CN110676364B - A blue light waveguide surface luminous structure with light emitting from four sides - Google Patents
A blue light waveguide surface luminous structure with light emitting from four sides Download PDFInfo
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- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
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- H—ELECTRICITY
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Abstract
本发明涉及一种四面出光蓝光波导面发光结构，其包括基板、四面出光封装形式的LED光源、高折射率蓝光波导层、扩散膜层和荧光粉层，所述基板上设置有若干四面出光封装形式的LED光源，在基板上还设置有覆盖四面出光封装形式的LED光源的高折射率蓝光波导层，且高折射率蓝光波导层的高度高于四面出光封装形式的LED光源的高度，所述高折射率蓝光波导层上自下而上依次设置扩散膜层和荧光粉层。本发明的优点在于：本发明四面出光蓝光波导面发光结构能够减少光在介质传播过程中衰减，提高混光效果且保证出光亮度均匀。
The present invention relates to a four-sided light-emitting blue light waveguide surface luminous structure, which comprises a substrate, an LED light source in a four-sided light-emitting package form, a high-refractive-index blue light waveguide layer, a diffusion film layer and a phosphor layer, wherein a plurality of LED light sources in a four-sided light-emitting package form are arranged on the substrate, and a high-refractive-index blue light waveguide layer covering the LED light sources in a four-sided light-emitting package form is also arranged on the substrate, and the height of the high-refractive-index blue light waveguide layer is higher than the height of the LED light source in a four-sided light-emitting package form, and a diffusion film layer and a phosphor layer are sequentially arranged on the high-refractive-index blue light waveguide layer from bottom to top. The advantages of the present invention are: the four-sided light-emitting blue light waveguide surface luminous structure of the present invention can reduce the attenuation of light during medium propagation, improve the light mixing effect and ensure uniform light output brightness.
Description
Technical Field
The invention belongs to the technical field of semiconductors, and particularly relates to a four-side light-emitting blue light guide surface light-emitting structure.
Background
In recent years, in surface light sources used in backlight display and lighting industries, surface light emitting modules (HLU: HACK LIGHT Unit) are classified into a direct type and a side entry type. The lateral entrance type scheme is thinner in overall thickness, and the number of light sources is small, so that the lateral entrance type structure is adopted by the current vast majority of surface light sources, but the lateral entrance type structure needs to adopt a light guide plate, so that the cost is high, the light conversion efficiency is lower than that of the direct type, regional extinction (Local Dimming) cannot be realized in the display field, and further High Dynamic Range (HDR) cannot be realized, and the HDR is generally 3000:1, the application is greatly limited.
In the direct type surface light source, an LED array is arranged at the bottom of a surface light emitting module, light emitted from an LED is reflected by the bottom surface and the side surface, and then is uniformly emitted through a diffusion plate and an optical module on the surface. The direct type surface light source has the advantages of simple process, reduction of light guide plates, high light conversion efficiency and low cost, and occupies a certain middle-low end market in the field of illumination and display; at present, in order to obtain a display effect with more vivid colors, a High Dynamic Range (HDR), which is a ratio of luminance differences actually existing in reality (i.e., a ratio of brightest object luminance to darkest object luminance), is required, because the HDR can reach 20000:1, therefore, are increasingly gaining attention in area light source applications in the backlight display and lighting industries.
At present, the traditional direct type surface light emitting module mainly comprises 3 modes:
(1) A light source array consisting of conventional LED light sources is adopted, a diffusion plate is arranged above the LED light source array at a certain distance, and a point light source is changed into a surface light source by using the diffusion plate;
(2) A light source array formed by conventional LED light sources is adopted, lenses are closely attached to the LED light sources, light emitted by LED lamp beads is conducted through an air layer between the lenses and a diffusion plate after passing through the lenses, light intensity is overlapped to a certain extent, and then the light source is irradiated onto the diffusion plate, so that a point light source is changed into a surface light source;
(3) And an LED chip array is adopted, and silica gel and fluorescent powder are directly coated on the surface of the LED chip array to form a light guide medium layer, so that a point light source is converted into a surface light source.
