CN103974564B - The production method and PCB coaxial cables of PCB coaxial cables - Google Patents

Abstract

The invention provides a method for manufacturing a PCB coaxial cable and a PCB coaxial cable, comprising: manufacturing a dielectric layer wrapping a core wire, and manufacturing two linear metal wires located on both sides of the core wire in the dielectric layer Connectors; wherein, the metal connectors do not intersect with the core wires; etching from the surface of the dielectric layer forms at least two grooves exposing the two metal connectors; wherein the core wires are In the dielectric layer between the grooves; metallize the grooves and the surface of the dielectric layer between the grooves to form a metal shielding layer wrapping the dielectric layer between the grooves to obtain a PCB coaxial cable . Due to the process of etching two grooves in the dielectric layer, filling the grooves, and metallizing the dielectric layer between the grooves, the metal shielding layer can be formed around the core wire simply and quickly, and a coaxial cable with a shielding layer is obtained. Compared with the prior art, the method has fewer processes and higher processing efficiency.

Description

Manufacturing method of PCB coaxial cable and PCB coaxial cable

technical field

The invention relates to the field of PCB manufacturing, in particular to a method for manufacturing a PCB coaxial cable and the PCB coaxial cable.

Background technique

In the PCB field, coaxial cables are required to transmit signals. The outer surface of the coaxial cable is wrapped with metal foil to shield the interference of external signals.

In the prior art, in the process of manufacturing coaxial cables, metallized grooves are formed first, and then core wires and insulators are filled to form coaxial cables in the metallized grooves. After multiple metallizations and multiple fillings, a foil-wrapped coaxial cable is obtained. This manufacturing process requires multiple fillings, the process steps are cumbersome, and the manufacturing efficiency is low.

Contents of the invention

The present invention aims to provide a method for manufacturing a PCB coaxial cable and a PCB coaxial cable, so as to solve the problems of cumbersome manufacturing process and low manufacturing efficiency of the above-mentioned coaxial cable.

The invention provides a method for manufacturing a PCB coaxial cable, comprising:

Make a dielectric layer wrapping the core wire, and make two linear metal connectors located on both sides of the core wire in the dielectric layer; wherein, on the PCB forming plane projection, the metal connector and the core no crossing of lines;

Etching from the surface of the dielectric layer to form at least two grooves exposing the two metal connectors; wherein the core wire is in the dielectric layer between the grooves;

metallizing the grooves and the surface of the dielectric layer between the grooves to form a metal shielding layer wrapping the dielectric layer between the grooves to obtain a PCB coaxial cable.

The present invention also provides a method for manufacturing a PCB coaxial cable, comprising:

On the surface of the metal foil substrate, make a dielectric layer that wraps the core wire;

Etching from the surface of the dielectric layer to form two grooves exposing the metal foil; wherein the core wire is in the dielectric layer between the two grooves;

metallizing the grooves and the surface of the dielectric layer between the grooves to form a metal shielding layer wrapping the dielectric layer between the grooves to obtain a PCB coaxial cable.

The present invention also provides a PCB coaxial cable, comprising a core wire and a dielectric layer wrapping the core wire, and further comprising: linear metal connecting bodies on both sides of the core wire, and the metal connecting body and the dielectric layer There are grooves connected to the surface of the layers, and the grooves and the surface of the dielectric layer between the grooves are covered with metal to form a metal shielding layer covering the dielectric layer between the grooves.

The present invention also provides a PCB coaxial cable, which includes a core wire, a dielectric layer wrapping the core wire, and a metal foil substrate on one side of the dielectric layer. There is at least one groove on both sides of the core wire, which is connected to the metal foil. The other side of the foil substrate and the dielectric layer; the surface of the groove and the dielectric layer between the grooves is covered with metal, forming a metal shielding layer wrapping the dielectric layer between the grooves.

Since the present invention adopts the process of etching two grooves in the dielectric layer, filling the grooves, and metallizing the dielectric layer between the grooves, the metal shielding layer can be formed around the core wire simply and quickly, and a coaxial cable with a shielding layer can be obtained. cable. Compared with the prior art, the method has fewer processes and higher processing efficiency.

