CN108908804B - A mold rapid cooling and rapid heating device using a semiconductor refrigerator and a phase change material - Google Patents
A mold rapid cooling and rapid heating device using a semiconductor refrigerator and a phase change material Download PDFInfo
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- CN108908804B CN108908804B CN201810991971.5A CN201810991971A CN108908804B CN 108908804 B CN108908804 B CN 108908804B CN 201810991971 A CN201810991971 A CN 201810991971A CN 108908804 B CN108908804 B CN 108908804B
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- 238000001816 cooling Methods 0.000 title claims abstract description 95
- 239000012782 phase change material Substances 0.000 title claims abstract description 55
- 239000004065 semiconductor Substances 0.000 title claims abstract description 53
- 238000010438 heat treatment Methods 0.000 title claims abstract description 43
- 239000000110 cooling liquid Substances 0.000 claims abstract description 82
- 238000003860 storage Methods 0.000 claims abstract description 52
- 239000002826 coolant Substances 0.000 claims abstract description 17
- 239000012071 phase Substances 0.000 claims description 46
- 239000000758 substrate Substances 0.000 claims description 43
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 41
- 230000017525 heat dissipation Effects 0.000 claims description 16
- 239000000498 cooling water Substances 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- 238000011084 recovery Methods 0.000 claims description 8
- 239000007791 liquid phase Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000005485 electric heating Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 239000012188 paraffin wax Substances 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000007790 solid phase Substances 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims 2
- 230000007423 decrease Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 11
- 238000000465 moulding Methods 0.000 description 11
- 239000003292 glue Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 2
- 238000010137 moulding (plastic) Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
本发明提出一种采用半导体制冷器及相变材料的模具急冷急热装置，包括控制模块、模具加热器、冷却液模具通道、相变储冷器、冷却液降温管、半导体制冷器；所述相变储冷器内贮有相变部件；所述冷却液模具通道设于模具处；所述冷却液降温管设于相变储冷器处并经可控阀与冷却液模具通道相通；所述半导体制冷器的热端与模具相接，冷端与相变储冷器相接；当对模具进行急热作业时，半导体制冷器的热端加热模具而冷端对相变储冷器降温；当对模具进行急冷作业时，冷却液在冷却液降温管和冷却液模具通道中流动以快速对模具降温；本发明通过结合半导体制冷器及相变材料的优点，并引入闭环反馈控制电路，能实现对模具进行高效节能的急冷急热调节。
The present invention proposes a mold rapid cooling and rapid heating device using a semiconductor refrigerator and a phase change material, including a control module, a mold heater, a coolant mold channel, a phase change cold storage device, a coolant cooling tube, and a semiconductor refrigerator; Phase change parts are stored in the phase change cold storage; the cooling liquid mold channel is set at the mold; the cooling liquid cooling pipe is set at the phase change cold storage and communicates with the cooling liquid mold channel through a controllable valve; The hot end of the semiconductor refrigerator is connected to the mould, and the cold end is connected to the phase change cold storage device; when the mold is heated rapidly, the hot end of the semiconductor refrigerator heats the mold and the cold end cools the phase change cold storage device ; When the mold is quenched, the coolant flows in the coolant cooling pipe and the coolant mold channel to quickly cool the mold; the present invention combines the advantages of semiconductor refrigerators and phase change materials, and introduces a closed-loop feedback control circuit, It can realize the rapid cooling and rapid heating adjustment of the mold with high efficiency and energy saving.
Description
技术领域technical field
本发明涉及成型制造技术领域，尤其是一种采用半导体制冷器及相变材料的模具急冷急热装置。The invention relates to the technical field of forming and manufacturing, in particular to a rapid cooling and rapid heating device for a mold using a semiconductor refrigerator and a phase change material.