The above approaches all have certain drawbacks or limitations:
(1) For the first approach: as shown in fig. 1 and 2, the maximum light emitting angle of the conventional LED light source reaches about 120 °, and a relatively large distance is required between the LED light source 91 and the diffusion plate 92 to achieve a relatively uniform light mixing effect, so that the entire light emitting module is generally thick and can only be applied to lighting industries, such as panel lamps, and the application is very limited.
(2) For the second approach: as shown in fig. 3 and 4, the light emitting angle of the LED light source 91 after the lens 3 is superimposed can reach 135 °, although the light emitting angle is increased, the light emitting from the top surface is greatly reduced, and a more uniform light mixing effect can be achieved in a relatively shorter distance, and since the secondary optical lens is required to be used, the diffusion plate 92 and the secondary optical lens 93 must be spaced apart by a certain distance, and although the thickness is reduced compared with the first mode, the light emitting module cannot achieve an ultrathin effect.
(3) For the third mode, as shown in fig. 6, a fluorescent powder layer 94 is coated on the surface of a light source array formed by a plurality of LED chips 91', so that the lateral propagation and light mixing of white light are slightly increased; however, from optical theory, it is found that when blue light is transmitted through a waveguide containing a phosphor, the intensity of blue light as excitation light is rapidly reduced due to absorption and irregular scattering of the phosphor. As shown in fig. 7, taking a point light source as an example, when the light intensity is transmitted in a waveguide containing fluorescent powder, the intensity is inversely proportional to the cube of the distance in value; as shown in fig. 8, the intensity of the linear light source, when transmitted in a waveguide containing phosphor, is inversely proportional in value to the square of the distance; as shown in fig. 9, the intensity of the surface light source is inversely proportional in value to the distance when the light intensity is transmitted in the waveguide containing the phosphor.
In summary, the first and second surface light sources are not only easy to form dark areas and poor in light mixing uniformity due to the limitation of the light emitting angles of the LED light sources, but also thicker in the whole direct type surface light emitting module, and if the thickness of the whole surface light emitting module is reduced, the reduction of the distance between the adjacent LED light sources can be achieved (see fig. 5), but the required increase of the LED light sources is doubled, and the cost is greatly increased.
The surface light source adopting the third mode solves the problem of the thickness of the module, but the attenuation of the white light obtained by mixing the blue light excited fluorescent powder in the propagation process of the light guide medium is serious, and the blue light excited fluorescent powder is attenuated, so that the intensity of the blue light is reduced, and the transverse propagation intensity along the waveguide direction is reduced; the brightness of the chip is uneven, the light mixing effect is poor, and the brightness of the whole surface of the surface light source is also uneven.
Disclosure of Invention
The technical problem to be solved by the invention is to provide the four-side light-emitting blue light guide surface light-emitting structure which can reduce the thickness of the direct type surface light-emitting module, has uniform brightness and good light mixing effect.
In order to solve the technical problems, the technical scheme of the invention is as follows: the utility model provides a four sides light-emitting blue light guide face luminous structure which characterized in that: the LED light source comprises a substrate, an LED light source in a four-side light emitting package form and a high-refractive-index blue light waveguide layer;
the LED light source is a chip with a reflecting layer on the top surface for forming four-side light emission, a high-refractive-index blue light waveguide layer which covers all the LED light sources is arranged on the substrate, and the height of the high-refractive-index blue light waveguide layer is equal to or higher than the height of the top surface of the LED light source;
The high refractive index blue optical waveguide layer simultaneously satisfies the following conditions:
(1) The high-refractive-index blue light waveguide layer is a single medium and uniformly distributed medium layer;
(2) Defining one surface of the high-refractive-index blue optical waveguide layer, which is far away from the substrate, as an upper waveguide interface, and defining one side medium, which is far away from the substrate, of the two sides of the upper waveguide interface, as an outer medium layer, wherein the refractive index of the high-refractive-index blue optical waveguide layer is denoted as n 2, and the refractive index of the outer medium layer is denoted as n 3,n2＞n3;
(3) The other surface of the high refractive index blue optical waveguide layer, which is close to the substrate, is defined as a lower waveguide interface, and a waveguide reflection layer is arranged between the lower waveguide interface and the substrate.