Description of drawings

The accompanying drawings described here are used to provide a further understanding of the present invention and constitute a part of the application. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations to the present invention. In the attached picture:

Fig. 1 shows the flowchart of embodiment;

Fig. 2 shows a schematic cross-sectional view of forming a core wire and a metal connector in a dielectric layer in an embodiment;

Fig. 3 shows the schematic diagram of making the metal connector L to the bottom of the dielectric layer in the embodiment;

Fig. 4A shows a schematic cross-sectional view after grooves are opened from the surface of the dielectric layer in the embodiment;

Figure 4B shows a schematic cross-sectional view of the shielding layer obtained after metallization in the embodiment;

5 shows a schematic cross-sectional view of etching a core wire and a metal connector in the middle of a dielectric layer in an embodiment;

Figure 6 shows a schematic cross-sectional view of the laminated dielectric layer in the embodiment;

Fig. 7 shows a schematic cross-sectional view of etching grooves from both sides of the front and back sides in the embodiment;

Figure 8 shows a schematic cross-sectional view of metallized grooves in the embodiment;

Fig. 9 shows the metal foil substrate selected in the embodiment;

Fig. 10 shows a schematic cross-sectional view of processing a core wire and a metal connector on a metal foil substrate in an embodiment;

Fig. 11 shows a schematic cross-sectional view of an embodiment after laminating a dielectric layer and a metal foil;

Figure 12 shows a schematic cross-sectional view of openings with grooves on the two metal foil surfaces in the embodiment;

Fig. 13 shows a schematic cross-sectional view of opening grooves in the embodiment;

Fig. 14 shows a schematic cross-sectional view of electroplating a metal layer S2 on the surface of a PCB coaxial cable in an embodiment;

Fig. 15 shows a schematic cross-sectional view of the coaxial cable after etching in the embodiment;

Fig. 16 shows a schematic cross-sectional view of processing a twin-core wire in an embodiment;

Fig. 17 shows a schematic cross-sectional view of a twin-core coaxial cable in an embodiment;

Fig. 18 shows a schematic front view of a coaxial cable in which the twin core wires form a cross shape in an embodiment;

Fig. 19 shows a schematic front view of the PCB metallization groove in Fig. 18 in the embodiment;

Figure 20 shows a flowchart of another embodiment;

Figure 21 shows a schematic cross-sectional view of making a core wire on a single-sided metal foil substrate in an embodiment;

Figure 22 shows a schematic cross-sectional view of the grooves in the embodiment;

Fig. 23 shows a schematic cross-sectional view of the metallized groove of the embodiment;

Fig. 24 shows a schematic cross-sectional view of forming a core wire in a dielectric layer between double-sided metal foils in an embodiment;

FIG. 25 shows a schematic cross-sectional view of grooves on the PCB of FIG. 24 in an embodiment.

Detailed ways

The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments. Referring to the flow chart of the embodiment shown in Figure 1, it may comprise the following steps:

S11: Make a dielectric layer wrapping the core wire, and make two linear metal connectors located on both sides of the core wire in the dielectric layer; wherein, on the plane projection of the PCB, the metal connector and the The core wires do not cross;

S12: Etching from the surface of the dielectric layer to form at least two grooves exposing the two metal connectors; wherein the core wire is in the dielectric layer between the grooves;

S13: Metallizing the groove and the surface of the dielectric layer between the grooves to form a metal shielding layer covering the dielectric layer between the grooves to obtain a PCB coaxial cable.

In the above embodiment, due to the use of the process of etching two grooves in the dielectric layer, filling the grooves, and metallizing the dielectric layer between the grooves, the metal shielding layer can be formed around the core wires simply and quickly, and a metal shielding layer with a shielding layer can be obtained. coaxial cable. Compared with the prior art, the method has fewer processes and higher processing efficiency.

Preferably, a single-sided substrate can be used to make the coaxial cable in the embodiment. A single-sided substrate is a PCB with one dielectric layer and one layer of metal foil. After the core wire K is etched on one side of the single-sided substrate, a dielectric layer covering the core wire K is fabricated on the surface, and a metal layer is pressed on the surface of the dielectric layer on the other side for subsequent metal connectors L. Form the structure shown in Figure 2.