背景技术Background technique
注塑和模压成型作为塑料加工中的重要成型方法，在工业生产的各个领域都有广泛应用，对塑料产品的精度、表面质量和强度的要求日益提高。传统塑料成型过程，易出现存在熔接痕、橘皮、细纹等缺陷，如能采用优质的急冷急热方法，将模温快速升高至塑料的玻璃化温度温度以上，成型后再快速降低模温至顶出温度，可有效加以消除上述缺陷。其中，如何快速实现动态的模温变化与控制，是制约其实现的关键难题。Injection molding and compression molding, as important molding methods in plastic processing, are widely used in various fields of industrial production, and the requirements for the precision, surface quality and strength of plastic products are increasing day by day. The traditional plastic molding process is prone to defects such as weld marks, orange peel, and fine lines. If a high-quality rapid cooling and rapid heating method can be used to quickly raise the mold temperature above the glass transition temperature of the plastic, and then quickly lower the mold temperature after molding Warming to the ejection temperature can effectively eliminate the above defects. Among them, how to quickly realize dynamic mold temperature change and control is a key problem restricting its realization.
目前市场上所采用的塑料成型设备，在实际生产过程中，通常通过加热整个模具，由此制造出的产品常存在熔接痕、橘皮、细纹等外观问题，且需要表面进行二次加工；这不仅增加了能耗与生产成本，如何进一步缩短成型周期也存在瓶颈。The plastic molding equipment currently used in the market, in the actual production process, usually heats the entire mold, and the products produced from this often have appearance problems such as weld marks, orange peel, and fine lines, and require secondary processing on the surface; This not only increases energy consumption and production costs, but also has bottlenecks in how to further shorten the molding cycle.
发明内容Contents of the invention
本发明提出一种采用半导体制冷器及相变材料的模具急冷急热装置，通过结合半导体制冷器及相变材料的优点，并引入闭环反馈控制电路，能实现对模具进行高效节能的急冷急热调节。The present invention proposes a rapid cooling and rapid heating device for molds using semiconductor refrigerators and phase change materials. By combining the advantages of semiconductor refrigerators and phase change materials and introducing a closed-loop feedback control circuit, it can realize rapid cooling and rapid heating of molds with high efficiency and energy saving adjust.
本发明采用以下技术方案。The present invention adopts the following technical solutions.
一种采用半导体制冷器及相变材料的模具急冷急热装置，用于对模具（10）进行急冷急热的温度调节作业，所述急冷急热装置包括控制模块、模具加热器、冷却液模具通道（9）、相变储冷器（1）、冷却液降温管（3）、半导体制冷器（6）；所述相变储冷器内贮有相变部件；所述冷却液模具通道设于模具（10）处；所述冷却液降温管设于相变储冷器处并经可控阀与冷却液模具通道相通；所述半导体制冷器的热端与模具相接，冷端与相变储冷器相接；当对模具进行急热作业时，半导体制冷器的热端加热模具而冷端对相变储冷器降温；当对模具进行急冷作业时，冷却液在冷却液降温管和冷却液模具通道中流动以快速对模具降温。A mold rapid cooling and rapid heating device using a semiconductor refrigerator and a phase change material, which is used to perform rapid cooling and rapid heating of the mold (10) for temperature adjustment operations, and the rapid cooling and rapid heating device includes a control module, a mold heater, and a cooling liquid mold channel (9), phase change cold storage device (1), cooling liquid cooling pipe (3), semiconductor refrigerator (6); phase change components are stored in the phase change cold storage device; the cooling liquid mold channel is set at the mold (10); the cooling liquid cooling pipe is set at the phase change cold storage and communicates with the cooling liquid mold channel through a controllable valve; the hot end of the semiconductor refrigerator is connected to the mold, and the cold end is connected to the phase The variable storage coolers are connected; when the mold is rapidly heated, the hot end of the semiconductor refrigerator heats the mold and the cold end cools the phase change cold storage; when the mold is rapidly cooled, the coolant is in the coolant cooling tube And the coolant flows in the mold channel to quickly cool down the mold.
