CN116654289A - Automatic assembling and adjusting method for star sensor CMOS circuit board target surface - Google Patents

Abstract

The invention belongs to the technical field of precise assembly of aerospace devices, and relates to an automatic assembling and adjusting method for a star sensor CMOS circuit board target surface. The adopted assembling and adjusting equipment mainly comprises a feeding module, a measuring module, an assembling and adjusting module and a tool locking module, wherein the method is divided into an assembling process, a checking process and a locking process by taking a parallelism detection process as a demarcation point, the checking process is divided into two cases, and if the accuracy requirement is met after the checking, the locking process is directly continued; if the precision requirement is not met, batch parallelism measurement is carried out on a plurality of groups of new parts while waiting for the grinding processing of the adjusting gaskets. The invention can realize the alignment positioning of the adjusting gasket, the automatic adjustment and assembly of the relative positions of the CMOS circuit board and the star sensor bracket and the automatic measurement and calculation of the parallelism of the target surface and the reference surface, and the fixture is used for positioning and locking parts for measurement in the process of assembly and adjustment, so that the locking measurement is not needed to be disassembled and adjusted, and the damage of the parts is reduced.

Description

A method for automatically installing and adjusting the target surface of a star sensor CMOS circuit board

technical field

The invention belongs to the technical field of precision assembly of aerospace devices, and relates to a method for automatic assembly and adjustment of a target surface of a CMOS circuit board of a star sensor, which is an automatic assembly method for a CMOS circuit board containing a target surface in a starlight sensitive processing unit of a miniaturized star sensor and tuned techniques.

Background technique

The star sensor is a high-precision space attitude measurement device with the starry sky as the working object. It is used to provide accurate space orientation and reference for aerospace vehicles. It has high attitude determination accuracy, fast data processing speed, small size, quality and power consumption. Significantly reduced and so on. The star sensor is mainly composed of three parts: a miniaturized structural unit, an optical system unit, and a star-sensitive processing unit. The image processor and the imaging circuit in the star-sensitive processing unit are collectively called a CMOS circuit board after welding. The core component of the star sensor, the target surface is located at the specified position on the CMOS circuit board, and its manufacturing and assembly accuracy will have an important impact on the performance of the star sensor. Therefore, the adjustment method of the target surface in the starlight sensitive processing unit is of great significance to improve the attitude measurement accuracy of the star sensor.

For the assembly and adjustment of the CMOS circuit board and the star sensor bracket in the star sensor, the precision requirement is to make the installation inclination range of the target surface relative to the bottom reference plane of the star sensor bracket less than or equal to 2′, and at the same time require the pixel point rectangle in the target surface to be x , The installation inclination range of the y-axis relative to the edge of the reference plane is less than or equal to 1'. The current assembly and adjustment method mainly uses special fixtures and tools such as screws, pins and screws for manual assembly, such as the invention patent No. CN201810202225.3, Chen Ting and others invented a high-precision and high-stability installation method for satellite-borne star sensors , the installation and adjustment process is to clamp the star sensor to a special installation structure, manually tighten the screws in the diagonal mounting holes and apply the required torque to ensure the accuracy requirements, this method is difficult to guarantee the precise application of torque, and at the same time The torque of the screw is different, which is easy to damage the workpiece. Invention Patent No. CN201811549719.5, Zhai Zhengyi and others invented a high-efficiency assembly and adjustment system and method for the reference prism of the star sensor. The process mainly relies on manual assembly, which has a certain effect on the adjustment of parts during the assembly process, but it needs to continuously adjust six dimensions, and the efficiency is low. In the paper "Research on Attitude Detection Method of Star Sensor Imaging Plane", Qin Guohua designed a star sensor imaging surface attitude detection device with two-dimensional guide rail and gantry structure. The sensor and camera realize the detection of the inclination angle of the imaging surface, and the least square method is used to complete the calculation of the inclination angle. The equipment and method in this paper can realize the detection of the assembly effect but do not involve the specific assembly method of the parts, and the workpieces to be detected are all located on the same surface of the fixed base , but in this patent assembly task, the target surface and the reference surface of the CMOS circuit board are located in different planes, and the measurement difficulty is relatively increased.

To sum up, it can be seen that the adjustment accuracy of the existing adjustment methods depends on the technical level, operating habits, work experience, etc. of the workers, and the adjustment accuracy is low and the reject rate is high. In view of the above problems, it is difficult to improve the operation level of workers to achieve high assembly accuracy, the output-to-input ratio is small, and the degree of automation is low, so it is difficult to guarantee the assembly accuracy. Only by inventing a reasonable, feasible, convenient and efficient assembly method and cooperating with the self-developed automatic assembly equipment can the current requirements of assembly efficiency and accuracy be met.

Contents of the invention

The technical problem to be solved by the present invention is: to overcome the accuracy and efficiency defects brought by the current CMOS circuit board and star sensor bracket assembly process, and to invent an automatic assembly and adjustment method for the star sensor CMOS circuit board target surface, which can be fast and accurate Realize the assembly and adjustment of CMOS circuit board and star sensor bracket accurately, improve the accuracy and efficiency of assembly and adjustment.

Technical scheme of the present invention is as follows:

A method for automatic installation and adjustment of the target surface of a star sensor CMOS circuit board. The installation and adjustment equipment used is mainly composed of a feeding module, a measurement module, an installation and adjustment module and a tooling locking module. The bottoms of the three modules are all installed on the optical On platform 4, from left to right are the measurement module, tooling locking module and feeding module, while the assembly and adjustment module adopts a gantry structure and is horizontally placed above the equipment to realize the automatic locking function of parts.

The measurement module is mainly composed of a three-axis precision displacement slide table 5, a probe support a6, a combined laser displacement probe 7, a probe support b8, a measurement component bracket 9 and an industrial camera a10. The bottom of the probe support a6 and the probe support b8 are installed on one side of the measuring component bracket 9, the industrial camera a10 is installed on the other side of the measuring component bracket 9, and the measuring component bracket 9 is installed on the three-axis precision displacement slide table On the Z axis of 5, the bottom of the three-axis precision displacement slide table 5 is installed on the optical platform 4, and the combined laser displacement probe 7 is locked front and rear by the probe support a6 and the probe support b8, wherein the combined laser displacement probe 7 consists of three small spectroscopic interferometric displacement meters installed on the combined fixture, and the three are arranged in the shape of an equilateral triangle. After the CMOS circuit board 1 is assembled, the combined laser displacement measuring head 7 realizes the measurement function of the target surface of the CMOS circuit board 1 and the parallelism of the datum plane under the star sensor bracket 3; the industrial camera a10 is mounted on the CMOS circuit board 1 During assembly, the function of measuring the parallelism of the edge of the pixel rectangular target surface on the CMOS circuit board 1 and the edge of the reference plane of the star sensor bracket 3 is realized; the three-axis precision displacement slide table 5 has three-dimensional linear motion capability, and can realize combined laser The displacement probe 7 and the industrial camera a10 can adjust the functions of different measurement positions.

