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CN108615734B - Display panel, manufacturing method thereof and display device - Google Patents

Display panel, manufacturing method thereof and display device Download PDF

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Publication number
CN108615734B
CN108615734B CN201810414611.9A CN201810414611A CN108615734B CN 108615734 B CN108615734 B CN 108615734B CN 201810414611 A CN201810414611 A CN 201810414611A CN 108615734 B CN108615734 B CN 108615734B
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China
Prior art keywords
sensing element
display
layer
groove
photoelectric sensing
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Expired - Fee Related
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CN201810414611.9A
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CN108615734A (en
Inventor
孙阔
胡耀
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Priority to CN201810414611.9A priority Critical patent/CN108615734B/en
Publication of CN108615734A publication Critical patent/CN108615734A/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • H10D86/021Manufacture or treatment of multiple TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices

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Abstract

The invention relates to the technical field of display, in particular to a display panel, a manufacturing method of the display panel and a display device. The display panel includes: the display structure comprises a display structure and a photoelectric sensing element, wherein a groove is formed in a display area on the display structure, and the photoelectric sensing element is embedded in the groove. By the scheme provided by the invention, the photoelectric sensing element can be integrated in the display area of the display panel without increasing the thickness of the display panel.

Description

Display panel, manufacturing method thereof and display device
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a manufacturing method of the display panel and a display device.
Background
Ambient Light Sensors (ALS) can sense Ambient light conditions and inform the processing chip to automatically adjust the backlight brightness of the display, reducing the power consumption of the product. In the prior art, a photoelectric sensing device is positioned outside a display panel and is a separate system with the display panel, the photoelectric sensing device module and the display panel are respectively provided by a photoelectric device provider and a display panel provider, and are respectively connected with a control center through independent circuit paths.
The integration of an ambient light sensor into a flat panel display is a new proposal of the current display technology, which is to build a photoelectric sensor in the flat panel display to detect the intensity of ambient light. In order to prevent the interference of the panel backlight light source to the photoelectric sensing device in the prior art, the photoelectric sensing device and the display panel are completely separated, the photoelectric sensing device is generally packaged firstly, and then the whole functional module is independently installed outside the display panel, so that the visual and operational screen display area is limited, and the packaged photoelectric sensing device module increases the longitudinal size of the whole system and is not in line with the trend of lightness and thinness of the display device.
Disclosure of Invention
The invention aims to provide a display panel, a manufacturing method thereof and a display device, which aim to solve the problem of thickness increase of the display panel caused by integrating a photoelectric sensing element into the display panel.
In order to achieve the purpose, the invention provides the following technical scheme:
the present invention first provides a display panel, including:
the display structure comprises a display structure and a photoelectric sensing element, wherein a groove is formed in a display area on the display structure, and the photoelectric sensing element is embedded in the groove.
Preferably, the display structure includes an array substrate and a flat layer disposed on the array substrate, and the groove is disposed on the flat layer.
Preferably, the display structure includes a pixel driving circuit and a flat layer disposed on the pixel driving circuit, and the groove is disposed on the flat layer.
Specifically, the planarization layer is further provided with a via hole for electrically connecting the photoelectric sensing element with other components.
In particular, the photo sensing element comprises an ambient light sensor and/or a distance sensor.
Correspondingly, the present invention further provides a manufacturing method of a display panel, the manufacturing method is used for manufacturing the display panel according to any one of the above technical solutions, and the manufacturing method includes:
forming a groove in a display area of the display structure;
and the photoelectric sensing element is embedded in the groove.
Preferably, the step of forming the groove in the display region of the display structure includes:
a flat layer provided with a groove is formed on the array substrate of the display area.
Preferably, the step of forming the groove in the display region of the display structure includes:
a flat layer having a groove is formed on a pixel driving circuit in a display region.
Specifically, the step of embedding the photo-sensing element in the groove includes: forming a photoelectric sensing element on a silicon substrate; embedding the photo-sensing element in the groove.
Specifically, the manufacturing method of the display panel further includes:
forming a via hole on the planarization layer;
and forming a conductive layer on the flat layer, wherein the conductive layer is used for realizing the electrical connection of the photoelectric sensing element and other components through the through hole.
