CN112839276B - Microphone and speaker combination module, earphone and terminal equipment - Google Patents

Abstract

The invention relates to the technical field of wireless earphones, in particular to a microphone and speaker combination module, earphones and terminal equipment. The microphone and speaker combination module includes a microphone, a speaker and a PCB, wherein the microphone has a microphone front cavity, the speaker has a speaker front cavity, and the microphone front cavity and the speaker front cavity are connected; the microphone and the speaker are arranged on the PCB, and the PCB is provided with a signal The processing unit, the microphone and the speaker are respectively electrically connected with the signal processing chip. In the present application, the microphone and the speaker are arranged on the PCB and the front cavity of the microphone and the front cavity of the speaker are communicated, so that the microphone and the speaker can share the front cavity, so that the space utilization rate of the microphone and the speaker can be improved, and the occupation of the speaker and the microphone can be solved. space problem.

Description

Microphone and speaker combination module, earphone and terminal equipment

technical field

The present application relates to the technical field of wireless earphones, and in particular, to a microphone and speaker combination module, earphones and terminal equipment.

Background technique

With the development of TWS (True Wirless Stereo) wireless Bluetooth earphone technology, TWS earphones include numerous sensors, resulting in higher and higher integration of earphone components and tighter internal space of earphones.

In order to obtain a good uplink call effect and a feedback signal pickup requirement of ANC (Active Noise Cancellation, Active Noise Cancellation), a microphone is usually arranged between a speaker (also called a speaker) and the ear canal. The microphone is used to pick up the surrounding noise signal, and the noise signal is reversed and transmitted to the speaker through the circuit. The reverse noise signal output by the speaker cancels the noise signal directly entering the ear, so as to achieve the purpose of reducing noise.

As shown in FIG. 1 , it is a schematic cross-sectional view of a conventional (noise reduction) earphone. The earphone includes a first casing 11' and a second casing 12', the magnetic circuit system 21' of the speaker 2' is arranged in the first casing 11', the diaphragm 22' of the speaker 2' and the second casing 12 'Form the front cavity 13' of the horn 2'. The speaker 2' and the microphone 3' are independent devices, the microphone 3' is fixed on the PCB4' (Printed Circuit Board, printed circuit board), the PCB4' is arranged outside the second housing 12', the speaker 2' and the PCB4' They are electrically connected through FPC (Flexible Printed Circuit, flexible circuit board) (not shown in the figure). Due to the arrangement of the microphone 3', the front cavity 13' of the speaker 2' is squeezed, which reduces the cross-sectional area of the sound outlet channel 131' of the front cavity 13', thus affecting the high frequency of the speaker 2'. response, thereby sacrificing the high-frequency sound of the headphones.

Therefore, there is an urgent need for a microphone and speaker combination module, an earphone and a terminal device to solve the above problems.

SUMMARY OF THE INVENTION

The technical solution of the present application provides a combined module of a microphone and a speaker, an earphone and a terminal device, so as to solve the problem that the speaker and the microphone occupy a large space.

In the first aspect, the technical solution of the present application provides a microphone and speaker combination module, including:

a microphone with a microphone front cavity;

The speaker has a front cavity of the speaker, and the front cavity of the microphone communicates with the front cavity of the speaker;

A printed circuit board, the microphone and the speaker are arranged on the printed circuit board, a signal processing unit is arranged on the printed circuit board, and the microphone and the speaker are respectively electrically connected to the signal processing unit. By connecting the microphone front cavity of the microphone and the speaker front cavity of the speaker, the microphone and the speaker can share the front cavity, so that the space utilization rate of the microphone and the speaker can be improved.

In a possible design, the microphone and the speaker are set as separate bodies, for example, they can be independent and staggered along the sound output direction, or they can be independent and staggered along the sound output direction, which can improve the Space utilization of microphones and speakers.

In a possible design, the microphone includes a casing, a first diaphragm disposed in the casing, and a first base for supporting the first diaphragm;

The microphone and speaker combination module includes a first PCB, the casing and the first base are fixed on the first PCB, the casing, the first diaphragm, the first base and the The microphone front cavity is formed between the first PCBs;

The horn includes a second diaphragm and a second base for supporting the second diaphragm, a rear cavity of the horn is formed between the second diaphragm and the second base, and the second diaphragm is opposite to the other. The opposite side of the rear cavity of the horn forms the front cavity of the horn;

The first PCB and the second substrate are disposed on the printed circuit board. The first PCB and the second substrate are arranged on the printed circuit board, so that the signal transmission in the microphone and the speaker can be realized.

In a possible design, the first base and the second base are respectively made of silicon material, the first diaphragm is made of silicon material and piezoelectric material, and the second diaphragm is made of silicon materials and piezoelectric materials. In this way, when the first diaphragm and the second diaphragm vibrate, the first diaphragm can convert the mechanical deformation into electrical signals and transmit them through the first substrate; the first diaphragm can also convert the mechanical deformation into electrical signals The signal is transmitted through the second substrate.

In one possible design, the printed circuit board includes:

the second PCB, the microphone and the signal processing unit are all arranged on the second PCB;

The third PCB, the speaker is arranged between the second PCB and the third PCB. In this way, the microphone and the speaker can be independent and staggered along the sound output direction.

In one possible design, the horn includes:

a bracket, arranged between the second PCB and the third PCB;

The diaphragm is arranged on the bracket, the second PCB is arranged in the sound output direction of the diaphragm, the front cavity of the speaker is formed between the diaphragm and the second PCB, and the second PCB is The PCB is provided with a sounding hole, and the front cavity of the speaker communicates with the front cavity of the microphone through the sounding hole;

A driving system is arranged on the third PCB, and the driving system is used for driving the diaphragm to vibrate. By arranging the second PCB in the sound output direction of the diaphragm, the bracket can play the role of protecting the speaker and supporting the diaphragm.

In a possible design, the microphone and the speaker are integrally formed, so that the space utilization rate of the microphone and the speaker can be further improved compared with the separate arrangement of the two.

In a possible design, the microphone and the speaker form a first integrated body, and the first integrated body includes:

a first bottom wall, disposed on the printed circuit board;

a first side wall, disposed on the first bottom wall and enclosing a cavity;

The second side wall is disposed on the first bottom wall, the second side wall is located inside the first side wall, the second side wall is connected with the first side wall and encloses a cavity ;

a first diaphragm, arranged on the first side wall and the second side wall;

a second diaphragm, one end is disposed on the first side wall, and the other end is a free end;

A microphone back cavity is formed between the first bottom wall, the first side wall, the second side wall and the first diaphragm, and the first bottom wall, the first side wall, the A horn rear cavity is formed between the second side wall and the second diaphragm, and there is a gap between the first diaphragm and the second diaphragm;

The side opposite to the rear cavity of the microphone of the first diaphragm forms the front cavity of the microphone, and the side opposite to the rear cavity of the speaker forms the front cavity of the speaker of the second diaphragm. In this way, the noise can be picked up by the first diaphragm, and the sound can be emitted by the second diaphragm; and because the other end of the second diaphragm is the free end, the vibration amplitude of the second diaphragm is higher than that of the first diaphragm. big.

In a possible design, there are a plurality of the first vibrating membranes, and there is a gap between two adjacent first vibrating membranes, so as to facilitate the vibration of the first vibrating membranes.

In a possible design, there are multiple second diaphragms, and there is a gap between two adjacent second diaphragms, which can facilitate the vibration of the second diaphragms.

