Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
The embodiment of the application provides an electronic device which can comprise electronic equipment and the like.
In some embodiments, an electronic device is provided. The electronic device can be a smart phone, a tablet computer and the like. Referring to fig. 1, the electronic device 100 includes a cover plate 10, a display screen 21, a circuit board 30, and a case 40.
Wherein the cover plate 10 is mounted to the display screen 21 to cover the display screen 21. The cover plate 10 may be a transparent glass cover plate. In some embodiments, the cover plate 10 may be a glass cover plate made of a material such as sapphire.
The display screen 21 is mounted on the housing 40 to form a display surface of the electronic apparatus 100. The display 21 serves as a front case of the electronic device 100, and forms a closed space with the housing 40 for accommodating other electronic components of the electronic device 100. Meanwhile, the display screen 21 forms a display surface of the electronic apparatus 100 for displaying information such as images, texts, and the like.
The circuit board 30 is mounted inside the housing 40 to accommodate the circuit board 30 in the closed space. The circuit board 30 may be a motherboard of the electronic device 100. The circuit board 30 is provided with a grounding point to realize grounding of the circuit board 30. Functional components such as a camera and a processor may be integrated on the circuit board 30. Meanwhile, the display screen 21 may be electrically connected to the circuit board 30.
In some embodiments, display control circuitry is disposed on the circuit board 30. The display control circuit outputs an electric signal to the display screen 21 to control the display screen 21 to display information.
The housing 40 is used to form the outer contour of the electronic device 100. The housing 40 may be made of plastic or metal. The housing 40 may be integrally formed.
As shown in fig. 1 and 2, the electronic device 100 further includes a sensor assembly 232 and an optical reflector 22. Wherein the sensor assembly 232 and the optical mirror 22 are both disposed on one side of the display screen 21.
It will be appreciated that the sensor assembly 232 and the optical mirror 22 are disposed on the inside of the display screen 21. Here, the inner side refers to a side where the display screen 21 is not visible when viewed from the outside of the electronic apparatus 100. That is, the sensor assembly 232 and the optical mirror 22 are located inside the electronic device 100.
The display panel 21 includes a display layer 211 and a light-shielding layer 212. The display layer 211 is used to display information such as images and texts. The light shielding layer 212 faces the sensor element 232. The light-shielding layer 212 is used to hide the internal structure of the electronic device 100, so that a user can see the internal electronic components of the electronic device 100 through the display screen 21.
In some embodiments, the cover plate 10 is mounted on the display screen 21. That is, the cover plate 10 is disposed over the display layer 211. Wherein, the edge of the cover plate 10 is provided with an opening 213, and the opening 213 allows signals such as optical signals, sound wave signals, etc. to pass through.
Sensor assembly 232 includes a signal transmitter 2321 and a signal receiver 2322. The signal transmitter 2321 is configured to transmit the detection signal a outwards. The detection signal a is reflected to the opening 213 by the optical mirror 22 and then transmitted to the outside through the opening 213. When the detection signal a contacts an external object 200 (e.g., a user's face), a reflected signal B is generated. Reflected signal B passes through aperture 213 and enters signal receiver 2322 via optical mirror 22.
After receiving the reflected signal B, the signal receiver 2322 may output the received signal to a processor of the electronic device 100 for processing, so as to control the display screen of the electronic device 100 to turn off or turn on the display screen.
Further, the signal emitter 2321 has a signal emitting surface facing the optical mirror 22; signal receiver 2322 has a signal-receiving face which faces optical mirror 22.
It should be noted that, the optical reflector 22 is matched with the sensor component 232, and the signal sent by the sensor component 232 can be reflected to the opening 213 through the optical reflector 22 and then transmitted to the outside through the opening 213; meanwhile, the formed signal reflected by the external object can also pass through the opening 213 and be reflected to the sensor assembly 232 by the optical reflector 22. The placement angles of the sensor assembly 232 and the optical reflector 22 are not limited herein, and can be set by those skilled in the art according to the actual situation.
Sensor module 232 can be through optics speculum 22 with detection signal reflection to trompil 213 department, and reflection signal can reflect to sensor module 232 through optics speculum 22 simultaneously for detection signal A and reflection signal B need not pass through display screen 21, have promoted sensor module 232 detection signal's accuracy, and then improve the accuracy that electronic equipment 100 controlled display screen 21 and put out the screen or shine the screen.
In some embodiments, the signal emitter 2321 is an infrared emitter for emitting infrared rays. The signal receiver 2322 is an infrared receiver, and is configured to receive infrared rays.
In some embodiments, the Display 21 may be a Liquid Crystal Display (LCD) or Organic Light-Emitting Diode (OLED) Display, or the like. When the display screen 21 is a liquid crystal display screen, the display layer 211 may include a backlight plate, a lower polarizer, an array substrate, a liquid crystal layer, a color film substrate, an upper polarizer, and the like, which are sequentially stacked. When the display panel 21 is an organic light emitting diode display panel, the display layer 211 may include a base layer, an anode, an organic layer, a conductive layer, an emission layer, a cathode, and the like, which are sequentially stacked.
