CN107482101A - A kind of LED encapsulation device with multi-cup holder and preparation method thereof - Google Patents

Abstract

The invention provides an LED packaging device with a multi-cup bracket, which includes an LED chip, a bracket, an electrical connection wire, and a fluorescent glue layer. Plastic layer; the reflective plastic layer is coated around the surface of the plastic base in a cup shape to form a bracket cup; the number of plastic baffles is at least one, and the plastic baffle is arranged on the metal substrate; the plastic baffle and The reflective plastic layer forms at least two independent bowls. The invention provides an LED packaging device with a multi-cup holder, which has an ingenious structure, not only adjustable color temperature, but also no mutual light absorption phenomenon between chips. The invention also provides a method for preparing an LED packaging device with a multi-cup holder, the preparation process is simple and easy, and the preparation efficiency is high.

Description

A kind of LED encapsulation device with multi-cup holder and preparation method thereof

technical field

The invention belongs to the technical field of light-emitting diodes (LEDs), and in particular relates to an LED packaging device with a multi-cup holder and a preparation method thereof.

Background technique

Light-emitting diodes (LEDs) have the characteristics of long service life, high color rendering index, energy saving and environmental protection, and high brightness. Therefore, the country vigorously advocates the use of LEDs, which have been widely used in technical fields such as architectural decoration, backlight, stage color light, automobile headlights, indoor and outdoor lighting, and traffic signals.

Most of the existing LED brackets are single-cup brackets, which have the following disadvantages: the choice of chips is single, and if multiple chips are connected in parallel or in series, only LED sealing devices with the same color temperature can be prepared, and the color of the lamp beads is also single. In addition, when multiple chips are connected in parallel or in series, it is easy for chips to absorb light from each other.

At present, the existing Chinese patent CN104183685A discloses an LED double-cup adjustable LED lamp with adjustable color temperature, display finger and seven colors. In this patent, two reflective cups are separated by a longitudinal partition wall through the insulating body, so as to achieve the purpose of preparing lamp beads with different color temperatures. However, two types of LED chips can be arranged in each reflector cup and have mutually independent conductive terminals, so the structure is relatively complicated; and the preparation process is relatively difficult, the preparation efficiency is low, and the preparation cost is high.

Therefore, there is an urgent need to find a better method for use in LED packaging technology, so that the color temperature of the LED device produced by it can be adjusted, and the mutual light absorption phenomenon will not occur between the chips.

Contents of the invention

In order to make up for the deficiencies in the prior art, the purpose of the present invention is to provide an LED packaging device with a multi-cup holder, which has an ingenious structure, not only adjustable color temperature, but also no mutual light absorption between chips.

The present invention is for reaching its purpose, and the technical scheme that adopts is as follows:

An LED packaging device with a multi-cup bracket, comprising an LED chip, a bracket, an electrical connection wire, and a fluorescent glue layer, and the bracket includes a plastic base, a metal base plate arranged on the plastic base, a plastic baffle, and a reflective plastic layer; the reflective plastic layer is coated around the surface of the plastic base in a cup shape to form a bracket bowl; the number of the plastic baffle is at least one, and the plastic baffle is arranged on the metal substrate ; The plastic baffle and the reflective plastic layer form at least two independent bowls.

Further, the height of the plastic baffle is consistent with the height of the bracket cup.

Further, the metal substrate is an etched copper sheet; the etched copper sheet includes a chip placement area, a positive electrode area and a negative electrode area.

Furthermore, the positive electrode area and the negative electrode area are respectively arranged on two sides of the chip placement area. The chip placement area where the LED chip is located is separated from the positive electrode area and the negative electrode area, realizing a thermoelectric separation structure.

Further, the reflective plastic layer is also coated on the chip placement area, the surface of the metal substrate between the positive electrode area and the negative electrode area, and the peripheral surface of the chip placement area. By increasing the surface area of the reflective plastic layer, the reflective effect of the LED packaging device of the present invention is also increased, so that the present invention has the advantages of improving light efficiency and increasing light and color effects.

Furthermore, the reflective plastic layer is a white reflective plastic layer.

Further, the plastic baffle is located on the chip placement area, the positive electrode area and the negative electrode area. The plastic baffle is located on the chip placement area, the positive electrode area and the negative electrode area at the same time, and multiple LED chips use the same positive electrode area and negative electrode area, which reduces the area of the metal substrate.

