CN111370556A - LED support light source packaging structure and process thereof - Google Patents

Abstract

The invention relates to the technical field of semiconductor lighting, in particular, to an LED bracket light source packaging structure and a process thereof. It includes a circuit module on which at least one group of LED packages is distributed, and the LED package includes a protective cover, a silica gel layer, a fluorescent layer, an upper bracket, a thermally conductive glue, a connecting column, a lower bracket, a metal heat sink, and a contact electrode , conductive column, ceramic bracket, welding layer, LED chip, LED chip slot, limit column and limit hole, the metal heat dissipation plate is fixedly installed inside the lower bracket, and the upper end surface of the metal heat dissipation plate is coated with thermally conductive glue , the upper end surface of the thermally conductive adhesive is provided with a contact electrode, and the contact electrode is connected with the welding layer through a conductive column. The present invention greatly improves the thermal conductivity and anti-vibration performance of the LED bracket light source, and effectively prolongs the service life.

Description

A kind of LED bracket light source packaging structure and process thereof

technical field

The present invention relates to the technical field of semiconductor lighting, in particular to an LED bracket light source packaging structure and a process thereof.

Background technique

LED bracket, the bottom base of the LED lamp bead before packaging, on the basis of the LED bracket, the chip is fixed in, the positive and negative electrodes are welded, and then the packaging glue is used for one time packaging.

The led bracket is generally made of copper (there are also iron, aluminum and ceramics, etc.), because copper has good conductivity, there will be leads in it to connect the electrodes inside the LED lamp bead. After the LED lamp bead is packaged and formed, the lamp The bead can be removed from the bracket, and the copper feet at both ends of the lamp bead become the positive and negative poles of the lamp bead, which are used for welding to LED lamps or other LED products.

In the current LED brackets, the insufficient heat dissipation capacity often leads to damage to the LED modules and reduces the service life of the brackets. The existing LED brackets mostly use gold wires to power the chips, and the use of gold wires to connect them during transportation is prone to de-soldering due to vibration, resulting in LED modules. damage.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide an LED bracket light source packaging structure and a process thereof, so as to solve the above-mentioned problems in the background art.

In order to achieve the above purpose, on the one hand, the present invention provides an LED bracket light source package structure, including a circuit module, on which at least one group of LED packages is distributed, and the LED package includes a protective cover, a silica gel layer, a fluorescent layer, Upper bracket, thermal adhesive, connecting column, lower bracket, metal heat sink, contact electrode, conductive column, ceramic bracket, solder layer, LED chip, LED chip slot, limit column and limit hole, the metal heat sink is fixedly installed Inside the lower bracket, the upper end surface of the metal heat dissipation plate is coated with thermally conductive adhesive, and the upper end surface of the thermally conductive adhesive is provided with a contact electrode, the contact electrode is connected to the welding layer through a conductive column, and the contact electrode is connected to the conductive column. It is wrapped by a ceramic bracket, the ceramic bracket is fixedly connected to the inside of the upper bracket, the LED chip slot is opened on the upper end surface of the upper bracket, the upper end surface of the ceramic bracket is provided with a welding layer, and the LED chip passes through the welding layer. and fixed in the LED chip slot, the phosphor layer is arranged on the upper end face of the LED chip, the protective cover is installed on the upper end face of the LED chip slot, the four corners of the circuit module are fixedly connected with fixed corners, the circuit module Both ends are fixedly connected with a contact angle.

As a further improvement of the present technical solution, the limiting hole is opened on the upper end face of the lower bracket and the corresponding position of the circuit module, and the limiting hole is adapted to the limiting column.

As a further improvement of the technical solution, there are four groups of the limit posts, which are symmetrically distributed at the four corners of the lower end face of the upper bracket.

As a further improvement of this technical solution, the circuit module includes a contact electrode, a fixed piece, an insulating connector and a negative electrode plate, the contact electrode is composed of a negative electrode plate and a positive electrode plate, and the contact portion between the negative electrode plate and the positive electrode plate passes through the The insulating connectors are connected, the positive plate and the negative plate are respectively connected with at least one contact electrode, the fixing piece is inserted and connected between the positive plate and the negative plate, and the area between the positive plate and the negative plate is divided into a rectangular space, Each group of rectangular spaces is provided with a pair of contact electrodes.

As a further improvement of the technical solution, there are two groups of the contact angles, which are fixedly connected to the positive plate and the negative plate respectively.