所述半导体制冷器的热端经下导热基板（8）与模具相接，冷端经上导热基板（4）与相变储冷器相接；上导热基板、下导热基板的上、下面处均涂有导热硅胶或石墨作为导热介质；所述上导热基板、下导热基板的材料包括铜或铝。The hot end of the semiconductor refrigerator is connected to the mold through the lower heat conduction substrate (8), and the cold end is connected to the phase change cold storage device through the upper heat conduction substrate (4); the upper and lower parts of the upper heat conduction substrate and the lower heat conduction substrate Both are coated with thermally conductive silica gel or graphite as a thermally conductive medium; the materials of the upper thermally conductive substrate and the lower thermally conductive substrate include copper or aluminum.
所述半导体制冷器与上、下导热基板的连接方式包括螺钉夹紧固定、树脂胶黏或焊接；所述上、下导热基板与相变储冷器的连接方式包括螺钉夹紧固定、树脂胶黏或焊接。The connection method between the semiconductor refrigerator and the upper and lower heat conduction substrates includes screw clamping and fixing, resin glue or welding; the connection method between the upper and lower heat conduction substrates and the phase change cold storage includes screw clamping and fixing, resin glue glued or welded.
所述冷却液为水，所述冷却液降温管与辅助冷却水路相通；所述辅助冷却水路处设有驱动液体流动的供液泵；所述辅助冷却水路包括第一管、第二管；所述第一管连通冷却液降温管和冷却液模具通道；第二管与冷却液降温管相通且第二管处设有阀门。The cooling liquid is water, and the cooling liquid cooling pipe communicates with the auxiliary cooling waterway; the auxiliary cooling waterway is provided with a liquid supply pump to drive the liquid flow; the auxiliary cooling waterway includes a first pipe and a second pipe; The first pipe communicates with the cooling liquid cooling pipe and the cooling liquid mold channel; the second pipe communicates with the cooling liquid cooling pipe and the second pipe is provided with a valve.
所述冷却液模具通道的输出端处设有储水箱（13）用于暂存从冷却液模具通道输出的高温度冷却液，所述储水箱与第二管和冷却液模具通道相连。A water storage tank (13) is provided at the output end of the cooling liquid mold channel for temporarily storing the high-temperature cooling liquid output from the cooling liquid mold channel, and the water storage tank is connected with the second pipe and the cooling liquid mold channel.
所述模具内预置有电加热棒（12）作为辅助加热工具。An electric heating rod (12) is preset in the mold as an auxiliary heating tool.
所述半导体制冷器的热端处设有用于感应所述下导热基板（8）中心温度的热端闭环控制电路，该热端闭环控制电路通过PID控制并根据所感应的温度来调节半导体制冷器（6）的工作电流，确保采用最合适的工作电流使模具成型面温度在预设的范围内调整，即通过所感应的下导热基板的温度自动调整半导体制冷器的制热/制冷效果来控制模具型腔工作面工作温度。The hot end of the semiconductor refrigerator is provided with a hot end closed-loop control circuit for sensing the central temperature of the lower heat-conducting substrate (8), and the hot end closed-loop control circuit is controlled by PID and adjusts the semiconductor refrigerator according to the sensed temperature (6) The working current ensures that the most suitable working current is used to adjust the temperature of the mold forming surface within the preset range, that is, it is controlled by automatically adjusting the heating/cooling effect of the semiconductor refrigerator through the temperature of the lower heat-conducting substrate sensed The working temperature of the working surface of the mold cavity.
所述相变储冷器处设有散热风扇（2）；所述散热风扇连接所述用于感应所述上导热基板中心温度的冷端闭环控制电路，该冷端闭环控制电路通过温控开关控制，当感应到上导热基板（4）的中心温度超过设定值时，开启散热风扇，增加散热能力，使相变材料处的温度进一步降低，当上导热基板中心温度又降低到设定值以下时，关闭散热风扇。A heat dissipation fan (2) is provided at the phase-change cold storage; the heat dissipation fan is connected to the cold-end closed-loop control circuit for sensing the temperature of the center of the upper heat-conducting substrate, and the cold-end closed-loop control circuit is controlled by a temperature control switch. Control, when it is sensed that the center temperature of the upper heat conduction substrate (4) exceeds the set value, the cooling fan is turned on to increase the heat dissipation capacity, so that the temperature at the phase change material is further reduced, and when the center temperature of the upper heat conduction substrate drops to the set value Below, turn off the cooling fan.