In a possible design, the microphone and the speaker form a second integrated body, and the second integrated body includes:

a second bottom wall, disposed on the printed circuit board;

a third side wall, disposed on the second bottom wall and enclosing a cavity;

a fourth side wall, disposed on the second bottom wall and enclosing a cavity, the fourth side wall is located inside the third side wall;

a first vibrating film, arranged on the fourth side wall;

The second diaphragm, one end is arranged on the third side wall, and the other end is a free end;

A microphone back cavity is formed between the second bottom wall, the fourth side wall and the first diaphragm, and the second bottom wall, the third side wall, the fourth side wall and the A horn rear cavity is formed between the second diaphragms, and there is a gap between the first diaphragm and the second diaphragm;

The side opposite to the rear cavity of the microphone of the first diaphragm forms the front cavity of the microphone, and the side opposite to the rear cavity of the speaker forms the front cavity of the speaker of the second diaphragm. In this way, the noise can be picked up by the first diaphragm, and the sound can be emitted by the second diaphragm; and because the other end of the second diaphragm is the free end, the vibration amplitude of the second diaphragm is higher than that of the first diaphragm. big.

In a possible design, the first diaphragm is one and is disposed at the center of the second integrated body. Considering that the microphone of the earphone is mainly used to pick up external noise, the cross-sectional area of the first diaphragm does not need to be too large, for example, it may be at the center of the second integrated body.

In a possible design, there are multiple second diaphragms, and there is a gap between two adjacent second diaphragms, which can facilitate the vibration of the second diaphragms.

In a possible design, the microphone and the speaker are respectively made by MEMS technology, which facilitates the integration of the microphone and the speaker.

In a possible design, the microphone, the speaker and the signal processing unit are fixed on the printed circuit board using SMT technology, which solves the inconsistency in sound effects caused by differences in the manual assembly of modules. , which improves the reliability of the product.

In a possible design, the signal processing unit includes:

a first signal processing unit, electrically connected to the microphone and the speaker respectively;

The second signal processing unit is electrically connected to the first signal processing unit. The output impedance of the microphone can be matched and the call and audio quality with a more balanced effect can be achieved through the first signal processing unit, and the electrical signal of the noise can be reversely processed through the second signal processing unit to achieve active noise reduction.

In a possible design, the first signal processing unit includes an ASIC chip, and the second signal processing unit includes a DSP chip. The ASIC chip is used to drive the microphone and the speaker, and the DSP chip is used to reverse the electrical signal of the noise.

In a possible design, the printed circuit board is provided with a first through hole, the speaker is provided with a second through hole, and the first through hole is communicated with the second through hole, so as to ensure that the rear of the speaker is Pressure balance between cavity and environment.

In the second aspect, the technical solution of the present application provides an earphone, including:

the first shell;

a second casing, connected to the first casing;

The microphone and speaker combination module is arranged between the first housing and the second housing, and the microphone and speaker combination module is the above-mentioned microphone and speaker combination module;

A rear cavity of the microphone and the speaker is formed between the first shell and the printed circuit board, and a front cavity of the microphone and the speaker is formed between the second shell and the printed circuit board. cavity. Such an arrangement can realize that the microphone and the speaker share the front cavity, thereby improving the space utilization rate of the microphone and the speaker.

In a possible design, the second housing includes an ear-in portion, and a sound-outlet hole is arranged in the ear-in portion, the sound-outlet hole communicates with the front cavity, and a damping net is arranged in the ear-in portion. By setting the damping net, the high-frequency sound emitted by the speaker can be filtered out, so that the bass effect of the earphone is more pronounced.

In a possible design, the second housing further includes a first stepped portion connected to the ear-in portion, and the speaker and the microphone are arranged in the inner cavity of the first stepped portion;

The inner diameter of the first stepped portion is larger than the inner diameter of the ear entry portion, so that the volume of the front cavity can be maximized.

In a possible design, the second housing further includes a second stepped portion connected to the first stepped portion, and the second stepped portion is fixed to the first housing;

The inner diameter of the second stepped portion is larger than the inner diameter of the first stepped portion, a step is arranged in the second stepped portion, and the printed circuit board is fixed on the step, so that the combined mode of the microphone and the speaker can be achieved. group containment.

In a third aspect, the technical solution of the present application provides a terminal device, including the microphone and speaker combination module described above, so as to reduce the space occupied by the microphone and the speaker in the terminal device.

It can be seen that in the above aspects, by connecting the microphone front cavity of the microphone and the speaker front cavity of the speaker, the microphone and the speaker can share the front cavity, so that the space utilization rate of the microphone and the speaker can be improved, thereby solving the space occupied by the speaker and the microphone. big problem.

Description of drawings

1 is a schematic cross-sectional view of an existing (noise reduction) earphone;

FIG. 2 is an exploded schematic diagram of an earphone shown in an embodiment of the application;

3 is a schematic cross-sectional view of an earphone according to an embodiment of the application;

4a and 4b are schematic structural diagrams of the microphone and speaker combination module shown in the first embodiment of the application;

Fig. 5 is the communication schematic diagram of loudspeaker, microphone and signal processing chip in Fig. 4;

6 is a schematic cross-sectional view of the microphone and speaker combination module shown in FIGS. 4a and 4b;

7 is another schematic cross-sectional view of the microphone and speaker combination module 10 shown in FIGS. 4a and 4b;

FIG. 8 is a schematic diagram of the structure of the microphone and the PCB;

Fig. 9 is a kind of structural schematic diagram that the speaker and the PCB cooperate;

FIG. 10 is another structural schematic diagram of the cooperation between the speaker and the PCB;

FIG. 11 is a top view of the second diaphragm of the speaker shown in FIG. 10;

12a and 12b are schematic structural diagrams of the microphone and speaker combination module shown in the second embodiment of the application;

13a and 13b are schematic structural diagrams when the speaker and the microphone are integrated into a first integrated body;

Fig. 14a is a schematic structural diagram of a part of the microphone in Fig. 13a;

Figure 14b is a schematic structural diagram of a part of the horn in Figure 13a;

FIG. 15 is a schematic structural diagram of the first vibrating film and the second vibrating film in FIG. 13a;

16 is a schematic structural diagram when a speaker and a microphone are integrated into a second integrated body;

17 is a schematic cross-sectional view of the second integrated body;

18 is another schematic cross-sectional view of the second integrated body;

Figure 19 is a schematic cross-sectional view of the microphone and speaker combination module shown in Figures 12a and 12b;

Figure 20 is another schematic cross-sectional view of the microphone and speaker combination module shown in Figures 12a and 12b;

21a and 21b are schematic structural diagrams of the microphone and speaker combination module shown in the third embodiment of the application;

22 is a schematic cross-sectional view of the microphone and speaker combination module 10 shown in FIGS. 21a and 21b;

23 is another schematic cross-sectional view of the microphone and speaker combination module 10 shown in FIGS. 21a and 21b;

FIG. 24 is an exploded schematic view of the microphone and speaker combination module 10 shown in Embodiment 4 of the present application.

Reference number:

11'- the first shell;

12' - second housing;

13' - anterior cavity;

131'- sound channel;

2'- horn;

21'- Magnetic circuit system;

22'-diaphragm;

3' - microphone;

4'-PCB;

10- Microphone and speaker combination module;

11 - the first shell;

12 - the second shell;

121-In the ear;

122 - the first step part;

123-Second step part;

123a - steps;

124 - damping net;

13-Sound hole;

14-back cavity;

15-front cavity;

16-Sound hole;

2- horn;

20- drive system;

21-The second diaphragm;

211-clearance;

22 - the second substrate;

221 - bottom wall;

222 - side wall;

223 - the second through hole;

23 - the rear cavity of the horn;

24- the front cavity of the horn;

25-diaphragm;

201 - the first bottom wall;

202 - the first side wall;

203 - the second side wall;

204-clearance;

205 - second bottom wall;

206 - the third side wall;

207 - the fourth side wall;

20a - the first sector structure;

20b - the second sector structure;

20c - the third sector structure;

20d - the fourth sector structure;

20e- fifth sector structure;

20f - the sixth sector structure;

3 - microphone;

31 - shell;

311 - sound hole;

32 - the first diaphragm;

33 - the first substrate;

34 - the front cavity of the microphone;

35-microphone back cavity;

4- printed circuit board;

40 - cover body;

41 - the first signal processing chip;

42- the second signal processing chip;

43 - the first through hole;

441 - first side;

442 - second side;

401-first PCB;

402-Second PCB;

403 - Third PCB.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description serve to explain the principles of the invention.