Further, the invention also provides a display device comprising the display panel in any technical scheme.
Compared with the prior art, the scheme of the invention has the following advantages:
according to the display panel provided by the invention, the photoelectric sensing element is embedded in the groove of the display area, so that the photoelectric sensing element is integrated into the display area of the display panel, the area of a non-display area on the display panel is favorably reduced, the possibility of increasing the area of the display area on the display panel is improved, and meanwhile, the photoelectric sensing element is embedded in the groove of the display structure, so that the influence of the integrated photoelectric sensing element on the thickness of the whole display panel can be reduced.
According to the display panel provided by the invention, the photoelectric sensing element is integrated in the display area of the display panel, and compared with an external photoelectric sensing element, the number of external leads for signal transmission between the photoelectric sensing element and other components is reduced, and the complexity of lead connection is reduced.
According to the display panel provided by the invention, the through holes are formed in the flat layer, so that the photoelectric sensing element and other components can transmit signals more conveniently through the formed through holes, and the power consumption of the signals in the long-line transmission process is reduced. Moreover, the light intensity signal change detected by the photoelectric sensing element can be timely fed back and output through the via hole formed in the flat layer, so that the energy consumption of the screen can be effectively reduced, and the effect of saving electricity is achieved.
In addition, the display device provided by the invention is improved on the basis of the display panel, and therefore, the display device naturally inherits all the advantages of the display panel.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
fig. 2 is a schematic view of a partial structure of a display panel in a display area according to an embodiment of the present invention;
fig. 3 is a schematic view illustrating another state of the display panel according to an embodiment of the invention;
fig. 4 is a schematic partial structural view of a display panel in a display area according to another embodiment of the present invention;
fig. 5 is a schematic view illustrating another state of a display panel according to another embodiment of the present invention;
fig. 6 is a schematic flow chart illustrating a manufacturing method of a display panel according to an embodiment of the present invention.
Reference numerals:
10-display structure, 200-array substrate, 30-photoelectric sensing element, 40-interlayer insulating layer, 50-first conducting layer, 60-flat layer, 70-second conducting layer, 100-substrate and 80-pixel driving circuit.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative only and should not be construed as limiting the invention.
The present invention firstly provides a display panel, the structure diagram of which is shown in fig. 1, comprising: the display device comprises a display structure 10 and a photoelectric sensing element 30, wherein a groove is arranged in a display area on the display structure 10, and the photoelectric sensing element 30 is embedded in the groove.
The display structure 10 includes a display area and a non-display area thereon. The display structure may be a structure for forming the photo sensing element 30, such as the pixel driving circuit 80 and the planarization layer 60 disposed thereon, or the array substrate 200 and the planarization layer 60 disposed thereon. The photo-sensing element 30 may be used as an ambient light sensor or a distance sensor, or may be an integrated element combining the functions of the ambient light sensor and the distance sensor. When the photoelectric sensing element 30 is used as an ambient light sensor, the photoelectric sensing element 30 is configured to convert the collected light signal into an electrical signal and transmit the electrical signal to a component connected to the electrical signal, such as a main control module, where the main control module controls the backlight brightness of the backlight module according to the electrical signal transmitted by the ambient light sensor, so as to optimize the brightness of a display screen, and when the photoelectric sensing element 30 is used as an ambient light sensor, the photoelectric sensing element includes: at least one of a photodiode, a phototransistor, and a phototransistor.
Further, a second conductive layer 70 is disposed on the display structure 10, and the second conductive layer facilitates electrical connection between the photoelectric sensing element 30 embedded in the groove and other components. The other components include: a master control module or other components that require as input the light intensity signal detected by the photo-sensing element 30.
The position of the groove preferably does not affect the position of the photo-sensing element 30 for detecting the intensity of the ambient light, the shape and size of the groove are adjusted according to actual conditions, and are preferably optimized parameters determined in advance according to the display performance of the display panel, the size of the groove can enable the photo-sensing element 30 to be just embedded into the groove, and the shape of the groove can be an inverted trapezoid shape which is convenient for the photo-sensing element 30 to be embedded into, as shown in fig. 1.
