CN102110866B - Manufacturing process of waveguide slot - Google Patents
Manufacturing process of waveguide slot Download PDFInfo
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- CN102110866B CN102110866B CN 200910189330 CN200910189330A CN102110866B CN 102110866 B CN102110866 B CN 102110866B CN 200910189330 CN200910189330 CN 200910189330 CN 200910189330 A CN200910189330 A CN 200910189330A CN 102110866 B CN102110866 B CN 102110866B
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- Prior art keywords
- groove
- layer
- copper
- laser
- waveguide
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 53
- 229910052802 copper Inorganic materials 0.000 claims abstract description 53
- 239000010949 copper Substances 0.000 claims abstract description 53
- 239000010410 layer Substances 0.000 claims abstract description 53
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 40
- 238000007747 plating Methods 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000011241 protective layer Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000005553 drilling Methods 0.000 claims abstract description 8
- 239000000243 solution Substances 0.000 claims description 19
- 239000012670 alkaline solution Substances 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 7
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 6
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 5
- 238000004381 surface treatment Methods 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 3
- 235000019270 ammonium chloride Nutrition 0.000 claims description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 3
- 229910001431 copper ion Inorganic materials 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 2
- 239000003929 acidic solution Substances 0.000 claims 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 4
- 238000010923 batch production Methods 0.000 abstract description 3
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 238000000576 coating method Methods 0.000 description 21
- 239000011248 coating agent Substances 0.000 description 20
- 238000007639 printing Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 241001074085 Scophthalmus aquosus Species 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000005111 flow chemistry technique Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910021653 sulphate ion Inorganic materials 0.000 description 1
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Abstract
本发明适用于PCB板制造领域，提供了一种波导槽制作工艺，本发明利用锡和铜对激光的吸收率不同，以及激光烧锡和烧铜所需的能量不同，采用激光烧去凹槽底部外层的镀锡层，而凹槽底部内层的镀铜层不被去除，可以阻止激光钻到镀铜层下的芯板；之后蚀刻去除凹槽底部内层的镀铜层，然后再用常规工艺方法去除凹槽侧壁外层的镀锡层，接下来在凹槽侧壁内层的镀铜层覆上保护层，从而制得侧壁为金属层(镀铜层和保护层)、底部无金属层的波导槽。本发明制作流程简单，采用激光钻工序代替现有技术中的LPI液态感光型油墨工序，成本相对较低，而且激光钻机的定位精度高，完全可以保证波导槽的品质，从而能实现产品的批量生产。
The invention is applicable to the field of PCB board manufacturing, and provides a waveguide groove manufacturing process. The invention utilizes the different absorption rates of tin and copper for laser light, and the energy required for laser tin burning and copper burning, and uses laser to burn out grooves. The tin plating layer on the bottom outer layer, while the copper plating layer on the bottom inner layer of the groove is not removed, which can prevent the laser from drilling into the core board under the copper plating layer; then etch to remove the copper plating layer on the bottom inner layer of the groove, and then Remove the tin-plated layer on the outer layer of the side wall of the groove with a conventional process, and then cover the copper layer on the inner layer of the side wall of the groove with a protective layer, thereby making the side wall a metal layer (copper-plated layer and protective layer) , The waveguide slot without metal layer at the bottom. The production process of the present invention is simple, the laser drilling process is used to replace the LPI liquid photosensitive ink process in the prior art, the cost is relatively low, and the positioning accuracy of the laser drilling machine is high, which can completely guarantee the quality of the waveguide groove, thereby realizing the batch production of products Production.
Description
Technical field
The invention belongs to pcb board and make the field, relate in particular to the non-metallic waveguide slot manufacture craft in a kind of side-wall metallicization bottom.
Background technology
In the pcb board manufacturing; the groove of waveguide slot for offering at pcb board, the sidewall of waveguide slot is copper plate and protective layer (being referred to as metal level), the bottom does not have metal level; the metal level of waveguide slot sidewall is used for the signal that components and parts send on the shielding pcb board; the loss of anti-stop signal, and bottom shielded signal not guarantees the normal propagation of signal; this structure of waveguide slot; can make signal produce resonance, therefore, this waveguide slot in industry will be used widely.
