CN115338338A - A MEMS probe fixing device and leveling process method - Google Patents

Abstract

The invention relates to a MEMS probe fixing device, which includes a posture adjustment mechanism and a probe limit mechanism arranged on the posture adjustment mechanism. The probe limit mechanism includes a driving support seat arranged on the posture adjustment mechanism. An ultrasonic cavity is provided, and a MEMS probe limit base is arranged in the ultrasonic cavity; a probe limit slot for limiting and storing the MEMS probe is arranged on the MEMS probe limit base; the lower part of the MEMS probe limit base is also set Has a magnetic chuck. The invention provides a MEMS probe fixing device and a leveling process method, which can arrange the MEMS probes in the probe limiting groove in an orderly manner, facilitate positioning and assist in the straightening and flattening of the MEMS probes.

Description

A MEMS probe fixing device and leveling process method

technical field

The invention relates to the field of mechanical processing, in particular to a MEMS probe fixing device and a leveling process method.

Background technique

In the field of semiconductor testing, probe cards are an important tool for chip testing. With the increase of the number of chips per unit area on the wafer, the pitch of chip pins continues to shrink, and the minimum pitch of chip pins can reach 40 μm. In order to meet the needs of chip detection, it is necessary to use MEMS probes for detection.

The size of the MEMS probe is very small (minimum cross-section 30μm*30μm), and the MEMS probe manufactured by using the MEMS process has a network structure (MEMS is a micro-electromechanical system), which needs to be tested to determine good products and mark defective products. Cut and remove good quality probes.

Since the probe after MEMS processing is in a warped state under natural pressure-free state, the next step of probe detection, probe cutting, etc. cannot be performed, and the MEMS probe needs to be positioned and fixed.

Conventional MEMS probe fixing and leveling methods include vacuum adsorption, glass cover pressing and other methods.

The problem with the vacuum adsorption method is that the size of the probe is too small, smaller than the size of the adsorption hole of the vacuum adsorption plate, and cannot be adsorbed, fixed, and leveled.

The problem with the flattening of the glass cover is that the flatness of the glass cover cannot be guaranteed to be very high-precision, so that the probe cannot be fixed and leveled when the large-format probe is flattened, and this contact pressure flattening will have a negative impact on the probe. The needle causes certain crushing damage, and the flattening and fixing of the probe cannot be guaranteed.

Aiming at the above problems, combined with the MEMS probe structure and actual use requirements, a MEMS probe fixing device and leveling process method are invented. This device has the following functions.

Contents of the invention

The present invention overcomes the deficiencies of the prior art, and provides a MEMS probe fixing device and a leveling process method, which can place the MEMS probes in the probe limiting slot in an orderly manner, facilitate positioning and assist the alignment of the MEMS probes Smooth and flatten functions.

In order to achieve the above object, the technical solution adopted in the present invention is: a MEMS probe fixing device, including a posture adjustment mechanism, and a probe limit mechanism arranged on the posture adjustment mechanism, the probe limit mechanism includes a drive set in the attitude Adjust the support seat on the mechanism, the support seat is provided with an ultrasonic cavity, and the ultrasonic cavity is provided with a MEMS probe limit base; the MEMS probe limit base is provided with a probe limit slot for limiting the storage of the MEMS probe; The lower part of the MEMS probe limiting base is also provided with a magnetic chuck corresponding to the probe limiting groove.

In a preferred embodiment of the present invention, the probe limiting groove is provided with a limiting column for limiting the MEMS probe, and the structure of the limiting column and the MEMS probe is a male-female staggered matching structure.

In a preferred embodiment of the present invention, the limit post includes bar one and bar two arranged in a staggered manner; Tooth arrangement.

In a preferred embodiment of the present invention, the probe limiting mechanism is also provided with several brushes corresponding to the probe limiting slots; the brushes can swing and brush relative to the probe limiting slots.