The photoelectric sensing element 30 is embedded in the groove of the display area, on one hand, the photoelectric sensing element 30 can be integrated on the display panel, meanwhile, the power consumption in the signal transmission process between the photoelectric sensing element 30 and other parts is reduced, and the complexity of lead wires for connecting the photoelectric sensing element 30 and other parts is reduced, on the other hand, the photoelectric sensing element 30 is embedded in the groove of the display structure, so that the influence of the direct integration of the photoelectric sensing element 30 on the display panel on the longitudinal dimension of the display panel is avoided, and the problem of the thickness increase of the display panel caused by the integration of the photoelectric sensing element can be solved. The photoelectric sensing element 30 is embedded in the groove of the display region, so that compared with the photoelectric sensing element 30 arranged in the non-display region, the photoelectric sensing element is beneficial to reducing the area required by the non-display region, further reducing the non-display region and increasing the probability of realizing full-screen display.
In one embodiment, the display structure includes an array substrate 200 and a flat layer 60 disposed on the array substrate 200, and the groove is opened on the flat layer 60 of the array substrate 200. Fig. 2 is a schematic view of a partial structure of a display panel in a display area, where the display panel includes: the array substrate comprises an array substrate 200, a flat layer 60 and a second conductive layer 70, wherein the flat layer 60 and the second conductive layer 70 are sequentially stacked on the array substrate, a groove is formed in the flat layer 60, a photoelectric sensing element 30 is embedded in the groove, and the second conductive layer 70 is connected with the photoelectric sensing element 30 and other components. Fig. 3 is a schematic view of the display panel provided in this embodiment in another state, where the array substrate 200 includes: the substrate comprises a substrate base plate 100, a first active layer, a grid electrode insulating layer, a grid electrode metal layer, an interlayer insulating layer 40 and a first conducting layer 50, wherein the first active layer, the grid electrode insulating layer, the grid electrode metal layer, the interlayer insulating layer 40 and the first conducting layer 50 are sequentially arranged on the substrate base plate 100, and the first conducting layer 50 is electrically connected with the first active layer through a through hole penetrating through the interlayer insulating layer 40 and the grid electrode insulating layer. The interlayer insulating layer 40 disposed on the gate metal layer can protect the gate metal layer from being contaminated and damaged by other adjacent layers, and the interlayer insulating layer 40 may be an insulating material such as silicon oxide, silicon nitride, or an organic material. A flat layer 60 is further disposed on the interlayer insulating layer 40, and the flat layer 60 covers the first conductive layer 50. The flat layer 60 is provided with a groove, the shape and size of the groove provided on the flat layer may be set according to actual conditions, and preferably are optimized parameters determined in advance according to the display performance of the display panel, and the shape of the groove may be an inverted trapezoid, a rectangle, or other shapes that facilitate embedding of the photoelectric sensing element 30.
The second conductive layer 70 is used to connect the photo-sensing element 30 with other components, so as to implement a signal transmission path between the photo-sensing element and the other components, where the other components include: a master control module or other modules that require the light intensity signal detected by the photo-sensing element 30.
The flat layer 60 is further provided with a via hole for electrically connecting the photo-sensing element 30 with other components, and the second conductive layer 70 on the flat layer transmits the light intensity signal measured by the photo-sensing element 30 to the component for establishing connection with the photo-sensing element 30 through the via hole.
In the embodiment of the invention, the photoelectric sensing element 30 is integrated in the display area of the display panel, the signal transmission between the photoelectric sensing element 30 and other parts is mostly realized through an internal lead wire, and the light intensity change signal detected by the photoelectric sensing element 30 can be transmitted to other parts without a complex external lead wire, so that the complexity of the external lead wire in the display device is reduced.
By providing the grooves in the planar layer 60 on the array substrate 200, the planar layer 60 has better coverage than other layers, such as the first active layer or the interlayer insulating layer 40, so that the photo-sensing element 30 embedded in the grooves has better stability and electrical performance.