Further, a diffusion film layer and a fluorescent powder layer are sequentially arranged above the upper waveguide interface of the high-refractive-index blue optical waveguide layer from bottom to top, and an air layer or an air gap is formed between the diffusion film layer and the high-refractive-index blue optical waveguide layer and is used as an outer medium layer.
Further, when an air gap exists between the diffusion film and the high-refractive-index blue light waveguide layer, the lower surface of the diffusion film layer is provided with an uneven microstructure, and the microstructure accounts for 10-100% of the total area of the diffusion film layer; and the microstructure on the lower surface of the diffusion film layer is tightly attached to the upper waveguide interface of the high-refractive-index blue optical waveguide layer to form an air gap.
Further, an upper diffusion film layer is further arranged on the fluorescent powder layer.
Further, the four-side light-emitting packaging type LED light source comprises an LED chip body and a reflecting layer covering the top surface of the LED chip body.
Further, the LED light source in the four-side light-emitting packaging mode comprises an LED chip body, wherein transparent layers are arranged on the top surface and the side surface of the LED chip body, and reflecting layers are arranged on the top surface of the transparent layers.
Further, the thickness of the side surface of the transparent layer is denoted as a, the height of the transparent layer is denoted as h, the refractive index of the transparent layer is denoted as n 1, the refractive index of the high refractive index blue optical waveguide layer is denoted as n 2, the refractive index of the outer medium layer is denoted as n 3, and in order to realize total reflection of light, the requirements are as follows
Further, the LED light source in the four-side light-emitting packaging mode comprises an LED chip body, a transparent layer is arranged on the top surface of the LED chip body, and a reflecting layer is arranged on the top surface of the transparent layer.
Further, a middle reflecting layer is arranged between the top surface of the LED chip body and the transparent layer, and the middle reflecting layer is a total reflecting layer or a partial reflecting layer.
Further, the medium refractive index of the transparent layer is higher than or equal to the refractive index of the high refractive index blue optical waveguide layer.
Further, the upper surface of the substrate or the lower surface of the high refractive index blue optical waveguide layer is provided with a micro-structure optical scattering layer, or the upper surface of the high refractive index blue optical waveguide layer is provided with a micro-structure optical scattering layer.
Furthermore, the high refractive index blue light waveguide layer is manufactured by adopting modes of mould pressing, dispensing, spraying or material growth.
Further, the fluorescent powder layer is formed on the diffusion film layer in a coating, mould pressing or growing mode and is integrated with the diffusion film layer, or is a single sheet fluorescent powder layer or a fluorescent powder layer formed by taking a transparent film as a supporting substrate.
The invention has the advantages that:
Compared with the traditional side-in type light guide technology, the LED light source is in a four-side light-emitting packaging mode, and meanwhile, the LED light sources are uniformly distributed in the high-refractive-index blue light waveguide layer in an array mode, so that the light distribution is more uniform;
because the LED light sources are directly arranged in the high-refractive-index blue light waveguide layer, each LED light source emits light in the high-refractive-index blue light waveguide layer to form light transmission and coupling, and the traditional side-entry light guide technology is characterized in that the LED light sources are incident on two sides of the light guide plate and then transversely spread, and the light sources are completely separated from the light guide plate;
in terms of application, for example, in the process of manufacturing the lamp, the conventional side-entry type light source needs to be additionally attached to the side surface of the light guide plate, and the light source manufacturer is separated from the lamp manufacturer; by adopting the structure of the invention, the light guide layer and the light source are directly attached and combined in the production process, and lamp manufacturers do not need secondary attachment, thus greatly simplifying the production process of the lamp.
The chip can smoothly realize local light emission and local extinction by independently controlling external electrical connection, and display with High Dynamic Range (HDR) is achieved compared with a side-entry light guide technology.