The tooling locking module is mainly composed of a bearing with seat 33, a rotating shaft support 34, a rotating shaft 35, a guide rod cylinder 36, a fixture assembly base 37, a corner cylinder 38, a reflector 39, a V-shaped block 40, and a linear precision displacement slide. Table d41, precision turntable b42 and tooling locking component bracket 43 are composed. The tooling locking assembly bracket 43 is a U-shaped structure, a reflector 39 is installed in the middle, a bearing with a seat 33 is installed on one end side, a precision turntable b42 is installed on the other end side, and the bottom is installed on a linear precision displacement On the slide table d41, the bottom of the linear precision displacement slide table d41 is installed on the optical table 4; the base 37 of the clamp assembly is an L-shaped structure, and one end of the slide table d41 is equipped with a rotating shaft support 34, and one end of the rotating shaft 35 is connected from the opening of the rotating shaft support 34 The other end of the rotating shaft 35 passes through the bearing 33 and is fixed; the other end of the clamp assembly base 37 is installed on the turntable surface of the precision turntable b42; the guide rod cylinder 36 is installed At one end of the clamp assembly base 37 , the angle cylinder 38 is vertically installed in the middle of the clamp assembly base 37 , and the V-shaped block 40 is installed on the side of the other end of the clamp assembly base 37 . The reflector 39 realizes the function of the industrial camera a10 observing the rectangular target surface of pixels on the CMOS circuit board 1 and the reference plane of the star sensor bracket 3 from the side to the top; the L-shaped clamp assembly base 37 and the rotating shaft support 34 , rotating shaft 35, bearing with seat 33, precision turntable b42 and other components form a swing-like rotating structure. Driven by the precision turntable b42, the fixture assembly base 37 and the star sensor bracket 3 parts and the rotating shaft support 34 on it can be made , rotating shaft 35, guide rod cylinder 36, corner cylinder 38 and V-shaped block 40 and other components rotate around the rotating shaft of precision turntable b42, and realize the adjustment of CMOS circuit board 1, adjustment gasket 2 and star sensor during assembly and measurement The function of the attitude of the bracket 3 parts; the V-shaped block 40 is adapted to the outer contour design of the star sensor bracket 3, and realizes the positioning function in the positioning and clamping of the star sensor bracket 3; the ejector rod of the guide rod cylinder 36 can be moved along the The telescopic movement in the opening direction of the V-shaped block 40 realizes the clamping function in the positioning and clamping of the star sensor bracket 3; the corner cylinder 38 can be locked after rotating 90° around its own rotating shaft, so that the CMOS circuit board 1 can be adjusted and assembled. , the locking function of the CMOS circuit board 1; the linear precision displacement slide table d41 can be displaced in a single direction to realize the function of adjusting the working position and assembly of parts on it.

The assembly and adjustment module is mainly composed of a profile bracket 11, a linear precision displacement slide a12, a slide table support 16, an assembly and adjustment module and a locking module; the slide table support 16 is a U-shaped structure, and its two ends The adjustment module and the locking module are respectively installed, the middle part of which is installed on the linear precision displacement slide a12, the bottom of the linear precision displacement slide a12 is installed on the profile support 11, and the bottom of the profile support 11 is installed on the optical table 4. The assembly and adjustment module is mainly composed of an industrial camera b13, an assembly assembly bracket 14, a linear precision displacement slide b15, a precision turntable a26, a cylindrical force sensor 27 and a part adsorption head 28. The top of the part adsorption head 28 is installed on the bottom of the cylindrical force sensor 27, the top of the cylindrical force sensor 27 is installed on the turntable surface at the bottom of the precision turntable a26, and the top of the precision turntable a26 is installed on the mounting surface at the bottom of the assembly bracket 14, The industrial camera b13 is installed on the adjustment component bracket 14, the side of the adjustment component bracket 14 is installed on the table top of the linear precision displacement slide b15, and the linear precision displacement slide b15 is installed on the side of the slide bracket 16. The locking module is mainly composed of a sliding table cylinder 17, a locking cylinder 18, a locking assembly base 19, a linear guide rail 20, an electric screwdriver 21, an electric screwdriver bracket 22 and a screw suction head 23. The electric screwdriver 21 is installed on the electric screwdriver support 22, the electric screwdriver support 22 is an L-shaped structure, its side is installed on the linear guide rail 20, and the bottom of the linear guide rail 20 is installed on the lock assembly base 19, and the lock assembly base 19 is L-shaped structure, its side is installed on the slide table cylinder 17 table, the bottom of the slide table cylinder 17 is installed on the side of the slide table bracket 16, the lock pay cylinder 18 is fixedly installed on the lock pay assembly base 19, its ejector rod and electric The screwdriver brackets 22 are connected and installed, and the screw suction head 23 is installed on the bottom of the base 19 of the locking assembly. The linear precision displacement slide a12, the linear precision displacement slide b15 and the linear precision displacement slide d41 are combined to form a three-dimensional motion structure for picking and assembling parts; the linear precision displacement slide a12, the slide cylinder 17 and the linear precision displacement slide The table d41 is combined to form a three-dimensional motion structure of the process of screw adsorption and retrieving and parts lock and pay; the precision turntable a26 can drive the parts adsorbed on the part adsorption head 28 to rotate around the rotation axis, that is, to realize the adjustment of the pixel point rectangular target on the CMOS circuit board 1 The function of parallelism between the surface edge and the star sensor bracket 3 reference surface edge; the industrial camera b13 realizes the function of identifying the position of the parts to be assembled; the cylindrical force sensor 27 provides real-time feedback between the part suction head 28 and the part during the assembly process. The contact force can not only avoid the failure of picking up parts due to insufficient contact, but also avoid damage to parts and equipment due to excessive contact force; the locking module can realize the functions of screw adsorption and parts locking, wherein the locking cylinder 18 realizes the driving The electric screwdriver bracket 22 and its upper electric screwdriver 21 have the function of reciprocating up and down movement, the linear guide rail 20 realizes the guiding function of the electric screwdriver bracket 22 and its upper electric screwdriver 21 up and down reciprocating movement, and the screw suction head 23 realizes the screw feeder 24 The provided screw adsorption and reclaiming function.

The feeding module is mainly composed of a screw feeder 24 , a screw feeder base 25 , a tray 29 , a pressing block 30 , a linear precision displacement slide table c31 and a feeding assembly base 32 . The bottom of the screw feeder 24 is installed on the screw feeder base 25, and the bottom of the screw feeder base 25 is installed on the optical platform 4; the bottom of the material tray 29 is installed on the linear precision displacement slide table c31, and the linear precision The bottom of the displacement slide c31 is installed on the base 32 of the feeding assembly, and the bottom of the base 32 of the feeding assembly is installed on the optical table 4; the pressing block 30 is placed on a fixed area on the tray. The screw feeder 24 realizes the feeding function of the screw; the feed tray 29 is adapted to the holes on the CMOS circuit board 1, the adjustment gasket 2 and the pressure block 30, and is designed with a boss-shaped stop structure, so that The three adjusting shims 2 are placed directly on the tray 29 in a triangular distribution, so that the adjusting shims 2 and the briquetting block 30 are placed on the plane of the feeding tray 29 and are limited by the limit structure, without excessive rotation, which is convenient for parts adsorption Adsorption and picking of the head 28; the bottom of the press block 30 is coated with a buffer material. After the CMOS circuit board 1 is installed, the press block 30 is picked up by the assembly module and pressed on the CMOS circuit board 1, and then compressed by the corner cylinder 38 The pressing block 30 prevents the corner cylinder 38 from directly pressing on the CMOS circuit board 1 to damage the parts, and since the CMOS circuit board 1 and the star sensor bracket 3 need to be screwed and locked eventually, the pressing block 30 presses the CMOS circuit board 1 Finally, an opening structure is designed corresponding to the position of the screw hole on the CMOS circuit board 1, so as to ensure that the screw lock is not affected under the pressed state.

