CN107481987B - Integrated electronic device, method for producing integrated electronic device, and electronic equipment - Google Patents

Abstract

The embodiment of the present application discloses an integrated electronic device, including: a bottom plate, a metal base and an active device; the active device is arranged on the bottom plate; A first pit, the metal base is provided with a second pit, the first pit and the second pit are electrically connected through a first metal body, wherein the first metal body is partially embedded in The first recess is partially embedded in the second recess. The application also provides a corresponding production method and electronic equipment. The metal body of the present application can play a position-limiting and alignment function in the pit, so that the coplanarity of the metal base is strong, and the thickness of the metal base can be compensated by the metal body.

Description

Integrated electronic device, method for producing integrated electronic device, and electronic equipment

technical field

The present application relates to the field of electronic technology, and in particular to an integrated electronic device, a production method of the integrated electronic device, and electronic equipment.

Background technique

Electronic products often use system-in-package (SIP) to integrate multiple electronic components with different functions into one package to realize a single standard package with certain functions, thus forming a system or Subsystems, for example, system modules such as step-down modules, step-up modules, and voltage-regulating power supply modules. For modules with higher power requirements such as step-down modules, boost modules, and voltage-regulating power supply modules, it is generally necessary to integrate active devices on the bottom board. For example, the bottom board can be a metal frame, and then the bottom The source device is mounted on the plastic package by surface mount technology (surface mount technology, SMT).

Taking the step-down module as an example, a complete step-down module generally integrates metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET) and control chips and other active devices on the bottom board, as well as inductors and other passive devices. source device. When the volume of the inductor is large or the height is high, the metal oxide half field effect transistor (hereinafter referred to as the field effect transistor or MOSFET tube) and the control chip are usually plastic-encapsulated, and then the inductor is mounted by surface mount technology (surface mount technology, SMT) is mounted on the plastic package, as shown in Figure 1, wherein, 101 is an inductor, 102 is solder, and 103 is a plastic package. When integrating components such as field effect transistors, control chips, and inductors on the bottom board, it is generally necessary to pre-embed a metal base on the bottom board as two pads for the two poles of the inductor, so that the metal base and the inductor exposed on the plastic package Electrical connection is performed by soldering, as shown in FIG. 2 , where 201 is a metal base, 202 is a solder layer, 203 is a base plate, and 204 is a local enlargement of a copper sheet bending. The metal base and the field effect tube are connected to the bottom bottom plate through soldering by SMT process, and the control chip is connected to the bottom bottom plate through glue or SMT. In order to electrically connect the field effect transistor in a certain area of the base plate to another area in the base plate, a conductive copper sheet is also needed at this time. The copper sheet needs to be molded so that one end electrically connected to a certain area of the base plate forms a bend. Then, the pre-bent end is welded to the upper surface of the field effect tube by soldering, and the other bent end is welded to a region of the bottom plate. After plastic sealing, the subsequent manufacturing process is carried out to complete the packaging.

Since all the components are connected directly by soldering, and the direct soldering of the solder causes the metal base to easily shift, and when the solder is uneven, it will cause the metal base to tilt, the coplanarity is poor, and the thickness of the package is different. Metal bases of different thicknesses need to be molded.

Contents of the invention

In order to solve the problems in the prior art that the metal base is easy to shift and the metal base with different thickness needs to be molded, the embodiment of the present application provides an integrated electronic device, which realizes electrical connection through a metal body, and the metal body It can play the role of limit and self-calibration in the pit, so that the metal base is not easy to shift or tilt, and the coplanarity is strong, and the thickness of the metal base can be compensated by the metal body. The embodiment of the present application also provides a production method of the integrated electronic device and electronic equipment.