所述相变部件的材质为具有一个熔点的单一相变材料或具有多个熔点的多种相变材料混合体，相变材料熔点范围为5~15摄氏度，且相变材料的熔点与半导体制冷器冷端非工作状态下的温度相匹配；当相变部件的材质为多种相变材料混合体时，相变材料混合体内的不同熔点的多种相变材料可随半导体制冷器冷端温度降低依次放热相变；所述相变材料包括低熔点石蜡。The material of the phase change component is a single phase change material with one melting point or a mixture of multiple phase change materials with multiple melting points. When the material of the phase change component is a mixture of multiple phase change materials, the multiple phase change materials with different melting points in the phase change material mixture can increase with the temperature of the cold end of the semiconductor refrigerator. Reduced sequential exothermic phase change; said phase change material comprising low melting point paraffin.
所这急冷急热装置对模具的调温作业分为急速加热作业、快速冷却作业和相变材料恢复作业；The temperature adjustment operation of the mold by the rapid cooling and rapid heating device is divided into rapid heating operation, rapid cooling operation and phase change material recovery operation;
在急速加热作业中，所述可控阀关闭冷却液降温管与冷却液模具通道的连接；半导体制冷器以热端加热模具成型面使模具温度快速上升，以冷端对相变储冷器降温使相变部件的相变材料由液相凝固为固相，此时相变材料释放的相变潜热通过冷却液降温管、辅助冷却水路内流动的水散逸，热端闭环控制电路通过调节半导体制冷器的工作电流来确保对模具的加热满足要求；In the rapid heating operation, the controllable valve closes the connection between the cooling liquid cooling pipe and the cooling liquid mold channel; the semiconductor refrigerator uses the hot end to heat the mold forming surface so that the mold temperature rises rapidly, and uses the cold end to cool the phase change cold storage The phase change material of the phase change component is solidified from the liquid phase to the solid phase. At this time, the phase change latent heat released by the phase change material dissipates through the cooling liquid cooling pipe and the water flowing in the auxiliary cooling water circuit. The operating current of the device is used to ensure that the heating of the mold meets the requirements;
在快速冷却作业中，所述半导体制冷器断电，所述可控阀导通冷却液降温管与冷却液模具通道的连接；所述供液泵驱动水在冷却液降温管和冷却液模具通道中流动以快速对模具降温；从冷却液模具通道输出的水在储水箱（13）内贮存并以储水箱内的大储量水快速降温；In the rapid cooling operation, the semiconductor refrigerator is powered off, and the controllable valve is connected to the cooling liquid cooling pipe and the cooling liquid mold channel; the liquid supply pump drives water to flow between the cooling liquid cooling pipe and the cooling liquid mold channel Flow in the middle to quickly cool down the mold; the water output from the coolant mold channel is stored in the water storage tank (13) and quickly cooled with the large amount of water in the water storage tank;
在相变材料恢复作业中，可控阀关闭冷却液降温管与冷却液模具通道的连接，所述第二管、第三管与冷却液降温管连通，使储水箱内的热水快速进入冷却液降温管，并在冷却液降温管、辅助冷却水路内循环流动，加热相变材料使其相变为液相，同时使水路内的水温快速降低；此时如上导热基板的温度高于阈值，则冷端闭环控制电路启动散热风扇以强化散热。During the phase change material recovery operation, the controllable valve closes the connection between the cooling liquid cooling pipe and the cooling liquid mold channel, and the second pipe and the third pipe are connected with the cooling liquid cooling pipe, so that the hot water in the water storage tank can quickly enter the cooling Liquid cooling pipe, and circulates in the cooling liquid cooling pipe and the auxiliary cooling water channel, heats the phase change material to change its phase into a liquid phase, and at the same time rapidly reduces the water temperature in the water channel; at this time, the temperature of the above heat-conducting substrate is higher than the threshold value, Then the cold-end closed-loop control circuit activates the heat dissipation fan to enhance heat dissipation.