In addition, a diffusion film layer is arranged above the high-refractive-index blue light waveguide layer, and a gap exists by utilizing the microstructure on the surface of the diffusion film layer, namely an air gap occupying most area in the area of the diffusion film layer is used as a low-refractive-index layer, or an air layer is directly formed between the diffusion film layer and the high-refractive-index blue light waveguide layer, and then a fluorescent powder layer is arranged above the diffusion film layer. The blue light emitted by the LED light source forms a waveguide in the high-refractive-index blue light waveguide layer, the refraction and scattering of fluorescent powder particles in a conventional structure on light can be reduced through the high-refractive-index blue light waveguide layer, meanwhile, in a single medium, the attenuation of the blue light can be greatly reduced, meanwhile, the waveguide effect of the light can enable a point light source to convert to a surface light source, the transverse propagation of the blue light is increased, meanwhile, uniform light intensity distribution can be obtained in the low-refractive-index layer, and finally white light is formed through fluorescence excitation after the surface light source is formed.
Drawings
The invention will be described in further detail with reference to the drawings and the detailed description.
Fig. 1 is a graph showing the light emission angle test of a conventional LED light source.
Fig. 2 is a schematic diagram of light intensity superposition in the first mode of the conventional direct type surface light emitting module.
Fig. 3 is a graph showing the light emission angle test of a conventional LED light source with a lens.
Fig. 4 is a schematic diagram of light intensity superposition using LED light source and lens in a conventional direct type surface light emitting module.
Fig. 5 is a schematic diagram of another light intensity superposition method using tightly arranged LED light sources and lenses in a conventional direct type surface light emitting module.
Fig. 6 is a schematic diagram of a conventional direct type surface light emitting module using an LED light source array and phosphor.
FIG. 7 is a graph showing the loss of light intensity from a point source containing a phosphor waveguide.
FIG. 8 is a graph showing the loss of light intensity from a linear light source with a phosphor-containing waveguide.
Fig. 9 is a schematic diagram of the loss of light intensity from a surface light source with a phosphor waveguide.
Fig. 10 is a schematic view of a first embodiment of a four-sided light-emitting blue light guide surface light-emitting structure according to the present invention.
Fig. 11 is a schematic view of an LED light source according to a first embodiment of the present invention.
Fig. 12 is a schematic view showing a second embodiment of the four-side light-emitting blue light guide surface light-emitting structure of the present invention.
Fig. 13 is a schematic view of an LED light source structure according to a second embodiment of the present invention.
Fig. 14 is a light-emitting angle test chart of an LED light source according to a second embodiment of the present invention.
Fig. 15 to 17 are schematic views of another three structures of an LED light source according to a second embodiment of the present invention.
Fig. 18 is a partial view of fig. 12.
Fig. 19 is a schematic view showing a third embodiment of the four-side light-emitting blue light guide surface light-emitting structure of the present invention.
Detailed Description
The following examples will provide those skilled in the art with a more complete understanding of the present invention and are not intended to limit the invention to the embodiments described.
Example 1
The four-side light-emitting blue light guide surface light-emitting structure of the present embodiment includes, as shown in fig. 10, a substrate 1, an LED light source 2 in a four-side light-emitting package form, a high refractive index blue light guide layer 3, a diffusion film layer 4, and a phosphor layer 5.
A plurality of LED light sources 2 in a four-side light emitting packaging mode are arranged on the substrate 1, the LED light sources 2 are blue light chips with reflection layers on the top surfaces to form four-side light emitting, a high-refractive-index blue light waveguide layer 3 which covers all the LED light sources 2 is arranged on the substrate 1, the height of the high-refractive-index blue light waveguide layer 3 is equal to or higher than the height of the top surface of the LED light sources 2, and a diffusion film layer 4 and a fluorescent powder layer 5 are sequentially arranged on the high-refractive-index blue light waveguide layer 3 from bottom to top. An upper diffusion film layer 6 is also provided on the phosphor layer 5. Of course, the blue light chip may be a violet light chip, and the violet light is utilized to excite the fluorescent powder in the fluorescent powder layer 5 to form white light.