The first aspect of the present application provides an integrated electronic device, which can be an integrated module in an electronic product, such as a boost module, a step-down module, and a voltage-regulating power supply module, etc., and the integrated electronic device includes: a base plate, a metal The base and the active device; the active device is arranged on the bottom plate; the side on which the active device is arranged on the bottom plate is provided with a first pit, and the metal base is provided with a second pit, the first pit and the second pit The electric connection is made through the first metal body, wherein the first metal body is partially embedded in the first recess and partially embedded in the second recess. The bottom plate can be a metal frame, the active components can be control chips and field effect transistors, etc., and the metal base can be copper base, silver base, aluminum base, etc. Since the bottom plate and the metal base can be provided with corresponding pits at the positions where they are electrically connected to each other, and a metal body is arranged in the pits, and the electrical connection is realized through the metal body, the shape, size and number of the pits can be flexible. set up. The metal body can play the role of limiting and self-calibrating in the pit, so that the coplanarity of the metal base is strong. And the electrical connection is realized through the metal body, so that the thickness of the metal base can be compensated by the metal body. The same metal base can meet the needs of different types of thickness, and the connection between the metal base and the bottom plate is realized through the metal body, which avoids the development of different thicknesses. Metal base.

With reference to the first aspect of the embodiment of the present application, in the first implementation manner of the first aspect of the embodiment of the present application, the integrated electronic device further includes a metal sheet, and the metal sheet can be a copper sheet, a silver sheet, an aluminum sheet, an iron sheet, etc. . The metal sheet is arranged on the top of the active device, and the metal sheet is used to connect the active device to the metal base. The top of the active device is provided with a third pit, and the metal sheet is provided with a fourth pit. The third pit is connected to the metal base. The fourth pit is electrically connected through the second metal body, wherein the second metal body is partially embedded in the third pit and partially embedded in the fourth pit. The side where the metal sheet is electrically connected to the active device is also provided with a fifth pit, and a sixth pit is provided in the conduction area between the bottom plate and the metal base, and the fifth pit and the sixth pit pass through the third metal body. Electrical connection, wherein, the third metal body is partially embedded in the fifth cavity, and partially embedded in the sixth cavity. Among them, between the active device and the metal sheet, as well as between the bottom plate and the metal sheet, pits can be provided at the positions where they are electrically connected to each other, and a metal body is arranged in the pit, and the electrical connection is realized through the metal body. The shape, size and number of pits can be flexibly set. The metal body can not only play the role of limiting and self-calibration in the pit, but also realize electrical connection through the metal body, so that the same metal sheet can be adapted to different types of active devices, and the metal sheet does not need to be bent to connect with the bottom plate , but realize the connection between the metal sheet and the base plate through the metal body, avoiding the development of different types of metal sheets.

In combination with the first implementation manner of the first aspect of the embodiment of the present application, in the second implementation manner of the first aspect of the embodiment of the application, in order to facilitate welding, the first metal body, the second metal body and the third metal body are all It is a spherical metal body coated with solder on the outer surface, so that after reflow soldering, the solder coated on the outer surface melts, so that each metal body is electrically connected to the corresponding pit, which is very convenient to implement.

In combination with the second implementation manner of the first aspect of the embodiment of the present application, in the third implementation manner of the first aspect of the embodiment of the application, the first pit, the second pit, the third pit, and the fourth pit , the fifth pit and the sixth pit are pits with circular openings, the first metal body, the second metal body and the third metal body are all spherical metal bodies, and when the spherical metal bodies are placed in the pits, they form an anastomosis fixed. It should be noted that the shape of the pit is not limited to a circular opening, and the shape of the metal body is not limited to a spherical shape, as long as the pit and the metal body can be fit and fixed, and the metal body can be limited in the pit And the calibration function can be. The opening size and depth of the pit can be flexibly set to ensure that the metal body will not roll in the pit. For example, the opening size of the pit can be set to be similar to the maximum circumference of the spherical metal body, and the depth of the pit can be set to Set to be close to the radius of the spherical metal body. Since the opening of the pit is circular and the metal body is a spherical metal body, the pit and the metal body can be fitted and fixed, and the ball-shaped metal body can be conveniently placed in the pit through the ball planting process, which is simple to process and easy to plant. The technology of the ball is mature, and it is very convenient to realize.

In combination with any one of the first to third implementations of the first aspect of the embodiments of the present application, in the fourth implementation of the first aspect of the embodiments of the present application, the active device includes a field effect transistor, the The field effect tube can be a MOSFET tube. The top of the field effect tube is provided with a seventh pit, and the metal sheet is also provided with an eighth pit, and the seventh pit and the eighth pit are electrically connected through a fourth metal body, wherein the fourth metal body is partially embedded in the seventh pit. The pit is partially embedded in the eighth pit; the seventh pit is contained in the third pit, the eighth pit is contained in the fourth pit, and the fourth metal body is contained in the second metal body. It can be seen that the field effect transistor can be electrically connected with the metal sheet through the metal body, so that the same metal sheet can be adapted to different types of field effect transistors, and it is not necessary to open molds for various types of metal sheets, which is very convenient to implement.