与现有技术相比，本发明的有益效果在于：Compared with prior art, the beneficial effect of the present invention is:
（1）本发明通过急冷急热的实现，可大幅提升成型制品的表面质量。注塑（模压）前结合半导体制冷器的热端将成型面快速加热至较高温度，，成型完成后结合制冷器对模具快速降温，由此实现急冷急热；对应产品成型质量好、可消除成型产品的熔接痕和橘皮等缺陷。(1) The present invention can greatly improve the surface quality of molded products through the realization of rapid cooling and rapid heating. Before injection molding (molding), the hot end of the semiconductor refrigerator is used to quickly heat the molding surface to a higher temperature, and after the molding is completed, the refrigerator is used to quickly cool down the mold, thereby realizing rapid cooling and rapid heating; the corresponding product has good molding quality and can eliminate molding Defects such as weld lines and orange peel of the product.
（2）充分利用半导体热端与冷端能量进行模具分阶段加热冷却，具有显著的节能优点。结合相变材料的运用，进一步充分利用热能、节能环保，缩短了热冷却液冷却时间，提高加工循环效率。(2) Make full use of the energy of the hot end and cold end of the semiconductor to heat and cool the mold in stages, which has significant energy-saving advantages. Combined with the use of phase-change materials, the thermal energy is further fully utilized, energy-saving and environmentally friendly, the cooling time of the hot coolant is shortened, and the processing cycle efficiency is improved.
（3）由于半导体制冷器结构简单、体积紧凑，无移动部件，使得整个散热装置结构紧凑、可靠性强。此外，制冷器热端温度可控，可较为准确得控制型腔成型面的加热温度，保证成型面工作时的温度不高于设定值。(3) Since the semiconductor refrigerator has a simple structure, a compact volume, and no moving parts, the whole cooling device has a compact structure and high reliability. In addition, the temperature at the hot end of the refrigerator is controllable, which can accurately control the heating temperature of the molding surface of the cavity to ensure that the temperature of the molding surface is not higher than the set value when it is working.
附图说明Description of drawings
下面结合附图和具体实施方式对本发明进一步详细的说明：Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:
图1是本发明的示意图；Fig. 1 is a schematic diagram of the present invention;
图2是本发明急速加热作业的原理示意图（图中箭头为冷却水流动方向）；Fig. 2 is a schematic diagram of the principle of the rapid heating operation of the present invention (the arrow in the figure is the cooling water flow direction);
图3是本发明快速冷却作业的原理示意图（图中箭头为冷却水流动方向）；Fig. 3 is a schematic diagram of the principle of the rapid cooling operation of the present invention (the arrow in the figure is the cooling water flow direction);
图4是本发明相变材料恢复作业的原理示意图（图中箭头为冷却水流动方向）；Fig. 4 is a schematic diagram of the principle of the recovery operation of the phase change material of the present invention (the arrow in the figure is the cooling water flow direction);
图5是本发明以电加热棒辅助加热模具的示意图；Fig. 5 is the schematic diagram that the present invention assists heating mold with electric heating rod;
图6是本发明工作时相变材料能量传递的示意图图；Fig. 6 is a schematic diagram of the energy transfer of the phase change material during the work of the present invention;
图7是本发明设有储水箱时的急速加热作业的原理示意图（图中箭头为冷却水流动方向）；Fig. 7 is a schematic diagram of the principle of the rapid heating operation when the water storage tank is provided in the present invention (the arrow in the figure is the cooling water flow direction);
图8是本发明设有储水箱时的快速冷却作业的原理示意图（图中箭头为冷却水流动方向）；Fig. 8 is a schematic diagram of the principle of the rapid cooling operation when the water storage tank is provided in the present invention (the arrow in the figure is the cooling water flow direction);
图9是本发明设有储水箱时的相变材料恢复作业的原理示意图（图中箭头为冷却水流动方向）；Fig. 9 is a schematic diagram of the principle of phase change material recovery operation when the water storage tank is provided in the present invention (the arrow in the figure is the cooling water flow direction);
图10是本发明的热端闭环控制电路的原理示意图；Fig. 10 is a schematic diagram of the principle of the hot end closed-loop control circuit of the present invention;
图11是本发明的冷端闭环控制电路的原理示意图。Fig. 11 is a schematic diagram of the principle of the cold-end closed-loop control circuit of the present invention.