During the entire assembly and adjustment process, after completing the parallelism detection of the target surface of the CMOS circuit board 1 and the reference surface of the star sensor bracket 3, it is necessary to compare whether it meets the accuracy requirements. If the installation tilt range requirements are met, the next step of assembly can be continued process; if the installation tilt range requirements are not met, the assembly must be stopped immediately, and the grinding amount required for the adjustment gasket is calculated according to the algorithm. After the grinding process is completed, a new adjustment gasket is used to re-test the parallelism until it is qualified, and the entire assembly and adjustment is completed. process. Therefore, taking the parallelism detection process as the demarcation point, the automatic assembly and adjustment method of the target surface of the star sensor CMOS circuit board is divided into three processes, which are the assembly process, the inspection process, and the locking process. The specific steps are as follows:

The first step, parts loading: before assembly, the star sensor bracket 3 is manually placed on the V-shaped block 40 of the tooling locking module for positioning, and the star sensor bracket 3 is clamped by the push rod of the guide rod cylinder 36. In the V-shaped block 40 ; place the pressing block 30 , the parts to be assembled, the CMOS circuit board 1 and the adjusting spacer 2 on the charging tray 29 with a position-limiting structure, and complete the loading. Wherein, the material tray 29 corresponds to the hole position on the CMOS circuit board 1, the adjustment gasket 2 and the pressure block 30, and is designed with a boss-shaped stop structure, so that the three adjustment gaskets 2 are placed on the material tray 29 directly to form a The triangular distribution makes the adjustment gasket 2 and the pressure block 30 placed on the plane of the material tray 29 limited by the limit structure, without excessive rotation, which is convenient for the adsorption and picking of the part adsorption head 28.

The second step, the assembly of the adjusting gasket 2: after the loading is completed, the adjusting gasket 2 is assembled. The assembly and adjustment module is driven by the linear precision displacement slide a12 to move to the position where the adjustment gasket 2 is absorbed and picked up. With the assistance of the industrial camera b13, the combination of the linear precision displacement slide a12 and the linear precision displacement slide c31 forms a two-dimensional plane Movement, adjust the relative position between the parts adsorption head 28 and the adjustment gasket 2, adjust the relative posture between the parts adsorption head 28 and the adjustment gasket 2 by the precision turntable a26, after alignment, it is driven by the linear precision displacement slide b15 The parts suction head 28 moves downwards to absorb and take out the adjustment gasket 2. After the material is taken successfully, the parts adsorption head 28 is driven by the linear precision displacement slide b15 to drive the adjustment gasket 2 to move upwards, and the adjustment gasket 2 is completed. Reclaimer. Among them, the mutual contact force between the parts adsorption head 28 and the adjustment gasket 2 when contacting and picking up materials is fed back in real time by the cylindrical force sensor 27 to ensure a suitable contact force without damaging the parts and equipment; The position of the position has been limited by the triangularly distributed boss shape structure on the material tray 29 during loading, so that the part adsorption head 28 can pick up three adjusting gaskets 2 in a single adsorption, and the assembly efficiency is improved. After the material retrieving is completed, the assembly and adjustment module is driven by the linear precision displacement slide a12 to move to the assembly and adjustment working position of the adjustment gasket 2. With the assistance of the industrial camera b13, the linear precision displacement slide a12 and the linear precision displacement slide d41 Combined to form a two-dimensional plane movement, adjust the relative position between the adjusting gasket 2 adsorbed on the part adsorption head 28 and the assembly hole position on the star sensor bracket 3, and adjust the adjusting gasket adsorbed on the part adsorption head 28 by the precision turntable a26 2 and the mounting hole on the star sensor bracket 3, after alignment, the adjusting gasket 2 adsorbed on the part adsorption head 28 is driven by the linear precision displacement slide b15 to move downward, and the adjusting gasket 2 is assembled At the assembly hole position of the star sensor bracket 3, after the assembly is completed, the linear precision displacement slide table b15 drives the part adsorption head 28 to move upward to restore the initial position, and the assembly of the adjusting gasket 2 is completed. Among them, the mutual contact force between the adjusting gasket 2 adsorbed on the part adsorption head 28 and the assembly hole position on the star sensor bracket 3 is fed back in real time by the cylindrical force sensor 27 to ensure an appropriate contact force without damaging parts and equipment .

The third step, CMOS circuit board 1 assembly: after the adjustment spacer 2 is assembled, the CMOS circuit board 1 is assembled. The assembly module is driven by the linear precision displacement slide a12 to move to the adsorption and picking position of the CMOS circuit board 1. With the assistance of the industrial camera b13, the combination of the linear precision displacement slide a12 and the linear precision displacement slide c31 forms a two-dimensional plane Movement, to adjust the relative position between the parts suction head 28 and the CMOS circuit board 1, the relative posture between the parts suction head 28 and the CMOS circuit board 1 is adjusted by the precision turntable a26, after alignment, it is driven by the linear precision displacement slide b15 The parts suction head 28 moves downward to absorb and take out the CMOS circuit board 1. After the material is taken successfully, the linear precision displacement slide b15 drives the parts suction head 28 to drive the CMOS circuit board 1 to move upwards to complete the CMOS circuit board 1. Reclaimer. Wherein, the mutual contact force between the part adsorption head 28 and the CMOS circuit board 1 is fed back in real time by the cylindrical force sensor 27 to ensure proper contact force without damaging parts and equipment. After the material retrieving is completed, the assembly and adjustment module moves to the CMOS circuit board 1 assembly and adjustment working position driven by the linear precision displacement slide a12. With the assistance of the industrial camera a10 and the industrial camera b13, the linear precision displacement slide a12 and the linear precision The displacement slide table d41 is combined to form a two-dimensional plane movement to adjust the relative position between the CMOS circuit board 1 adsorbed on the part adsorption head 28 and the assembly hole position on the star sensor bracket 3, and the precision turntable a26 is used to adjust the adsorption on the part adsorption head 28 The parallelism between the pixel point rectangular target surface edge of the CMOS circuit board 1 and the star sensor bracket 3 reference plane edge; wherein, the industrial camera a10 is on the side, and observes the pixel points of the CMOS circuit board 1 from bottom to top through the mirror 39 The sideline of the rectangular target surface and the sideline of the reference plane of the star sensor bracket 3, the auxiliary precision turntable a26 is used to adjust the attitude of the sideline parallelism, the industrial camera b13 is on the top, and the assembly hole position on the star sensor bracket 3 is observed from top to bottom, and the auxiliary line is precise The displacement slide table a12 and the linear precision displacement slide table d41 adjust the position between the CMOS circuit board 1 and the star sensor bracket 3; after the position and attitude adjustment is completed, the linear precision displacement slide table b15 drives the CMOS adsorbed on the part adsorption head 28 The circuit board 1 moves downward, and the CMOS circuit board 1 is stacked on the adjusting gasket 2. After the assembly is completed, the linear precision displacement slide table b15 drives the part suction head 28 to move upward to restore the initial position, and the assembly of the CMOS circuit board 1 is completed. Wherein, the mutual contact force between the CMOS circuit board 1 adsorbed on the part suction head 28 and the adjusting gasket 2 during assembly is fed back in real time by the cylindrical force sensor 27 to ensure proper contact force without damaging parts and equipment.