In another embodiment, the display structure includes a pixel driving circuit 80 and a flat layer 60 disposed on the pixel driving circuit 80, and the groove is opened on the flat layer 60.
Fig. 4 is a schematic view of a partial structure of a display panel in a display area, where the display panel includes: the pixel structure comprises a substrate 100, a pixel driving circuit 80 arranged on the substrate 100, a flat layer 60 laminated on one surface of the pixel driving circuit 80 far away from the substrate, and a second conductive layer 70 on the flat layer 60, wherein a groove is formed on the flat layer 60, a photoelectric sensing element 30 is embedded in the groove, and the second conductive layer 70 is connected with the photoelectric sensing element 30 and other components.
The pixel driving circuit 80 comprises structures such as a thin film transistor, a pixel electrode and a common electrode which drive a plurality of sub-pixels, a flat layer 60 with a groove is arranged on the pixel driving circuit 80, and the flat layer 60 is preferably made of an inorganic material, so that the instability of a device caused by stress among materials can be improved, and the stability of the device is improved. The shape and size of the grooves formed in the planarization layer 60 are preferably the same as those described in the previous embodiment. Similarly, the planarization layer 60 is further provided with a via hole, which facilitates the electrical connection between the photo-sensing element 30 and the pixel driving circuit 80 in the present embodiment.
The second conductive layer 70 connects the photo sensing element 30 and other components through a via hole penetrating the planarization layer 60, thereby realizing a signal transmission path between the photo sensing element and other components. The other components include a main control module, a pixel driving circuit 80, and the like. Fig. 5 is a schematic view of the display panel provided in this embodiment in another state.
Locate the recess in the planarization layer 60 on pixel drive circuit 80, realize integrating the photoelectric sensing element 30 in the recess in the display area of display panel, just pixel drive circuit 80 and photoelectric sensing element 30 can carry out the transmission of signal through the via hole that sets up more conveniently, reduce the power consumption of signal in the long-line transmission process, reduce the quantity of external lead wire simultaneously, reduce the lead wire complexity.
Correspondingly, the present invention further provides a manufacturing method of a display panel, which is used for manufacturing the display panel according to any of the above technical solutions, and the flow diagram of the manufacturing method is shown in fig. 6, and the method includes:
s61, forming a groove in the display area of the display structure;
the display structure is provided with a display area and a non-display area, and the display structure can be a pixel driving circuit, a flat layer arranged on the upper layer of the pixel driving circuit, an array substrate, a flat layer arranged on the upper layer of the array substrate and the like which are used for forming a photoelectric sensing element. And exposing and developing the display structure of the display area according to preset parameters of the groove to form the groove, wherein the preset parameters comprise the size and the shape of the groove, the preset parameters are preferably optimized parameters which are determined in advance according to the display performance of the display panel, and the position of the groove preferably does not influence the position of the photoelectric sensing element for detecting the ambient light intensity, such as the position of the groove formed on a flat layer on the array substrate.
The groove is formed in the display area, an external hanging device which is not originally integrated into the display panel can be embedded into the groove, the external hanging device is integrated on the display panel, and moreover, the external hanging device is integrated into the groove, so that the influence of the integrated external hanging device on the longitudinal size of the display panel is favorably reduced.
And S62, embedding the photoelectric sensing element in the groove.
This embodiment provides two kinds of modes and realizes to inlay the photoelectric sensing element in the recess, include: the photoelectric sensing element is formed in the groove, or the photoelectric sensing element is formed on the substrate in advance and then transferred into the groove.
Forming a photo-sensing element in the recess, the photo-sensing element being fabricated using thin film technology with silicon or an organic semiconductor, the fabrication process comprising: layers of the photo-sensing element are formed in the groove, which are sequentially stacked. In one embodiment, the photo-sensing element comprises: and the electrode layer, the thin film transistor layer and the photoelectric sensing layer are preferably formed in the groove in a deposition mode and are sequentially stacked.
The photoelectric sensing element is directly formed in the groove, so that the fitting degree of the photoelectric sensing element and the groove can be improved, the problem of the matching tolerance between the photoelectric sensing element and an external packaging layer caused by the external hanging of the photoelectric sensing element is avoided, and the packaging difficulty is favorably reduced.