图中：1-相变储冷器；2-散热风扇；3-冷却液降温管；4-上导热基板；6-半导体制冷器；8-下导热基板；9-冷却液模具通道；10-模具；11-水流动方向；12-电加热棒；13-储水箱；101-第一管；102-第二管；103-供液泵；104-可控阀；105-阀门。In the figure: 1-phase change cold storage; 2-radiating fan; 3-coolant cooling pipe; 4-upper heat conduction substrate; 6-semiconductor refrigerator; 8-lower heat conduction substrate; 9-coolant mold channel; 10- Mold; 11-water flow direction; 12-electric heating rod; 13-water storage tank; 101-first pipe; 102-second pipe; 103-liquid supply pump; 104-controllable valve; 105-valve.
具体实施方式Detailed ways
如图1-11所示，一种采用半导体制冷器及相变材料的模具急冷急热装置，用于对模具10进行急冷急热的温度调节作业，所述急冷急热装置包括控制模块、模具加热器、冷却液模具通道9、相变储冷器1、冷却液降温管3、半导体制冷器6；所述相变储冷器内贮有相变部件；所述冷却液模具通道设于模具10处；所述冷却液降温管设于相变储冷器处并经可控阀104与冷却液模具通道相通；所述半导体制冷器的热端与模具相接，冷端与相变储冷器相接；当对模具进行急热作业时，半导体制冷器的热端加热模具而冷端对相变储冷器降温；当对模具进行急冷作业时，冷却液在冷却液降温管和冷却液模具通道中流动以快速对模具降温。As shown in Figure 1-11, a mold rapid cooling and rapid heating device using a semiconductor refrigerator and a phase change material is used to perform rapid cooling and rapid heating of the mold 10. The temperature adjustment operation, the rapid cooling and rapid heating device includes a control module, a mold Heater, cooling liquid mold channel 9, phase change cold storage device 1, cooling liquid cooling pipe 3, semiconductor refrigerator 6; phase change components are stored in the phase change cold storage device; the cooling liquid mold channel is located in the mold 10 places; the cooling liquid cooling pipe is located at the phase change cold storage and communicates with the cooling liquid mold channel through the controllable valve 104; the hot end of the semiconductor refrigerator is connected to the mold, and the cold end is connected to the phase change cold storage When the mold is rapidly heated, the hot end of the semiconductor refrigerator heats the mold and the cold end cools the phase change cold storage; when the mold is rapidly cooled, the coolant is in the coolant cooling tube and Flow in the mold channel to quickly cool down the mold.
所述半导体制冷器的热端经下导热基板8与模具相接，冷端经上导热基板4与相变储冷器相接；上导热基板、下导热基板的上、下面处均涂有导热硅胶或石墨作为导热介质；所述上导热基板、下导热基板的材料包括铜或铝。The hot end of the semiconductor refrigerator is connected to the mold through the lower heat conducting substrate 8, and the cold end is connected to the phase change cold storage through the upper heat conducting substrate 4; the upper and lower parts of the upper and lower heat conducting substrates are coated with heat conducting Silica gel or graphite is used as the heat conduction medium; the materials of the upper heat conduction substrate and the lower heat conduction substrate include copper or aluminum.
所述半导体制冷器与上、下导热基板的连接方式包括螺钉夹紧固定、树脂胶黏或焊接；所述上、下导热基板与相变储冷器的连接方式包括螺钉夹紧固定、树脂胶黏或焊接。The connection method between the semiconductor refrigerator and the upper and lower heat conduction substrates includes screw clamping and fixing, resin glue or welding; the connection method between the upper and lower heat conduction substrates and the phase change cold storage includes screw clamping and fixing, resin glue glued or welded.