As a further improvement of the technical solution, the metal heat sinks in each adjacent two groups of LED packages are connected by connecting posts.

As a further improvement of the technical solution, the bottom of the metal heat dissipation plate is connected with a plurality of groups of heat dissipation fins.

As a further improvement of the technical solution, the circuit module is located in the gap between the upper bracket and the lower bracket.

As a further improvement of the technical solution, the thermally conductive adhesive is specifically an insulating and thermally conductive material.

As a further improvement of the technical solution, the conductive column is cast by using precious metal gold as a raw material.

As a further improvement of the technical solution, the upper bracket and the lower bracket are composed of heat shrinkable materials.

On the other hand, the present invention provides a manufacturing method of an LED bracket light source packaging structure, including the LED bracket light source packaging structure described in any one of the above, including the following steps:

S1. The connecting column will be fixedly connected to the metal heat sink by laser welding;

S2. Sleeve the lower bracket on the outside of the metal heat sink, and spray thermally conductive glue on the upper surface of the metal heat sink;

S3. The conductive column is fixedly installed inside the ceramic bracket, and the upper bracket is sleeved on the outside of the ceramic bracket;

S4. Assemble the upper bracket, the circuit module and the lower bracket through the limit column and the limit hole, and heat and shrink the upper bracket and the lower bracket after the assembly is completed;

S5, welding the LED chip on the upper end face of the ceramic bracket through the welding layer, and the phosphor layer covers the upper end face of the LED chip;

S6. Paste the protective cover on the upper part of the LED chip slot through hot melt adhesive, and inject silicone into the gap between the protective cover and the fluorescent layer to form a silicone layer to complete the entire package.

Compared with the prior art, the beneficial effects of the present invention are as follows: the use of the ceramic bracket can effectively dissipate heat when the bracket is in use, and at the same time, the lower end surface of the ceramic bracket is provided with thermally conductive glue, which can timely introduce heat to the The metal heat dissipation plate dissipates heat, and the side end face of the metal heat dissipation plate is welded with connection posts. When the heat of a single package is too high, the connection posts can disperse the heat to the adjacent packages through the connection posts to avoid damage to the LED chip due to excessive temperature. At the same time, a conductive column is used to connect with the contact electrode, and the conductive column is fixed inside the ceramic bracket, so as to avoid the problem of chip de-soldering due to vibration.

Description of drawings

Fig. 1 is the overall structure schematic diagram in embodiment 1;

2 is a schematic cross-sectional structure diagram of the LED package in Embodiment 1;

3 is a schematic diagram of a circuit module in Embodiment 1;

4 is a schematic three-dimensional structure diagram of the LED package in Embodiment 1;

Fig. 5 is the schematic diagram at A place in embodiment 1 Fig. 3;

The meanings of the symbols in the figure are:

1. LED package; 2. Contact angle; 3. Circuit module; 4. Fixed angle; 5. Protective cover; 6. Silicone layer; 7. Fluorescent layer; 8. Upper bracket; 9. Thermal adhesive; 10. Connecting column; 11. Lower bracket; 12. Metal heat sink; 13. Contact electrode; 14. Conductive column; 15. Ceramic bracket; 16. Soldering layer; 17. LED chip; 18. LED chip slot; 19. Limiting column; 20. Limiting hole; 21, positive plate; 22, fixing piece; 23, insulating connector; 24, negative plate.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Example 1

Referring to FIGS. 1 to 5 , one of the purposes of this embodiment is to provide an LED bracket light source packaging structure, including a circuit module 3 , at least one set of LED packages 1 is distributed on the circuit module 3 , and the LED package 1 includes a protection Cover 5, silica gel layer 6, phosphor layer 7, upper bracket 8, thermally conductive glue 9, connecting column 10, lower bracket 11, metal heat sink 12, contact electrode 13, conductive column 14, ceramic bracket 15, welding layer 16, LED chip 17. The LED chip slot 18, the limit post 19 and the limit hole 20, the metal heat sink 12 is fixedly installed inside the lower bracket 11, the upper end surface of the metal heat sink 12 is coated with thermally conductive adhesive 9, There is a contact electrode 13, the contact electrode 13 is connected to the solder layer 16 through the conductive column 14, the conductive column 14 is connected to the contact electrode 13, and the conductive column 14 is fixed inside the ceramic bracket 15 to avoid the chip being de-soldered due to vibration, and the contact electrode 13 And the conductive column 14 is wrapped by the ceramic bracket 15, the use of the ceramic bracket 15 can effectively dissipate heat when the bracket is in use, the ceramic bracket 15 is fixedly connected to the inside of the upper bracket 8, and the LED chip slot 18 is opened in the upper bracket 8 The upper end face of the ceramic bracket 15 is provided with a welding layer 16, the LED chip 17 is fixed in the LED chip groove 18 through the welding layer 16, the fluorescent layer 7 is arranged on the upper end face of the LED chip 17, and the protective cover 5 is installed on the On the upper end surface of the LED chip slot 18 , the four corners of the circuit module 3 are fixedly connected with the fixed corners 4 , and the two ends of the circuit module 3 are fixedly connected with the contact corners 2 .