Forming the photoelectric sensing element on a substrate in advance and transferring the photoelectric sensing element into a groove, wherein the substrate is a substrate for forming the photoelectric sensing element, preferably a silicon-based substrate, and the step of forming the photoelectric sensing element on the substrate in advance comprises the following steps: and sequentially depositing each layer of the photoelectric sensing element on the silicon substrate, stripping the silicon substrate and the formed photoelectric sensing element, and transferring the photoelectric sensing element into the groove.
The method for forming the photoelectric sensing element outside the groove in advance provided by the embodiment can be used for manufacturing the photoelectric sensing element without manufacturing the photoelectric sensing element after the display structure is formed, reducing the influence of the manufacturing process and the manufacturing time of the display panel on the manufacture of the photoelectric sensing element, manufacturing the photoelectric sensing element while manufacturing other device layers of the display panel, and assembling the display panel with the groove and the photoelectric sensing element, thereby improving the manufacturing efficiency of the display panel.
The manufacturing method of the display panel further comprises the following steps: and S63, forming a second conductive layer connecting the photoelectric sensing element and other components on the display structure.
The second conducting layer penetrates through a through hole formed in the flat layer to be connected with other components, and the other components comprise: and the main control module, the pixel driving circuit and other parts need to be connected with the photoelectric sensing element.
The photoelectric sensing element can be used as an ambient light sensor or a distance sensor, and can also be an integrated element combining the functions of the ambient light sensor and the distance sensor. When the photoelectric sensing element is used as an ambient light sensor, the photoelectric sensing element can detect the brightness change of ambient light when the display device operates to change the backlight brightness of the backlight module so as to optimize the brightness of a displayed picture, and when the photoelectric sensing element is used as the ambient light sensor, the photoelectric sensing element comprises: at least one of a photodiode, a phototransistor, and a phototransistor.
When the photoelectric sensing element is used as an ambient light sensor, a light intensity signal is collected and converted into an electric signal to be transmitted to the main control module, and the main control module adjusts the driving current of the display device according to the electric signal so as to adjust the output of the display device and adjust the ambient illumination. The manufacturing method and the manufacturing material of the photoelectric sensing element can be the same as those of the display structure so as to simplify the processing process and the manufacturing procedure.
In one embodiment, the step of forming the recess in the display area of the display structure comprises: a flat layer provided with a groove is formed on the array substrate of the display area.
Specifically, a first active layer, a gate insulating layer, a gate metal layer, and an interlayer insulating layer are sequentially formed on a substrate. The interlayer insulating layer on the display area is also provided with a first conducting layer, the first conducting layer penetrates through the interlayer insulating layer and is connected to the source electrode and the drain electrode on the substrate to form electric contact, a flat layer provided with a groove is formed on the interlayer insulating layer and covers the first conducting layer, and the groove is used for embedding a subsequent photoelectric sensing element.
Forming a flat layer on the interlayer insulating layer in a manner including: deposition, evaporation, sputtering, and the like. Preferably, a deposition mode is adopted, a mask is utilized to form a flat layer with a groove on the interlayer insulating layer, a via hole is formed on the flat layer, the position of the via hole is preferably arranged at the edge position of the flat layer nearest to the groove, and the electrical connection between the photoelectric sensing element in the groove and other parts is facilitated through the via hole. It should be noted that the formation of the via hole on the planarization layer and the formation of the planarization layer may adopt the same process, or the via hole may be formed after the planarization layer is formed.
Further, a second conductive layer is formed on the planarization layer. The second conductive layer is connected with the photoelectric sensing element and other components through via holes penetrating through the flat layer, and a signal transmission path between the photoelectric sensing element and other components is established, wherein the other components comprise a main control module and the like.
Compared with the groove arranged on other layers such as the first active layer or the interlayer insulating layer, the groove is arranged on the flat layer, the flat layer has better cladding performance, and the photoelectric sensing element embedded in the groove has better stability and electrical performance.