In the prior art field, the manufacturing process of waveguide slot is:
(1) machined grooves on pcb board;
(2) pcb board is immersed in the electrolytic copper plating solution electroplates, sidewall and the bottom electrical of groove plate layer of copper;
(3) the LPI photosensitive-ink that will have an anti-plating evenly is coated with bottom and the sidewall that is imprinted on groove;
(4) to after the exposure of LPI photosensitive-ink, solidifying, sidewall printing ink removes and the reservation of bottom photosensitive-ink, and bottom portion of groove just has anti-plating (being that bottom portion of groove is not electroplated metal);
(5) pcb board is immersed in electroplate in the tin liquor and electroplates, the sidewall of groove is electroplated last layer tin, because the bottom of groove has anti-plating, tin is electroplated not Shang in the bottom, remains photosensitive-ink bottom namely;
(6) remove the photosensitive-ink of bottom portion of groove with alkaline solution;
(7) remove the copper plate of bottom portion of groove with another kind of alkaline solution etching;
(8) with nitric acid or the outer field tin coating of nitric acid series solution removal sidewall;
(9) recess sidewall is carried out surface treatment, make recess sidewall be covered with protective layer.
Like this, just having made sidewall is that copper, bottom are nonmetallic waveguide slot.
By above description as can be known, the waveguide slot manufacture craft adopts LPI liquid photosensitive type printing ink, but manufacturing process complexity, be coated with seal, exposure, development, curing and the bottom land printing ink that relate to printing ink are removed, because printing ink is coated with and is imprinted in the groove, the exposure characteristics that adds Exposing Lamp is limit, and film figure shifts and very bad control is solidified in the printing ink exposure, so quality can not guarantee.
Summary of the invention
The object of the present invention is to provide and a kind ofly make simple, the waveguide slot manufacture craft that can guaranteed quality of flow process, thereby can realize the batch process of waveguide slot.
The present invention is achieved in that a kind of waveguide slot manufacture craft, the groove of described waveguide slot for offering at pcb board; the sidewall of described groove is metal level; the no metal level in bottom, described metal level is copper plate and protective layer, described waveguide slot manufacture craft comprises the steps:
(1) machined grooves on pcb board;
(2) pcb board is immersed in the electrolytic copper plating solution electroplates, make the sidewall of groove and bottom be covered with copper plate;
(3) pcb board is immersed in to electroplate in the tin liquor again and electroplates, make the sidewall of groove and bottom be covered with tin coating again;
(4) adopt laser drill, make the laser energy of laser drill generation 2～300mj, the outer field tin coating of burning-off bottom portion of groove, the copper plate of reservation bottom portion of groove internal layer;
(5) adopt the alkaline solution etching to remove the copper plate of bottom portion of groove internal layer;
(6) adopt acid solution to remove the tin coating of recess sidewall;
(7) copper plate to recess sidewall carries out surface treatment, makes copper plate be covered with protective layer.
Particularly, in the step (4), described laser drill adopts CO2 infrared laser or UV Ultra-Violet Laser.
Preferably, in the step (4), the laser energy of described laser drill is 5～10mj.
Preferably, in the step (5), described alkaline solution is the solution that contains ammonium chloride, ammoniacal liquor and copper ion.
Preferably, in the step (6), described acid solution is salpeter solution.
Preferably, in the step (7), adopt chemical nickel and gold technology or chemical silver process, make recess sidewall be covered with protective layer.
Particularly, the thickness of the copper plate of described step (2) is more than the 18um.
Particularly, the thickness of the tin coating of described step (3) is 5um～10um.
Particularly, described pcb board is superposeed successively by central layer and prepreg and makes.
It is different that the present invention utilizes laser to burn the tin energy required with burning copper; adopt the outer field tin coating of laser burning-off bottom portion of groove; adopt the alkaline solution etching to remove the copper plate of bottom portion of groove internal layer afterwards; and then remove the outer field tin coating of sidewall with conventional method; next the copper plate at the recess sidewall internal layer is covered with protective layer, is the waveguide slot that copper plate and protective layer, bottom do not have metal level thereby make sidewall.Compared with prior art, it is simple that the present invention makes flow process, adopts laser driller order to replace LPI liquid photosensitive type printing ink operation of the prior art, cost is relatively low, and the positioning accuracy height of laser drill, the quality of waveguide slot can be guaranteed fully, thereby the batch process of product can be realized.