Detailed ways

The present invention will be described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

In the description of the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "first" and "second" are only used for the purpose of description, and should not be construed as indicating or implying relative importance; unless otherwise specified Or to illustrate, the term "plurality" refers to two or more; the terms "connection" and "fixed" should be understood in a broad sense, for example, "connection" can be a fixed connection or a detachable connection, or Connected integrally, or connected electrically; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

In the description of this specification, it should be understood that the directional terms such as "upper" and "lower" described in the embodiments of the present invention are described from the perspective shown in the drawings, and should not be construed as a description of the embodiments of the present invention. limited. Also, in this context, it should also be understood that when an element is referred to as being "on" or "under" another element, it can not only be directly connected "on" or "under" the other element, but also Indirectly connected "on" or "under" another element through intervening elements.

In the related art, some terminal devices have the function of picking up sound and emitting sound, that is, having acoustic devices such as microphones and speakers. However, these acoustic devices are independent devices in the terminal device, occupying a lot of internal space of the terminal device.

In order to solve the above technical problems, an embodiment of the present application provides a terminal device, and the terminal device is provided with a microphone and speaker combination module, and the microphone and speaker combination module can integrate the microphone and the speaker on the printed circuit board at the same time, to reduce the space occupied by the microphone and speaker. Wherein, the terminal device can be, for example, a head-mounted device, specifically AR glasses and VR glasses; for example, it can also be a portable device, specifically a headset, a mobile phone, and a wristband; of course, it can also be any other device capable of picking up sounds and emitting sounds. Functional products, which are not enumerated here.

For example, the terminal device may be an earphone as an example. In an implementation solution, the earphone may be a TWS (True Wireless Stereo, true wireless stereo) wireless Bluetooth earphone.

As shown in FIG. 2 , which is an exploded schematic diagram of the earphone shown in the embodiment of the present application. The earphone includes a first shell 11 and a second shell 12, and a space for accommodating a microphone and speaker combination module 10 is formed between the first shell 11 and the second shell 12, and the microphone and speaker combination module 10 includes a speaker 2. The microphone 3 and the printed circuit board 4, the speaker 2 and the microphone 3 are fixed on the printed circuit board 4, and the printed circuit board 4 can also be provided with a signal processing unit for processing electrical signals, such as a signal processing chip, the speaker 2 and the microphone 3 are respectively electrically connected to the signal processing unit through the printed circuit board 4 . In one embodiment, the signal processing unit may include a first signal processing unit and a second signal processing unit, for example, the first signal processing unit is the first signal processing chip 41 and the second signal processing unit is the second signal processing chip 42 . The speaker 2 and the microphone 3 are respectively electrically connected to the first signal processing chip 41 through the printed circuit board 4 , and the first signal processing chip 41 is electrically connected to the second signal processing chip 42 through the printed circuit board 4 . Through the first signal processing unit, the matching of the output impedance of the microphone 3 and the call and audio quality with a more balanced effect can be achieved. The second signal processing unit can perform reverse processing on the electrical signal of the noise to realize active noise reduction, and the detailed working process can be referred to the following description.

In some embodiments, the speaker 2, the microphone 3, the first signal processing chip 41 and the second signal processing chip 42 are all soldered on the printed circuit board 4, for example, SMT (Surface Mounted Technology, surface mount technology) can be used for soldering .

In some embodiments, the first signal processing chip 41 includes, but is not limited to, an ASIC (Application Specific Integrated Circuit, application specific integrated circuit) chip, for example, may also include an FPGA (Field-Programmable Gate Array, field programmable gate array) chip, or a DSP (Digital Signal Processor, digital signal processing unit) chip, etc.

In some embodiments, the second signal processing chip 42 includes, but is not limited to, a DSP chip. For example, it may also include an FPGA chip, or a BT SOC (Bluetooth System on Chip) integrated with a DSP chip (or FPGA chip). Bluetooth chip).

It should be noted that, taking the first signal processing chip 41 including an ASIC chip as an example, the first signal processing chip 41 may include an ASIC chip, and the ASIC chip can realize the matching of the output impedance of the microphone 3 and the call with a more balanced effect. and audio quality. It can be understood that the first signal processing chip 41 may also include two ASIC chips, wherein the former ASIC chip can match the output impedance of the microphone 3 , and the latter ASIC chip can realize more balanced call and audio quality.

As shown in FIG. 3 , which is a schematic cross-sectional view of the earphone shown in the embodiment of the present application. The rear cavity 14 of the speaker 2 and the microphone 3 is formed between the first housing 11 and the printed circuit board 4 , and the front cavity 15 of the speaker 2 and the microphone 3 is formed between the second housing 12 and the printed circuit board 4 . That is, the printed circuit board 4 divides the space for accommodating the microphone and speaker combination module 10 into a rear cavity 14 and a front cavity 15 . Among them, the speaker 2 and the microphone 3 share the front cavity 15, so that the space utilization rate of the speaker 2 and the microphone 3 can be improved; at the same time, since the speaker 2 is arranged in the front cavity 15, the front cavity 15 will not be squeezed, thereby causing no leakage. The cross-sectional area of the sound channel is reduced, so not only the internal space of the earphone is saved, but also the high-frequency sound effect of the speaker 2 can be guaranteed.

In some embodiments, the second housing 12 includes an in-ear portion 121 for inserting into the ear canal of the human ear. The ear-in portion 121 is provided with a sound outlet hole 13 inside, and the sound emitted by the speaker 2 can pass through the front cavity 15 and the sound outlet hole. 13 to the human ear. Since the outside of the in-ear portion 121 is covered with a soft rubber sleeve (not shown in the figure), there may be a gap between the soft rubber sleeve and the human ear due to insufficient sealing, and external noise will enter from the outside to the sound through this gap. into the hole 13 , and then into the front cavity 15 and then picked up by the microphone 3 . External noise can also be picked up by the microphone 3 through the sound outlet 13 and the front cavity 15. The microphone 3 processes the sound signal, for example, the sound signal can be converted into an electrical signal, and the electrical signal can be transmitted to the first signal processing chip 41 for processing. , the audio electrical signal generated after processing by the first signal processing chip 41 is transmitted to the second signal processing chip 42 for reverse processing, and the speaker 2 converts the reversely processed electrical signal into a sound signal and sends out, so as to realize active reduction noise. In an implementation manner, the transmission of the above-mentioned electrical signals is accomplished through the printed circuit board 4 .

In some embodiments, the second housing 12 further includes a first stepped portion 122 connected to the in-ear portion 121 , and the speaker 2 and the microphone 3 are disposed in the inner cavity of the first stepped portion 122 . Wherein, the position of the first step portion 122 is the part where the earphone is not inserted into the ear canal or the part just inserted into the ear canal. The inner diameter of the first stepped portion 122 is larger than the inner diameter of the ear entry portion 121 , and the front cavity 15 includes the inner cavity of the first stepped portion 122 . Thus, by arranging the first stepped portion 122 , the volume of the front cavity 15 can be maximized.

In some embodiments, the front cavity 15 is provided with a damping net 124 , for example, the damping net 124 can be fixed on the inner wall of the ear-in portion 123 by means of bonding, and the high-frequency sound emitted by the speaker 2 can be filtered out by setting the damping net 124 , so that the bass effect of the headphones is more pronounced. In an implementation manner, the damping net 124 may be made of a material containing electromagnetic shielding, such as conductive rubber or conductive foam, so that the electromagnetic shielding capability of the microphone 3 can be improved. In an implementation manner, the damping net 124 is closer to one side of the human ear canal, so that dust can be prevented from entering the side wall of the sound outlet hole 13 and contaminate the sound outlet hole 13 as much as possible.