所述冷却液为水，所述冷却液降温管与辅助冷却水路相通；所述辅助冷却水路处设有驱动液体流动的供液泵103；所述辅助冷却水路包括第一管101、第二管102；所述第一管连通冷却液降温管和冷却液模具通道；第二管与冷却液降温管相通且第二管处设有阀门105。The cooling liquid is water, and the cooling liquid cooling pipe communicates with the auxiliary cooling water circuit; the auxiliary cooling water circuit is provided with a liquid supply pump 103 for driving liquid flow; the auxiliary cooling water circuit includes a first pipe 101, a second pipe 102 ; the first pipe communicates with the cooling liquid cooling pipe and the cooling liquid mold channel; the second pipe communicates with the cooling liquid cooling pipe, and the second pipe is provided with a valve 105 .
所述冷却液模具通道的输出端处设有储水箱13用于暂存从冷却液模具通道输出的高温度冷却液，所述储水箱与第二管和冷却液模具通道相连。The output end of the cooling liquid mold channel is provided with a water storage tank 13 for temporarily storing the high-temperature cooling liquid output from the cooling liquid mold channel, and the water storage tank is connected with the second pipe and the cooling liquid mold channel.
所述模具内预置有电加热棒12作为辅助加热工具。An electric heating rod 12 is preset in the mold as an auxiliary heating tool.
所述半导体制冷器的热端处设有用于感应所述下导热基板8中心温度的热端闭环控制电路，该热端闭环控制电路通过PID控制并根据所感应的温度来调节半导体制冷器6的工作电流，确保采用最合适的工作电流使模具成型面温度在预设的范围内调整，即通过所感应的下导热基板的温度自动调整半导体制冷器的制热/制冷效果来控制模具型腔工作面工作温度。The hot end of the semiconductor refrigerator is provided with a hot end closed-loop control circuit for sensing the temperature of the center of the lower heat-conducting substrate 8. The hot end closed-loop control circuit is controlled by PID and adjusts the temperature of the semiconductor refrigerator 6 according to the temperature sensed. Working current, to ensure that the most suitable working current is used to adjust the temperature of the molding surface of the mold within the preset range, that is, to control the work of the mold cavity by automatically adjusting the heating/cooling effect of the semiconductor refrigerator through the sensed temperature of the lower heat conduction substrate surface working temperature.
所述相变储冷器处设有散热风扇2；所述散热风扇连接所述用于感应所述上导热基板中心温度的冷端闭环控制电路，该冷端闭环控制电路通过温控开关控制，当感应到上导热基板4的中心温度超过设定值时，开启散热风扇，增加散热能力，使相变材料处的温度进一步降低，当上导热基板中心温度又降低到设定值以下时，关闭散热风扇。A heat dissipation fan 2 is provided at the phase-change cold storage; the heat dissipation fan is connected to the cold-end closed-loop control circuit for sensing the temperature of the center of the upper heat-conducting substrate, and the cold-end closed-loop control circuit is controlled by a temperature control switch. When it is sensed that the center temperature of the upper heat conduction substrate 4 exceeds the set value, turn on the heat dissipation fan to increase the heat dissipation capacity, and further reduce the temperature at the phase change material; when the center temperature of the upper heat conduction substrate drops below the set value, turn off cooling fan.
所述相变部件的材质为具有一个熔点的单一相变材料或具有多个熔点的多种相变材料混合体，相变材料熔点范围为5~15摄氏度，且相变材料的熔点与半导体制冷器冷端非工作状态下的温度相匹配；当相变部件的材质为多种相变材料混合体时，相变材料混合体内的不同熔点的多种相变材料可随半导体制冷器冷端温度降低依次放热相变；所述相变材料包括低熔点石蜡。The material of the phase change component is a single phase change material with one melting point or a mixture of multiple phase change materials with multiple melting points. When the material of the phase change component is a mixture of multiple phase change materials, the multiple phase change materials with different melting points in the phase change material mixture can increase with the temperature of the cold end of the semiconductor refrigerator. Reduced sequential exothermic phase change; said phase change material comprising low melting point paraffin.