Furthermore, the number of the plastic baffle is one, and the plastic baffle is located on the axis line of the chip placement area, the positive electrode area and the negative electrode area.

Further, the LED chip is fixed in the chip placement area; the LED chip is electrically connected to the chip placement area, the positive electrode area or the negative electrode area through the electrical connection line to form a circuit loop; the fluorescent The adhesive layer completely covers the LED chip and the electrical connection wire in a heat-cured form.

Further, a silver layer is plated on the surface of the etched copper sheet.

Further, an LED packaging device with a multi-cup holder, the holder further includes a reflective layer, and the reflective layer is arranged on the surface of the reflective plastic layer inside the cups of the holder. A reflective layer is provided on the surface of the reflective plastic layer inside the bracket bowl, which further increases its reflective effect, further improves light efficiency, and increases light and color effects.

In addition, another object of the present invention is to correspondingly provide a method for preparing an LED packaging device with a multi-cup holder, the preparation process of which is simple and feasible, and the preparation efficiency is high.

The present invention is for reaching its purpose, and the technical scheme that adopts is as follows:

A preparation of an LED packaging device with a multi-cup holder, the method comprising the following steps:

S10: fixing the metal substrate on the plastic base;

S20: making a plastic baffle on the metal substrate;

S30: making a cup-shaped reflective plastic layer around the surface of the plastic base;

S40: The LED chip is fixed on the chip placement area; the LED chip is electrically connected to the chip placement area, the positive electrode area, or the negative electrode area through an electrical connection wire to form a circuit loop;

S50: Cover the LED chip and the electrical connection wire completely with a fluorescent adhesive layer, and package them into an LED packaging device.

Further, after step S10 and before step S20, the following steps are also included:

S11: The metal substrate is etched to form a chip placement area, a positive electrode area, and a negative electrode area;

S12: Plating a silver layer on the surface of the chip placement area, the positive electrode area and the negative electrode area through an electroplating process.

Further, after step S30 and before step S40, the following steps are also included:

S31: coating the reflective plastic layer on the surface of the metal substrate between the chip placement area, the positive electrode area, and the negative electrode area, and the surface around the chip placement area;

S32: Making a reflective layer on the surface of the reflective plastic layer inside the bracket cup.

Furthermore, in the step S20, the plastic baffle is manufactured by injection molding or molding; in the steps S30 and S31, the reflective plastic layer is manufactured by injection molding or molding.

Further, in the step S32, the reflective layer adopts a process of mask and spraying.

Compared with the prior art, the present invention has the following beneficial technical effects:

1. The structure of the present invention is ingenious, the plastic baffle is set on the metal substrate, and forms at least two independent bowls with the white reflective plastic layer, so that the brightness between the multi-chips will not affect each other, completely solving the problem of multi-chip Chips absorb each other, and at the same time solve the problem of single color of lamp beads in the prior art;

2. The preparation method of an LED packaging device with a multi-cup holder provided by the present invention has a simpler preparation process, is easy to process, significantly improves the preparation efficiency, and reduces the preparation cost.

Description of drawings

Fig. 1 is the plan view of a kind of structure of support of the present invention;

Fig. 2 is a sectional view of part A in Fig. 1;

Fig. 3 is a sectional view of part B in Fig. 1;

Fig. 4 is a top view of parallel connection of the LED chips of the present invention on the bracket shown in Fig. 1;

Fig. 5 is a sectional view of part A in Fig. 4;

Fig. 6 is a sectional view of part B in Fig. 4;

Fig. 7 is a schematic diagram of a preparation process of the LED packaging device shown in Fig. 4;

Fig. 8 is a top view of LED chips of the present invention connected in series on the bracket shown in Fig. 1;

Fig. 9 is a sectional view of part A in Fig. 7;

Fig. 10 is a top view of another structure of the stent of the present invention;

Reference signs:

100-LED packaging device; 1-bracket; 11-plastic base; 12-metal substrate; 121-chip placement area; 122-positive electrode area; 123-negative electrode area; 13-plastic baffle; 14-reflective plastic layer; 15-reflective layer; 2-LED chip; 3-electrical connecting wire; 4-fluorescent adhesive layer.

detailed description

Below in conjunction with accompanying drawing, technical scheme of the present invention is described further:

Example 1

As shown in FIGS. 1-8 , this embodiment discloses an LED packaging device 100 with a multi-cup holder, including an LED chip 2 , a holder 1 , an electrical connection wire 3 , and a fluorescent glue layer 4 .

