CN117165189A - Debondable anisotropic conductive adhesive, component bonded by using the same and debonding method of the component - Google Patents
Debondable anisotropic conductive adhesive, component bonded by using the same and debonding method of the component Download PDFInfo
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- CN117165189A CN117165189A CN202311042832.5A CN202311042832A CN117165189A CN 117165189 A CN117165189 A CN 117165189A CN 202311042832 A CN202311042832 A CN 202311042832A CN 117165189 A CN117165189 A CN 117165189A
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- Prior art keywords
- conductive adhesive
- anisotropic conductive
- debondable
- parts
- cyclobutane
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- 239000000853 adhesive Substances 0.000 title claims abstract description 62
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 22
- PMPVIKIVABFJJI-UHFFFAOYSA-N Cyclobutane Chemical compound C1CCC1 PMPVIKIVABFJJI-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000005267 main chain polymer Substances 0.000 claims abstract description 30
- 239000002994 raw material Substances 0.000 claims abstract description 27
- 238000002604 ultrasonography Methods 0.000 claims abstract description 15
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 8
- 150000001875 compounds Chemical class 0.000 claims abstract description 7
- 239000001294 propane Substances 0.000 claims abstract description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000001301 oxygen Substances 0.000 claims abstract description 4
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims description 36
- 239000011347 resin Substances 0.000 claims description 36
- 239000002245 particle Substances 0.000 claims description 29
- 229920000642 polymer Polymers 0.000 claims description 29
- 239000002313 adhesive film Substances 0.000 claims description 26
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 claims description 25
- 239000002904 solvent Substances 0.000 claims description 22
- 239000003822 epoxy resin Substances 0.000 claims description 19
- 239000000178 monomer Substances 0.000 claims description 19
- 229920000647 polyepoxide Polymers 0.000 claims description 19
- 239000003795 chemical substances by application Substances 0.000 claims description 18
- 239000003054 catalyst Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000002360 preparation method Methods 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 9
- 238000011049 filling Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 2
- 230000009471 action Effects 0.000 abstract description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical class O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 239000005062 Polybutadiene Substances 0.000 description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 229920002857 polybutadiene Polymers 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000004408 titanium dioxide Substances 0.000 description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 229920001225 polyester resin Polymers 0.000 description 6
- 239000004645 polyester resin Substances 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 235000012239 silicon dioxide Nutrition 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 239000004005 microsphere Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229920003048 styrene butadiene rubber Polymers 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 238000007792 addition Methods 0.000 description 4
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 4
- -1 lithium aluminum hydride Chemical compound 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229920000459 Nitrile rubber Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- VYXHVRARDIDEHS-UHFFFAOYSA-N 1,5-cyclooctadiene Chemical compound C1CC=CCCC=C1 VYXHVRARDIDEHS-UHFFFAOYSA-N 0.000 description 2
- 239000004912 1,5-cyclooctadiene Substances 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000002775 capsule Substances 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 239000005457 ice water Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000012280 lithium aluminium hydride Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- CCNDOQHYOIISTA-UHFFFAOYSA-N 1,2-bis(2-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1C(C)(C)OOC(C)(C)C CCNDOQHYOIISTA-UHFFFAOYSA-N 0.000 description 1
- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- AXWJKQDGIVWVEW-UHFFFAOYSA-N 2-(dimethylamino)butanedioic acid Chemical compound CN(C)C(C(O)=O)CC(O)=O AXWJKQDGIVWVEW-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- FKAWETHEYBZGSR-UHFFFAOYSA-N 3-methylidenepyrrolidine-2,5-dione Chemical compound C=C1CC(=O)NC1=O FKAWETHEYBZGSR-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 102000008186 Collagen Human genes 0.000 description 1
- 108010035532 Collagen Proteins 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229920002536 Scavenger resin Polymers 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 229920001436 collagen Polymers 0.000 description 1
- 238000004440 column chromatography Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000012043 crude product Substances 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- NWADXBLMWHFGGU-UHFFFAOYSA-N dodecanoic anhydride Chemical compound CCCCCCCCCCCC(=O)OC(=O)CCCCCCCCCCC NWADXBLMWHFGGU-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229940079826 hydrogen sulfite Drugs 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012968 metallocene catalyst Substances 0.000 description 1