The limit holes 20 are opened on the upper end face of the lower bracket 11 and the corresponding position of the circuit module 3 , and the limit holes 20 are matched with the limit posts 19 . There are four groups of limit posts 19 , symmetrically distributed under the upper bracket 8 The four corners of the end face, the circuit module 3 includes the contact electrode 13, the fixing piece 22, the insulating connector 23 and the negative electrode plate 24, the contact electrode 13 is composed of the negative electrode plate 24 and the positive electrode plate 21, and the contact part between the negative electrode plate 24 and the positive electrode plate 21 is insulated. The connector 23 is connected, the positive plate 21 and the negative plate 24 are respectively connected with at least one contact electrode 13, the fixing piece 22 is inserted between the positive plate 21 and the negative plate 24, and divides the area between the positive plate 21 and the negative plate 24 A pair of contact electrodes 13 are arranged in each group of rectangular spaces. There are two groups of contact angles 2, which are fixedly connected to the positive plate 21 and the negative plate 24 respectively. The metal heat sinks 12 in each adjacent two groups of LED packages 1 Connected by the connection pillars 10, the connection pillars 10 can disperse the heat to the adjacent packages through the connection pillars 10 when the heat of a single package is too high, so as to avoid the damage of the LED chips due to excessive temperature. The bottom of the metal heat sink 12 is connected with multiple groups of The heat sink improves the heat dissipation effect. The circuit module 3 is located in the gap between the upper bracket 8 and the lower bracket 11. The thermally conductive adhesive 9 is specifically an insulating and thermally conductive material. , the conductive column 14 is cast with precious metal gold as the raw material, and the upper bracket 8 and the lower bracket 11 are composed of heat shrinkable materials.

The second purpose of this embodiment is to provide a manufacturing method of an LED bracket light source packaging structure, including any one of the above LED bracket light source packaging structures, including the following steps:

S1, the connecting column 10 and the metal heat sink 12 will be fixedly connected by laser welding;

S2. Sleeve the lower bracket 11 on the outside of the metal heat dissipation plate 12, and spray the thermally conductive adhesive 9 on the upper surface of the metal heat dissipation plate 12;

S3, the conductive column 14 is fixedly installed inside the ceramic support 15, and the upper support 8 is sleeved outside the ceramic support 15 at the same time;

S4, assemble the upper bracket 8, the circuit module 3 and the lower bracket 11 through the limit post 19 and the limit hole 20, and heat and shrink the upper bracket 8 and the lower bracket 11 after the assembly is completed;

S5, welding the LED chip 17 on the upper end face of the ceramic bracket 15 through the welding layer 16, and the phosphor layer 7 covers the upper end face of the LED chip 17;

S6, paste the protective cover 5 on the upper part of the LED chip groove 18 by hot melt adhesive, and inject silica gel into the gap between the protective cover 5 and the fluorescent layer 7 to form a silica gel layer 6, and complete the whole package.

The foregoing has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above-mentioned embodiments, and the above-mentioned embodiments and descriptions are only preferred examples of the present invention, and are not intended to limit the present invention, without departing from the spirit and scope of the present invention. Under the premise, the present invention will also have various changes and improvements, and these changes and improvements all fall within the scope of the claimed invention. The claimed scope of the present invention is defined by the appended claims and their equivalents.