Combining the first aspect of the embodiment of the present application, any one of the first to fourth implementation manners of the first aspect of the embodiment of the present application, in the fifth implementation manner of the first aspect of the embodiment of the present application, The first metal body includes multiple types, each type of the first metal body has a different height, and the first metal body is used to adjust the distance between the metal base and the bottom plate. For example, when the height of the first metal body is the first height, the distance between the metal base and the base plate forms the second height; when the height of the first metal body is the third height, the distance between the metal base and the base plate The distance forms the fourth height. It can be seen that the electrical connection between the metal base and the bottom plate is realized through the first metal body, which not only ensures the high precision of the metal base, the horizontal direction, the height direction, and the inclination, improves the packaging quality, but also ensures the metal base. The needs of different heights of the seat can be adjusted by setting the height of the first metal body, avoiding the development of metal bases of different heights, that is, the thickness of the metal base can be compensated by the metal body, and the same metal base can adapt to different types of The thickness requirement avoids the development of metal bases with different thicknesses, saves development costs, and shortens the development cycle.

In combination with any one of the first to fifth implementations of the first aspect of the embodiments of the present application, in the sixth implementation of the first aspect of the embodiments of the present application, the integrated electronic device further includes a plastic package, The bottom plate, the metal sheet and the active components are all packaged in the plastic package, and the surface of the metal base is partly or completely exposed outside the plastic package through the openings provided in the plastic package. The height of the exposed metal base outside the plastic package can be adjusted by setting the height of the first metal body to meet the requirements for different heights of the metal base without developing a variety of metal bases with different heights. In addition, the upper surface of the metal base exposed outside the plastic package is larger than the bottom surface of the bottom plate, realizing a structure with a large top and a small bottom, that is, the area of the upper metal base is larger than the area of the lower bottom plate, thereby saving the area of the bottom plate and making the package It can be made smaller and the power density can be improved. When a large-area metal base is used as a pad of a passive device, the area of the pad of the passive device can be increased, so that the area reserved for welding on the bottom plate is not limited to the size of the pad required by the passive device.

In combination with any one of the first aspect of the embodiment of the present application, the first implementation manner to the sixth implementation manner of the first aspect of the embodiment of the present application, in the seventh implementation manner of the first aspect of the embodiment of the application, The integrated electronic device also includes passive components electrically connected to the metal base. The passive components may include inductors and capacitors, etc., because when the passive components such as inductors or capacitors are large in size or high in height, the passive components can be mounted on the plastic package by SMT technology, and connected with metal The base is electrically connected to realize the electrical connection with other components of the plastic package, which is very convenient to implement.

The second aspect of the present application provides a method for producing an integrated electronic device described in the above-mentioned first aspect of the present application or any possible implementation of the first aspect of the present application, including: disposing active devices on the bottom plate; A first pit is set on one side of the active device, and a second pit is set on the metal base; the first pit and the second pit are electrically connected through the first metal body, wherein the first metal body is partially embedded in the second pit The first pit is partially embedded in the second pit. The bottom plate can be a metal frame, the active components can be control chips and field effect transistors, etc., and the metal base can be copper base, silver base, aluminum base, etc. Since the bottom plate and the metal base can be provided with corresponding pits at the positions where they are electrically connected to each other, and a metal body is arranged in the pits, and the electrical connection is realized through the metal body, the shape, size and number of the pits can be flexible. set up. The metal body can play the role of limiting and self-calibrating in the pit, so that the coplanarity of the metal base is strong. And the electrical connection is realized through the metal body, so that the thickness of the metal base can be compensated by the metal body. The same metal base can meet the needs of different types of thickness, and the connection between the metal base and the bottom plate is realized through the metal body, which avoids the development of different thicknesses. Metal base.