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 1
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 235000010259 potassium hydrogen sulphite Nutrition 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- 235000011151 potassium sulphates Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- WYKYCHHWIJXDAO-UHFFFAOYSA-N tert-butyl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)C WYKYCHHWIJXDAO-UHFFFAOYSA-N 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to a debondable anisotropic conductive adhesive and a debonding method thereof, belonging to the technical field of conductive adhesives. The invention discloses a debondable anisotropic conductive adhesive, wherein the raw materials of the debondable anisotropic conductive adhesive comprise 5-30% of cyclobutane main chain polymers, wherein oxygen-containing pentacyclic rings and cyclobutane are connected in parallel; the molecular weight of the cyclobutane main chain polymer is 1000-100000. According to the invention, the cyclobutane main chain polymer is added into a raw material system, and the double bond and/or the propane oxide structure at the tail end of the main chain can be thermally crosslinked and solidified with other double bond and hydroxyl-containing compounds in the anisotropic conductive adhesive, so that the debondable anisotropic conductive adhesive has better cohesiveness; when debonding is carried out, the anisotropic conductive adhesive is placed in ultrasound, double bonds are generated by the ultrasound, and the conductive adhesive can be catalyzed to be further crosslinked to cause over-curing under the action of light and/or heat, so that interface adhesion is reduced, and debonding is realized.
Description
Technical Field
The invention belongs to the technical field of conductive adhesive, and relates to a debondable anisotropic conductive adhesive, a component bonded by the debondable anisotropic conductive adhesive and a debonding method of the component.
Background
An anisotropic conductive adhesive film made of an anisotropic conductive adhesive and a PET film is used as a polymer film having three functions of conductivity, insulation and adhesion, and after thermocompression bonding, has conductivity in the film thickness direction and insulation in the film surface direction, and can simultaneously bond the opposite electrode portions, conduct electricity between electrodes and insulate electrode patterns. While the anisotropic conductive film realizes efficient bonding, it also causes some problems: when the imaging display, the sensor and other equipment need to be maintained and debonded, the anisotropic conductive adhesive with over-strong viscosity easily causes the problems of glass breakage, adhesive solution residue and the like at the bonding position. It is therefore desirable to develop an anisotropic conductive paste having high viscosity and being easily debonded.
Chinese patent application publication (publication number CN108699411 a) discloses a curable temporary adhesive that is bonded by heat and/or radiation by an adhesive composition made of Bismaleimide (BMI) oligomer, nadimide (nadimide) oligomer or itaconimide oligomer, an ethylenically unsaturated comonomer and a photoinitiator; can maintain adhesion at 300 ℃ or higher, can be mechanically debonded (peelable, 0.8 to 2.0N/cm) at room temperature after exposure to thermal cycles, and its residue can be easily removed by a common solvent; however, the olefinic bonds in this formulation are consumed during heating and are not suitable for effecting debonding of the anisotropic conductive adhesive by over-curing.
Disclosure of Invention
The invention aims at solving the problems in the prior art and provides a debondable anisotropic conductive adhesive, and the prepared conductive adhesive film can simultaneously meet the effects of high viscosity and easy debonding when used for bonding components.
The aim of the invention can be achieved by the following technical scheme:
a debondable anisotropic conductive adhesive, the debondable anisotropic conductive adhesive comprising 5 to 30wt.% of a cyclobutane backbone polymer, wherein an oxygen-containing pentacyclic and a cyclobutane are connected in parallel;
the structural formula is as follows:
wherein n is more than or equal to 2;
the molecular weight of the cyclobutane main chain polymer is 1000-100000.
Preferably, the backbone end of the cyclobutane backbone polymer is a double bond, and/or the backbone end of the cyclobutane backbone polymer is a propane oxide structure, and/or the backbone end of the cyclobutane backbone polymer comprises a double bond and a propane oxide structure.
According to the invention, the cyclobutane main chain polymer is added into a raw material system, and double bonds at the tail end of the main chain can be thermally crosslinked and solidified with other compound raw materials containing double bonds and hydroxyl groups in the anisotropic conductive adhesive, so that the debondable anisotropic conductive adhesive has good cohesiveness. And after the main chain polymer of the cyclobutane is synthesized, double bonds at two ends can be oxidized into a propane oxide structure by an oxidation method (hydrogen peroxide), and the propane oxide structure can also realize thermal crosslinking and curing, so that the effect of improving the adhesive force is achieved.