Claims (12)

1. The utility model provides a LED support light source packaging structure, includes circuit module (3), its characterized in that: the LED packaging structure is characterized in that at least one group of LED packages (1) are distributed on the circuit module (3), each LED package (1) comprises a protective cover (5), a silica gel layer (6), a fluorescent layer (7), an upper layer support (8), heat-conducting glue (9), a connecting column (10), a lower layer support (11), a metal heat-radiating plate (12), a contact electrode (13), a conductive column (14), a ceramic support (15), a welding layer (16), an LED chip (17), an LED chip groove (18), a limiting column (19) and a limiting hole (20), the metal heat-radiating plate (12) is fixedly arranged inside the lower layer support (11), the upper end face of the metal heat-radiating plate (12) is coated with the heat-conducting glue (9), the upper end face of the heat-conducting glue (9) is provided with the contact electrode (13), the contact electrode (13) is connected with the welding layer (16) through the conductive column (14), and the contact electrode (13) and the conductive column, ceramic support (15) fixed connection is in upper support (8), the up end at upper support (8) is seted up in LED chip groove (18), the up end of ceramic support (15) is equipped with welding layer (16), LED chip (17) pass through welding layer (16) and fix in LED chip groove (18), fluorescent layer (7) set up the up end at LED chip (17), the up end at LED chip groove (18) is installed in protection casing (5), the fixed angle of four corners fixedly connected with (4) of circuit module (3), the both ends fixedly connected with contact angle (2) of circuit module (3).

2. The LED bracket light source package structure of claim 1, wherein: the limiting hole (20) is formed in the upper end face of the lower layer support (11) and the corresponding position of the circuit module (3), and the limiting hole (20) is matched with the limiting column (19).

3. The LED bracket light source package structure of claim 1, wherein: the limiting columns (19) are four groups in total and are symmetrically distributed at four corners of the lower end face of the upper layer support (8).

4. The LED bracket light source package structure of claim 1, wherein: the circuit module (3) comprises a contact electrode (13), a fixing piece (22), an insulating connecting piece (23) and a negative plate (24), wherein the contact electrode (13) is composed of the negative plate (24) and the positive plate (21), the contact part between the negative plate (24) and the positive plate (21) is connected with the insulating connecting piece (23), the positive plate (21) and the negative plate (24) are respectively at least connected with one contact electrode (13), the fixing piece (22) is connected between the positive plate (21) and the negative plate (24) in a penetrating manner, the area between the positive plate (21) and the negative plate (24) is divided into rectangular spaces, and a pair of contact electrodes (13) is arranged in each rectangular space.

5. The LED bracket light source package structure of claim 1, wherein: the contact angles (2) are divided into two groups, and the two groups are fixedly connected with the positive plate (21) and the negative plate (24) respectively.

6. The LED bracket light source package structure of claim 1, wherein: the metal heat dissipation plates (12) in each two adjacent groups of LED packages (1) are connected through the connecting columns (10).

7. The LED bracket light source package structure of claim 1, wherein: the bottom of the metal heat dissipation plate (12) is connected with a plurality of groups of heat dissipation fins.

8. The LED bracket light source package structure of claim 1, wherein: the circuit module (3) is located in a gap between the upper layer support (8) and the lower layer support (11).

9. The LED bracket light source package structure of claim 1, wherein: the heat conducting glue (9) is specifically an insulating heat conducting material.

10. The LED bracket light source package structure of claim 1, wherein: the conductive posts (14) are cast by taking precious metal gold as a raw material.

11. The LED bracket light source package structure of claim 1, wherein: the upper layer support (8) and the lower layer support (11) are made of heat-shrinkable materials.

12. A manufacturing method of an LED support light source package structure, comprising the LED support light source package structure of any one of claims 1 to 11, wherein: the method comprises the following steps:

s1, fixedly connecting the connecting column (10) with the metal heat dissipation plate (12) through laser welding;

s2, sleeving the lower layer support (11) outside the metal heat dissipation plate (12), and spraying heat-conducting glue (9) on the upper surface of the metal heat dissipation plate (12);

s3, fixedly installing the conductive posts (14) in the ceramic support (15), and sleeving the upper layer support (8) outside the ceramic support (15);

s4, assembling the upper bracket (8), the circuit module (3) and the lower bracket (11) through the limiting columns (19) and the limiting holes (20), and heating and shrinking the upper bracket (8) and the lower bracket (11) after the assembly is finished;

s5, welding the LED chip (17) on the upper end face of the ceramic support (15) through a welding layer (16), wherein the fluorescent layer (7) covers the upper end face of the LED chip (17);

s6, adhering the protective cover (5) to the upper part of the LED chip groove (18) through hot melt adhesive, and injecting silica gel into the gap between the protective cover (5) and the fluorescent layer (7) to form a silica gel layer (6) to complete the whole encapsulation.

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