The high refractive index blue optical waveguide layer 3 is a transparent layer which does not contain a single medium of fluorescent powder and has uniformly distributed medium, and one surface of the high refractive index blue optical waveguide layer 3 far away from the substrate 1 is defined as an upper waveguide interface, and in the embodiment, the upper waveguide interface is the upper surface of the high refractive index blue optical waveguide layer 3; the medium at one side of the two sides of the upper waveguide interface, which is far away from the substrate, is an outer medium layer, namely the medium above the upper surface of the high refractive index blue optical waveguide layer 3 is an outer medium layer;
the refractive index of the high refractive index blue waveguide layer is denoted as n 2, and the refractive index of the outer medium layer is denoted as n 3,n2＞n3;
In this embodiment, the lower surface of the diffusion film layer 4 has a rugged microstructure, and the microstructure accounts for 10-100% of the total area of the diffusion film layer 4, and the rugged microstructure is formed by coating organic diffusion particles and an adhesive on the diffusion film layer 4, or the surface of the diffusion film layer 4 is changed into an irregular surface structure by rolling or the like. The cavities are formed by the minute gaps of these rugged or irregular surfaces. When the microstructure of the lower surface of the diffusion film layer 4 is attached to the upper surface of the upper waveguide interface of the high refractive index blue optical waveguide layer 3, an air gap is formed, and the air gap serves as an outer medium layer.
Further, the other surface of the high refractive index blue optical waveguide layer 3 near the substrate 1 is defined as a lower waveguide interface, which in this embodiment is the lower surface of the high refractive index blue optical waveguide layer 3; a waveguide reflective layer 7 is provided between the lower waveguide interface and the substrate 1.
In this embodiment, as shown in fig. 11, the LED light source 2 in the form of a four-sided light emitting package includes an LED chip body 21 and a reflective layer 22 covering the top surface of the chip body 21, and the area of the reflective layer 22 is equal to the area of the top surface of the LED chip body 21. The reflective layer 22 may be a DBR distributed bragg mirror or a metal reflective layer.
In order to improve the uneven light intensity and enhance the light mixing effect, a microstructure optical scattering layer may be disposed on the upper surface of the substrate 1 or the lower surface of the high refractive index blue optical waveguide layer 3, or a microstructure optical scattering layer may be disposed on the upper surface of the high refractive index blue optical waveguide layer 3, depending on the situation. The microstructured optical scattering layer is typically arranged in a dark region of the LED light sources 2 distributed in an array.
The high refractive index blue optical waveguide layer 3 is manufactured by adopting the modes of mould pressing, dispensing, spraying or material growth. In this embodiment, the material is transparent high refractive index material such as silica gel, acryl material, PC, PS, etc.
And the fluorescent powder layer 5 is formed on the diffusion film layer 4 in a coating, mould pressing or growing way and is integrated with the diffusion film, or is a single sheet fluorescent powder layer or a fluorescent powder layer formed by taking a specific transparent film as a supporting substrate.
In the invention, the high refractive index blue light waveguide layer 3 does not contain fluorescent powder, white light emitted by the backlight module is formed by mixing blue light excited fluorescent powder layers emitted by the blue light chip, and the white light is formed by all fluorescent powder in the blue light excited fluorescent powder layers 5.
The product of the embodiment can be applied to ultrathin displays, panel lamps (with frames and without frames), bulb lamps, filament lamps, fluorescent lamps and street lamps.