In addition, the cyclobutane main chain polymer is used as a force-sensitive group, in the bonding process, the 5-4 parallel ring structure of the oxygen-containing pentacyclic and the cyclobutane has certain stability, cannot be easily changed, and the parallel ring structure provides certain rigidity, so that the glass transition temperature of the conductive adhesive can be improved, and the heat resistance is further improved.
When debonding is carried out, the cyclobutane structure is cracked under the action of ultrasound, so that enough reactive double bonds are generated, and the double bonds can be catalyzed to be further crosslinked to cause over-curing under the action of light and/or heat; the overcuring introduces new crosslinking sites into the polymer network, confines the mobile molecular chains, and induces shrinkage between the conductive paste and the carrier and/or substrate by polymerization to reduce interfacial adhesion, effecting debondability.
Preferably, the preparation method of the cyclobutane main chain polymer comprises the following steps:
s1, maleic anhydride and 1, 5-cyclooctadiene are dissolved in a first organic solvent, and a first intermediate is obtained after deoxidization and UV light irradiation;
s2, dissolving the intermediate in a second organic solvent at the temperature of between 90 ℃ below zero and 60 ℃ below zero, adding the second organic solvent into the lithium aluminum hydride suspension, and reacting for 60 to 120 minutes in an ice water bath; adding hydrochloric acid, stirring, extracting, and purifying to obtain a second intermediate;
and S3, after the second intermediate reacts with the Grubbs II catalyst, adding ethyl vinyl ether to continue the reaction, adding metal scavenger resin after the reaction, and recrystallizing to obtain the cyclobutane main chain polymer.
Preferably, the raw materials of the debondable anisotropic conductive adhesive further comprise, in parts by weight: 30-50 parts of supporting resin, 5-20 parts of epoxy resin, 20-40 parts of latent curing agent, 5-15 parts of active monomer, 1-10 parts of tackifying resin, 1-10 parts of catalyst, 0.1-10 parts of conductive particles and 10-60 parts of filling particles.
Preferably, the reactive monomer, the support resin and the epoxy resin in the raw materials contain double bonds and/or hydroxyl groups which can react with the double bonds and/or the structure of the propylene oxide at the main chain end of the cyclobutane main chain polymer.
Further preferably, the mass ratio of the cyclobutane backbone polymer to the total mass of other double bond and/or hydroxyl group containing compounds in the feed is 1: (0.1-10).
Preferably, the support resin includes one or more of butadiene rubber, styrene-butadiene rubber, silicone rubber, aliphatic polyurethane elastomer, polymethacrylic resin, and phenoxy resin.
Polyester resins such as polymethacrylic resins cannot react with the end groups of the backbone polymer of the cyclobutane backbone; however, the support resin (combination) must have a starting material present which can react with the terminal groups of the backbone of the cyclobutane backbone polymer.
Preferably, the latent curing agent includes one or more of a thermal/photoacid generator, a thermal/photobase generator, a capsule type amine curing agent, an imidazole (capsule type) curing agent, and a cationic curing agent.
Preferably, the tackifying resin comprises one or more of terpene tackifying resins, rosin tackifying resins and rosin derivative tackifying resins.
Preferably, the reactive monomer comprises one or more of methyl/endo-isobornyl methacrylate, cyclohexyl methacrylate, methyl/tetrahydrofurfuryl acrylate, N-dimethyllactam, polyethylene glycol o-phenyl ether endo-acrylate, ethoxyethoxyethyl acrylate, dimethylaminoethyl methacrylate, 2-phenoxyethyl endo-acrylate, methyl/endo-lauryl acrylate, dicyclopentenyl acrylate, stearyl methacrylate, cyclo-trimethylol endo-methylal endo-acrylate, beta-carboxyethyl endo-acrylate, triethylene glycol dimethacrylate, ethylene glycol dimethacrylate, 1, 4-butanediol di-endo-acrylate, dipentaerythritol hexa-endo-ate, caprolactone methacrylate, carboxy long carbon chain acrylate, pentaerythritol triacrylate, trimethylolpropane trimethacrylate, tris (2-hydroxyethyl) isocyanurate triacrylate.