The fourth step is to compress the CMOS circuit board 1 and the adjusting spacer 2: after the CMOS circuit board 1 is assembled, it needs to be compressed and fixed by the corner cylinder 38. In order to protect the parts from damage, the pressure block 30 is used as the intermediate buffer part. The assembly and adjustment module is driven by the linear precision displacement slide a12 to move to the pick-up position of the pressure block 30. With the assistance of the industrial camera b13, the combination of the linear precision displacement slide a12 and the linear precision displacement slide c31 forms a two-dimensional plane movement , adjust the relative position between the parts adsorption head 28 and the pressing block 30, adjust the relative posture between the parts adsorption head 28 and the pressing block 30 by the precision turntable a26, after alignment, drive the parts adsorption head by the linear precision displacement slide b15 28 moves downwards to absorb and reclaim the briquetting block 30. After the material retrieving is successful, the linear precision displacement slide b15 drives the part adsorption head 28 to drive the upper briquetting block 30 to move upwards to complete the retrieving of the briquetting block 30. Among them, the mutual contact force between the part suction head 28 and the pressing block 30 is fed back in real time by the cylindrical force sensor 27 to ensure proper contact force without damaging parts and equipment. After the retrieving is completed, the assembly and adjustment module moves to the assembly and adjustment working position of the pressure block 30 under the drive of the linear precision displacement slide a12. With the assistance of the industrial camera b13, the linear precision displacement slide a12 and the linear precision displacement slide d41 are combined Form a two-dimensional plane movement, adjust the relative position between the pressure block 30 adsorbed on the part adsorption head 28 and the CMOS circuit board 1, and adjust the distance between the pressure block 30 adsorbed on the part adsorption head 28 and the CMOS circuit board 1 by the precision turntable a26 After alignment, the pressure block 30 adsorbed on the part adsorption head 28 is driven by the linear precision displacement slide b15 to move downward, and the pressure block 30 is stacked on the CMOS circuit board 1. After the assembly is completed, the linear precision The displacement slide b15 drives the part adsorption head 28 to move upwards to restore the initial position, and completes the assembly of the pressing block 30 . Among them, the mutual contact force between the pressure block 30 adsorbed on the part suction head 28 and the CMOS circuit board 1 is fed back in real time by the cylindrical force sensor 27 to ensure proper contact force without damaging parts and equipment. After the briquetting block 30 is assembled, the corner cylinder 38 rotates 90° and then presses down, and its pressing rod directly acts on the briquetting block 30, pressing the briquetting block 30 on the CMOS circuit board 1, and indirectly pressing the CMOS circuit board 1 on the CMOS circuit board 1. Adjust the gasket 2, and then press the adjusting gasket 2 indirectly on the star sensor bracket 3 to complete the compression of all parts. Wherein, the lower surface of the pressure block 30 is coated with a buffer material, so that the pressing force is evenly distributed on the back of the CMOS circuit board 1 to avoid damage to the CMOS circuit board 1 . This is the assembly process.

The fifth step is to measure the parallelism between the target surface of CMOS circuit board 1 and the reference plane of star sensor bracket 3: after CMOS circuit board 1 and adjusting gasket 2 are pressed on star sensor 3, measure the target surface of CMOS circuit board 1 and the star sensor bracket. Parallelism of the reference plane of the sensor bracket 3. The tooling locking module is driven by the linear precision displacement slide table d41 to move to the working position for detecting the parallelism of the target surface of the CMOS circuit board 1 and the reference plane of the star sensor bracket 3, and the V-shaped block 40 and its upper part have been adjusted by the precision turntable b42. The attitude of the CMOS circuit board 1 clamped by the corner cylinder 38, the adjustment gasket 2 and the star sensor bracket 3 assembly makes the target surface of the CMOS circuit board 1 and the standard surface of the star sensor bracket 3 face the combined laser displacement measuring head 7, by The three-axis precision displacement slide table 5 drives the combined laser displacement measuring head 7 to move, respectively measure the target surface of the CMOS circuit board 1 and the standard surface of the star sensor bracket 3, and transmit the data to the industrial computer to calculate the parallelism between the two planes. After the parallelism detection of the target surface of the CMOS circuit board 1 and the reference plane of the star sensor support 3 is completed, the precision turntable b42 drives and adjusts the V-shaped block 40 and the CMOS circuit board 1 and the adjustment gasket 2 clamped by the corner cylinder 38 on it. The posture of the assembly with the star sensor bracket 3 makes the target surface of the CMOS circuit board 1 and the standard surface of the star sensor bracket 3 return to a vertically downward state. If the parallelism detection of the target surface of CMOS circuit board 1 and the reference plane of star sensor bracket 3 is qualified, the screw lock payment process is performed; if the parallelism detection of the target surface of CMOS circuit board 1 and the reference plane of star sensor bracket 3 is unqualified, then three The adjustment amount of each adjusting gasket 2 is recorded and fed back to the operator, and then the assembly and adjustment module is used to unload the pressing block 30, the CMOS circuit board 1 and the adjusting gasket 2. Grind and process the adjustment shim 2, and then reassemble and adjust the measurement after processing. At this stage when the assembly process is stopped, the equipment can continue to measure the parallelism of another set of new parts, avoiding time-consuming and invalid waiting, and at the same time achieving the effect of batch measurement. This is the inspection process.

Step 6: If the accuracy requirements are met, perform CMOS circuit board 1 locking: After the parallelism of the target surface of CMOS circuit board 1 and the reference plane of star sensor bracket 3 is qualified, perform CMOS circuit board 1 locking. The tooling locking module moves to the locking position of CMOS circuit board 1 under the drive of the linear precision displacement slide d41, and the locking module moves to the adsorption and retrieving position on the screw feeder 24 under the drive of the linear precision displacement slide a12 , the screw adsorption head 23 in the lock payment module is driven by the slide cylinder 17 to move downward, and the screw is adsorbed and picked up. Movement to complete the adsorption and retrieving of the screw. Among them, the position of the screw is fixed for each adsorption and pickup, and the screw outlet of the screw feeder 24 has been adjusted and aligned in advance, and the locking module is driven by the linear precision displacement slide a12 to move to the same position each time for adsorption and pickup. materials without visual positioning feedback. After the screw is absorbed and picked up, the locking module moves to the CMOS circuit board 1 locking position driven by the linear precision displacement slide a12. With the assistance of the industrial camera b13, the linear precision displacement slide a12 and the linear precision displacement The slide table d41 is combined to form a two-dimensional plane movement, adjust the relative position between the screw suction head 23 in the locking module and the assembly hole on the star sensor bracket 3, after alignment, the slide table cylinder 17 drives the screw suction head 23 And the screw adsorbed on it moves downward, and then the push rod of the locking cylinder 18 pushes the electric screwdriver bracket 22 and the electric screwdriver 21 installed on it to move downward under the guidance of the linear guide rail 20, and the screw is pushed out of the screw adsorption head 23. Lock the CMOS circuit board 1 and the adjusting spacer 2 on the star sensor bracket 3, and then complete the picking and locking of the remaining two screws in sequence, complete the locking and payment of the CMOS circuit board 1, and finally reset each module of the device, by The operator removes the locked CMOS circuit board 1, adjusting gasket 2 and star sensor bracket 3 assembly to complete the assembly;

If the accuracy requirements are not met, after the grinding of the adjustment gasket 2 is completed, repeat the parts loading, the assembly of the adjustment gasket 2, the assembly of the CMOS circuit board 1, the compression of the CMOS circuit board 1 and the adjustment gasket 2, and the target surface of the CMOS circuit board 1. Hexing sensor bracket 3 reference plane parallelism detection process, if the accuracy requirements are still not met after the detection, the adjustment amount is calculated, the material is cut and re-grinded, and the CMOS circuit board 1 is locked until the detection result meets the installation tilt range requirements. Complete the entire assembly process. So far it is the locking process.

The present invention has the following beneficial effects:

a. In addition to manual loading before assembly, the assembly and adjustment process can be automatically controlled by a program to improve assembly efficiency and avoid errors caused by manual assembly;

b. The installation and adjustment process is visible, and the target surface adjustment and hole position alignment can be fed back by visual technology, and the precision displacement slide table cooperates with the precision turntable to realize automatic adjustment and alignment functions;

c. It can not only complete the whole assembly process at one time, but also perform batch measurement while waiting for the grinding process, which has dual functions.

Description of drawings

Figure 1(a) and Figure 1(b) are the decomposition and overall schematic diagram of the star sensor parts;

Figure 2 is an overall schematic diagram of the front of the installation and adjustment equipment;

Figure 3 is an overall schematic diagram of the back of the assembly and adjustment equipment;

Fig. 4 is a schematic diagram of the measurement module;

Figure 5 is a schematic diagram of the tooling locking module;

Figure 6 is a schematic diagram of the assembly and adjustment module.