Example 2
The structure of this embodiment is basically the same as that of embodiment 1, and as shown in fig. 12, each includes a substrate 1, an LED light source 2 in a four-side light emitting package form, a high refractive index blue light waveguide layer 3, a diffusion film layer 4, a phosphor layer 5, and an upper diffusion film layer 6. A plurality of LED light sources 2 are provided on the substrate 1, and a high refractive index blue light waveguide layer 3 covering all the LED light sources 2 and the upper reflection layer thereof is provided on the substrate 1. The high refractive index blue optical waveguide layer simultaneously satisfies the following conditions: the high refractive index blue optical waveguide layer 3 is a single medium and uniformly distributed medium layer; defining one surface of the high-refractive-index blue optical waveguide layer 3 far away from the substrate 1 as an upper waveguide interface, and defining one side medium, which is located far away from the substrate 1, of the two sides of the upper waveguide interface as an outer medium layer, wherein the refractive index of the high-refractive-index blue optical waveguide layer 3 is denoted as n 2, and the refractive index of the outer medium layer is denoted as n 3,n2＞n3; the other surface of the high refractive index blue optical waveguide layer 3, which is close to the substrate 1, is defined as a lower waveguide interface, and a waveguide reflection layer 7 is provided between the lower waveguide interface and the substrate 1.
A diffusion film layer 4 and a fluorescent powder layer 5 are sequentially arranged on the high refractive index blue light waveguide layer 3 from bottom to top. An upper diffusion film layer 6 is optionally further provided on the phosphor layer 5. Similarly, an air gap is present between the diffusion film layer 4 and the high refractive index blue optical waveguide layer 3, and this air gap serves as an outer medium layer.
The difference is that: as shown in fig. 13 and 18, the LED light source includes an LED chip body 21, a transparent layer 23 is provided on the top surface and the side surface of the LED chip body 21, and a reflective layer 22 is provided on the top surface of the transparent layer 23. The dielectric refractive index of the transparent layer 23 is higher than or equal to the refractive index of the high refractive index blue optical waveguide layer 3.
The thickness of the side surface of the transparent layer 23 is denoted as a, the height of the transparent layer 23 is denoted as h, the refractive index of the transparent layer 23 is denoted as n 1, the refractive index of the high refractive index blue optical waveguide layer 3 is denoted as n 2, the refractive index of the outer medium layer is denoted as n 3, and in order to achieve total reflection of light, the requirements are satisfied
Taking an LED light source in a four-side light-emitting package form using a semi-transparent semi-reflective top surface reflection structure as an example, as shown in fig. 14, the structure successfully converts the main energy angle of the main light emitting direction of the LED light source in a normal lambertian structure from 0 ° directly above to plus or minus 60 ° around. Secondly, the luminous intensity of the light source is successfully and uniformly distributed in the whole luminous angle from the light intensity distribution, and the luminous intensity of the light source is about 73% of the light intensity peak value even under the large-angle range of plus or minus 85 degrees. Whereas in a LED light source of a normal lambertian structure its light output angle is 120 °, i.e. its light output intensity is only half of the peak value when it is at plus or minus 60 ° (see fig. 1). In the LED light source structure adopting the semi-transparent semi-reflective top surface reflecting structure, the light intensity is 73% of the light intensity peak value even in a large angle range of plus or minus 85 degrees.
Of course, as shown in fig. 15, the transparent layer 23 in the present embodiment may be disposed only on the top surface of the LED chip body 22, and the reflective layer 22 may be disposed on the transparent layer 23.
As an example, as shown in fig. 16 and 17, a middle reflective layer 24 is further provided between the top surface of the LED chip body 21 and the transparent layer 23, and the middle reflective layer 24 is a total reflection layer or a partial reflection layer.