Preferably, the catalyst comprises one or more of Azobisisobutyronitrile (AIBN), azobisisoheptonitrile (ABVN), azobisisobutyrimidine hydrochloride (AIBA), azobisiso Ding Mi hydrochloride (AIBI), dimethyl azobisisobutyrate (V601, AIBME), azoiso Ding Qingji formamide (V30), 2, 5-dimethyl-2, 5-di-tert-butylperoxy hexyne-3, bis (tert-butylperoxy isopropyl) benzene, 1-di-tert-butylperoxy cyclohexane, 1-di-tert-butylperoxy-3, 5-trimethyl cyclohexane, tert-butyl peroxy-2-ethyl hexanoate, lauroyl oxide, benzoyl peroxide, dicumyl peroxide, potassium sulfate/hydrogen sulfite, and metallocene catalyst.
Preferably, the conductive particles include one or more of metallic nickel spheres, gold spheres, nickel/gold spheres, metallic nickel-coated polymer microspheres, gold/nickel-coated polymer microspheres.
Further preferably, the diameter of the conductive particles is 2 to 20 μm.
Still more preferably, the conductive particles are gold/nickel coated polymer microspheres having a diameter of 3 to 10 μm; wherein the thickness of the metal layer of the gold/nickel coated polymer microsphere is 0.1-0.3 mu m.
Preferably, the raw material system further comprises a solvent, wherein the solvent comprises one or more of ethanol, acetone, butanone, ethyl acetate, butyl acetate and toluene.
A method for preparing a debondable anisotropic conductive adhesive, the method comprising:
s1, proportioning raw materials,
s2, mixing all the raw materials in sequence: the preparation method comprises the steps of uniformly mixing supporting resin, cyclobutane main chain polymer, epoxy resin, active monomer, tackifying resin, conductive particles, filling particles and solvent, and then adding a catalyst and a potential curing agent to uniformly mix to obtain the debondable anisotropic conductive adhesive.
The preparation method of the debondable anisotropic conductive adhesive film comprises the following steps: and coating the debondable anisotropic conductive adhesive on the stripping film, and heating and volatilizing part of the solvent to obtain the debondable anisotropic conductive adhesive film.
Preferably, the solvent is heated to a volatilizing temperature of 50 to 80 ℃ for 1 to 10 minutes.
Preferably, the curing rate of the anisotropic conductive film is 30 to 70%.
An assembly bonded with a debondable anisotropic conductive adhesive film, the method of making the assembly comprising:
removing the stripping film from the debondable anisotropic conductive adhesive film, and/or placing the debondable anisotropic conductive adhesive on the surface of a carrier and/or a substrate, connecting with the corresponding carrier and/or substrate, and bonding by pre-bonding and main bonding to obtain the component.
Preferably, the temperature of the pre-binding is 50-100 ℃, the binding pressure is 0.5-5 Mpa, and the time is 1-5 s.
Preferably, the temperature of the primary binding is 100-200 ℃ and the pressure is 1-100 Mpa.
Preferably, the cohesive force of the bonded assembly is more than or equal to 12N/cm.
The double bond at the main chain end of the cyclobutane main chain polymer can be thermally crosslinked and solidified with other compound raw materials containing double bond and hydroxyl in the anisotropic conductive adhesive in the binding process, so that the debondable anisotropic conductive adhesive can exert better cohesiveness.
A debonding method, the debonding method comprising: and (3) placing the component bonded by adopting the debondable anisotropic conductive adhesive in ultrasonic, treating for 5-300 min, taking out, heating for 1-100 min at 70-200 ℃ and carrying out mechanical stripping.
When debonding is carried out, the anisotropic conductive adhesive is placed in ultrasound, and the cyclobutane structure is cracked under the action of the ultrasound, so that enough reactive double bonds are generated, and the double bonds can be catalyzed to be further crosslinked to cause over-curing under the action of light and/or heat; the overcuring introduces new crosslinking sites into the polymer network, confines the mobile molecular chains, and induces shrinkage between the conductive paste and the carrier and/or substrate by polymerization to reduce interfacial adhesion, effecting debondability.