所这急冷急热装置对模具的调温作业分为急速加热作业、快速冷却作业和相变材料恢复作业；The temperature adjustment operation of the mold by the rapid cooling and rapid heating device is divided into rapid heating operation, rapid cooling operation and phase change material recovery operation;
在急速加热作业中，所述可控阀关闭冷却液降温管与冷却液模具通道的连接；半导体制冷器以热端加热模具成型面使模具温度快速上升，以冷端对相变储冷器降温使相变部件的相变材料由液相凝固为固相，此时相变材料释放的相变潜热通过冷却液降温管、辅助冷却水路内流动的水散逸，热端闭环控制电路通过调节半导体制冷器的工作电流来确保对模具的加热满足要求；In the rapid heating operation, the controllable valve closes the connection between the cooling liquid cooling pipe and the cooling liquid mold channel; the semiconductor refrigerator uses the hot end to heat the mold forming surface so that the mold temperature rises rapidly, and uses the cold end to cool the phase change cold storage The phase change material of the phase change component is solidified from the liquid phase to the solid phase. At this time, the phase change latent heat released by the phase change material dissipates through the cooling liquid cooling pipe and the water flowing in the auxiliary cooling water circuit. The operating current of the device is used to ensure that the heating of the mold meets the requirements;
在快速冷却作业中，所述半导体制冷器断电，所述可控阀导通冷却液降温管与冷却液模具通道的连接；所述供液泵驱动水在冷却液降温管和冷却液模具通道中流动以快速对模具降温；从冷却液模具通道输出的水在储水箱13内贮存并以储水箱内的大储量水快速降温；In the rapid cooling operation, the semiconductor refrigerator is powered off, and the controllable valve is connected to the cooling liquid cooling pipe and the cooling liquid mold channel; the liquid supply pump drives water to flow between the cooling liquid cooling pipe and the cooling liquid mold channel Medium flow to quickly cool down the mold; the water output from the coolant mold channel is stored in the water storage tank 13 and quickly cooled with the large amount of water in the water storage tank;
在相变材料恢复作业中，可控阀关闭冷却液降温管与冷却液模具通道的连接，所述第二管、第三管与冷却液降温管连通，使储水箱内的热水快速进入冷却液降温管，并在冷却液降温管、辅助冷却水路内循环流动，加热相变材料使其相变为液相，同时使水路内的水温快速降低；此时如上导热基板的温度高于阈值，则冷端闭环控制电路启动散热风扇以强化散热。During the phase change material recovery operation, the controllable valve closes the connection between the cooling liquid cooling pipe and the cooling liquid mold channel, and the second pipe and the third pipe are connected with the cooling liquid cooling pipe, so that the hot water in the water storage tank can quickly enter the cooling Liquid cooling pipe, and circulates in the cooling liquid cooling pipe and the auxiliary cooling water channel, heats the phase change material to change its phase into a liquid phase, and at the same time rapidly reduces the water temperature in the water channel; at this time, the temperature of the above heat-conducting substrate is higher than the threshold value, Then the cold-end closed-loop control circuit activates the heat dissipation fan to enhance heat dissipation.
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| CN112265235B (en) * | 2020-09-25 | 2022-11-29 | 中山骏腾塑胶制品有限公司 | Injection mold temperature lifting system and heating and cooling method |
| KR102476253B1 (en) * | 2021-05-21 | 2022-12-12 | 리얼룩앤컴퍼니 주식회사 | Apparatus that controls the temperature of the mold using a thermoelectric element |
| CN115592911A (en) * | 2021-07-08 | 2023-01-13 | 汉达精密电子（昆山）有限公司（Cn） | Thermoelectric conversion method and equipment for rapid cooling and heating equipment of die |
| CN113747774B (en) * | 2021-10-11 | 2024-08-20 | 中国工程物理研究院应用电子学研究所 | Temperature control cooling system and application method thereof |
| CN114251869B (en) * | 2021-11-25 | 2023-07-25 | 浙江创基有机硅材料有限公司 | High-efficient cooling device is used in MQ silicone resin production |
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