In a preferred embodiment of the present invention, the upper part of the support seat is provided with a concave installation groove, and the magnetic chuck is arranged in the installation groove, and corresponds to the limit base of the MEMS probe; or/and, the attitude adjustment mechanism includes X-axis displacement The X-axis translation platform is driven by a Y-axis translation platform, and the Y-axis translation platform is driven by a probe limit mechanism.

In a preferred embodiment of the present invention, the MEMS probe includes several support beams arranged side by side at intervals, and one end of several probes is arranged side by side on the support beam at intervals in a comb arrangement; and several support beams are arranged at intervals in parallel Then connect through the positioning bracket.

In a preferred embodiment of the present invention, a MEMS probe leveling process method includes the following steps;

Step S1, initializing or resetting the device;

Step S2, placing the MEMS probe on the limit base of the MEMS probe;

Step S3, performing ultrasound, micro-displacement vibration, and brushing on the probe to align the probe and lock the probe;

Step S4, magnetically absorbing the probe and checking the attitude and position of the review probe;

Step S5, repeat steps 1 to 4, the number of repetitions is N times, and N is a natural number;

Step S6, correcting and cutting the probe;

Step S7, releasing the probe.

In a preferred embodiment of the present invention, in step S1, the initialization or reset process includes the following steps;

Step 1.1, the X-axis translation stage and the Y-axis translation stage move to the initial position;

Step 1.2, power off the strong magnetic suction plate to make it non-magnetic;

Step 1.3, the ultrasonic cavity is closed so that there is no ultrasonic vibration;

In step 1.4, the surface cleaning operation is performed on the limit base of the MEMS probe.

In a preferred embodiment of the present invention, step S2 includes the following steps;

Step 2.1, place the MEMS probe on the smooth silicon wafer, the smooth silicon wafer is the intermediate carrier for loading and transferring the MEMS probe;

In step 2.2, the MEMS probe is placed on the smooth silicon wafer along the groove of the limit base of the MEMS probe and the limit post.

In a preferred embodiment of the present invention, step S3 includes the following steps;

Step 3.1, the left and right micro-displacement jitter of the X-axis translation platform; the front and rear micro-displacement jitter of the Y-axis translation platform;

Step 3.2, turn on the ultrasonic wave, and vibrate ultrasonically; brush the probe; make the MEMS probe fall into the groove of the MEMS probe limit base;

Or/and, in step S4, including the following steps;

Step 4.1, the magnetic chuck is powered off, and the probe is strongly magnetically adsorbed;

Step 4.2, check whether there is a warped probe, if so, use a brush to move the probe to make it fall into the groove;

Step 4.3, MEMS probe positive detection; after the MEMS probe is leveled, move to the next step for positive detection as a whole; take out the MEMS probe after the positive detection;

Step 4.4, detection of the reverse side of the MEMS probe; repeat steps 1 to 5 to fix and level the reverse side of the MEMS probe;

Or/and, in step S6, include the following steps;

Step 6.1, after the probe detection, mark the good and bad products of the probe;

Step 6.2, according to the marking result, the probe is cut, the defective product is cut, and the good product is retained;

Or/and, in step S7, include the following steps;

The magnetic chuck is powered off, the magnetic force disappears, and the MEMS probe is removed for the next step of process operation.

The present invention solves the defective that exists in the background technology, the beneficial effect of the present invention:

(1) Provide a MEMS probe limiting base, which can limit the probes in the probe limiting slots, so that the probes can be separated from each other to prevent overlapping pins.

(2) The MEMS probe itself is made of ferromagnetic material. By providing a strong magnetic adsorption plate, the MEMS probe can be strongly adsorbed on the base, so that the warped probe can be fixed and leveled.

(3) By brushing the MEMS probe in a single direction reciprocating brush along the length of the probe, the MEMS probe can be straightened and flattened with a small number of warped MEMS probes.