Preferably, the mechanical peel force is < 3N/cm.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, 5-30 wt.% of cyclobutane main chain polymer is added into the debondable anisotropic conductive collagen system, and double bonds on the terminal groups and compound components (including active monomers, supporting resin and epoxy resin) containing double bonds and hydroxyl groups in other raw materials undergo a crosslinking reaction under catalysis, so that the debondable anisotropic conductive adhesive has good cohesiveness.
2. Under the action of ultrasound, the debondable anisotropic conductive adhesive provided by the invention has a cyclobutane structure for cracking, so that enough reactive double bonds are generated; the double bonds undergo ring opening crosslinking under the action of light and/or heat, causing over-curing, limiting movable molecular chains, and inducing shrinkage between the conductive adhesive and the carrier and/or the substrate by polymerization to reduce interfacial adhesion, thereby achieving debondability.
3. The debondable anisotropic conductive adhesive and the debondable anisotropic conductive adhesive film prepared by the invention can be used for imaging a display and a sensor, and can simultaneously meet the effects of high viscosity and easy debonding.
Detailed Description
The following are specific examples of the present invention, and the technical solutions of the present invention are further described, but the present invention is not limited to these examples.
The materials adopted by the invention are conventional commercial products, and the adopted method is conventional technical means unless specified.
The raw materials of the invention are as follows:
support resin: butadiene rubber (petaloid, BR 9000); nitrile rubber with molecular weight of 200000 ～ 1000000 and acrylonitrile content of 30%; styrene butadiene rubber (SBR 1502) has a molecular weight of 30000-100000; polyester resin: polymethacrylic resin, CAS25087-26-7, molecular weight 200000 ～ 1000000;
epoxy resin: naphthalene ring epoxy resin, EBA-65;
latent curing agent: capsule-type 2-ethylimidazole;
reactive monomer: pentaerythritol triacrylate;
tackifying resin: terpene tackifying resin, CAS number: 9003-74-1;
catalyst: bis (t-butylperoxyisopropyl) benzene;
filling particles 1: silane coupling agent modified silicon dioxide with the grain diameter of 0.3 micron;
filling particles 2: spherical titanium dioxide with a particle size of 0.2 microns;
conductive particles: gold/nickel coated polymer microspheres with a particle size of 4 microns;
the solvent comprises one or more of ethanol, acetone, butanone, ethyl acetate, butyl acetate and toluene;
the preparation method of the cyclobutane main chain polymer comprises the following steps:
maleic anhydride and 1, 5-cyclooctadiene were prepared according to 1:1.1 in acetone solution, deoxygenated by bubbling in nitrogen for 30 minutes, irradiated with 300nm UV light for 14 hours; washing the solid with diethyl ether after removing the solvent to obtain a first intermediate;
the first intermediate was dissolved in dry THF and the solution was added to a THF suspension of lithium aluminum hydride at-78 ℃. The mixture was stirred in an ice water bath at 0 ℃ for 90 minutes; 6M HCl was slowly added to the mixture and stirred for an additional 15 minutes; THF was then removed under reduced pressure; the mixture was extracted three times with ethyl acetate and the combined organic layers were washed with brine and dried over magnesium sulfate; further purifying the crude product by column chromatography to obtain a white powder second intermediate;
dissolving a second intermediate in dichloromethane, and uniformly mixing with Grubbs II catalyst; the reaction was stirred for 3 hours, then ethyl vinyl ether was added and the mixture was stirred for 30 minutes; then a suspension of quadruped TU macroporous particles in dichloromethane was added followed by recrystallisation from methanol, the white solid obtained being a cyclobutane backbone polymer.