In some embodiments, the second housing 12 further includes a second stepped portion 123 connected to the first stepped portion 122 , and the second stepped portion 123 is fixed to the first housing 11 . In an implementation manner, a step 123a is provided in the second step portion 123, and the printed circuit board 4 is fixed on the step 123a, for example, by welding or bonding. The inner diameter of the second stepped portion 123 is larger than the inner diameter of the first stepped portion 122 , which can accommodate the microphone and speaker combination module 10 .

The specific structure and design method of the microphone and speaker combination module 10 will be described below.

As shown in FIG. 4a and FIG. 4b, which are schematic structural diagrams of the microphone and speaker combination module shown in the first embodiment of the application, wherein FIG. 4a is a schematic structural diagram of the microphone and speaker combination module 10 from a first viewing angle. 4b is a schematic structural diagram of the microphone and speaker combination module 10 in a second viewing angle. The microphone and speaker combination module includes a speaker 2, a microphone 3 and a printed circuit board 4. The speaker 2 and the microphone 3 are respectively fixed on the printed circuit board 4. The printed circuit board 4 is provided with a signal processing unit for processing electrical signals, such as The signal processing chip, the speaker 2 and the microphone 3 are respectively electrically connected to the signal processing chip through the printed circuit board 4 . In one embodiment, the signal processing unit may include a first signal processing unit and a second signal processing unit, such as a first signal processing chip 41 and a second signal processing chip 42 . The speaker 2 and the microphone 3 are respectively electrically connected to the first signal processing chip 41 through the printed circuit board 4 , and the first signal processing chip 41 is electrically connected to the second signal processing chip 42 through the printed circuit board 4 . The printed circuit board 4 is also provided with a first through hole 43 that communicates with the speaker 2 , so that the pressure balance between the rear cavity of the speaker and the environment can be ensured (the specific process can be seen in FIG. 9 ).

In some embodiments, both the speaker 2 and the microphone 3 are made by using a MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) process. The speaker 2 and the microphone 3 made by using the MEMS process have the advantages of small size, light weight and low power consumption. , the advantages of high reliability, high sensitivity and easy integration, so it is convenient to integrate the speaker 2 and the microphone 3.

As shown in FIG. 5 , it is a schematic diagram of communication between the speaker 2 , the microphone 3 and the signal processing chip in FIG. 4 . Specifically, the first signal processing chip 41 integrates a microphone driving module 411 , a signal processing module 412 and a speaker driving module 413 . Wherein: the microphone driving module 411 is electrically connected to the microphone 3 for receiving the electrical signal sent by the microphone 3 (because the microphone 3 may be piezoelectric, so the noise can be converted into an electrical signal by the microphone 3); the microphone driving module 411 is connected to The signal processing module 412 is electrically connected, and the signal processing module 412 can process the electrical signal sent by the microphone driving module 411 (for example, including matching the output impedance of the microphone 3); the signal processing module 412 is electrically connected with the second signal processing chip 42, The second signal processing chip 42 reversely processes the electrical signal sent by the signal processing module 412; the speaker driving module 413 is electrically connected to the second signal processing chip 42 and the speaker 2, respectively, and the speaker driving module 413 is used to convert the electrical signal sent by the second signal processing chip 413. The electrical signal sent by the speaker 42 is transmitted to the speaker 2, and the speaker 2 is used to convert the electrical signal sent by the speaker driving module 413 into a sound signal, so as to realize active noise reduction.

As shown in FIG. 6 , it is a schematic cross-sectional view of the microphone and speaker combination module 10 shown in FIGS. 4 a and 4 b . In this embodiment, the speaker 2 and the microphone 3 may be located on the second side of the printed circuit board 4 , and the first signal processing chip 41 and the second signal processing chip 42 may be located on the first side of the printed circuit board 4 .

As shown in FIG. 7 , it is another schematic cross-sectional view of the microphone and speaker combination module 10 shown in FIGS. 4 a and 4 b . In this embodiment, the speaker 2 , the microphone 3 and the first signal processing chip 41 may be located on the second side of the printed circuit board 4 , and the second signal processing chip 42 may be located on the first side of the printed circuit board 4 .

In this embodiment, the microphone 3 and the loudspeaker 2 are arranged separately, wherein the two are independent and staggered along the direction perpendicular to the sound output, so that the space utilization of the microphone 3 and the loudspeaker 2 can be improved.

It should be noted that as long as it is ensured that the first signal processing chip 41 is electrically connected to the speaker 2 and the microphone 3 respectively, and whether the first signal processing chip 41 and the speaker 2 and the microphone 3 are located on the same side or the opposite side, this The application does not specifically limit it. In one implementation, the electrical signals and/or the transmission of electrical signals may be accomplished through the printed circuit board 4 .

The specific structures of the speaker 2 and the microphone 3 shown in FIG. 6 or FIG. 7 are respectively described below.

As shown in FIG. 8 , it is a schematic structural diagram of the cooperation of the microphone 3 with the printed circuit board. The microphone 3 includes a casing 31, a first diaphragm 32 and a first base 33 for supporting the first diaphragm 32. The casing 31 and the first base 33 are fixed on the first PCB 401, for example, the casing 31 is fixed on the first base 33, The first base 33 is fixed on the first PCB 401 ; for another example, the housing 31 is fixed on the first PCB 401 , and the first base 33 is fixed on the first PCB 401 , for example, by welding. Then, the microphone 3 is fixed on the printed circuit board 4 through the first PCB 401, for example, by welding. In an implementation manner, the first vibrating membrane 32 and the first substrate 33 may be integrally etched from a single crystal or polycrystalline silicon material, and a piezoelectric material (eg ceramic material) is sprayed on the etched first vibrating membrane 32 , or cover a layer of piezoelectric ceramic sheet on the etched first diaphragm 32 to make a piezoelectric microphone.

The microphone front cavity 34 is formed between the housing 31 , the first diaphragm 32 , the first substrate 33 and the first PCB 401 , and the microphone rear cavity 35 is formed between the first diaphragm 32 , the first substrate 33 and the first PCB 401 . The casing 31 is provided with a sound hole 311 communicating with the microphone front cavity 34 , and the sound is transmitted to the first diaphragm 32 of the microphone 3 through the sound hole 311 , so that the first diaphragm 32 bends with the change of air pressure.

In this embodiment, the first vibrating membrane 32 and the first substrate 33 can be made of single crystal or polycrystalline silicon material, and the surface of the first vibrating membrane 32 can also be sprayed with piezoelectric material (eg ceramic material), or etched The latter first vibrating membrane 32 is covered with a layer of piezoelectric ceramic sheet. When the first diaphragm 32 is bent, the first diaphragm 32 will generate an electrical signal; the first signal processing chip 41 electrically connected to the microphone 3 can process the electrical signal. In an implementation manner, the transmission of electrical signals is accomplished through the first substrate 33 , the first PCB 401 and the printed circuit board 4 . In this way, the use of wire connection can be avoided, and a channel for passing the wire through the casing 31 can also be avoided, which is more simple and convenient.

In addition, the way to realize the electrical connection between the first signal processing chip 41 and the microphone 3 may also be to use wires.

In this embodiment, the casing 31 is generally arranged in the shape of a right quadrangular prism with a rectangular top, and the casing 31 can be made of metal (the material of the metal can be selected from stainless steel, aluminum, aluminum alloy, copper, Copper alloy materials, iron materials, iron alloy materials, etc.), plastics (plastics can choose rigid plastics, such as ABS, POM, PS, PMMA, PC, PET, PBT, PPO, etc.) and other alloy materials. In this way, the arrangement stability of the casing 31 can be improved, thereby effectively improving the practicability, reliability and durability of the casing 31 . In an implementation manner, the housing 31 can be made of a metal material, so that the electromagnetic shielding effect of the microphone 3 can be more significant, thereby improving the electromagnetic anti-interference ability of the microphone 3 .