(4) Provide a vibration platform formed by the combination of ultrasound and micro-displacement, which can vibrate the MEMS probe into the probe limit slot by means of ultrasound and vibration, and make it orderly placed in the probe limit slot ;

(5) Since the MEMS probe needs to detect the front and back sides, combined with the probe structure, the designed MEMS probe limit base can meet the requirements of the front and back limit of the probe, thus being compatible with the front and back detection requirements of the MEMS probe ;

(6) The MEMS probe is fixed and leveled by the leveling process method, which can provide a good position accuracy for the subsequent probe cutting and provide a good environment for the subsequent process.

Description of drawings

The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

Fig. 1 is a schematic diagram of the axis structure of the preferred embodiment of the present invention (MEMS probe limit base is set in the ultrasonic cavity);

Fig. 2 is the second structural schematic diagram of the preferred embodiment of the present invention (the MEMS probe limit base is not set in the ultrasonic cavity);

Fig. 3 is the top view structure schematic diagram of MEMS probe in the preferred embodiment of the present invention;

Fig. 4 is the axial view structure schematic diagram of MEMS probe in the preferred embodiment of the present invention;

Fig. 5 is a top view structural diagram of the MEMS probe limit base in a preferred embodiment of the present invention;

Fig. 6 is a schematic diagram of the axial view structure of the MEMS probe limit base in the preferred embodiment of the present invention;

Fig. 7 is a side view structural schematic diagram of the MEMS probe limit base in the preferred embodiment of the present invention;

Fig. 8 is a schematic top view structure diagram of a MEMS probe accommodated on a MEMS probe limiting base in a preferred embodiment of the present invention;

Fig. 9 is a schematic diagram of an axial view structure of a MEMS probe accommodated on a MEMS probe limiting base in a preferred embodiment of the present invention;

Fig. 10 is a schematic structural view of a magnetic chuck in a preferred embodiment of the present invention;

Fig. 11 is a schematic structural view of a brush in a preferred embodiment of the present invention;

Among them, 1-attitude adjustment mechanism, 11-X-axis translation stage, 111-linear motor 1, 12-Y-axis translation stage, 121-linear motor 2; 2-probe positioning mechanism, 21-support seat, 211-installation groove . Hole; 4-magnetic chuck, 5-MEMS probe, 51-support beam, 52-positioning frame, 53-probe, 6-brush.

Detailed ways

The present invention will now be further described in detail in conjunction with the accompanying drawings and embodiments. These drawings are all simplified schematic diagrams, only illustrating the basic structure of the present invention in a schematic manner, so it only shows the composition related to the present invention.

Embodiment one

The support beam 51 is a probe support beam, and the probes 53 are fixed together by the support beam 51 . The probe 53 processed by MEMS has a network structure. Since there is no back support, the probe 53 will warp due to stress. When placed on a plane, the plane formed by all the probes 53 will have unevenness.

As shown in FIGS. 1 to 11 , a MEMS probe fixing device includes an attitude adjustment mechanism 1 and a probe limit mechanism arranged on the attitude adjustment mechanism 1 . Further, the MEMS probe 5 positioned in the probe limit mechanism includes several support beams 51 arranged side by side at intervals, and one end of several probes 53 is arranged on the support beam 51 at intervals in a comb arrangement; and several The support beams 51 are arranged side by side at intervals and connected by a positioning frame 52 .

Specifically, the posture adjustment mechanism 1 includes an X-axis translation platform 11, on which a Y-axis translation platform 12 is driven and installed, and a probe limit mechanism is driven and installed on the Y-axis translation platform 12. And the X-axis displacement table 11 comprises a displacement frame one, and a screw mandrel one is pivotally arranged on the displacement frame one, and the screw mandrel one is driven and connected by a linear motor one 111 arranged at an end of the displacement frame one, and the screw mandrel one is driven and connected. The upper drive is provided with a sliding seat 1 slidably arranged on the displacement frame 1, and the sliding seat 1 is driven with a Y-axis displacement platform 12 . The Y-axis displacement table 12 includes a displacement frame two, and a screw rod two is pivotally arranged on the displacement frame two, and the screw rod two is driven and connected by a linear motor two 121 arranged at one end of the displacement frame two, and the screw rod two is connected The drive is provided with a slide seat 2 slidably arranged on the displacement frame 2, and the drive of the slide seat 2 is provided with a probe 53 positioning mechanism 2 .