In the figure: 1CMOS circuit board; 2Adjusting gasket; 3Star sensor bracket; 4Optical platform; ;9 measurement component bracket; 10 industrial camera a; 11 profile bracket; 12 linear precision displacement slide a; 13 industrial camera b; Cylinder; 18 lock cylinder; 19 lock component base; 20 linear guide rail; 21 electric screwdriver; 22 electric screwdriver bracket; 23 screw suction head; 24 screw feeder; 25 screw feeder base; 26 precision turntable a; 27 Cylindrical force sensor; 28 parts adsorption head; 29 material tray; 30 press block; 31 linear precision displacement slide table c; 32 feeding component base; 33 bearing with seat; 34 rotating shaft support; 35 rotating shaft; 37 fixture assembly base; 38 corner cylinder; 39 mirror; 40V block; 41 linear precision displacement slide table d; 42 precision turntable b;

Detailed ways

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

The structure of the star sensor parts is shown in Figure 1(a) and Figure 1(b), and the assembly and adjustment equipment used in the method of the present invention is specifically shown in Figure 2, Figure 3, Figure 4, Figure 5 and Figure 6.

Before assembly, the part star sensor bracket 3 is mounted and clamped on the tooling locking module through the V-shaped block 40 and the guide rod cylinder 36; the material tray 29 is horizontally installed on the linear precision displacement slide table c31, and the CMOS circuit board 1 and The adjusting gasket 2 is placed on the material tray 29 with a certain pre-limit position to complete the loading of the parts to be assembled.

The position and posture of the parts to be assembled are acquired by the industrial camera b13, so as to realize the linear precision displacement slide table a12 to drive the part adsorption head 28 to move accurately to the pick-up position, and the feedback of the linear precision displacement slide table a12 and the part adsorption head 28 on the industrial camera b13 The automatic and accurate adsorption and retrieving of the three adjusting pads 2 and the CMOS circuit board 1 is completed twice in two steps (the CMOS circuit board 1 needs to be placed above the adjusting pad 2, and the three adjusting pads 2 are first picked up at one time). After the parts are picked up, when the adjustment shims 2 are assembled, the linear precision displacement slides a12, c31 and the precision turntable a26 adjust the position and posture of the parts under the feedback of the industrial camera b13, so as to ensure that the three adjustment shims 2 are placed accurately In the preset hole position of the star sensor bracket 3; when assembling the CMOS circuit board 1, the industrial camera a10 observes the edge of the bottom reference plane of the star sensor bracket 3 and the CMOS circuit board from bottom to top through the 45° mirror 39 The edge of the target surface in 1 is rotated by the precision turntable a26 to adjust the attitude of the target surface, so as to meet the installation tilt range requirements of the x and y axes of the pixel point rectangle in the target surface relative to the edge of the reference surface, and at the same time ensure that the CMOS circuit board 1 Align the installation holes on the upper part to avoid affecting the subsequent locking process. After the adjustment is completed, assemble it.

After the assembly of the adjusting gasket 2 and the CMOS circuit board 1 is completed, screw locking cannot be performed directly. It is necessary to check whether the parallelism between the target surface of the CMOS circuit board 1 and the reference plane of the star sensor bracket 3 meets the accuracy requirements, so the corner cylinder 38 is used The way on the pressure block 30 maintains the current state of the assembly, and the measurement of the reference plane and the target plane is completed through the combination of the precision turntable b42 and the combined laser displacement measuring head 7 . The specific process is as follows: the linear precision displacement slide table a12 drives the part adsorption head 28 to move to the pick-up position, absorbs the pressing block 30 and stacks it on the CMOS circuit board 1, wherein the position corresponding to the screw hole on the pressing block 30 is slotted The pressure is measured by the cylindrical force sensor 27 during stacking, and the force signal is transmitted to the industrial computer through the control circuit to realize closed-loop control; the corner cylinder 38 acts on the pressing block 30 to press the CMOS circuit board 1 Tight, to ensure that subsequent actions do not affect assembly accuracy and reduce damage to parts. The precision turntable b42 drives the star sensor assembly on the V-shaped block 40 to rotate 90°, and the reference plane and the target surface face the measurement module, and the combined laser displacement measuring head 7 completes the alignment between the reference plane and the target surface under the movement of the three-axis precision displacement slide table 5. For the measurement of the target surface, the algorithm calculates the parallelism between the target surface and the reference plane.

After the parallelism detection is completed, if the accuracy requirements are met, the screw locking process will be carried out; if the accuracy requirements are not met, the adjustments of the three adjusting shims 2 will be calculated and recorded and fed back to the operator, and then the assembly and adjustment module will successively place the pressing blocks 30 , The CMOS circuit board 1 and the adjusting gasket 2 are unloaded, and the adjusting gasket 2 is taken away by the operator for grinding and processing, and then reassembled for adjustment and measurement after processing. At this stage when the assembly process is stopped, the equipment can continue to measure the parallelism of another set of new parts, avoiding time-consuming and invalid waiting, and at the same time achieving the effect of batch measurement.

Satisfy the precision requirement, continue to lock the CMOS circuit board 1 directly, the precision turntable b42 rotates the star sensor assembly 90° so that the target surface of the CMOS circuit board 1 and the standard surface of the star sensor bracket 3 return to the vertical downward state, straight line The precision displacement slide d41 drives the star sensor assembly to move to the locking position; the linear precision displacement slide a12 drives the lock module to move to the adsorption and retrieving position, and the slide cylinder 17 drives the screw adsorption head in the lock module 23 moves downwards, and vacuum absorbs and picks up materials. Among them, the screw feeder 24 realizes automatic screw feeding; then the linear precision displacement slide a12 and the slide cylinder 17 drive the locking module to move to the locking working position. Driven by the locking cylinder 18, the screwdriver 21 locks the screw on the star sensor assembly, repeats three times to lock the CMOS circuit board 1; the linear precision displacement slide table d41 drives the assembly back to the blanking position, and the corner cylinder 38 and guide rod cylinder 36 are loose and pre-tightened, and the operator takes the material and completes the assembly.

If the accuracy requirements are not met, it is necessary to wait for the grinding of the adjusting gasket 2 to be completed, then repeat the parts loading, the assembly of the adjusting gasket 2, the assembly of the CMOS circuit board 1, the pressing of the CMOS circuit board 1 and the adjusting gasket 2, and the target of the CMOS circuit board 1 The parallelism detection process of the surface and the star sensor bracket 3 reference plane, if the accuracy requirements are still not met after the detection, the adjustment amount is calculated, the material is cut and re-grinded, and the CMOS circuit board 1 is locked until the detection result meets the installation tilt range requirements. , to complete the entire assembly process.

The invention relates to an automatic assembly and adjustment method for a target surface of a CMOS circuit board of a star sensor of an aerospace device. The present invention is not limited to the automatic assembly of star sensor parts, the adaptability of the method can be enhanced by modifying part of the assembly and adjustment process, and the assembly and adjustment of parts of other specifications can still use this assembly and adjustment method.