In this embodiment, external noise enters the earphone from the sound outlet 13 (refer to FIG. 3 ), and is picked up by the microphone 3. The microphone 3 converts the picked-up noise signal into an electrical signal, and the electrical signal is processed by the first signal. The chip 41 sends the processed signal to the second signal processing chip 42 . The second signal processing chip 42 reversely processes the noise electrical signal, and then transmits it to the speaker 2 through the first signal processing chip 41 . The speaker 2 transmits the reversed noise electrical signal according to the first signal processing chip 41 The sound signal opposite to the noise is output to the outside, and the sound signal opposite to the noise and the noise directly entering the ear cancel each other out, thus playing a good noise reduction effect.

As shown in FIG. 9 , it is a schematic structural diagram of the cooperation between the speaker 2 and the printed circuit board 4 . The speaker 2 includes a second diaphragm 21 and a second base 22 for supporting the second diaphragm 21. The second base 22 is fixed on the printed circuit board 4, for example, by welding. The second base 22 includes a bottom wall 221 and a side wall 222. The rear cavity 23 is formed between the second diaphragm 21, the bottom wall 221 and the side wall 222 (ie, between the second diaphragm 21 and the second base 22). A horn front cavity 24 is formed on the opposite side of the dual diaphragm 21 relative to the horn rear cavity 23 . The front cavity 24 of the speaker is communicated with the front cavity 34 of the microphone (see FIG. 8 ), so that the microphone 3 and the speaker 2 can share the front cavity, so that the space utilization rate of the microphone 3 and the speaker 2 can be improved, and the space occupied by the speaker and the microphone can be solved. big problem.

In an implementation manner, the second vibrating membrane 21 and the second substrate 22 may be integrally etched from a single crystal or polycrystalline silicon material, and a piezoelectric material (such as a ceramic material) is sprayed on the etched second vibrating membrane 21 , or cover the etched first vibrating membrane 32 with a piezoelectric ceramic sheet, so that the first signal processing chip 41 electrically connected to the speaker 2 can excite the second vibrating membrane 21, so that the second vibrating membrane The 21 vibrates relative to the second base 22 to emit sound, that is, the speaker 2 can first convert the electrical signal into mechanical deformation, and then convert the mechanical deformation into a sound signal, thereby realizing sound production.

In this embodiment, in order to ensure the pressure balance between the rear cavity 23 of the speaker and the environment when the second diaphragm 21 vibrates, the bottom wall 221 is provided with one or more second through holes communicating with the first through holes 43 . The hole 223 , the first through hole 43 penetrates through the first side surface 441 and the second side surface 442 of the printed circuit board 4 . In order to balance the pressure, when the second diaphragm 21 descends, air can pass from the rear cavity 23 of the speaker to the outside of the first side 441 of the printed circuit board 4 through the second through hole 223 and the first through hole 43 (this is because the printed circuit The first side 441 of the plate 4 is in communication with the environment) outflow. Similarly, when the second diaphragm 21 rises, air can also flow into the speaker rear cavity 23 from the outside of the first side surface 441 of the printed circuit board 4 through the first through holes 43 and the second through holes 223 .

As shown in FIGS. 10 and 11 , FIG. 10 is another structural schematic diagram of the speaker 2 and the printed circuit board 4 , and FIG. 11 is a top view of the second diaphragm 21 of the speaker 2 shown in FIG. 10 . The difference between the speaker 2 and the speaker 2 shown in FIG. 9 is that one end of the second diaphragm 21 is fixed on the side wall 222 , and the other end is a free end (ie, a cantilever beam structure).

As shown in FIG. 11 , in this embodiment, there is a gap 211 between two adjacent second diaphragms 21 , so that each second diaphragm 21 can be easily vibrated. Among them, the speaker 2 is used to emit sound, and the microphone 3 is mainly used to pick up external noise, so the vibration amplitude of the second diaphragm 21 can be greater than the vibration amplitude of the first diaphragm 32 . As an embodiment, the second diaphragm 21 with the structure shown in FIG. 10 and FIG. 11 has a larger bending amplitude than the second diaphragm 21 with the structure shown in FIG. 9 , so that the second diaphragm 21 can emit sound The range of sizes is larger.

Please continue to refer to FIG. 11 , in a circular area, in order to ensure that the vibration amplitude of each second diaphragm 21 is the same, in an implementation manner, the second diaphragm 21 is a fan-shaped structure with the same cross-sectional area, and the total The number can be six to fill the circular area to a greater extent. Of course, the circular area may also be in other shapes, such as a rectangle. In order to match the rectangular area, the second diaphragm 21 may be a triangular structure, and the number may be four, so as to fill the rectangular area to a greater extent.

Please continue to refer to FIG. 6 to FIG. 10. In the first implementation, the microphone 3 is fixed to the printed circuit board 4 through the first PCB 401. Specifically, it can be fixed on the printed circuit board 4 by means of SMT patch. Similarly, the first signal processing The chip 41 and the speaker 2 can also be fixed on the printed circuit board 4 by means of SMT, so as to solve the inconsistency in sound effects caused by differences in the manual assembly of the modules, and improve the reliability of the product.

It should be pointed out that since the second diaphragm 21 of the speaker 2 is made of single crystal or polycrystalline silicon material (using the high temperature resistance of silicon material), the speaker 2 can also be fixed by means of SMT patches. In the related art, the speaker is fixed on the printed circuit board by ordinary welding or bonding. This is because the diaphragm of the microphone in the related art is made of PET, PEN or PEI material, which is not resistant to high temperature. , so it may not be possible to use the SMT patch process.

In addition, the first vibrating membrane 32 and the second vibrating membrane 21 are both made of piezoelectric material (eg ceramic material), which improves the waterproof and dustproof capabilities of the earphone. In addition, compared with a moving coil-driven microphone or speaker, the speaker 2 and the microphone 3 provided in this embodiment can pick up sound and emit sound respectively due to the characteristics of the piezoelectric material, so that there is no coupling between the speaker 2 and the microphone 3. Noise can solve the problem of electrical signal interference caused by the close combination of traditional moving coil speakers and microphones.

As shown in FIGS. 12a and 12b, it is a schematic structural diagram of the microphone and speaker combination module 10 shown in the second embodiment of the application, wherein FIG. 12a is a schematic structural diagram of the microphone and speaker combination module 10 from a first viewing angle, FIG. 12b is a schematic structural diagram of the microphone and speaker combination module 10 from a second viewing angle. The difference between the microphone and speaker combination module 10 shown in this embodiment and the first embodiment is that the speaker 2 and the microphone 3 are integrated into one component (hereinafter referred to as "the first integrated body").

As shown in Fig. 13a and Fig. 13b, it is a schematic diagram of the structure when the speaker 2 and the microphone 3 are integrated into a first integrated body, wherein Fig. 13a is a schematic structural diagram of the first integrated body from a first perspective, and Fig. 13b is the first integrated body Schematic diagram of the structure of the body in the second viewing angle. The first integrated body includes a first bottom wall 201 , a first side wall 202 and a second side wall 203 respectively connected to the first bottom wall 201 (see FIG. 14 a ), a first diaphragm 32 and a second diaphragm 21 . The first side wall 202 is arranged on the first bottom wall 201 and encloses a cavity, the second side wall 203 is arranged on the first bottom wall 201, the second side wall 203 is located inside the first side wall 202, and the second side wall 203 is located inside the first side wall 202. The two side walls 203 are connected to the first side wall 202 and enclose a cavity. In an implementation manner, the number of the first diaphragm 32 and the second diaphragm 21 can be one or more, and the number of the first diaphragm 32 and the second diaphragm 21 shown in FIG. 13a is only an example, It can be understood that the first integrated body has at least one first vibrating film 32 and one second vibrating film 21 . In this embodiment, two adjacent vibrating membranes (ie, the first vibrating membrane 32 and the second vibrating membrane 21 , the first vibrating membrane 32 and the first vibrating membrane 32 , or the second vibrating membrane 21 and the second vibrating membrane 21) with a gap 204 therebetween.