Specifically, the probe limit mechanism includes driving the support seat 21 arranged on the slide seat 2 on the attitude adjustment mechanism 1. The support seat 21 is of a groove-shaped structure, and the concave installation groove 211 on the support seat 21 is provided with The magnetic chuck 4 , and the support base 21 is also provided with an ultrasonic chamber 22 corresponding to the magnetic chuck 4 , and a MEMS probe limit base 3 is arranged in the ultrasonic chamber 22 . The MEMS probe limiting base 3 includes a limiting seat 31 , which is provided with a probe limiting groove 32 in an annular structure and a mounting hole 34 located on the periphery of the probe limiting groove 32 . There are installation holes 34 around the MEMS probe limit base 3, which are fixed with the support base 1 by bolts. The MEMS probe limiting base 3 is provided with a probe limiting groove 32 , and the probe limiting groove 32 is designed as a groove structure, which is convenient for placing the MEMS probe 5 . A protruding limiting column 33 for limiting the MEMS probe 5 is disposed in the probe limiting groove 32 , and the structure of the limiting column 33 and the MEMS probe 5 is a male-female staggered matching structure. The limit column 33 includes a staggered bar one 331 and a bar two 332; . The outer shape of the limit post 33 meshes with the outer shape of the MEMS probe 5 to form a male-female structure, so that there is a physical distance between the MEMS probe 5 and the probe 53 to prevent pin overlapping.

Embodiment two

On the basis of the first embodiment, several brushes 6 corresponding to the probe limiting grooves 32 are also provided on the probe limiting mechanism. The brush 6 is driven and arranged above the probe limiting groove 32 through a swing mechanism. The brush 6 can swing and brush relative to the probe limiting groove 32 . The brush 6 is a kind of soft brush, which can reciprocate in one direction toward the length direction of the probe 53, so that the probe 53 with a large degree of warping is brushed into the MEMS probe limit base 3 by the brush 6, and then It is sucked by the strong magnetic chuck 4, thereby ensuring the flatness of the probe 53.

Or, in other embodiments, the brush 6 is driven and arranged above the probe limiting groove 32 through a displacement mechanism. The brush 6 can swing and brush relative to the probe limiting groove 32 .

Embodiment three

On the basis of embodiment one or embodiment two, a MEMS probe 5 leveling process method comprises the following steps;

Step S1, initialize or reset the device. Specifically, the initialization or reset process includes the following steps: step 1.1, the X-axis translation stage 11 and the Y-axis translation stage 12 in the attitude adjustment mechanism 1 move to the initial position; step 1.2, the strong magnetic suction plate is powered off, so that it cannot Magnetic force; step 1.3, closing the ultrasonic cavity 22 so that there is no ultrasonic vibration; step 1.4, performing surface cleaning operation on the MEMS probe limit base 3 .

In step S2 , the MEMS probe 5 is placed on the MEMS probe limiting base 3 . Step 2.1, place the MEMS probe 5 on the smooth silicon wafer, which is the intermediate carrier for loading and transferring the MEMS probe; Step 2.2, place the MEMS probe 5 on the smooth silicon wafer along the MEMS probe limit base 3 grooves, limit post 33 are placed.

Step S3 , performing ultrasound, micro-displacement vibration, and brushing with the brush 6 on the probe 53 to align the probe 53 and lock the probe 53 . Step 3.1, the left and right micro-displacement jitters of the X-axis translation table 11; the front and rear micro-displacement jitters of the Y-axis translation table 12; Step 3.2, the ultrasonic is turned on, and the ultrasonic vibration is used; the brush 6 brushes the MEMS probe 5; the MEMS probe 5 falls into the MEMS In the groove of the probe limit base 3. In step S3, the brushing of the brush 6 may be done manually, so that the brush 6 swings and brushes relative to the probe limiting groove 32 .