Etching the metal layer used to make the connecting body L to etch out two metal connecting bodies L. After the metal connection body L is etched out, a dielectric layer whose thickness does not exceed the thickness of the metal connection body L is covered to form a structure as shown in FIG. 3 .

It can also be made with a double-sided substrate. First, make a single-sided pattern on the substrate, that is, the core wire part K, and then coat a resin layer or press a layer of prepreg on one side of the core wire to form a structure as shown in 2, and then make graphics. After the connecting body L is etched out, the dielectric layer whose thickness does not exceed the thickness of the metal connecting body L is covered to form a structure as shown in FIG. 3 .

Of course, in addition to these two processes, there are various implementation schemes for embedding the metal connector L into the dielectric layer, exposing the surface, or embedding part of the depth while exposing the other part.

During the processing of the grooves, two grooves can be etched by laser, as shown in FIG. 4A.

After the two grooves are metallized, a shield layer is formed that wraps the dielectric layer between the grooves. As shown in Figure 4B.

In another embodiment, the core wire K and the metal connecting body L can be located in the middle of the dielectric layer at the same time.

The core wire K and the metal connector L can be formed in the middle of the dielectric layer in the following manner.

Referring to Figure 5, the core wire and the metal connector are etched out of the metal foil on the surface of the single-sided substrate;

A dielectric layer covering the core wire and the metal connecting body is pressed on the surface of the single-sided substrate. Form a structure in which the core wire K and the metal connector L are formed in the middle of the dielectric layer as shown in FIG. 6 .

Preferably, in an embodiment, the process of forming the groove includes:

Four grooves as shown in FIG. 7 are etched by laser on the front and back sides of the single-sided substrate after the dielectric layer is pressed. Then, after the grooves and the surface of the dielectric layer between the grooves are metallized, a PCB coaxial cable as shown in FIG. 8 is formed.

In another embodiment, in addition to fabricating the PCB coaxial cable on the single-sided substrate, the PCB coaxial cable can also be fabricated on the metal foil substrate. In this way, when etching the groove, either laser etching or plasma (PLASMA) etching can be used. During the plasma etching process, the dielectric layer outside the groove needs to be protected by metal foil. Although the process of making metal foil is increased, the time of etching grooves by plasma is less than that of laser etching, which can still improve the efficiency of making PCB coaxial cables.

Preferably, a metal foil substrate can also be used to make a PCB coaxial cable. Referring to FIG. 9 , a double-sided metal foil substrate is selected. The production process is as follows:

Referring to FIG. 10 , the core wire K and the metal connecting body L are etched on one surface of the metal foil.

Referring to FIG. 11 , the surface of the core wire is covered with a dielectric layer and metal foil to form a substrate with metal foil on both sides.

Referring to FIG. 12 , according to the position and width of the groove, the surface of the metal foil S1 on the front and back sides is etched to expose the dielectric layer.

Referring to FIG. 13 , according to the positions of the grooves, plasma or laser is used to etch the exposed dielectric layer to form four grooves.

Referring to FIG. 14 , the groove is metallized. At the same time, the metallized groove and the metal foil S1 on the surface of the substrate form the metal shielding layer of the PCB coaxial cable.

Preferably, after the metallized groove is fused with the metal foil S1, there will be a rough seam at the contact position. In order to eliminate the rough surface at these seams, it is also included that the metal foil S2 is plated on the front and back sides of the PCB coaxial cable.

For the PCB coaxial cable shown in FIG. 4 or FIG. 8 in the embodiment, a layer of metal foil can also be electroplated on both sides to form a PCB coaxial cable as shown in FIG. 14 .

Preferably, the coaxial cable is etched according to the interval between the grooves to form a PCB coaxial cable as shown in FIG. 15 .

Preferably, in the above embodiment, the number of the core wires is one or more; the multiple core wires may be parallel to each other, or there may be intersection points, or there may be both cases.

Through the method of the above-mentioned embodiment, a PCB coaxial cable is obtained, including: a core wire and a dielectric layer wrapping the core wire, further comprising: a linear metal connecting body on both sides of the core wire, and the metal connecting body and the The grooves on the surface of the dielectric layer communicate with each other, and the grooves and the surface of the dielectric layer between the grooves are covered with metal to form a metal shielding layer covering the dielectric layer between the grooves.