As shown in FIG. 14a, it is a schematic structural diagram of a part of the microphone 3 in FIG. 13a; as shown in FIG. 14b, it is a schematic structural diagram of a part of the speaker 2 in FIG. 13a. In this embodiment, the first sidewall 202 is disposed outside the second sidewall 203 and is connected to the second sidewall 203 , the first diaphragm 32 is fixed on the first sidewall 202 and the second sidewall 203 , the first One end of the two-diaphragm 21 is fixed on the first side wall 202 , and the other end is a free end (ie, a cantilever beam structure).

In this embodiment, a microphone rear cavity is formed between the first bottom wall 201 , the first side wall 202 , the second side wall 203 and the first diaphragm 32 , and the first diaphragm 32 is formed on the opposite side of the microphone rear cavity. The front cavity of the microphone; the rear cavity of the speaker is formed between the first bottom wall 201, the first side wall 202, the second side wall 203 and the second diaphragm 21, and the second diaphragm 21 is opposite to the rear cavity of the speaker to form the front of the speaker cavity. Since the amplitude of the vibration of the second diaphragm 21 may be greater than that of the first diaphragm 32 , the change in air pressure caused by the vibration of the second diaphragm 21 is also relatively significant. In order to ensure the pressure balance between the rear cavity of the speaker and the environment when the second diaphragm 21 vibrates, as an embodiment, the first bottom wall 201 is provided with a first through hole 43 (see FIGS. 9 and 10 ). ) communicated with the second through hole 223.

In this embodiment, the first bottom wall 201 , the first side wall 202 and the second side wall 203 respectively connected to the first bottom wall 201 can be made of single crystal or polycrystalline silicon material, so that the first diaphragm 32 The generated electrical signal is transmitted to the printed circuit board 4 , or the electrical signal received from the printed circuit board 4 is transmitted to the second diaphragm 21 .

In this embodiment, the first bottom wall 201 may be a circular structure (see FIG. 13b ), the first side wall 202 may be a cylindrical cavity (see FIG. 13a ), and the second side wall 203 may be a zigzag shape structure, the second side wall 203 and the first side wall 202 enclose a fan-shaped cavity (see FIG. 14a ), and the first diaphragm 32 formed on the first side wall 202 and the second side wall 203 may be a fan-shaped structure ( 13a and 14a), the second diaphragm 21 formed on the first side wall 202 may be a fan-shaped structure (see FIGS. 13a and 14b), wherein the first diaphragm 32 and the second diaphragm 21 The total number can be six to evenly divide the circle into six fan-shaped structures. It can be understood that, the first bottom wall 201 can also be a square structure or a structure of other shapes, and the specific shapes of the first side wall 202, the second side wall 203, the first diaphragm 32 and the second diaphragm 21 can be determined according to The specific shape of the first bottom wall 201 is correspondingly designed, which is not specifically limited in this application.

As shown in FIG. 15 , which is a schematic structural diagram of the first vibrating membrane 32 and the second vibrating membrane 21 in FIG. 13 a . When the first bottom wall 201 is a circular structure, and the total number of the first diaphragm 32 and the second diaphragm 21 is six fan-shaped structures, the six fan-shaped structures are respectively defined as: the first fan-shaped structure 20a, the second fan-shaped structure 20b, a third fan-shaped structure 20c, a fourth fan-shaped structure 20d, a fifth fan-shaped structure 20e, and a sixth fan-shaped structure 20f. The combination of forming the first diaphragm 32 and the second diaphragm 21 can be as follows: the first fan-shaped structure 20a is the first diaphragm 32, and the other fan-shaped structures are the second diaphragm 21; the first fan-shaped structure 20a and the fourth fan-shaped structure 20d is the first diaphragm 32 , the other fan-shaped structures are the second diaphragm 21 ; the first fan-shaped structure 20 a , the third fan-shaped structure 20 c and the fifth fan-shaped structure 20 e are the first diaphragm 32 , and the other fan-shaped structures are the second diaphragm 21 ; The first fan-shaped structure 20a and the second fan-shaped structure 20b are the first diaphragm 32, and the other fan-shaped structures are the second diaphragm 21; of course, other combinations are also included, which are not exhaustive in this application. As long as it is ensured that one or more of the fan-shaped structures are the first diaphragms 32 , and the other fan-shaped structures are the second diaphragms 21 .

In this embodiment, the microphone 3 and the speaker 2 are integrally formed, so that the space utilization rate of the microphone 3 and the speaker 2 can be further improved compared with the separate arrangement of the two.

As shown in FIG. 16 , it is a schematic structural diagram when the speaker 2 and the microphone 3 are integrated into a second integrated body. As shown in FIG. 17 , it is a schematic cross-sectional view of the second integrated body. As shown in FIG. 18 , it is another schematic cross-sectional view of the second integrated body. Referring to FIGS. 16 to 18 , the second integrated body includes a second bottom wall 205 , a third side wall 206 and a fourth side wall 207 respectively connected to the second bottom wall 205 , a first diaphragm 32 and a second diaphragm membrane 21. The third side wall 206 is disposed on the second bottom wall 205 and encloses a cavity; the fourth side wall 207 is disposed on the second bottom wall 205 and encloses a cavity, and the fourth side wall 207 is located on the third side wall 206 ; one end of the second diaphragm 21 is fixed on the third side wall 206 and the other end is a free end (ie, a cantilever beam structure); the first diaphragm 32 is fixed on the fourth side wall 207 . In one implementation, there is one first vibrating membrane 32 , six second vibrating membranes 21 , and the six second vibrating membranes 21 are evenly distributed on the outer periphery of the first vibrating membrane 32 . In this embodiment, there are gaps 204 between two adjacent second diaphragms 21 and between the first diaphragm 32 and the second diaphragm 21 .

In this embodiment, the second bottom wall 205 may be a circular structure, the third side wall 206 may be a cylindrical cavity, and the fourth side wall 207 may be a polyhedral (eg, hexahedral) cavity formed on the fourth side wall The first diaphragm 32 on 207 may be a polygonal (eg, hexagonal) structure, and the second diaphragm 21 formed on the third sidewall 206 may be a fan-like ring (for example, a fan ring close to the first diaphragm 32 ). The side is changed from a curve to a straight line) structure, wherein the number of the first diaphragm 32 can be one, and the number of the second diaphragm 21 can be six, so as to divide the circle into a hexagonal structure and evenly distribute it on the six Six fan-like ring structures around the edge structure.

As an embodiment, the second bottom wall 205 may be a circular structure, the third side wall 206 may be a cylindrical cavity, and the fourth side wall 207 may also be a cylindrical cavity formed on the fourth side wall 207 The first vibrating membrane 32 can also be a circular structure, and the second vibrating membrane 21 formed on the third side wall 206 can also be a fan ring structure, wherein the number of the first vibrating membrane 32 can be one, and the number of the second vibrating membrane 32 can be one. The number of 21 may be six, so as to divide the circle into a circular structure and six fan ring structures evenly distributed around the circular structure. It can be understood that the second bottom wall 205 can also be a square structure or other shapes, and the specific shapes of the third side wall 206 , the fourth side wall 207 , the first diaphragm 32 and the second diaphragm 21 can be determined according to The specific shape of the second bottom wall 205 is designed accordingly, which is not specifically limited in the present application.