Or, in other embodiments, it is also possible to drive the brush 6 on the probe limit mechanism through a swing mechanism or a displacement mechanism, and drive the brush 6 to swing relative to the probe limit groove 32 through a swing mechanism or a displacement mechanism Brush or displacement brush.

Step S4, magnetically attracting the MEMS probe 5 and checking and rechecking the posture and position of the MEMS probe 5 . Step 4.1, the magnetic chuck 4 is powered off, and the MEMS probe 5 is attracted by strong magnetism; Step 4.2, check whether there is a warped probe 53, and if so, use the brush 6 to brush the MEMS probe 5 to make it fall into the groove ; Step 4.3, MEMS probe 5 positive detection; after MEMS probe 5 is leveled, move to the next process as a whole for positive detection; MEMS probe 5 is taken out after the positive detection; Step 4.4, MEMS probe 5 negative detection; repeat From step 1 to step 5, fix and level the reverse side of the MEMS probe 5 .

Step S5, repeat steps 1 to 4, and the number of repetitions is N times.

Step S6, correcting and cutting the MEMS probe 5; step 6.1, after the detection of the MEMS probe 5, marking the good and defective products of the MEMS probe 5; step 6.2, cutting the probe 53 according to the marking result, cutting the defective products, and keeping Good product.

Step S7, releasing the MEMS probe 5. The magnetic chuck 4 is powered off, the magnetic force disappears, and the MEMS probe 5 is removed to carry out the next process operation.

working principle:

A MEMS probe limiting base 3 is provided, which can limit the probe 53 in the probe limiting groove 32, so that the probe 53 is separated from the probe 53 to prevent overlapping needles; the MEMS probe 5 itself is Ferromagnetic material, by providing a strong magnetic adsorption plate, the MEMS probe 5 can be strongly adsorbed on the base, so that the warped probe 53 can be fixed and leveled; Brushing the MEMS probe 5 in a reciprocating manner can straighten and flatten a small number of MEMS probes 5 with large warpage. The vibration platform formed by the combination of ultrasound and micro-displacement can vibrate the MEMS probe 5 into the probe limiting groove 32 by means of ultrasound and vibration, and make it be arranged in the probe limiting groove 32 in an orderly manner. Since the MEMS probe 5 needs to detect the front and back sides, combined with the structure of the probe 53, the designed MEMS probe limit base 3 can meet the front and back limit requirements of the probe 53, so that it is compatible with the front and back detection of the MEMS probe 5 Testing needs. Fixing and leveling the MEMS probe 5 through the leveling process method can provide a good positional accuracy for the subsequent cutting of the probe 53 and provide a good environment for the subsequent process.

The above is inspired by the ideal embodiment of the present invention. Through the above description, relevant personnel can make various changes and modifications within the scope of not departing from the technical idea of the present invention. The technical scope of the present invention is not limited to the content in the specification, and must be determined according to the scope of the claims.

Claims (10)

1. The utility model provides a MEMS probe fixing device, includes attitude adjustment mechanism to and set up the probe stop gear on attitude adjustment mechanism, its characterized in that: the probe limiting mechanism comprises a supporting seat which is arranged on the posture adjusting mechanism in a driving mode, an ultrasonic cavity is arranged on the supporting seat, and an MEMS probe limiting base is arranged in the ultrasonic cavity; a probe limiting groove for limiting and accommodating the MEMS probe is formed in the MEMS probe limiting base;

and the lower part of the MEMS probe limiting base is also provided with a magnetic sucker corresponding to the probe limiting groove.

2. The MEMS probe fixture of claim 1 wherein: and a limiting column for limiting the MEMS probe is arranged in the probe limiting groove, and the structure of the limiting column and the structure of the MEMS probe are in a male-female staggered matching structure.