The cyclobutane main chain polymer can be pretreated by hydrogen peroxide, and double bonds at two ends are oxidized into a propane oxide structure;
the invention relates to a raw material of a debondable anisotropic conductive adhesive, which comprises the following raw materials in parts by weight: 30-50 parts of supporting resin, 5-50 parts of cyclobutane main chain polymer, 5-20 parts of epoxy resin, 20-40 parts of latent curing agent, 5-15 parts of active monomer, 1-10 parts of tackifying resin, 1-10 parts of catalyst, 0.1-10 parts of conductive particles, 10-60 parts of filling particles and 1-100 parts of solvent; wherein the cyclobutane backbone polymer content is from 5 to 30wt.%;
the preparation method of the debondable anisotropic conductive adhesive comprises the following steps:
s1, proportioning raw materials;
s2, mixing all the raw materials in sequence: uniformly mixing supporting resin, a cyclobutane main chain polymer, epoxy resin, an active monomer, tackifying resin, conductive particles, filler particles and a solvent, and then adding a catalyst and a potential curing agent to uniformly mix;
the preparation method of the debondable anisotropic conductive adhesive film comprises the following steps: coating the debondable anisotropic conductive adhesive on a stripping film, and preparing the debondable anisotropic conductive adhesive film after part of solvent is heated and volatilized;
the solvent is heated and volatilized at 50-80 ℃ for 1-10 min;
the solidification rate of the anisotropic conductive adhesive film is 30-70%;
the thickness of the partially cured debondable anisotropic conductive adhesive is 3-50 micrometers;
an assembly bonded with a debondable anisotropic conductive adhesive film, the method of making the assembly comprising:
removing the stripping film from the debondable anisotropic conductive adhesive film, or placing the debondable anisotropic conductive adhesive on the surface of a carrier and/or a substrate, connecting the debondable anisotropic conductive adhesive film with the corresponding carrier and/or substrate, and bonding the debondable anisotropic conductive adhesive film by pre-bonding and main bonding to prepare a component;
the temperature of the pre-binding is 50-100 ℃, the binding pressure is 0.5-5 Mpa, and the time is 1-5 s;
the temperature of the main binding is 100-200 ℃, the pressure is 1-100 Mpa, and the time is 1-10 s;
the cohesive force of the bonded assembly is more than or equal to 12N/cm;
the debonding method of the debondable anisotropic conductive adhesive comprises the following steps: placing the components bonded by adopting the debondable anisotropic conductive adhesive in ultrasound, treating for 5-300 min, taking out, heating for 1-100 min at 70-200 ℃ and carrying out mechanical stripping;
the acting force of mechanical stripping is less than 3N/cm.
Example 1
The anisotropic conductive adhesive of the embodiment comprises the following raw materials: 15 parts of butadiene rubber, 30 parts of polyester resin, 21 parts of a cyclobutane main chain polymer, 15 parts of epoxy resin, 25 parts of a latent curing agent, 7 parts of an active monomer, 5 parts of a tackifying resin, 4 parts of a catalyst, 8 parts of conductive particles, 10 parts of silicon dioxide, 15 parts of titanium dioxide and the balance of solvent (toluene);
the ratio of cyclobutane backbone polymer in this example was 13.5%; and the mass ratio of the cyclobutane main chain polymer to the butadiene rubber to the epoxy resin is 1.4:1:1, a step of;
all raw materials are mixed in sequence: uniformly mixing the support resin, the cyclobutane main chain polymer, the epoxy resin, the active monomer, the tackifying resin, the conductive particles, the filling particles and the solvent, then adding the catalyst and the latent curing agent, and uniformly mixing to obtain the debondable anisotropic conductive adhesive; the content thereof was 45%.
The preparation method of the anisotropic conductive adhesive film comprises the following steps: coating the debondable anisotropic conductive adhesive on a stripping film, and volatilizing a solvent (70 ℃ for 2 min) to obtain the debondable anisotropic conductive adhesive film;
the preparation method of the component bonded by the debondable anisotropic conductive adhesive comprises the following steps: after stripping the debondable anisotropic conductive adhesive film from the stripping film, placing the stripped anisotropic conductive adhesive film on the surface of a carrier and/or a substrate, enabling the debondable anisotropic conductive adhesive film to be in contact with the corresponding carrier and/or substrate, combining the stripped anisotropic conductive adhesive film and the corresponding carrier and/or substrate to form a component, and bonding the component through pre-bonding and main bonding;
and/or directly coating the debondable anisotropic conductive adhesive on the surface of a carrier and/or a substrate, enabling the debondable anisotropic conductive adhesive film to be in contact with the corresponding carrier and/or substrate, combining to form a component, and bonding through pre-bonding and main bonding;
the temperature of pre-binding is 60 ℃, the binding pressure is 1Mpa, and the time is 1s;
the temperature of the main binding is 170 ℃, the pressure is 3Mpa, and the time is 5s;
the cohesive force of the bonded assembly can reach 12N/cm;
placing the assembly in ultrasonic treatment for 60min, taking out, heating at 120deg.C for 3min, and mechanically stripping; the mechanical peel force was 1.1N/cm.