Claims (1)

1. A method for automatic assembly and adjustment of the target surface of a star sensor CMOS circuit board, characterized in that the assembly and adjustment equipment adopted is mainly composed of a feeding module, a measurement module, an assembly and adjustment module and a tooling locking module, wherein three modules The bottom of each is installed on the optical platform (4), from left to right are the measurement module, the tooling locking module and the feeding module, while the assembly and adjustment module adopts a gantry structure horizontally above the equipment to realize the automatic locking of parts. Additional functions; The measurement module is mainly composed of a three-axis precision displacement slide table (5), a measuring head support a (6), a combined laser displacement measuring head (7), a measuring head support b (8), a measuring component bracket (9 ) and industrial camera a (10); the bottom of the probe support a (6) and probe support b (8) is installed on one side of the measurement component bracket (9), and the industrial camera a (10) is installed On the other side of the measurement component bracket (9), the measurement component bracket (9) is installed on the Z-axis of the three-axis precision displacement slide table (5), and the bottom of the three-axis precision displacement slide table (5) is installed on the optical table (4) Above, the combined laser displacement measuring head (7) is locked front and rear by the measuring head support a (6) and the measuring head support b (8). Among them, the combined laser displacement measuring head (7) is installed by three small The three are arranged in an equilateral triangle shape; the combined laser displacement measuring head (7) realizes the target surface and the star of the CMOS circuit board (1) after the CMOS circuit board (1) is assembled. The measurement function of the parallelism of the reference plane under the sensor bracket (3); when the industrial camera a (10) is assembled on the CMOS circuit board (1), it realizes the pixel point rectangular target surface edge on the CMOS circuit board (1) Hexing sensor bracket (3) has the function of measuring the parallelism of the datum plane edge; the three-axis precision displacement slide table (5) has three-dimensional linear motion capability, and realizes the adjustment of the combined laser displacement measuring head (7) and industrial camera a (10) Functionality of different measuring positions; The tooling locking module is mainly composed of a bearing with seat (33), a rotating shaft support (34), a rotating shaft (35), a guide rod cylinder (36), a clamp assembly base (37), a corner cylinder (38), a reflective Mirror (39), V-shaped block (40), linear precision displacement slide table d (41), precision turntable b (42) and tooling locking assembly bracket (43); described tooling locking assembly bracket (43) is U-shaped structure, the reflector (39) is installed in the middle, the bearing with seat (33) is installed on the side of one end, the precision turntable b (42) is installed on the side of the other end, and the bottom is installed on the linear precision displacement slide table On d (41), the bottom of the linear precision displacement slide table d (41) is installed on the optical platform (4); the base of the clamp assembly (37) is an L-shaped structure, and one end is equipped with a rotating shaft support (34), and the rotating shaft One end of (35) passes through the opening of the rotating shaft support (34) and is locked and fixed, and the other end of the rotating shaft (35) passes through and is fixed in the belt seat bearing (33); the clamp assembly base (37) The other end is installed on the turntable surface of the precision turntable b (42); the guide rod cylinder (36) is installed on one end of the clamp assembly base (37), and the corner cylinder (38) is vertically installed on the clamp assembly base (37) ) middle part, the V-shaped block (40) is installed on the other end side of the clamp assembly base (37); the reflector (39) realizes the observation of the CMOS circuit board (1) from bottom to top by the industrial camera a (10) on the side ) function of the rectangular target surface of pixels and the reference plane of the star sensor bracket (3); The precision turntable b (42) forms a swing-like rotating structure. Driven by the precision turntable b (42), the fixture assembly base (37) and the star sensor bracket (3) parts and shaft support (34) on it are , the rotating shaft (35), the guide rod cylinder (36), the angle cylinder (38) and the V-shaped block (40), which rotate around the rotating shaft of the precision turntable b (42), realize the adjustment of the CMOS circuit board ( 1), the function of adjusting gasket (2) and star sensor bracket (3) parts attitude; the V-shaped block (40) is adapted to the outer contour design of star sensor bracket (3), and the star sensor bracket (3) ) to realize the function of positioning in the positioning and clamping; the ejector rod of the guide rod cylinder (36) moves telescopically along the opening direction of the V-shaped block (40), and realizes the clamping in the positioning and clamping of the star sensor bracket (3) Function; the corner cylinder (38) is locked after rotating 90° around its own rotating shaft to realize the locking function of the CMOS circuit board (1) after the CMOS circuit board (1) is adjusted and assembled; the linear precision displacement slide table d ( 41) Displacement in a single direction to realize the function of adjusting the working position and assembly adjustment of the parts on it; The adjustment module is mainly composed of a profile bracket (11), a linear precision displacement slide a (12), a slide bracket (16), an adjustment module and a locking module; the slide bracket (16 ) is a U-shaped structure, and its two ends are respectively installed with an adjustment module and a locking module, the middle part is installed on the linear precision displacement slide a (12), and the bottom of the linear precision displacement slide a (12) is installed on the profile On the support (11), the bottom of the profile support (11) is installed on the optical platform (4); the assembly and adjustment module is mainly composed of an industrial camera b (13), an assembly assembly support (14), a linear precision displacement slide table b (15), precision turntable a (26), cylindrical force sensor (27) and parts suction head (28); the top of the parts suction head (28) is installed on the bottom of the cylindrical force sensor (27), and the cylindrical force sensor The top of the sensor (27) is installed on the turntable surface at the bottom of the precision turntable a (26), the top of the precision turntable a (26) is installed on the installation surface at the bottom of the assembly bracket (14), and the industrial camera b (13) is installed on the bottom of the assembly On the adjustment component bracket (14), the side of the adjustment component bracket (14) is installed on the table surface of the linear precision displacement slide table b (15), and the linear precision displacement slide table b (15) is installed on the side surface of the slide table bracket (16) The lock payment module is mainly composed of slide table cylinder (17), lock payment cylinder (18), lock payment assembly base (19), linear guide rail (20), electric screwdriver (21), electric screwdriver support (22) and screw suction head (23); the electric screwdriver (21) is installed on the electric screwdriver bracket (22), the electric screwdriver bracket (22) is an L-shaped structure, and its side is installed on the linear guide rail (20), and the linear guide rail ( 20) The bottom is installed on the lock assembly base (19), the lock assembly base (19) is an L-shaped structure, its side is installed on the table of the slide table cylinder (17), and the bottom of the slide table cylinder (17) is installed on the slide table On the side of the support (16), the locking cylinder (18) is fixedly mounted on the locking component base (19), its ejector rod is connected and installed with the electric screwdriver bracket (22), and the screw suction head (23) is installed At the bottom of the lock assembly base (19); the linear precision displacement slide a (12), the linear precision displacement slide b (15) and the linear precision displacement slide d (41) are combined to form a three-dimensional motion for parts picking and assembly Structure; the linear precision displacement slide table a (12), the slide table cylinder (17) and the linear precision displacement slide table d (41) are combined to form a three-dimensional motion structure in the process of screw adsorption and retrieving and parts locking; the precision turntable a (26) drives the parts adsorbed on the part suction head (28) to rotate around the axis of rotation, which realizes the adjustment of the parallelism between the edge of the rectangular target surface of pixels on the CMOS circuit board (1) and the edge of the reference plane of the star sensor support (3) function; the industrial camera b (13) realizes the function of identifying the position of the part to be assembled; the cylindrical force sensor (27) feeds back the contact force between the part adsorption head (28) and the part in real-time during the assembly process, so as to avoid contact Insufficient parts will fail to be picked up, and excessive contact force will be avoided to damage parts and equipment; the locking module realizes screw adsorption and parts locking functions, wherein the locking cylinder (18) realizes driving the electric screwdriver bracket (22) And the upper and lower electric screwdriver (21) has the function of reciprocating up and down movement, the linear guide rail (20) realizes the guiding function of the electric screwdriver bracket (22) and the upper electric screwdriver (21) and up and down reciprocating movement, and the screw adsorption head (23) Realize the screw adsorption and retrieving function provided by the screw feeder (24); The feeding module is mainly composed of a screw feeder (24), a screw feeder base (25), a feeding tray (29), a pressing block (30), a linear precision displacement slide table c (31) and a feeding assembly The base (32) is composed of; the bottom of the screw feeder (24) is installed on the screw feeder base (25), and the bottom of the screw feeder base (25) is installed on the optical table (4); (29) The bottom is installed on the linear precision displacement slide table c (31), the bottom of the linear precision displacement slide table c (31) is installed on the feeding assembly base (32), and the bottom of the feeding assembly base (32) is installed on the optical table (4) above; the briquetting block (30) is placed on the fixed area on the tray; the screw feeder (24) realizes the feeding function of the screw; the tray (29) is adapted to the CMOS circuit board (1 ), the holes on the adjusting gasket (2) and the pressure block (30) are designed with a boss-shaped limiting structure, so that the three adjusting gaskets (2) are directly placed in a triangular distribution on the material tray (29) , so that the adjusting gasket (2) and the briquetting block (30) are placed on the plane of the material tray (29) and are restricted by the position-limiting structure, without excessive rotation, which is convenient for the adsorption and picking of the parts adsorption head (28); the described The bottom of the briquetting block (30) is coated with buffer material. After the CMOS circuit board (1) is installed, the briquetting block (30) is picked up by the assembly module and pressed onto the CMOS circuit board (1), and then the corner cylinder (38) Press the pressing block (30) to prevent the corner cylinder (38) from directly pressing on the CMOS circuit board (1) to damage parts, and because the screw lock is eventually required between the CMOS circuit board (1) and the star sensor bracket (3) Tight, so after the pressing block (30) compresses the CMOS circuit board (1), an opening structure is designed corresponding to the position of the screw hole on the CMOS circuit board (1), so as to ensure that the screw lock is not affected under the compressed state; Taking the parallelism detection process as the demarcation point, the automatic assembly and adjustment method of the star sensor CMOS circuit board target surface is divided into three processes, which are the assembly process, the inspection process, and the locking process. The specific steps are as follows: The first step, parts loading: before assembly, manually place the star sensor bracket (3) on the V-shaped block (40) of the tooling locking module for positioning, and use the push rod of the guide rod cylinder (36) to position the star sensor The device bracket (3) is clamped in the V-shaped block (40); then the briquetting block (30), the CMOS circuit board (1) and the adjusting gasket (2) of the parts to be assembled are placed on the material tray ( 29) to complete the feeding; wherein, the material tray (29) corresponds to the hole positions on the CMOS circuit board (1), the adjustment spacer (2) and the pressure block (30), and is designed with a boss-shaped stop structure , so that the three adjusting shims (2) are placed directly on the tray (29) in a triangular distribution, so that the adjusting shims (2) and the pressure block (30) are placed on the plane of the tray (29) and are limited by the structure limit, without excessive rotation, which is convenient for the adsorption and picking of the parts adsorption head (28); The second step is the assembly of the adjusting gasket (2): after the loading is completed, the adjusting gasket (2) is assembled; the assembly and adjustment component moves to the adjusting gasket (2) under the drive of the linear precision displacement slide a (12) Pick up the working position, with the assistance of the industrial camera b (13), the combination of the linear precision displacement slide a (12) and the linear precision displacement slide c (31) forms a two-dimensional plane movement, adjust the part suction head (28) and Adjust the relative position between the shims (2), adjust the relative posture between the part suction head (28) and the adjustment shim (2) by the precision turntable a (26), after alignment, use the linear precision displacement slide b (15) Drive the part adsorption head (28) to move downwards, and absorb and take out the adjusting gasket (2). The upper adjusting gasket (2) moves upwards to complete the retrieving of the adjusting gasket (2); wherein, the mutual contact force between the part adsorption head (28) and the adjusting gasket (2) when contacting and retrieving is determined by the cylindrical force sensor ( 27) Real-time feedback to ensure the contact force without damaging parts and equipment; the mutual positions of the three adjusting gaskets (2) have been adjusted by the triangular-shaped boss-shaped structure on the material tray (29) during feeding. The position is limited to realize the single adsorption of the part suction head (28) to pick up three adjustment gaskets (2); ) assembly to adjust the working position, with the assistance of the industrial camera b (13), the two-dimensional plane motion is formed by the combination of the linear precision displacement slide table a (12) and the linear precision displacement slide table d (41), and the adjustment of the part adsorption head (28 ) on the relative position between the adjusting gasket (2) adsorbed on the star sensor bracket (3) and the assembly hole on the star sensor bracket (3), the adjusting gasket (2) adsorbed on the part adsorption head (28) is adjusted by the precision turntable a (26) ) and the mounting hole on the star sensor bracket (3), after alignment, the adjusting gasket (2) adsorbed on the part adsorption head (28) is driven by the linear precision displacement slide b (15) to Move downward, assemble the adjusting gasket (2) on the assembly hole of the star sensor bracket (3), after the assembly is completed, the linear precision displacement slide table b (15) drives the part suction head (28) to move upward to restore the initial state position, to complete the assembly of the adjusting gasket (2); among them, the mutual contact force between the adjusting gasket (2) adsorbed on the part adsorption head (28) and the assembly hole position on the star sensor bracket (3) is determined by the cylindrical The force sensor (27) provides real-time feedback to ensure contact force without damaging parts and equipment; The third step, CMOS circuit board (1) assembly: After the adjustment gasket (2) is assembled, the CMOS circuit board (1) is assembled; the assembly and adjustment module moves to the CMOS circuit under the drive of the linear precision displacement slide a (12) The plate (1) absorbs and picks up the working position. With the assistance of the industrial camera b (13), the two-dimensional plane movement is formed by the combination of the linear precision displacement slide a (12) and the linear precision displacement slide c (31) to adjust the adsorption of parts. The relative position between the head (28) and the CMOS circuit board (1) is adjusted by the precision turntable a (26) to adjust the relative posture between the part adsorption head (28) and the CMOS circuit board (1). The precision displacement slide table b(15) drives the part suction head (28) to move downward, and absorbs and takes out the CMOS circuit board (1). After the material is successfully taken out, the linear precision displacement slide table b(15) drives the part suction head (28) drives upward movement of CMOS circuit board (1) on it, completes CMOS circuit board (1) retrieving; Wherein, the mutual contact force when parts suction head (28) contacts with CMOS circuit board (1) is reclaimed, by The cylindrical force sensor (27) provides real-time feedback to ensure the contact force without damaging parts and equipment; after the material is taken out, the assembly and adjustment module moves to the assembly and adjustment of the CMOS circuit board (1) driven by the linear precision displacement slide a (12) In the working position, with the assistance of the industrial camera a (10) and the industrial camera b (13), the two-dimensional plane movement is formed by the combination of the linear precision displacement slide table a (12) and the linear precision displacement slide table d (41), and the parts are adjusted The relative position between the CMOS circuit board (1) adsorbed on the adsorption head (28) and the mounting holes on the star sensor bracket (3) is adjusted by the precision turntable a (26). Parallelism between the edge of the rectangular target surface of the pixel point of the circuit board (1) and the edge of the reference plane of the star sensor support (3); wherein, the industrial camera a (10) is on the side, and is observed from bottom to top by a mirror (39) CMOS circuit board (1) pixel rectangular target surface edge and star sensor bracket (3) reference plane edge, auxiliary precision turntable a (26) to adjust the attitude of the edge parallelism, industrial camera b (13) at the top, automatically Observe the assembly holes on the star sensor bracket (3) from top to bottom, and assist the linear precision displacement slide table a (12) and the linear precision displacement slide table d (41) to carry out the CMOS circuit board (1) and the star sensor bracket (3) ) between position adjustments; after the position and posture adjustment is completed, the CMOS circuit board (1) adsorbed on the part adsorption head (28) is driven by the linear precision displacement slide table b (15) to move downward, and the CMOS circuit board (1) Stacked on the adjusting gasket (2), after the assembly is completed, the linear precision displacement slide table b (15) drives the part adsorption head (28) to move upward to restore the original