The groove is formed on the flat layer on the array substrate, and the externally hung photoelectric sensing element can be integrated in the groove of the array substrate, so that the area of a non-display area is reduced, the packaging process is simplified, and the structural stability and the integration level of the whole display panel are improved.
In another embodiment, the step of forming the recess in the display area of the display structure comprises: a flat layer having a groove is formed on a pixel driving circuit in a display region.
Specifically, the pixel driving circuit is formed on the substrate, and a flat layer having a groove is preferably formed on the pixel driving circuit by deposition, and the shape and size of the groove are preferably the preset parameters. Similarly, a via hole is formed in the planarization layer above the pixel driving circuit through exposure and development, and is used for facilitating the electrical connection between the photoelectric sensing element and other components through the via hole, and the other components comprise a main control module, the pixel driving circuit and other components which need the light intensity signal collected by the photoelectric sensing element as input.
The position of the through hole is preferably arranged at the edge position of the flat layer closest to the groove, and the through hole facilitates the electrical connection between the photoelectric sensing element in the groove and other components. The formation of the via hole on the flat layer and the formation of the flat layer may adopt the same process, or the via hole may be formed after the flat layer is formed. In the embodiment, the flat layer and the via hole on the flat layer are preferably manufactured by one process, so that the manufacturing process and the production process are simplified.
Further, a second conductive layer is formed on the planarization layer. The second conductive layer is connected with the photoelectric sensing element and other components through a through hole penetrating through the flat layer, and a signal transmission path between the photoelectric sensing element and other components is established.
A groove is formed in the flat layer above the pixel driving circuit, and the photoelectric sensing element is integrated in the groove of the display area of the display panel, so that the convenience of signal transmission of the pixel driving circuit and the photoelectric sensing element is improved, and the power consumption of signals in a long-line transmission process is reduced.
Furthermore, the invention also provides a display device comprising the display panel according to any one of the above technical solutions.
The display device can be any product or component with a display function, such as electronic paper, an OLED panel, an AMOLED panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
The display device is improved on the basis of the display panel described above, and therefore, the display device naturally inherits all the advantages of the display panel.
The foregoing is only a partial embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (6)

1. A display panel, comprising:
the display device comprises a display structure and a photoelectric sensing element, wherein a groove is formed in a display area on the display structure, the photoelectric sensing element is embedded in the groove, and the photoelectric sensing element comprises an ambient light sensor and/or a distance sensor; the display structure comprises an array substrate and a flat layer arranged on the array substrate, and the groove is formed in the flat layer; the array substrate includes: the substrate comprises a substrate base plate, a first active layer and an interlayer insulating layer, wherein the first active layer and the interlayer insulating layer cover the first active layer, and a flat layer is further arranged on the interlayer insulating layer.
2. The display panel of claim 1, wherein the planarization layer further has a via hole for electrically connecting the photo sensor device to other components.
3. A manufacturing method of a display panel for manufacturing the display panel according to any one of claims 1 to 2, comprising:
forming a groove in a display area of the display structure; wherein the step of forming a recess in the display area of the display structure comprises: forming a flat layer provided with a groove on the array substrate of the display area;
embedding the photoelectric sensing element in the groove, wherein the photoelectric sensing element comprises an ambient light sensor and/or a distance sensor; the array substrate includes: the substrate comprises a substrate base plate, a first active layer and an interlayer insulating layer, wherein the first active layer and the interlayer insulating layer cover the first active layer, and a flat layer is further arranged on the interlayer insulating layer.
4. The method of claim 3, wherein the step of embedding the photo-sensing element in the groove comprises:
forming a photoelectric sensing element on a silicon substrate; embedding the photo-sensing element in the groove.
5. The method of manufacturing according to claim 3, further comprising:
forming a via hole on the planarization layer;
and forming a conductive layer on the flat layer, wherein the conductive layer is used for realizing the electrical connection of the photoelectric sensing element and other components through the through hole.
6. A display device comprising the display panel according to any one of claims 1 to 2.
CN201810414611.9A 2018-05-03 2018-05-03 Display panel, manufacturing method thereof and display device Expired - Fee Related CN108615734B (en)

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