In this embodiment, a microphone rear cavity is formed between the second bottom wall 205, the fourth side wall 207 and the first diaphragm 32, and the first diaphragm 32 forms a microphone front cavity on the opposite side of the microphone rear cavity; the second diaphragm 32 forms a microphone front cavity; A horn rear cavity is formed between the bottom wall 205 , the third side wall 206 , the fourth side wall 207 and the second diaphragm 21 , and the second diaphragm 21 forms a front horn cavity on the opposite side of the horn rear cavity.

In this embodiment, the first diaphragm 32 is arranged at the center of the second integrated body, because considering that the microphone 3 of the earphone is mainly used to pick up external noise, the main purpose of the earphone is to make the speaker 2 emit sound, so The cross-sectional area of the second diaphragm 21 of the speaker 2 needs to be larger than the cross-sectional area of the first diaphragm 32 of the microphone 3 .

It can be understood that, as long as the cross-sectional area of the second diaphragm 21 is larger than that of the first diaphragm 32, the specific design shapes and fixing methods of the first diaphragm 32 and the second diaphragm 21 are not specified. limited.

In this embodiment, the microphone 3 and the speaker 2 are integrally formed, so that the space utilization rate of the microphone 3 and the speaker 2 can be further improved compared with the separate arrangement of the two.

As shown in FIG. 19 , it is a schematic cross-sectional view of the microphone and speaker combination module 10 shown in FIGS. 12 a and 12 b . For example, the speaker 2 and the microphone 3 in FIG. 19 are shown in the form of the second integrated body shown in FIG. 16 . In this embodiment, the second integrated body is disposed on the second side surface 442 of the printed circuit board 4 , and the first signal processing chip 41 and the second signal processing chip 42 are disposed on the first side surface 441 of the printed circuit board 4 . In some implementations, the first signal processing chip 41 and the second signal processing chip 42 may be provided separately.

As shown in FIG. 20 , it is another schematic cross-sectional view of the microphone and speaker combination module 10 shown in FIGS. 12 a and 12 b . For example, the speaker 2 and the microphone 3 in FIG. 20 are shown in the form of the second integrated body shown in FIG. 16 . In this embodiment, the second integrated body is disposed on the second side surface 442 of the printed circuit board 4 , and the first signal processing chip 41 and the second signal processing chip 42 are disposed on the first side surface 441 of the printed circuit board 4 . In some implementation solutions, the first signal processing chip 41 and the second signal processing chip 42 may be integrally provided, and both are integrated in a cover body 40 . For example, the first signal processing chip 41 and the second signal processing chip 42 may be packaged in the cover body 40 by means of SIP (System in Package, system in package) packaging.

It can be understood that the microphone and speaker combination module 10 shown in FIG. 6 and FIG. 7 can also be packaged in a SIP manner. For example, the first signal processing chip 41 and the second signal processing chip 42 in the microphone and speaker combination module 10 shown in FIG. 6 can be SIP packaged, and the microphone 3 and the speaker 2 can also be packaged; The microphone 3 , the speaker 2 and the first signal processing chip 41 in the microphone and speaker combination module 10 are SIP packaged.

In this embodiment, external noise enters the earphone from the sound outlet 12 (see FIG. 3 ) and is picked up by the microphone 3 , so that the first diaphragm 32 bends as the air pressure changes. When the first diaphragm 32 bends An electrical signal will be generated, and the generated electrical signal will be transmitted to the printed circuit board 4 through the second side wall 203 and the first bottom wall 201 (or through the fourth side wall 207 and the second bottom wall 205 ), and then to the printed circuit The first signal processing chip 41 on the board 4 . The first signal processing chip 41 processes the electrical signal and transmits it to the second signal processing chip 42 for reverse processing, and the reversely processed electrical signal is then transmitted to the printed circuit board 4, the first The bottom wall 201, the first side wall 202 and the second diaphragm 21 (or the printed circuit board 4, the second bottom wall 205, the third side wall 206 and the second diaphragm 21), the second diaphragm 21 according to the first signal The reversed noise electrical signal transmitted from the processing chip 41 outputs a sound signal opposite to the noise, and the sound signal opposite to the noise and the noise directly entering the ear cancel each other out, thus playing a good noise reduction effect.

As shown in FIG. 21a and FIG. 21b, it is a schematic structural diagram of the microphone and speaker combination module 10 shown in the third embodiment of the application, wherein FIG. 21a is a schematic structural diagram of the microphone and speaker combination module 10 from a first viewing angle, FIG. 21b is a schematic structural diagram of the microphone and speaker combination module 10 from a second viewing angle. The difference between the microphone and speaker combination module 10 shown in this embodiment and the second embodiment is that the speaker 2 , the microphone 3 and the first signal processing chip 41 are integrated into one component. Specifically, in this embodiment, the speaker 2 , the microphone 3 and the first signal processing chip 41 are all located on the second side of the printed circuit board 4 .

Compared with the microphone and speaker combination module 10 shown in the first embodiment (for example, FIG. 6 ), after the speaker 2 and the microphone 3 in the third embodiment are integrated into the first integrated body or the second integrated body, they are integrated with the first signal processing chip. 41 Electrical connections.

For example, as shown in FIG. 22 , which is a schematic cross-sectional view of the microphone and speaker combination module 10 shown in FIGS. 21 a and 21 b . FIG. 22 shows the positional relationship with the first signal processing chip 41 after the speaker 2 and the microphone 3 are integrated into a second integrated body, that is, the speaker 2 , the microphone 3 and the first signal processing chip 41 are all located on the second side of the printed circuit board 4 . side.

For another example, as shown in FIG. 23 , which is another schematic cross-sectional view of the microphone and speaker combination module 10 shown in FIGS. 21 a and 21 b . FIG. 23 shows the positional relationship with the first signal processing chip 41 after the speaker 2 and the microphone 3 are integrated into a second integrated body, that is, the speaker 2 , the microphone 3 and the first signal processing chip 41 are all located on the second side of the printed circuit board 4 . side. In some implementations, the microphone and speaker combination module 10 shown in FIG. 23 performs SIP packaging on the microphone 3 , the speaker 2 and the first signal processing chip 41 .

It can be understood that, in this embodiment, the way of integrating the speaker 2 and the microphone 3 (ie, the way of being integrated into a first integrated body or a second integrated body) is the same as that of the second embodiment, and details are not repeated here.

Please refer to FIG. 12a to FIG. 23 , in the second and third embodiments, the speaker 2 and the microphone 3 are integrated into one body, that is, integrated into a first integrated body or a second integrated body, which can increase the size compared to the first embodiment. The volume of the front cavity of the speaker can further provide favorable conditions for functions such as sound pickup, active noise reduction and upward noise reduction in the ear canal.

As shown in FIG. 24 , which is an exploded schematic view of the microphone and speaker combination module 10 shown in the fourth embodiment of the present application. In this embodiment, the printed circuit board 4 includes a second PCB 402 and a third PCB 403, that is, the microphone and speaker combination module 10 includes a speaker 2, a microphone 3, a signal processing unit, a second PCB 402 and a third PCB 403, wherein the signal processing The unit may include a first signal processing unit and a second signal processing unit, eg, a first signal processing chip 41 and a second signal processing chip 42 (the second signal processing chip 42 is not shown in FIG. 22 ).

The specific structure of the microphone 3 can be seen in FIG. 8. The microphone 3 is fixed on the second PCB 402 through the first PCB 401, and the signal processing unit (eg, the first signal processing chip 41) is fixed on the second PCB 402. In an implementation manner, the microphone 3 is fixed on the second PCB 402. 3 and the signal processing unit are both fixed on the second PCB 402 through the SMT process. The speaker 2 is disposed between the second PCB 402 and the third PCB 403, so that the microphone 3 and the speaker 2 are assembled and formed, that is, the microphone 3 and the speaker 2 can be independent and staggered along the sound output direction. In this embodiment, the horn 2 includes a drive system 20, a diaphragm 25 and a bracket 26, wherein:

The bracket 26 is disposed between the second PCB 402 and the third PCB 403 , and the bracket 26 plays the role of protecting the speaker 2 and supporting the diaphragm 25 . In an implementation manner, the bracket 26 can be made of materials such as iron, aluminum alloy, or ABS plastic to ensure good strength.