position, and completes the assembly of the CMOS circuit board (1); among them, the part The mutual contact force between the CMOS circuit board (1) adsorbed on the suction head (28) and the adjusting gasket (2) during assembly is fed back in real time by the cylindrical force sensor (27) to ensure the contact force without damaging parts and equipment; The fourth step is to compress the CMOS circuit board (1) and the adjusting spacer (2): after the CMOS circuit board (1) is assembled, it needs to be compressed and fixed by the corner cylinder (38). The block (30) is used as an intermediate buffer part; the assembly and adjustment module is driven by the linear precision displacement slide a (12) to move to the working position of the pressing block (30) for adsorption and picking, and with the assistance of the industrial camera b (13), the linear precision The displacement slide a (12) and the linear precision displacement slide c (31) are combined to form a two-dimensional plane movement, and the relative position between the part adsorption head (28) and the pressing block (30) is adjusted, and the precision turntable a (26) Adjust the relative attitude between the part suction head (28) and the pressing block (30). Carry out adsorption and retrieving, after the retrieving is successful, the part adsorption head (28) is driven by the linear precision displacement slide b (15) to drive the upper briquetting block (30) to move upwards, and the retrieving of the briquetting block (30) is completed; wherein, the parts The mutual contact force between the suction head (28) and the briquetting block (30) is fed back in real time by the cylindrical force sensor (27) to ensure the contact force without damaging parts and equipment; Driven by the linear precision displacement slide a (12), it moves to the assembly and adjustment working position of the pressure block (30). With the assistance of the industrial camera b (13), the linear precision displacement slide a (12) and the linear precision displacement slide The combination of d(41) forms a two-dimensional plane movement, adjusts the relative position between the pressure block (30) adsorbed on the part adsorption head (28) and the CMOS circuit board (1), and adjusts the part adsorption head by the precision turntable a(26) The relative posture between the briquetting block (30) adsorbed on (28) and the CMOS circuit board (1), after alignment, the briquetting block adsorbed on the part adsorption head (28) is driven by the linear precision displacement slide b (15) (30) moves downward, and stacks the pressing block (30) on the CMOS circuit board (1). After the assembly is completed, the linear precision displacement slide table b (15) drives the part suction head (28) to move upward to restore the initial position , complete the assembly of the briquetting block (30); wherein, the mutual contact force between the briquetting block (30) adsorbed on the part adsorption head (28) and the CMOS circuit board (1) is fed back in real time by the cylindrical force sensor (27) , to ensure the contact force without damaging parts and equipment; after the briquetting block (30) is assembled, the corner cylinder (38) is rotated 90° and then pressed down, and its pressing rod directly acts on the briquetting block (30), and the briquetting block (30 ) on the CMOS circuit board (1), indirectly press the CMOS circuit board (1) on the adjusting gasket (2), and then indirectly compress the adjusting gasket (2) on the star sensor bracket (3) above, complete the pressing of all parts; wherein, the lower surface of the pressing block (30) is coated with a buffer material, so that the pressing force is evenly distributed on the back of the CMOS circuit board (1), avoiding damage to the CMOS circuit board (1); This is the assembly process; The fifth step is to check the parallelism between the target surface of the CMOS circuit board (1) and the reference plane of the star sensor bracket (3): after the CMOS circuit board (1) and the adjusting gasket (2) are pressed tightly on the star sensor (3) , to measure the parallelism between the target surface of the CMOS circuit board (1) and the reference plane of the star sensor bracket (3); the tooling locking module moves to the target surface of the CMOS circuit board (1) and The star sensor support (3) is used to detect the working position of the parallelism of the reference plane, and the precision turntable b (42) is used to drive and adjust the V-shaped block (40) and the CMOS circuit board (1) that has been clamped by the corner cylinder (38). Adjust the posture of the gasket (2) and the star sensor bracket (3) assembly so that the target surface of the CMOS circuit board (1) and the standard surface of the star sensor bracket (3) face the combined laser displacement measuring head (7). The shaft precision displacement slide table (5) drives the combined laser displacement measuring head (7) to move, respectively measure the target surface of the CMOS circuit board (1) and the standard surface of the star sensor bracket (3), and transmit the data to the industrial computer to calculate the two The parallelism between the planes, after the parallelism detection of the target surface of the CMOS circuit board (1) and the reference plane of the star sensor support (3), is driven by the precision turntable b (42) to adjust the V-shaped block (40) and the The attitude of the CMOS circuit board (1) clamped by the angle cylinder (38), the adjustment spacer (2) and the star sensor support (3) assembly make the CMOS circuit board (1) target surface and the star sensor support ( 3) The standard surface returns to the vertical downward state; if the parallelism of the target surface of the CMOS circuit board (1) and the reference plane of the star sensor bracket (3) is qualified, the screw locking process is carried out; if the CMOS circuit board (1) If the parallelism of the reference plane of the target surface and the star sensor bracket (3) fails to pass the test, the adjustment amount of the three adjustment shims (2) will be calculated and recorded and fed back to the operator. The circuit board (1) and the adjusting gasket (2) are unloaded. The specific steps are opposite to those of the assembly process. The operator removes the adjusting gasket (2) for grinding and processing, and then reassembles and adjusts the measurement; the assembly process stops At this stage, the equipment can continue to measure the parallelism of another group of new parts; so far it is the inspection process; The sixth step, if the accuracy requirements are met, carry out the CMOS circuit board (1) locking: after the CMOS circuit board (1) target surface and the star sensor bracket (3) have passed the parallelism test of the reference plane, carry out the CMOS circuit board (1) Locking; the tooling locking module moves to the locking working position of the CMOS circuit board (1) under the drive of the linear precision displacement slide table d (41), and the locking module moves to the locked position under the drive of the linear precision displacement slide table a (12). The adsorption and retrieving position on the screw feeder (24) is driven by the slide table cylinder (17) to move the screw adsorption head (23) in the locking module downward to absorb and reclaim the screw. After retrieving the material successfully, The slide table cylinder (17) drives the screw suction head (23) and the screw adsorbed on it to move upwards to complete the adsorption and retrieving of the screw; wherein, the position of the screw is fixed each time the suction is picked up, and the screw feeder (24 ) of the screw discharge port to adjust the alignment, and the locking module is driven by the linear precision displacement slide a (12) to move to the same position each time for adsorption and retrieval without visual positioning feedback; after the screw adsorption and retrieval is completed , the locking module moves to the locking position of the CMOS circuit board (1) under the drive of the linear precision displacement slide a (12). With the assistance of the industrial camera b (13), the linear precision displacement slide a (12 ) and the linear precision displacement slide table d(41) are combined to form a two-dimensional plane movement, adjust the relative position between the screw adsorption head (23) in the locking module and the assembly hole on the star sensor bracket (3), and align Finally, the screw suction head (23) and the screw adsorbed on it are driven downward by the slide table cylinder (17), and then the push rod of the locking cylinder (18) pushes the electric screwdriver bracket (22) and the electric screwdriver bracket (22) installed on it. The screwdriver (21) moves downward under the guidance of the linear guide rail (20), pushes the screw out of the screw suction head (23), and locks the CMOS circuit board (1) and the adjusting gasket (2) on the star sensor bracket ( 3) on, and then complete the picking and locking of the remaining two screws in sequence, complete the locking of the CMOS circuit board (1), and finally reset each module of the device, and the operator removes the locked CMOS circuit board (1), adjusts Gasket (2) and star sensor bracket (3) assembly, complete assembly; If the accuracy requirements are not met, after the grinding of the adjusting gasket (2) is completed, repeat the parts loading, adjusting gasket (2) assembly, CMOS circuit board (1) assembly, CMOS circuit board (1) and adjusting gasket (2) ) compression, CMOS circuit board (1) target surface and star sensor bracket (3) datum plane parallelism detection process, if the accuracy requirements are still not met after detection, the adjustment amount is calculated, the material is cut and re-grinded until the detection result is Satisfy the requirements of the installation tilt range, carry out the locking of the CMOS circuit board (1), and complete the entire assembly and adjustment process; so far is the locking process.