With reference to the second aspect of the embodiment of the present application, in the first implementation of the second aspect of the embodiment of the present application, the production method further includes: arranging the metal sheet on the top of the active device, and the metal sheet is used to place the active device Connect with the metal base, the metal sheet can be copper sheet, silver sheet, aluminum sheet and iron sheet etc. The third pit is set on the top of the active device, and the fourth pit is set on the metal sheet; the third pit and the fourth pit are electrically connected through the second metal body, wherein the second metal body is partially embedded in the third In the pit, partly embedded in the fourth pit. The fifth pit is also set on the side where the metal sheet is electrically connected to the active device; the sixth pit is set in the conduction area between the bottom plate and the metal base; the fifth pit and the sixth pit are passed through the third metal Body electrical connection, wherein the third metal body is partially embedded in the fifth cavity and partially embedded in the sixth cavity. Among them, between the active device and the metal sheet, as well as between the bottom plate and the metal sheet, pits can be provided at the positions where they are electrically connected to each other, and a metal body is arranged in the pit, and the electrical connection is realized through the metal body. The shape, size and number of pits can be flexibly set. The metal body can not only play the role of limiting and self-calibration in the pit, but also realize electrical connection through the metal body, so that the same metal sheet can be adapted to different types of active devices, and the metal sheet does not need to be bent to connect with the bottom plate , but realize the connection between the metal sheet and the base plate through the metal body, avoiding the development of different types of metal sheets.

In combination with the first implementation manner of the second aspect of the embodiment of the present application, in the second implementation manner of the second aspect of the embodiment of the application, in order to facilitate welding, the first metal body, the second metal body and the third metal body are all It is a spherical metal body coated with solder on the outer surface, so that after reflow soldering, the solder coated on the outer surface melts, so that each metal body is electrically connected to the corresponding pit, which is very convenient to implement.

In combination with the second implementation manner of the second aspect of the embodiment of the present application, in the third implementation manner of the second aspect of the embodiment of the application, the first pit, the second pit, the third pit, and the fourth pit The fifth, fifth, and sixth pits are all pits with circular openings, and the first metal body and the second metal body, both of which are spherical metal bodies, are respectively placed in the corresponding pits to form an anastomotic fixation. It should be noted that the shape of the pit is not limited to a circular opening, and the shape of the metal body is not limited to a spherical shape, as long as the pit and the metal body can be fit and fixed, and the metal body can be limited in the pit And the calibration function can be. The opening size and depth of the pit can be flexibly set to ensure that the metal body will not roll in the pit. For example, the opening size of the pit can be set to be similar to the maximum circumference of the spherical metal body, and the depth of the pit can be set to Set to be close to the radius of the spherical metal body. Since the opening of the pit is circular and the metal body is a spherical metal body, the pit and the metal body can be fitted and fixed, and the ball-shaped metal body can be conveniently placed in the pit through the ball planting process, which is simple to process and easy to plant. The technology of the ball is mature, and it is very convenient to realize.

In combination with any one of the first to third implementation manners of the second aspect of the embodiments of the present application, in the fourth implementation manner of the second aspect of the embodiments of the present application, the active device includes a field effect transistor, the The field effect tube can be a MOSFET tube. The seventh pit is set on the top of the field effect tube, and the eighth pit is also set on the metal sheet; the seventh pit and the eighth pit are electrically connected through the fourth metal body, wherein the fourth metal body is partially embedded in the seventh pit Pit, partially embedded in the eighth pit. The seventh pit is included in the third pit, the eighth pit is included in the fourth pit, and the fourth metal body is included in the second metal body. It can be seen that the field effect transistor can be electrically connected with the metal sheet through the metal body, so that the same metal sheet can be adapted to different types of field effect transistors, and it is not necessary to open molds for various types of metal sheets, which is very convenient to implement.

In combination with any of the second aspect of the embodiment of the present application, the first to the fourth implementation of the second aspect of the embodiment of the application, in the fifth implementation of the second aspect of the embodiment of the present application, the first The metal body includes multiple types, each type of the first metal body has a different height, and the first metal body is used to adjust the distance between the metal base and the bottom plate. For example, when the height of the first metal body is the first height, the distance between the metal base and the base plate forms the second height; when the height of the first metal body is the third height, the distance between the metal base and the base plate The distance forms the fourth height. It can be seen that the electrical connection between the metal base and the bottom plate is realized through the first metal body, which not only ensures the high precision of the metal base, the horizontal direction, the height direction, and the inclination, improves the packaging quality, but also ensures the metal base. The demand for different heights of the seat can be adjusted by setting the height of the first metal body, that is, the thickness of the metal base can be compensated by the metal body, and the same metal base can meet the needs of different types of thickness, avoiding the development of different thicknesses The metal base avoids the development of metal bases of different heights, saves development costs, and shortens the development cycle.