3. The MEMS probe fixture of claim 2 wherein: the limiting column comprises a first barrier strip and a second barrier strip which are arranged in a staggered mode; and the barrier strips II are transverse barrier strips, and one ends of the barrier strips I are arranged on the barrier strips II at intervals in parallel and are arranged in a comb shape.

4. The MEMS probe fixture of claim 3 wherein: the probe limiting mechanism is also provided with a plurality of hairbrushes corresponding to the probe limiting grooves; the brush can swing relative to the probe limiting groove.

5. The MEMS probe fixture of claim 1 wherein: a concave mounting groove is formed in the upper part of the supporting seat, and the magnetic sucker is arranged in the mounting groove;

or/and the posture adjusting mechanism comprises an X-axis displacement table, a Y-axis displacement table is arranged on the X-axis displacement table in a driving mode, and a probe limiting mechanism is arranged on the Y-axis displacement table in a driving mode.

6. The MEMS probe fixture of claim 1 wherein: the MEMS probe comprises a plurality of supporting beams which are arranged in parallel at intervals, and one ends of the plurality of probes are arranged on the supporting beams at intervals in parallel and are arranged in a comb shape; and a plurality of supporting beams are connected through the positioning frame after being arranged in parallel at intervals.

7. A MEMS probe leveling process method is characterized in that: the MEMS probe fixture apparatus of any one of claims 1 to 6 is used, comprising the steps of;

step S1, initializing or resetting equipment;

s2, placing the MEMS probe on an MEMS probe limiting base;

s3, performing ultrasonic, micro-displacement vibration and brush brushing on the probe to align the probe and lock the probe;

s4, magnetically adsorbing the probe and checking the posture and position state of the rechecking probe;

s5, repeating the step 1 to the step 4, wherein the repetition frequency is N times, and N is a natural number;

s6, correcting and cutting the probe;

and step S7, releasing the probe.

8. The MEMS probe fixture of claim 7 wherein: in the step S1, the step of initializing or resetting includes the following steps;

step 1.1, moving an X-axis displacement table and a Y-axis displacement table to initial positions;

step 1.2, powering off the strong magnetic attraction disc to enable the strong magnetic attraction disc to have no magnetic force;

step 1.3, closing the ultrasonic cavity to ensure that the ultrasonic cavity does not vibrate ultrasonically;

and 1.4, carrying out surface cleaning operation on the MEMS probe limiting base.

9. The MEMS probe fixture of claim 7 wherein: the step S2 includes the following steps;

step 2.1, placing the MEMS probe on a smooth silicon wafer, wherein the smooth silicon wafer is an intermediate carrier for loading and transferring the MEMS probe;

and 2.2, placing the MEMS probe on the smooth silicon chip along the MEMS probe limiting base groove and the limiting column.

10. The MEMS probe fixture of claim 7 wherein: the step S3 includes the following steps;

step 3.1, shaking the left and right micro-displacement of the X-axis displacement table; shaking the Y-axis displacement table by micro displacement back and forth;

step 3.2, ultrasonic starting and ultrasonic vibration; the brush brushes the probe; the MEMS probe falls into a groove of the MEMS probe limiting base;

or/and the step S4 comprises the following steps;

step 4.1, powering off the magnetic sucker, and adsorbing the probe by strong magnetism;

4.2, checking whether the probe is warped or not, and if yes, brushing the probe by using a brush to enable the probe to fall into the groove;

4.3, detecting the front surface of the MEMS probe; after the MEMS probe is leveled, the whole body is moved to the next procedure for front detection; taking out the MEMS probe after the front side detection is finished;

4.4, detecting the reverse side of the MEMS probe; repeating the first step to the fifth step to fix and level the back surface of the MEMS probe;

and/or, in the step S6, the following steps are included;

6.1, marking good products and defective products of the probes after the probes are detected;

6.2, according to the marking result, carrying out probe cutting, cutting defective products and keeping the defective products;

or/and, the step S7 comprises the following steps;

and (4) powering off the magnetic sucker, removing the MEMS probe after the magnetic force disappears, and carrying out the next process operation.

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