As shown in FIG. 16 and FIG. 17 , during the process of etching the core wires, two core wires parallel to each other are etched.

Referring to FIG. 18 , the etched core wire K is two core wires crossing and having a meeting point. In this way, one input for signal transmission and multiple output transmission modes are formed. Of course, it can also be three intersecting core wires, forming a figure with two intersection points, such as a horizontal core wire and two vertical core wires forming two intersection points, so that there are 6 core wire endpoints, Can form one input, five outputs.

After the core wire in Fig. 18 is manufactured, it is covered with a dielectric layer, grooved and metallized, and the pattern shown in Fig. 19 is formed, the surface of which is the shielding layer S1.

In the above-mentioned embodiment, the manufacturing process is simple, and the yield rate of the obtained PCB coaxial cable is high. In the above-mentioned embodiment, the form of setting the metal connecting body is adopted, and the groove is opened. This method is beneficial to the PCB with a deep groove depth. Due to the existence of the metal connecting body, it can be etched from the front and back sides towards the metal connecting body. groove. For shallower grooves, the following embodiments can also be used to make PCB coaxial cables.

Referring to Fig. 20, this embodiment comprises the following steps:

S21: on the surface of the metal foil substrate, making a dielectric layer for wrapping the core wire;

S22: Etching from the surface of the dielectric layer to form two grooves exposing the metal foil; wherein, the core wire is in the dielectric layer between the two grooves;

S23: Metallize the groove and the surface of the dielectric layer between the grooves to form a metal shielding layer covering the dielectric layer between the grooves to obtain a PCB coaxial cable.

By adopting the steps in this embodiment, the groove can be etched without etching the metal connecting body, and the PCB coaxial cable can be produced, which reduces the process and improves the production efficiency.

Referring to FIG. 21, after the dielectric layer wrapping the core wire is fabricated, the surface of the dielectric layer is etched with a laser to form two grooves as shown in FIG. 22;

Metallize the grooves and plate the dielectric layer between the grooves to form the PCB coaxial cable shown in Figure 23.

In order to improve the efficiency of etching the groove, the groove can also be etched by plasma, but it is necessary to add an electroplated metal foil to protect the dielectric layer from being damaged during the plasma etching process, as in the solution in the foregoing embodiment.

Referring to Fig. 24, after making the dielectric layer wrapping the core wire, metal foil is electroplated on the surface of the dielectric layer to form a substrate with metal foil on both sides.

Etching on the surface of the electroplated metal foil according to the position and width of the groove to expose the dielectric layer;

According to the position of the groove, plasma or laser is used to etch the groove to obtain the groove shown in FIG. 25 . The grooves are then metallized to get the PCB coaxial cable.

Through the method steps in the above-mentioned embodiments, the obtained PCB coaxial cable includes: a core wire and a dielectric layer wrapping the core wire, and a metal foil substrate on one side of the dielectric layer, and at least one on each side of the core wire The groove communicates with the metal foil substrate and the other side of the dielectric layer; the groove and the dielectric layer between the grooves are covered with metal to form a metal shielding layer covering the dielectric layer between the grooves.

Preferably, it also includes: electroplating metal foil on the front and back sides of the PCB coaxial cable; the same as adding the metal foil S2 in the foregoing embodiment. The coaxial cable after electroplating can eliminate rough surfaces and gaps on the surface during the groove metallization process, which is convenient for subsequent graphics production.

The number of core wires in this embodiment is one or more; the multiple core wires may be parallel to each other, or there may be intersection points, or there may be both cases.

Preferably, in the above embodiments, the substrate with the metal foil can be made of various materials such as resin coated substrate (RCC), copper clad substrate (CCL), and the like.

Preferably, in the above-mentioned embodiments, the medium layer can be made by pressing a prepreg, coating a resin layer, and the like.