Description of drawings
Fig. 1 is that the sidewall of the waveguide slot that provides of the embodiment of the invention and bottom internal layer are copper plate, outerly are the schematic diagram of tin coating;
Fig. 2 is tin coating is removed in the bottom of the waveguide slot among Fig. 1 with laser drill schematic diagram;
Fig. 3 is the etched schematic diagram of copper plate of the bottom of the waveguide slot among Fig. 2;
Fig. 4 is the schematic diagram after the tin coating of the sidewall of the waveguide slot among Fig. 3 is removed.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the present invention, and be not used in restriction the present invention.
Shown in Fig. 1～4; a kind of waveguide slot manufacture craft that the embodiment of the invention provides; the groove 1 of described waveguide slot for offering at pcb board 2; the sidewall of described groove 1 is copper plate 11 and protective layer (not shown); the no metal level in bottom; described pcb board 2 is superposeed successively by central layer 21 and prepreg 22 and makes, and its manufacture craft comprises the steps:
(1) machined grooves 1 on pcb board 2, the processing technology of this groove 1 is existing very ripe technology, specific process is: mill the ability of (or gong) and the thickness of precision and central layer 21 and prepreg 22 deeply according to control, to wherein one deck or two layers of central layer 21 and prepreg 22 flutings, simultaneously, the size of the thickness of Kai Cao central layer 21 and prepreg 22 and fluting is made groove internal gasket (not shown) on demand, other are by normal flow processing, set type by stepped construction, pad is put into groove, and the pairing stack is back carries out pressing to pcb board, after mistake is milled the limit, do the sharp processing control and mill deeply, mill out required groove 1;
(2) pcb board 2 is immersed in the electrolytic copper plating solution electroplates, make the sidewall of groove 1 and bottom be covered with copper plate 11, electrolytic copper plating solution is to contain copper sulphate (CuSO
45H
2O), sulfuric acid (H
2SO
4), the aqueous solution of chloride ion (Cl+) and brightener, carry out direct current electrode position, copper ball is as anode, pcb board 2 is as negative electrode, by impressed current generation ion-exchange reactions, thereby make the sidewall of groove 1 and bottom electrical plate layer of even copper, thickness can be set, and the thickness of copper plate 11 is generally more than 18um;
(3) pcb board 2 is immersed in to electroplate in the tin liquor again and electroplates, make the sidewall of groove 1 and bottom be covered with tin coating 12 again, like this, just formed double layer of metal in sidewall and the bottom of groove 1, internal layer be copper plate 11, outer be tin coating 12 (as shown in Figure 1); Electroplating tin liquor is to contain STANNOUS SULPHATE CRYSTALLINE (SnSO
4), sulfuric acid (H
2SO
4), the aqueous solution of brightener and dispersant, carry out direct current electrode position, the tin ball is as anode, pcb board 2 is as negative electrode, by impressed current generation ion-exchange reactions, thereby make the sidewall of groove 1 and bottom electrical plate layer of even tin, the thickness of tin coating 12 is generally at 5um～10um;
(4) the laser drill (not shown) that adopts the PCB industry to use, make laser brill program (being the laser drilling) according to the location hole of laser brill and position and the size of groove 1, the energy parameter of laser drill is set to 2～300mj, the preferential laser energy of recommending to adopt 5～10mj, laser facula (or light beam) improves laser by the higher value setting of laser drill and bores efficient, number of pulses is below 5, other parameters are set by the conventional parameter that laser bores, the tin coating 12 of burning-off groove 1 bottom exterior layer, because tin is different to the absorptivity of laser with copper, and laser burns tin and laser, and to burn the required energy of copper different, laser is the tin coating 12 of burning-off groove 1 bottom exterior layer fully, and the copper plate 11 of groove 1 bottom internal layer all or part of existence (as shown in Figure 2) still, thereby can stop laser to get into central layer 21 under the copper plate 11, protection pcb board 2 is not destroyed;
(5) adopt existing alkaline solution etching to remove the copper plate 11 of groove 1 bottom internal layer, in this area, the general employing of this alkaline solution contains ammonium chloride (NH
4Cl), ammoniacal liquor (NH
3.H
2O) and the solution of copper ion (Cu2+), because groove 1 sidewall skin is tin coating 12, tin coating 12 has the ability of alkali resistance solution corrosion, therefore, in alkaline etching liquid, the outer field tin coating 12 of groove 1 sidewall is not corroded (as shown in Figure 3), and the outer tin coating 12 of groove 1 sidewall can be protected the copper plate 11 of its internal layer;
(6) adopt existing acid solution to remove the outer field tin coating 12 of groove 1 sidewall, in this area, this acid solution often adopts nitric acid or nitric acid series solution, in the process that adopts these solution removal tin coatings 12, add oxidant and stabilizer simultaneously, oxidant is used for accelerating detin speed, and stabilizer can suppress copper plate 11 reactions of nitric acid and groove 1 sidewall;
(7) copper plate 11 to groove 1 sidewall carries out surface treatment; make the copper plate 11 of groove 1 sidewall be covered with protective layer; this protective layer can prevent copper plate 11 oxidation in air of groove 1 sidewall; this process of surface treatment is existing conventional technology; general this area common chemical nickel gold process that adopts (namely adopts chemical reaction to plate one deck nickel at the copper plate 11 of groove 1 sidewall earlier; and then at nickel dam deposition one deck gold); chemical tin technology (adopting chemical reaction at copper plate 11 deposition one deck tin of groove 1 sidewall) or chemical silver process (adopting chemical reaction at copper plate 11 deposition one deck silver of groove 1 sidewall), etc.