The four-side light-emitting blue light guide surface light-emitting structure of the embodiment is prepared by the following steps:
firstly, manufacturing an LED light source in a four-side light emitting packaging mode:
Step S1, selecting a qualified LED chip body 21, wherein the LED chip body 21 is provided with a lower reflecting layer, a P-GaN layer, a luminous layer, an N-GaN layer and a substrate from bottom to top in sequence;
Step S2, arranging a plurality of LED chip bodies 21 at equal intervals so that a fillable gap is formed between the adjacent LED chip bodies 21, and then arranging a transparent layer 23 on the upper surface of the whole LED chip body 21 and in the fillable gap;
Step S3, baking and semi-curing the semi-finished product obtained in the step S2, and then arranging a reflecting layer 22 on the top surface of the transparent layer 23;
Step S4: the whole wafer subjected to the step S3 is baked and solidified, then is cut and split, and after the split, the chip is tested, sorted and rearranged to obtain the LED light source2 with the transparent layer 23 and the reflecting layer 22, so as to form the LED light source2 in a four-side light-emitting packaging mode;
then, a four-side light-emitting blue light guide surface light-emitting structure is manufactured:
Step S5: selecting an integral substrate 1, and selecting whether to plate a reflecting layer on the surface of one side of the substrate 1 to be subjected to die bonding according to actual requirements, and integrally bonding the die on the substrate, namely attaching an LED light source 2 in a four-side light emitting packaging form on the substrate 1;
Step S6: arranging the continuous substrate 1 in the step S5 on a reusable mold or a backlight plate, integrally coating a high-refraction transparent material such as silica gel or acrylic material on the whole backlight plate, so that the high-refraction transparent material covers the whole surface of the continuous substrate 1, and finally integrally molding to form a high-refraction blue light waveguide layer 3 covering the LED light source 2 in a four-side light-emitting package form;
Step S7: and a diffusion film layer 4 and a fluorescent powder layer 5 are sequentially arranged on the upper surface of the high-refractive-index blue light waveguide layer 3, so that a four-side light-emitting blue light guide surface light-emitting structure is formed, and finally the four-side light-emitting blue light guide surface light-emitting structure is peeled off from the backlight plate.
The substrate 1 used in the four-sided light-emitting blue light guide-surface light-emitting structure of the above-described embodiments 1-2 may be a flexible or rigid, transparent or non-transparent substrate. The substrate 1 may be a whole plate, or a discontinuous substrate may be adopted, that is, the substrate 1 is composed of a plurality of strip-shaped substrates arranged at intervals, and one or both ends of the strip-shaped substrates are connected by electrode plates.
The method for manufacturing the four-side light-emitting blue light guide surface light-emitting structure by adopting the strip-shaped substrate comprises the following specific steps:
Step S5: selecting an integral substrate 1, selecting whether a reflecting layer is plated on the surface of one side of the substrate 1 to be subjected to die bonding according to actual requirements, and integrally die bonding the substrate, namely attaching an LED light source 2 in a four-side light emitting packaging form on the substrate 1, then cutting to form strip-shaped substrates with the width of 0.2-3mm, wherein one end or two ends of each strip-shaped substrate are connected through electrode plates or electrode devices to form an integral structure;
Step S6: placing the integral structure in the step S5 on a reusable mold or a backlight plate, integrally coating a high-refraction transparent material such as silica gel or acrylic material on the whole backlight plate to enable the high-refraction transparent material to cover the whole strip substrate surface and the area between the adjacent strip substrates, and finally integrally molding to form a high-refraction blue light waveguide layer 3 covering the LED light source 2 in a four-side light-emitting packaging mode;
Step S7: and a diffusion film layer 4 and a fluorescent powder layer 5 are sequentially arranged on the upper surface of the high-refractive-index blue light waveguide layer 3, so that a four-side light-emitting blue light guide surface light-emitting structure is formed, and finally the four-side light-emitting blue light guide surface light-emitting structure is peeled off from the backlight plate.
The parameters of the backlight module manufactured by the method in this embodiment 2 are compared with those of the conventional direct type backlight module as follows:
6 inch mobile phone backlight application case
Conclusion: it can be seen from the above table that, in this embodiment, the main light emitting energy direction is shifted from directly above to the side by using the large-angle four-side light emitting light source under the premise that the light emitting area is the same and the thickness of the backlight module is the same, and meanwhile, the light emitting angle is as high as 170 ° or more, so that the distance between adjacent light sources is effectively increased and the number of light source particles is greatly reduced under the premise of ensuring the same light mixing effect.
Example 3
The structure of this embodiment is substantially the same as that of embodiment 1, and as shown in fig. 19, the structure includes a substrate 1, an LED light source 2 in the form of a four-sided light emitting package, a high refractive index blue light waveguide layer 3, a diffusion film layer 4, a phosphor layer 5, and an upper diffusion film layer 6. A plurality of LED light sources 2 are arranged on a substrate 1, a high refractive index blue light waveguide layer 3 which covers all the LED light sources 2 and the upper reflection layer thereof is arranged on the substrate 1, and a diffusion film layer 4 and a fluorescent powder layer 5 are sequentially arranged on the high refractive index blue light waveguide layer 3 from bottom to top. An upper diffusion film layer 6 is also provided on the phosphor layer 5.