The diaphragm 25 is arranged on the bracket 26, and the second PCB 402 is arranged in the sound output direction of the diaphragm 25 (ie, in front of the diaphragm 25). The second PCB 402 can not only integrate the microphone 3 and the first signal processing chip 41, but also Since it is provided in front of the diaphragm 25 , it functions to protect the diaphragm 25 .

A speaker front cavity is formed between the diaphragm 25 and the second PCB 402 , the second PCB 402 is provided with a sounding hole 16 , and the speaker front cavity communicates with the microphone front cavity through the sounding hole 16 . At the same time, the sounding hole 16 can also communicate with the front cavity 15 (see FIG. 3 ).

The driving system 20 is disposed on the third PCB 403 , and the driving system 20 is used for driving the diaphragm 25 to vibrate. The driving system 20 can be a moving coil type or a piezoelectric type. Wherein, when the driving system 20 adopts the moving coil type, the driving system 20 is a magnetic circuit system (not shown in the specific structure diagram), and the voice coil (not shown in the diagram) of the diaphragm 25 is inserted into the driving system 20, and the The driving manner may be the prior art, and the specific composition of the magnetic circuit system and the setting manner of the voice coil and the second diaphragm 21 will not be described in detail here. When the driving system 20 adopts the piezoelectric type, the specific structure of the driving system 20 can be seen in FIG. 9 or FIG. 10 . The vibration of the diaphragm 21 drives the diaphragm 25 to vibrate, so as to emit sound, and the sound is emitted from the sound-emitting hole 16 provided at the center of the second PCB 402 .

The second PCB 402 and the third PCB 403 are respectively fixed on the two ends of the bracket 26, and the driving system 20 is fixed on the third PCB 403. When the driving system 20 adopts the piezoelectric type, the driving system 20 can be fixed on the third PCB 403 by the SMT process. .

In this embodiment, the microphone 3 and the loudspeaker 2 are arranged separately, wherein the two are independent and staggered along the sound output direction, so that the space utilization rate of the microphone 3 and the loudspeaker 2 can be improved.

To sum up, the microphone and speaker combination module 10 provided in the first to fourth embodiments of the present application, wherein the first and fourth embodiments show the structure in which the microphone 3 and the speaker 2 are separately arranged, and the second embodiment And Embodiment 3 shows the structural form in which the microphone 3 and the speaker 2 are integrally formed. In the present application, by integrating the speaker 2, the microphone 3 and the signal processing unit, the occupied space of the three is reduced. Since the speaker 2 is arranged in the front cavity 15, the front cavity 15 will not be squeezed, and thus the sound output channel will not be disturbed. The cross-sectional area is reduced, thus improving the high-frequency sound of the earphones.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made should be included within the protection scope of the present invention.

Claims (15)

1. A microphone and loudspeaker combination module, its characterized in that includes:

a microphone having a microphone front cavity;

the loudspeaker is provided with a loudspeaker front cavity, and the microphone front cavity is communicated with the loudspeaker front cavity;

the microphone and the loudspeaker are arranged on the printed circuit board, a signal processing unit is arranged on the printed circuit board, and the microphone and the loudspeaker are respectively and electrically connected with the signal processing unit;

the microphone and the speaker form a first integrated body, which includes:

the first bottom wall is arranged on the printed circuit board;

the first side wall is arranged on the first bottom wall and encloses a cavity;

the second side wall is arranged on the first bottom wall, is positioned inside the first side wall, and is connected with the first side wall to form a cavity;

the first vibrating diaphragm is arranged on the first side wall and the second side wall;

one end of the second vibrating diaphragm is arranged on the first side wall, and the other end of the second vibrating diaphragm is a free end;

a microphone back cavity is formed among the first bottom wall, the first side wall, the second side wall and the first vibrating diaphragm, a loudspeaker back cavity is formed among the first bottom wall, the first side wall, the second side wall and the second vibrating diaphragm, and a gap is formed between the first vibrating diaphragm and the second vibrating diaphragm;

or,

the microphone and the speaker form a second integrated body, which includes:

the second bottom wall is arranged on the printed circuit board;

the third side wall is arranged on the second bottom wall and encloses a cavity;

the fourth side wall is arranged on the second bottom wall and encloses a cavity, and the fourth side wall is positioned inside the third side wall;

the first vibrating diaphragm is arranged on the fourth side wall;

one end of the second vibrating diaphragm is arranged on the third side wall, and the other end of the second vibrating diaphragm is a free end;

a microphone rear cavity is formed among the second bottom wall, the fourth side wall and the first vibrating diaphragm, a loudspeaker rear cavity is formed among the second bottom wall, the third side wall, the fourth side wall and the second vibrating diaphragm, and a gap is formed between the first vibrating diaphragm and the second vibrating diaphragm;

the first diaphragm forms the microphone front cavity relative to the opposite side of the microphone rear cavity, and the second diaphragm forms the loudspeaker front cavity relative to the opposite side of the loudspeaker rear cavity.

2. The microphone and speaker combination module of claim 1, wherein the microphone and the speaker are integrally formed.

3. The microphone and speaker combination module of claim 1, wherein the first diaphragms are plural, and a gap is formed between two adjacent first diaphragms.

4. The microphone and speaker combination module of claim 1, wherein the second diaphragms are plural, and a gap is provided between two adjacent second diaphragms.

5. The microphone and speaker combination module of claim 1, wherein the first diaphragm is one and disposed at the center of the second integrated body.

6. The microphone and horn combination of any one of claims 1-5, wherein the microphone and the horn are each fabricated using MEMS technology.

7. The microphone and speaker combination module of any one of claims 1-5, wherein the microphone, the speaker and the signal processing unit are mounted on the printed circuit board using SMT process.

8. A microphone and horn combination module according to any one of claims 1-5, wherein the signal processing unit comprises:

the first signal processing unit is electrically connected with the microphone and the loudspeaker respectively;

and the second signal processing unit is electrically connected with the first signal processing unit.

9. The microphone and speaker combination module of claim 8, wherein the first signal processing unit comprises an ASIC chip and the second signal processing unit comprises a DSP chip.

10. A microphone and horn combination module according to any one of claims 1-5 wherein the printed circuit board is provided with a first through hole and the horn is provided with a second through hole, the first through hole communicating with the second through hole.

11. An earphone, comprising:

a first housing;

a second housing connected with the first housing;

a microphone and speaker combination module disposed between the first housing and the second housing, the microphone and speaker combination module being as claimed in any one of claims 1 to 10;

the first shell and the printed circuit board form the rear cavity of the microphone and the loudspeaker, and the second shell and the printed circuit board form the front cavity of the microphone and the loudspeaker.

12. The earphone of claim 11, wherein the second housing comprises an ear-in portion having a sound outlet aperture therein, the sound outlet aperture communicating with the front cavity, the ear-in portion having a damping mesh therein.

13. The headset of claim 12, wherein the second housing further comprises a first step portion connected to the ear-entry portion, the speaker and the microphone being disposed in an interior cavity of the first step portion;

the inner diameter of the first step portion is larger than that of the ear inlet portion.

14. The headset of claim 13, wherein the second housing further comprises a second step portion connected to the first step portion, the second step portion and the first housing being fixed;

the inner diameter of the second step part is larger than that of the first step part, a step is arranged in the second step part, and the printed circuit board is fixed on the step.

15. A terminal device comprising a microphone and speaker combination module according to any one of claims 1-10.

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