In combination with any one of the first to fifth implementations of the second aspect of the embodiments of the present application, in the sixth implementation of the second aspect of the embodiments of the present application, the first metal body, the second metal The outer surfaces of the body and the third metal body are coated with solder; the first metal body is arranged between the first pit and the second pit, the second metal body is arranged between the third pit and the fourth pit, and After the third metal body is arranged between the fifth pit and the sixth pit, reflow soldering is performed to melt the solder. Fixing and electrical connection of the metal body is achieved by applying solder on the outer surface of the metal body and melting the tin material, which is simpler than electroplating copper or installing copper pillars on via holes.

In combination with the second aspect of the embodiment of the present application, any one of the first to sixth implementation manners of the second aspect of the embodiment of the present application, in the seventh implementation manner of the second aspect of the embodiment of the present application, The production method also includes: encapsulating the bottom plate, the metal sheet and the active device in a plastic package, and exposing the surface of the metal base partially or completely outside the plastic package through the openings provided in the plastic package. The height of the exposed metal base outside the plastic package can be adjusted by setting the height of the first metal body to meet the requirements for different heights of the metal base without developing a variety of metal bases with different heights. In addition, the upper surface of the metal base exposed outside the plastic package is larger than the bottom surface of the bottom plate. A structure with a large top and a small bottom is realized, that is, the area of the upper metal base is larger than the area of the lower bottom plate, thereby saving the area of the bottom plate, making the package smaller and increasing the power density. When a large-area metal base is used as a pad of a passive device, the area of the pad of the passive device can be increased, so that the area reserved for welding on the bottom plate is not limited to the size of the pad required by the passive device.

In combination with the second aspect of the embodiments of the present application, any one of the first to seventh implementations of the second aspect of the embodiments of the present application, in the eighth implementation of the second aspect of the embodiments of the present application, The production method also includes: setting passive devices on the metal base, and electrically connecting the metal base and the passive devices. The passive components may include inductors and capacitors, etc., because when the passive components such as inductors or capacitors are large in size or high in height, the passive components can be mounted on the plastic package by SMT technology, and connected with metal The base is electrically connected to realize the electrical connection with other components of the plastic package, which is very convenient to implement.

A third aspect of the present application provides an electronic device including the integrated electronic device described in the first aspect or any possible implementation manner of the first aspect. The electronic equipment also includes a power module, a control module, a housing, etc., wherein the integrated electronic device is connected to the power module and the control module respectively; the housing is used to encapsulate the integrated electronic device, power module, and control module as a whole. The type of the electronic device can be set according to actual needs, for example, a charger for a mobile phone, a charger for a tablet computer, and the like.

It can be seen from the above technical solutions that the embodiments of the present application have the following advantages:

The bottom plate and the metal base in the integrated electronic device can be provided with corresponding recesses at the positions where they are electrically connected to each other, and a metal body can be provided in the recesses, and the electrical connection can be realized through the metal body. The metal body can play the role of limiting and self-calibrating in the pit, so that the metal base is not easy to shift or tilt, and the coplanarity is strong. And the electrical connection is realized through the metal body, so that the thickness of the metal base can be compensated by the metal body. The same metal base can meet the needs of different types of thickness, and the connection between the metal base and the bottom plate is realized through the metal body, which avoids the development of different thicknesses. Metal base.