The specific properties are shown in Table 1.
Example 2
The difference compared to example 1 is that the cyclobutane backbone polymer is 19.4% by weight;
the raw materials comprise: 14 parts of butadiene rubber, 27 parts of polyester resin, 30 parts of cyclobutane main chain polymer, 10 parts of epoxy resin, 25 parts of latent curing agent, 7 parts of active monomer, 5 parts of tackifying resin, 4 parts of catalyst, 8 parts of conductive particles, 10 parts of silicon dioxide, 15 parts of titanium dioxide and the balance of solvent.
The specific properties are shown in Table 1.
Example 3
The difference compared to example 1 is that the cyclobutane backbone polymer is 23.3%;
the raw materials comprise: 12 parts of butadiene rubber, 26 parts of polyester resin, 35 parts of cyclobutane main chain polymer, 8 parts of epoxy resin, 25 parts of latent curing agent, 7 parts of active monomer, 5 parts of tackifying resin, 4 parts of catalyst, 8 parts of conductive particles, 10 parts of silicon dioxide, 15 parts of titanium dioxide and the balance of solvent.
The specific properties are shown in Table 1.
Example 4
The difference compared to example 1 is that the type of support resin is different, and the ratio of the cyclobutane backbone polymer is 13.5%;
the method specifically comprises the following steps: 15 parts of butadiene rubber, 15 parts of nitrile rubber, 15 parts of styrene-butadiene rubber, 21 parts of a cyclobutane main chain polymer, 15 parts of epoxy resin, 25 parts of a latent curing agent, 7 parts of an active monomer, 5 parts of a tackifying resin, 4 parts of a catalyst, 8 parts of conductive particles, 10 parts of silicon dioxide, 15 parts of titanium dioxide and the balance of a solvent.
The specific properties are shown in Table 1.
Example 5
The difference compared to example 4 is that the amount of reactive monomer added is increased, the cyclobutane backbone polymer is 13.3%;
the method specifically comprises the following steps: 15 parts of butadiene rubber, 15 parts of nitrile rubber, 15 parts of styrene-butadiene rubber, 21 parts of a cyclobutane main chain polymer, 15 parts of epoxy resin, 25 parts of a latent curing agent, 10 parts of an active monomer, 5 parts of a tackifying resin, 4 parts of a catalyst, 8 parts of conductive particles, 10 parts of silicon dioxide, 15 parts of titanium dioxide and the balance of a solvent.
The specific properties are shown in Table 1.
Example 6
In comparison with example 1, the difference is that in the debonding process, the bonded assembly is subjected to ultrasound without heating after the ultrasound.
The mechanical peel force was not significantly changed.
The specific properties are shown in Table 1.
Example 7
In comparison with example 1, the difference is that in the debonding process, ultrasound is not performed, and only the bonded assembly is immersed in water, taken out and heated.
Comparative example 1
In comparison with example 1, the difference is that no cyclobutane backbone polymer is added; the addition amount of the rest components is unchanged.
The specific properties are shown in Table 1.
Comparative example 2
The difference compared to example 1 is that the cyclobutane backbone polymer is 33.3%;
the raw materials comprise: 6 parts of butadiene rubber, 20 parts of polyester resin, 50 parts of a cyclobutane main chain polymer, 5 parts of epoxy resin, 25 parts of a latent curing agent, 7 parts of an active monomer, 5 parts of a tackifying resin, 4 parts of a catalyst, 8 parts of conductive particles, 10 parts of silicon dioxide, 15 parts of titanium dioxide and the balance of a solvent;
the specific properties are shown in Table 1.