Specifically, as shown in FIGS. 1-3 , the bracket 1 includes a plastic base 11 , a metal substrate 12 disposed on the plastic base 11 , a plastic baffle 13 , and a reflective plastic layer 14 . The metal substrate 12 is an etched copper sheet, and the etched copper sheet includes a chip placement area 121 , a positive electrode area 122 and a negative electrode area 123 . Preferably, the positive electrode area 121 and the negative electrode area 122 are respectively arranged on two sides of the chip placement area 121 . Preferably, a silver layer is plated on the surface of the etched copper sheet. In this embodiment, the size of the positive electrode area 122 and the negative electrode area 123 is 0.3 mm×0.1 mm. The reflective plastic layer 14 is coated around the surface of the plastic base 11 in a cup shape to form a bracket cup. There is at least one plastic baffle 13 , and the plastic baffle 13 is disposed on the metal substrate 12 . Specifically, the plastic baffle 13 is located on the chip placement area 121 , the positive electrode area 122 and the negative electrode area 123 . The plastic baffle 13 and the reflective plastic layer 14 form at least two independent bowls. Therefore, the brightness of multiple LED chips 2 will not affect each other, and can be used to manufacture LED packaging devices with adjustable color temperature. In this embodiment, the number of plastic baffles 13 is one, and the plastic baffles 13 are located on the axis lines of the chip placement area 121, the positive electrode area 122, and the negative electrode area 123, and form two independent panels with the reflective plastic layer 14. Bowl cup. The height of the plastic baffle plate 13 is consistent with the height of the bracket bowl cup. The thickness of the plastic baffle 13 is 0.2-0.5 mm.

As shown in FIGS. 1-3 , the reflective plastic layer 14 is also coated on the surface of the metal substrate 12 between the chip placement area 121 , the positive electrode area 122 and the negative electrode area 123 and the peripheral surface of the chip placement area 121 . Preferably, the reflective plastic layer 14 is a white reflective plastic layer. In this embodiment, the thickness of the reflective plastic layer 14 coated on part of the surface of the metal substrate 12 is 0.05 mm. An LED packaging device with a multi-cup bracket also includes a reflective layer 15, which is arranged on the surface of the reflective plastic layer 14 inside the cups of the bracket. By increasing the surface area of the reflective plastic layer 14, and setting the reflective layer 15 on the surface of the reflective plastic layer 14 inside the bracket cup, the reflective effect of the LED packaging device prepared by the present invention is increased, so that the present invention has the effect of improving light efficiency and increasing light color The advantages.

As shown in Figures 4-6 and 8-9, two LED chips 2 are fixed on the chip placement area 121, and a positive electrode area 122 and a negative electrode area 123 are used together, which reduces the area of the metal substrate 12. As shown in Figures 4-6, the LED chip 2 is fixed on the chip placement area 121; the two LED chips 2 are electrically connected to the positive electrode area 122 and the negative electrode area 123 respectively through the electrical connection line 3, and the two LED chips are connected in parallel to form circuit loop. As shown in Figures 8-9, the LED chip 2 is fixed on the chip placement area 121; one of the LED chips 2 is electrically connected to the chip placement area 121 and the positive electrode area 122 through the electrical connection line 3, and the other LED chip 2 is electrically connected to the chip placement area 121 through the electrical connection line 3. It is electrically connected with the chip placement area 121 and the negative electrode area 123, and the two LED chips 2 are connected in series to form a circuit loop. The fluorescent adhesive layer 3 completely covers the LED chips 2 and the electrical connection wires 3 in a heat-cured form.

Correspondingly, this embodiment discloses a process flow of a manufacturing method of the LED packaging device 100 as shown in FIG. 7 , the method includes the following steps:

S10: fixing the metal substrate 12 on the plastic base 11;

S11: the metal substrate 12 is etched to form a chip placement area 121, a positive electrode area 122, and a negative electrode area 123;

S12: Plating a silver layer on the surface of the chip placement area 121, the positive electrode area 122 and the negative electrode area 123 through an electroplating process;

S20: making a plastic baffle 13 on the metal substrate 12;

S30: making a bowl-shaped reflective plastic layer 14 around the surface of the plastic base 11;

S31: coating the reflective plastic layer 14 on the metal substrate surface 12 between the chip placement area 121, the positive electrode area 122 and the negative electrode area 123 and the surface around the chip placement area 121;

S32: making a reflective layer 15 on the surface of the reflective plastic layer 14 inside the bracket cup;

S40: the LED chip 2 is fixed on the chip placement area 121; the LED chip 2 is electrically connected to the chip placement area 121, the positive electrode area 123 or the negative electrode area 123 through the electrical connection wire 3, forming a circuit loop;

S50 : completely cover the LED chips and the electrical connection wires 3 with the fluorescent adhesive layer 4 , and package them into an LED packaging device 100 .