Description of drawings

FIG. 1 is a partial schematic diagram of a plastic packaging method for devices in electronic products in the prior art;

Fig. 2 is a schematic diagram of a layout method of devices in electronic products in the prior art;

FIG. 3 is a schematic structural diagram of an integrated electronic device in an embodiment of the present application;

4 is a schematic diagram of a production method of an integrated electronic device in an embodiment of the present application;

FIG. 5 is a schematic diagram of the bottom plate structure of the integrated electronic device in the embodiment of the present application;

Fig. 6 is a schematic diagram of setting pits on the bottom plate of the integrated electronic device in the embodiment of the present application;

FIG. 7 is a schematic diagram of setting a metal body in a pit on the bottom plate of an integrated electronic device in an embodiment of the present application;

Fig. 8 is a schematic diagram of setting pits and metal bodies on the active devices of the integrated electronic device in the embodiment of the present application;

FIG. 9 is a schematic diagram of pits and metal bodies provided between the bottom plate and the metal base of the integrated electronic device in the embodiment of the present application;

FIG. 10 is a schematic diagram of the arrangement between the bottom plate and the metal base of the integrated electronic device in the embodiment of the present application.

Detailed ways

In order to solve the problems in the prior art that the metal base is easy to shift and the metal base with different thickness needs to be molded, the embodiment of the present application provides an integrated electronic device, which realizes electrical connection through a metal body, and the metal body It can play the role of limit and self-calibration in the pit, so that the metal base is not easy to shift or tilt, and the coplanarity is strong, and the thickness of the metal base can be compensated by the metal body. The embodiment of the present application also provides a production method of the integrated electronic device and electronic equipment, which will be described in detail below.

As shown in Figure 3, an embodiment of the present application provides an integrated electronic device, which can be an integrated module in an electronic product, such as a boost module, a step-down module, and a voltage-regulating power supply module, etc., and the electronic product can be It may be a mobile phone charger, a tablet computer charger, etc., or other types of electronic products, which are not limited here. The integrated electronic device includes: a base plate 301 , a metal base 302 , active devices and the like.

Wherein, the active device is arranged on the base plate 301, and the active device may include a control chip 303 and a field effect transistor, etc., the base plate 301 may be a metal frame, and the metal frame may be divided into a plurality of interconnected areas, and each element Components can be arranged in different regions of the metal frame, and the base plate 301 can also be a PCB board or other board materials, which are not limited here. The active device can be directly welded on the bottom plate 301 by soldering, or some array pits can be set on the bottom plate 301 by etching or stamping, and then a metal body is arranged in the pits, through which the metal body will be soldered. The source device is connected to the base plate 301 , or the active device is connected to the base plate 301 by electroplating through the metal body, and the like.

The side of the bottom plate 301 where the active devices are set is provided with a first pit by etching or stamping, and the metal base 302 is provided with a second pit, and the first pit and the second pit are electrically connected through the first metal body , wherein the first metal body is partially embedded in the first recess and partially embedded in the second recess. The first metal body can be a spherical metal body whose outer surface is coated with solder, and the solder can be melted after reflow soldering to achieve welding of the first metal body. That is, a second recess corresponding to the bottom plate 301 is provided in the interconnection area below the metal base 302 and the bottom plate 301 , so that the metal base 302 and the bottom plate 301 can be electrically connected by soldering through the first metal body. The metal base 302 can be a copper base, a silver base, an aluminum base and other electrical conductors. It should be noted that when the outer surface of the first metal body is not coated with solder, the electrical connection can also be performed by means of electroplating. The number of the metal base 302 can be flexibly set according to actual needs. In FIG. Two pit arrays 502, the first pit array 501 and the second pit array 502 are respectively provided with metal bodies connected to the two metal bases, the first pit array 501 and the second pit array 502 are included in First pit. The location, size, shape, number, etc. of the first pit, the second pit, and the metal body can be flexibly set, and the details are not limited here. For example, when the metal base 302 is a cube, only one pit can be set at the four corners of the metal base 302, so that only the metal bodies arranged in the four pits are connected with the bottom plate 301, while the metal base Other surfaces of 302 may not be in contact with the bottom plate 301, which saves the contact area between the bottom plate and the metal base, increases the grounding area of the bottom plate, and makes the integrated electronic device have better heat dissipation. The number, location, size, shape, etc. of the metal base 302 can be flexibly set, which is not specifically limited here.

In the embodiment of the present application, pits may be provided between the bottom plate and the metal base 302 of the integrated electronic device at positions where they are electrically connected to each other, and a metal body may be provided in the pit to realize electrical connection through the metal body. The metal body can play a position-limiting and self-calibrating role in the pit, so that the metal base 302 is not easy to shift or tilt, and the coplanarity is strong. And the electrical connection is realized through the metal body, so that the thickness of the metal base 302 can be compensated by the metal body, and the same metal base can meet the needs of different types of thickness, and the connection between the metal base 302 and the base plate is realized through the metal body, which avoids different developments. thick metal base 302 .