In some embodiments, the light-shielding layer 211 may be a thin layer structure made of foam or steel.
In some embodiments, the opening 213 is a circular hole. The diameter of the opening 213 is 2 to 4 mm. In other embodiments, the opening 213 may be a square hole, an elliptical hole, or other shapes.
In some embodiments, as shown in fig. 2 and 3, the optical reflector 22 has a reflecting plane 222. Wherein the reflective plane 222 faces the sensor assembly 232 and the aperture 213 in the display screen assembly 20.
It is understood that the optical reflector 22 has a reflection plane 222, wherein the reflection plane 222 faces the sensor element 232 and the opening 213, and the angle between the reflection plane of the optical reflector 22 and the sensor element 232 and the opening 213 is adjusted so that the signal emitted from the sensor element 232 can be reflected to the opening 213 via the reflection plane of the optical reflector 22.
In some embodiments, as shown in fig. 2 and 4, the optical reflecting mirror 22 has a concave reflecting surface 222, that is, the reflecting surface of the optical reflecting mirror 22 is concave and can function as a light-gathering surface, wherein the concave reflecting surface 222 faces the sensor element 232 and the opening 213, and the angles between the concave reflecting surface of the optical reflecting mirror 22 and the sensor element 232 and the opening 213 are adjusted, so that the signal emitted by the sensor element 232 can be reflected to the opening 213 via the reflecting plane of the optical reflecting mirror 22.
In some embodiments, as shown in fig. 5, sensor assembly 232 includes a signal transmitter 2321 and a signal receiver 2322. Wherein signal transmitter 2321 and signal receiver 2322 are disposed adjacent to one another. The distance d1 between the geometric center of signal transmitter 2321 and the geometric center of signal receiver 2322 is 2 to 14 millimeters.
In some embodiments, signal transmitter 2321 and signal receiver 2322 are packaged as a first chip 24. Disposing signal transmitter 2321 and signal receiver 2322 adjacent to one another may reduce the volume of first chip 24.
In some embodiments, as shown in fig. 6, sensor assembly 232 includes a signal transmitter 2321 and a signal receiver 2322. Wherein signal transmitter 2321 and signal receiver 2322 are disposed spaced apart from each other. Distance d2 between signal emitter 2321 and signal receiver 2322 is 2 to 14 millimeters. It is understood that the above distance is a distance between a geometric center of signal transmitter 2321 and a geometric center of signal receiver 2322. The signal transmitter 2321 and the signal receiver 2322 are spaced apart from each other, so that the isolation between the signal transmitter 2321 and the signal receiver 2322 can be improved, and the influence of the signal transmitted by the signal transmitter 2321 on the signal receiver 2322 can be reduced.
In some embodiments, the signal transmitter 2321 and the signal receiver 2322 are packaged as a first chip 24.
In some embodiments, as shown in fig. 7, sensor assembly 232 includes a signal emitter 2321, a signal receiver 2322, and an ambient light sensor 2323. The ambient light sensor 2323 is used to detect the intensity of ambient light. Electronic device 100 may adjust the brightness of display screen 21 based on the intensity of ambient light detected by ambient light sensor 2323.
Signal emitter 2321, signal receiver 2322, and ambient light sensor 2323 are disposed adjacent to one another. The distance d3 between the geometric center of signal transmitter 2321 and the geometric center of signal receiver 2322 is 2 to 14 millimeters.
In some embodiments, signal transmitter 2321, signal receiver 2322 and ambient light sensor 2323 are packaged as a second chip 25.
In some embodiments, as shown in fig. 8, sensor assembly 232 includes a signal emitter 2321, a signal receiver 2322, and an ambient light sensor 2323. The ambient light sensor 2323 is used to detect the intensity of ambient light. Electronic device 100 may adjust the brightness of display screen 21 based on the intensity of ambient light detected by ambient light sensor 2323.
Signal emitter 2321, signal receiver 2322 and ambient light sensor 2323 are disposed spaced apart from one another. Distance d4 between signal emitter 2321 and signal receiver 2322 is 2 to 14 millimeters. It is understood that the above distance is a distance between a geometric center of signal transmitter 2321 and a geometric center of signal receiver 2322. The signal emitter 2321, the signal receiver 2322 and the ambient light sensor 2323 are arranged at intervals, so that the isolation among the signal emitter 2321, the signal receiver 2322 and the ambient light sensor 2323 can be improved, and the influence of the signal emitted by the signal emitter 2321 on the signal receiver 2322 and the ambient light sensor 2323 can be reduced.
In some embodiments, signal transmitter 2321, signal receiver 2322 and ambient light sensor 2323 are packaged as a second chip 25.
The display screen assembly and the electronic device provided by the embodiments of the present application are described in detail above, and the principles and embodiments of the present application are explained herein by applying specific examples, and the descriptions of the above embodiments are only used to help understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.