In this embodiment, the high refractive index blue optical waveguide layer 3 is also a single medium transparent layer containing no phosphor, except that: defining one surface of the high refractive index blue optical waveguide layer 3 away from the substrate 1 as an upper waveguide interface, providing an air layer 8 between the upper waveguide interface and the diffusion film layer 4, the air layer 8 being an outer medium layer, the refractive index of the outer medium layer being denoted as n 3, the refractive index of the high refractive index blue optical waveguide layer 3 being denoted as n 2, and n 2＞n3; the other surface of the high refractive index blue optical waveguide layer 3, which is close to the substrate 1, is defined as a lower waveguide interface, and a waveguide reflection layer 7 is provided between the lower waveguide interface and the substrate 1.
In this embodiment, as shown in fig. 11, the LED light source 2 in the form of a four-sided light emitting package includes an LED chip body 21 and a reflective layer 22 covering the top surface of the chip body 21, and the area of the reflective layer 22 is equal to the area of the top surface of the LED chip body 21. The reflective layer 22 may be a DHR distributed bragg mirror or a metallic reflective layer.
The LED light source in the four-side light emitting package form may also be in the form as shown in fig. 13, and the LED light source includes an LED chip body 21, a transparent layer 23 is disposed on the top surface and the side surface of the LED chip body 21, and a reflective layer 22 is disposed on the top surface of the transparent layer 23. The dielectric refractive index of the transparent layer 23 is higher than or equal to the refractive index of the high refractive index blue optical waveguide layer 3.
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| CN2018212449636 | 2018-08-03 | ||
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| CN2018110760343 | 2018-09-14 | ||
| CN201811330817 | 2018-11-09 | ||
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| CN113707036A (en) * | 2020-05-22 | 2021-11-26 | 北京芯海视界三维科技有限公司 | Light-emitting module, display screen and display |
| CN112331642A (en) * | 2020-11-12 | 2021-02-05 | 江西兆驰光元科技股份有限公司 | LED backlight module with large light-emitting angle and display device |
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| CN104321694A (en) * | 2009-08-27 | 2015-01-28 | Lg电子株式会社 | Backlight unit and display device |
| KR20170019551A (en) * | 2015-08-11 | 2017-02-22 | 엘지디스플레이 주식회사 | Light-Emitting Package and Backlight Unit having the same |
| CN209434225U (en) * | 2018-09-14 | 2019-09-24 | 海迪科（南通）光电科技有限公司 | A kind of four sides goes out light blue light waveguide surface luminescence structure |
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| US8568012B2 (en) * | 2010-01-18 | 2013-10-29 | Lg Innotek Co., Ltd. | Lighting unit and display device having the same |
| KR20150066186A (en) * | 2013-12-06 | 2015-06-16 | 서울반도체 주식회사 | Light emitting device and backlight unit having the same |
| CN105895787B (en) * | 2016-06-06 | 2019-02-19 | 青岛海信电器股份有限公司 | LED, LED packaging method, direct type backlight module and LCD TV |
| CN107608134B (en) * | 2017-09-27 | 2019-07-12 | 京东方科技集团股份有限公司 | Light guide structure, direct type backlight module and display panel |
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| CN104321694A (en) * | 2009-08-27 | 2015-01-28 | Lg电子株式会社 | Backlight unit and display device |
| KR20170019551A (en) * | 2015-08-11 | 2017-02-22 | 엘지디스플레이 주식회사 | Light-Emitting Package and Backlight Unit having the same |
| CN209434225U (en) * | 2018-09-14 | 2019-09-24 | 海迪科（南通）光电科技有限公司 | A kind of four sides goes out light blue light waveguide surface luminescence structure |
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