In this embodiment, the integrated electronic device further includes a metal sheet 306, and the metal sheet 306 may be a conductor such as a copper sheet, a silver sheet, an aluminum sheet, or an iron sheet. The metal sheet 306 is arranged on the top of the active device. The metal sheet 306 is used to connect the active device to the metal base 302. The top of the active device is provided with a third pit by etching or developing, and the metal sheet 306 is provided with a third pit. There is a fourth pit, the third pit and the fourth pit are electrically connected through the second metal body, wherein the second metal body is partially embedded in the third pit and partially embedded in the fourth pit. The second metal body may be a spherical metal body whose outer surface is coated with solder. By melting the solder, the second metal body can be electrically connected to the metal sheet 306 through the fourth pit. When there are multiple active devices that need to be electrically connected, the metal sheet 306 can electrically connect the multiple active devices that need to be electrically connected. The location, size, shape, number, etc. of the third pit, the fourth pit, and the second metal body can be flexibly set, and the details are not limited here.

The side of the metal sheet 306 electrically connected to the active device is also provided with a fifth pit, and a sixth pit is provided in the conduction area between the bottom plate 301 and the metal base 302, and the fifth pit and the sixth pit pass through the first pit. The three metal bodies are electrically connected, wherein the third metal body is partially embedded in the fifth pit and partially embedded in the sixth pit. For example, the sixth pit in FIG. 3 can be set as the third pit array 503 including a plurality of pits. That is, a fifth recess corresponding to the bottom plate 301 is provided below the interconnection area between the metal sheet 306 and the bottom plate 301 , so that the metal sheet 306 and the bottom plate 301 can be electrically connected by electroplating or soldering through a third metal body. For example, when the third metal body is a spherical metal body whose outer surface is coated with solder, the metal sheet 306 and the bottom plate 301 can be electrically connected by soldering the third metal body. The metal sheet 306 can be a coplanar metal sheet 306 without bending.

In the prior art shown in Fig. 2, in order to electrically connect the active device to a certain area in the base plate, the metal sheet needs to be bent, and at this time, the cost of the bending mold will be generated, and the type of different active devices, the size At different times, metal sheets of different shapes and sizes need to be matched, and each metal sheet needs to be molded again, resulting in weak commonality of the metal sheets. However, in the embodiment of the present application, the electrical connection is realized through the metal body, which not only enables the same metal sheet 306 to adapt to different types of active devices, but also the metal sheet 306 does not need to be bent and connected to the bottom plate, but realizes the metal sheet through the metal body. 306 is connected to the base plate, avoiding the development of metal sheets 306 of different types and sizes. Realize that the metal sheet 306 does not need to be bent, so there is no need to increase the cost of the bending mold, and shorten the manufacturing cycle, and different active devices can be matched with the same metal sheet 306, and there is no need to open multiple types of molds The metal sheet 306 improves the commonality of the metal sheet 306 .

Wherein, the active device may be the control chip 303 and a field effect transistor, etc., the effect transistor is provided with a seventh pit, and the metal sheet 306 is also provided with an eighth pit, and the seventh pit and the eighth pit pass through the first pit. The four metal bodies are electrically connected, wherein the fourth metal body is partially embedded in the seventh pit and partially embedded in the eighth pit. The seventh pit is included in the third pit, the eighth pit is included in the fourth pit, and the fourth metal body is included in the second metal body.

In Fig. 3, taking the step-down module as an example, the field effect transistor includes a first field effect transistor 304 and a second field effect transistor 305, and the metal sheet 306 partially covers the first field effect transistor 304, and the metal sheet 306 can The two field effect transistors 305 are all covered. The passive device takes an inductor (not shown in FIG. 3 ) as an example. The inductor usually occupies a relatively large flat area. The type of the control chip 303 can be set according to actual needs, which is not limited here.

