and any variations that can be made by those skilled in the art are intended to fall within the scope of the present invention.
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111109517.0A CN113838809A (en) | 2021-09-22 | 2021-09-22 | A chip attachment device capable of realizing chip self-destruction and its control method |
| PCT/CN2021/137749 WO2023045113A1 (en) | 2021-09-22 | 2021-12-14 | Chip attachment apparatus capable of realizing chip self-destruction and control method therefor |
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| CN202111109517.0A CN113838809A (en) | 2021-09-22 | 2021-09-22 | A chip attachment device capable of realizing chip self-destruction and its control method |
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| CN119581419B (en) * | 2024-12-17 | 2025-04-04 | 中国电子科技集团公司信息科学研究院 | Preparation method of energy-containing self-destruction chip, energy-containing self-destruction chip and application |
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| CN111367835A (en) * | 2020-04-16 | 2020-07-03 | 泰鑫高科(北京)技术有限公司 | Self-destruction device of memory chip and working method thereof |
| CN113314470A (en) * | 2021-05-12 | 2021-08-27 | 湘潭大学 | Self-destructible chip device packaging structure and method integrating energy-containing semiconductor bridge |
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