Preferably, in the above-mentioned embodiments, the groove metallization can be made by electroplating, copper filling, electroplating combined with plug resin, electroplating combined with solder paste, etc., or directly filled with conductive materials.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (8)

1. a kind of production method of PCB coaxial cables, which is characterized in that including：

The dielectric layer of package core wire is made, and is produced on the two linear gold for being located at the core wire both sides in the dielectric layer Belong to connector；Wherein, it is formed in plane projection in PCB, the metal connector and the core wire are described to be produced on institute without intersecting Stating two linear metal connectors in dielectric layer positioned at the core wire both sides includes：It is etched in the metal foil of substrate surface The core wire and the metal connector cover the dielectric layer of the core wire and the metal connector in the substrate surface；

In the dielectric layer surface plating metal foil of making, forming obverse and reverse sides has the substrate of metal foil；

Position according to groove and width etch, exposed dielectric layer in the metal foil surface of the obverse and reverse sides；

According to the position of the groove, using plasma forms exposed described two gold from the surface etching of the dielectric layer Belong at least two grooves of connector；Wherein, in dielectric layer of the core wire between the groove；

The dielectric layer surface to metallize between the groove and the groove forms and wraps up the dielectric layer between the groove Metal screen layer obtains PCB coaxial cables；

In the obverse and reverse sides of the PCB coaxial cables, plating metal foil.

2. manufacturing method according to claim 1, which is characterized in that the dielectric layer for making package core wire and the gold Belong to connector process include：

Metal foil on double-sided substrate surface etches the core wire and the metal connector；

The dielectric layer of the core wire and the metal connector is covered on the double-sided substrate surface.

3. manufacturing method according to claim 1, which is characterized in that the exposed described two metal connectors of formation At least two grooves, including：

Form four grooves of exposed described two metal connectors.

4. manufacturing method according to claim 1, which is characterized in that the quantity of the core wire is one or more；

It is mutually parallel between a plurality of core wire, or, with one or more joints.

5. a kind of production method of PCB coaxial cables, which is characterized in that including：

On the surface of metal foil substrate, the dielectric layer of package core wire is made；

After the dielectric layer for making package core wire, in the dielectric layer surface, plating metal foil；

Position according to groove and width etch, exposed dielectric layer in the metal foil surface of plating；

According to the position of the groove, using plasma forms the two of bare metal foil from the surface etching of the dielectric layer A groove；Wherein, the core wire is between described two grooves in dielectric layer；

The dielectric layer surface to metallize between the groove and the groove forms and wraps up the dielectric layer between the groove Metal screen layer obtains PCB coaxial cables；

In the obverse and reverse sides of the PCB coaxial cables, plating metal foil.

6. production method according to claim 5, which is characterized in that further include：

The quantity of the core wire is one or more；

It is mutually parallel between a plurality of core wire, or, with one or more joints.

7. a kind of PCB coaxial cables include the dielectric layer of core wire and package core wire, which is characterized in that further include：The core The linear metal connector of line both sides, and the groove that is communicated with the metal connector and the dielectric layer surface, it is described recessed Dielectric layer surface between slot and groove covers metal, forms the metal screen layer for wrapping up the dielectric layer between the groove, In, the core wire and the metal connector in the metal foil of substrate surface by etching to obtain, wherein the metal screen layer It obtains in the following manner：In dielectric layer surface, plating metal foil；Position according to groove and width, in the metal foil of plating Surface etching, exposed dielectric layer；According to the position of the groove, using plasma is from the surface etching of the dielectric layer, shape At two grooves of bare metal connector；Wherein, the core wire is between described two grooves in dielectric layer；Also, institute The obverse and reverse sides for stating PCB coaxial cables are electroplate with metal foil.

8. a kind of PCB coaxial cables include the metal foil-based of the dielectric layer and the dielectric layer side of core wire and package core wire Plate, which is characterized in that the core wire both sides are at least each there are one groove, are connected to the another of metal foil substrate and the dielectric layer Side；Dielectric layer surface between the groove and groove covers metal, forms the metal for wrapping up the dielectric layer between the groove Shielded layer, wherein the metal screen layer obtains in the following manner：In dielectric layer surface, plating metal foil；According to groove Position and width etch, exposed dielectric layer in the metal foil surface of plating；According to the position of the groove, using plasma From the surface etching of the dielectric layer, two grooves of bare metal foil are formed；Wherein, the core wire described two grooves it Between in dielectric layer；Also, it is electroplate with metal foil in the obverse and reverse sides of the PCB coaxial cables.