Wherein, in step S20, the plastic baffle 13 is made by injection molding or Molding process; in said steps S30 and S31, the reflective plastic layer 14 is made by injection molding or Molding process; in step S32, the reflective layer 15 is made by Mask Spraying process.

Example 2

This embodiment discloses another LED packaging device with a multi-cup holder. In terms of structure, it differs from the LED packaging device 100 described in Embodiment 1 in that:

In this embodiment, as shown in FIG. 10, the number of plastic baffles 13 of the support 1 is two, and the plastic baffles 13 are located on the chip placement area 121, the positive electrode area 122 and the negative electrode area 123, and are connected with the reflective plastic layer. 14 form three separate bowl cups.

Other structures of another LED packaging device with a multi-cup holder and its manufacturing method in this embodiment are completely the same as those in Embodiment 1, and will not be repeated here.

For other contents of the LED packaging device with a multi-cup holder and its preparation method described in the present invention, please refer to the prior art.

The above is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Therefore, any content that does not depart from the technical solution of the present invention, any changes made to the above embodiments according to the technical essence of the present invention Simple modifications, equivalent changes and modifications all still fall within the scope of the technical solutions of the present invention.

Claims (10)

1. A LED packaging device with a multi-cup support, comprising an LED chip, a support, an electrical connection wire, and a fluorescent glue layer, characterized in that, the support includes a plastic base, a metal substrate disposed on the plastic base, Plastic baffle, reflective plastic layer; The reflective plastic layer is coated around the surface of the plastic base in a cup shape to form a bracket cup; The number of the plastic baffle is at least one, and the plastic baffle is arranged on the metal substrate; the plastic baffle and the reflective plastic layer form at least two independent bowls. 2 . The LED packaging device with a multi-cup holder according to claim 1 , wherein the height of the plastic baffle is consistent with the height of the holder cups. 3. The LED packaging device with a multi-cup holder according to claim 1, wherein the metal substrate is an etched copper sheet; the etched copper sheet includes a chip placement area, a positive electrode area and a negative electrode Area. 4. A LED packaging device with a multi-cup holder according to claim 3, wherein the reflective plastic layer is also coated on the chip placement area, the positive electrode area and the negative electrode area. The surface of the metal substrate and the peripheral surface of the chip placement area. 5. The LED packaging device with a multi-cup holder according to claim 3, the plastic baffle is located on the chip placement area, the positive electrode area and the negative electrode area. 6. The LED packaging device with a multi-cup holder according to claim 3, the surface of the etched copper sheet is plated with a silver layer. 7 . The LED packaging device with a multi-cup holder according to claim 4 , further comprising a reflective layer, the reflective layer being arranged on the surface of the reflective plastic layer inside the holder cups. 8. A method for preparing an LED packaging device with a multi-cup support, comprising the following steps: S10: fixing the metal substrate on the plastic base; S20: making a plastic baffle on the metal substrate; S30: making a cup-shaped reflective plastic layer around the surface of the plastic base; S40: The LED chip is fixed on the chip placement area; the LED chip is electrically connected to the chip placement area, the positive electrode area, or the negative electrode area through an electrical connection wire to form a circuit loop; S50: Cover the LED chip and the electrical connection wire completely with a fluorescent glue layer, and package them into an LED packaging device. 9. A method for preparing an LED packaging device with a multi-cup holder according to claim 8, further comprising the following steps after step S10 and before step S20: S11: The metal substrate is etched to form a chip placement area, a positive electrode area, and a negative electrode area; S12: Plating a silver layer on the surfaces of the chip placement area, the positive electrode area and the negative electrode area through an electroplating process. 10. A method for preparing an LED packaging device with a multi-cup holder according to claim 8, further comprising the following steps after step S30 and before step S40: S31: coating the reflective plastic layer on the surface of the metal substrate between the chip placement area, the positive electrode area, and the negative electrode area, and the surface around the chip placement area; S32: Making a reflective layer on the surface of the reflective plastic layer inside the bracket cup.