Like this, just having made sidewall is the waveguide slot (as shown in Figure 4) that metal level (copper plate 11 and protective layer), bottom do not have metal level.
The above only is preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910189330 CN102110866B (en) | 2009-12-24 | 2009-12-24 | Manufacturing process of waveguide slot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910189330 CN102110866B (en) | 2009-12-24 | 2009-12-24 | Manufacturing process of waveguide slot |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102110866A CN102110866A (en) | 2011-06-29 |
| CN102110866B true CN102110866B (en) | 2013-08-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910189330 Expired - Fee Related CN102110866B (en) | 2009-12-24 | 2009-12-24 | Manufacturing process of waveguide slot |
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| CN (1) | CN102110866B (en) |
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| CN102361539A (en) * | 2011-10-18 | 2012-02-22 | 沪士电子股份有限公司 | Method for manufacturing groove-type printed wiring board |
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| CN105764238B (en) * | 2015-06-25 | 2019-03-05 | 生益电子股份有限公司 | Manufacturing method of stepped groove PCB and PCB |
| CN105764237B (en) * | 2015-06-25 | 2019-03-05 | 生益电子股份有限公司 | Manufacturing method of stepped groove PCB and PCB |
| US10944148B2 (en) * | 2016-02-04 | 2021-03-09 | Advantest Corporation | Plating methods for modular and/or ganged waveguides for automatic test equipment for semiconductor testing |
| CN107454759A (en) * | 2016-06-01 | 2017-12-08 | 北大方正集团有限公司 | How to make waveguide groove |
| CN107770958B (en) * | 2016-08-17 | 2019-12-24 | 北大方正集团有限公司 | The waveguide groove of the PCB board and the manufacturing method of the waveguide groove of the PCB board |
| CN106739589B (en) * | 2016-12-27 | 2019-09-17 | 大族激光科技产业集团股份有限公司 | Printing and processing method |
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| CN107949176A (en) * | 2017-11-28 | 2018-04-20 | 东莞市鸿膜电子材料有限公司 | Processing method for transferring circuit board pattern |
| CN108303767B (en) * | 2018-02-09 | 2019-12-31 | 苏州德睿电力科技有限公司 | A method for preparing a concave mirror on an optical waveguide |
| CN108401370A (en) * | 2018-03-06 | 2018-08-14 | 深圳市五株科技股份有限公司 | A kind of processing method of metal blind slot |
| CN113133215A (en) * | 2021-04-14 | 2021-07-16 | 深圳市深联电路有限公司 | PCB circuit forming method |
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| DK1948850T3 (en) * | 2005-11-18 | 2019-07-29 | Luxembourg Inst Science & Tech List | PROCEDURE FOR MAKING A MULTIPLE LAYER STRUCTURE |
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|---|---|---|---|---|
| CN1668167A (en) * | 2000-02-28 | 2005-09-14 | Stsatl公司 | A method of manufacturing an electronic component and electronic component thereof |
| CN1490857A (en) * | 2002-10-18 | 2004-04-21 | 景硕科技股份有限公司 | Structure of micro-distance flip chip carrier plate and manufacturing method thereof |
| CN101316025A (en) * | 2007-05-31 | 2008-12-03 | 中国科学院半导体研究所 | Preparation method of fiber-coupled module of red light AlGaInP semiconductor laser |
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| CN102110866A (en) | 2011-06-29 |
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Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENNAN CIRCUITS Co.,Ltd. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: SHENNAN CIRCUITS Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130828 |