TABLE 1 adhesion force and mechanical peel force Property of debondable Anisotropic conductive adhesive
According to the embodiments 1-3, the content of other components is kept unchanged within a certain range, and the ratio of the main chain polymer of the cyclobutane is increased, so that the mechanical stripping acting force during debonding is reduced;
as shown in comparative example 1, the debonding is difficult to achieve without adding a cyclobutane backbone polymer, the situation of glue residue occurs, and the initial adhesion is not strong;
whereas the comparative example 2 system added an excess of the cyclobutane backbone polymer, the excess double bonds were internal reactions of the cyclobutane backbone polymer, forming phase separation, so that although the adhesion was all improved, the improvement was insignificant and the mechanical peel force was not significantly reduced;
from examples 1,4, 5, it is clear that the addition of compounds reactive with the cyclobutane backbone polymer increases the adhesion but also increases the mechanical peel force;
according to examples 1, 6 and 7, the debonding process must be treated by ultrasound and heating, double bond functional groups are not generated by ultrasound, and effective debonding cannot be performed, and mechanical peeling is facilitated by heating after ultrasound, and if post curing does not occur basically due to non-heating after ultrasound, the mechanical peeling force is also large; the mechanical peel force was even greater than that of comparative example 1 without the addition of the cyclobutane backbone polymer.
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the invention. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Claims (10)
1. The debondable anisotropic conductive adhesive is characterized in that the raw material of the debondable anisotropic conductive adhesive comprises 5-30 wt.% of cyclobutane main chain polymer, wherein an oxygen-containing pentacyclic ring and cyclobutane are connected in parallel;
the structural formula is as follows:
wherein n is more than or equal to 2;
the molecular weight of the cyclobutane main chain polymer is 1000-100000.
2. The debondable anisotropic conductive adhesive according to claim 1, wherein the raw materials of the debondable anisotropic conductive adhesive further comprise: 30-50 parts of supporting resin, 5-20 parts of epoxy resin, 20-40 parts of latent curing agent, 5-15 parts of active monomer, 1-10 parts of tackifying resin, 1-10 parts of catalyst, 0.1-10 parts of conductive particles and 10-60 parts of filling particles.
3. The debondable anisotropic conductive adhesive according to claim 2, wherein the reactive monomer, the support resin, and the epoxy resin in the raw material contain a double bond and/or a hydroxyl group which can act with a double bond at a main chain end of the cyclobutane main chain polymer and/or a structure of propane oxide.
4. A debondable anisotropic conductive paste according to claim 3, wherein the mass ratio of the cyclobutane backbone polymer to the total mass of other double bond and/or hydroxyl group containing compounds in the raw material is 1: (0.1-10).
5. A method for preparing a debondable anisotropic conductive adhesive, comprising the steps of:
s1, proportioning raw materials,
s2, mixing all raw materials in sequence: the preparation method comprises the steps of firstly uniformly mixing the support resin, the cyclobutane main chain polymer, the epoxy resin, the active monomer, the tackifying resin, the conductive particles, the filler particles and the solvent, and then adding the catalyst and the potential curing agent to uniformly mix.
6. The preparation method of the debondable anisotropic conductive adhesive film is characterized by comprising the following steps: the debondable anisotropic conductive adhesive film is prepared by coating the debondable anisotropic conductive adhesive film on a stripping film and volatilizing a solvent after heating.
7. An assembly bonded with a debondable anisotropic conductive adhesive, the method of making the assembly comprising: the debondable anisotropic conductive adhesive according to any one of claims 1 to 4, and/or the debondable anisotropic conductive adhesive according to the preparation method of claim 5, and/or the debondable anisotropic conductive adhesive film according to claim 6 is placed on the surface of a carrier and/or a substrate after the peeling film is removed, so that the debondable anisotropic conductive adhesive film is connected with the corresponding carrier and/or substrate, and bonding is realized through pre-bonding and main bonding, so as to form a component; the cohesive force of the bonded assembly is more than or equal to 12N/cm.
8. The assembly of claim 7, wherein the pre-binding temperature is 50-100 ℃, the binding pressure is 0.5-5 Mpa, and the time is 1-5 s; the temperature of the main binding is 100-200 ℃ and the pressure is 1-100 Mpa.
9. A debonding method, the debonding method comprising: placing the assembly bonded by the debondable anisotropic conductive adhesive in any one of claims 7 to 8 in ultrasound, treating for 5 to 300min, taking out, heating for 1 to 100min at 70 to 200 ℃ and carrying out mechanical stripping.
10. Debonding process according to claim 9, characterized in that the mechanical debonding force is < 3N/cm.
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| CN202311042832.5A CN117165189A (en) | 2023-08-18 | 2023-08-18 | Debondable anisotropic conductive adhesive, component bonded by using the same and debonding method of the component |
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