When the active device includes a first field effect transistor 304 and a second field effect transistor 305, both the first field effect transistor 304 and the second field effect transistor 305 may be MOSFETs. The first field effect transistor 304 is provided with a ninth recess, and is electrically connected to the corresponding tenth recess on the metal sheet 306 through the fifth metal body provided in the ninth recess. The second effect transistor 305 can be directly electrically connected to the metal sheet by soldering, or an eleventh pit can be arranged on the second field effect transistor 305, and the sixth metal body and the metal The corresponding twelfth pits on the sheet 306 are electrically connected. Wherein, the ninth pit and the eleventh pit are included in the aforementioned seventh pit, the tenth pit and the twelfth pit are included in the aforementioned eighth pit, and the fifth metal body and the sixth metal body include in the aforementioned fourth metal body. It can be seen that, in order to facilitate the electrical connection between the first field effect transistor 304 and the second field effect transistor 305, it can be connected through the metal sheet 306, and the metal sheet 306 does not need to be bent, and does not need to increase the cost of the bending mold , the manufacturing cycle is shortened, so that the same metal sheet 306 can be adapted to different types of field effect transistors, and there is no need to open molds for various types of metal sheets 306, which is very convenient to implement.

It should be noted that the aforementioned first metal body, second metal body, and third metal body include various types, and each type of metal body has a different height. Taking the first metal body as an example, the first metal body includes various types, each type of the first metal body has a different height, and the first metal body can be used to adjust the distance between the metal base 302 and the bottom plate 301 . That is, the thickness of the metal base 302 can be compensated by the metal body, and the same metal base 302 can meet the requirements of different types of thickness, avoiding the development of metal bases 302 with different thicknesses. For example, when the height of the first metal body is the first height, a second height is formed between the metal base 302 and the bottom plate 301; When the height of the first metal body is the fifth height, the sixth height is formed between the metal base 302 and the bottom plate 301, and so on. It can be seen that the electrical connection between the metal base 302 and the bottom plate 301 through the first metal body not only ensures that the metal base 302 has high precision in the horizontal direction, height direction, and inclination, and improves the packaging quality, but also The requirements for different heights of the metal base 302 can be adjusted by setting the height of the first metal body, avoiding the development of metal bases 302 of different heights, saving development costs, and shortening the development cycle. The metal base 302 is connected to the bottom plate 301 through a metal body. When the metal body is limited by the recess, it is not easy to shift during processing, which can effectively prevent the metal base 302 from shifting.

The first pit, the second pit, the third pit, the fourth pit, the fifth pit and the sixth pit are all pits with circular openings, and the first metal body and the second metal body Both the metal body and the third metal body are spherical metal bodies, and when the spherical metal body is placed in the pit, anastomosis and fixation are formed. It should be noted that the shape of the pit is not limited to a circular opening, and the shape of the metal body is not limited to a spherical shape, as long as the pit and the metal body can be fit and fixed, and the metal body can be limited in the pit And the calibration function can be. The opening size and depth of the pit can be flexibly set to ensure that the metal body will not roll in the pit. For example, the opening size of the pit can be set to be similar to the maximum circumference of the spherical metal body, and the depth of the pit can be set to Set to be close to the radius of the spherical metal body. Since the opening of the pit is circular and the metal body is a spherical metal body, the pit and the metal body can be fitted and fixed, and the ball-shaped metal body can be conveniently placed in the pit through the ball planting process, which is simple to process and easy to plant. The technology of the ball is mature, and it is very convenient to realize.

In order to facilitate the fixing of the metal body in the pit, solder can be applied on the outer surface of the metal body. For example, when the metal body is a spherical metal body, solder is applied on the outer surface of the spherical metal body, and the ball is planted in the pit by the ball planting process. Finally, after reflow soldering, the solder on the surface of the spherical metal body melts to form interconnections. The spherical metal body plays the role of limit and self-calibration, which can ensure that the metal base 302 and the metal sheet 306 have high precision in the horizontal direction, height direction, and inclination. Metal bases 302 of different heights can also It is adjusted by the diameter of the spherical metal body.

The integrated electronic device also includes a plastic package, and the bottom plate 301, the metal sheet 306 and the active components can be packaged in the plastic package, and the surface of the metal base 302 is partially or completely exposed outside the plastic package through the openings provided by the plastic package, which is convenient When the passive components are mounted on the plastic package, the pins can be electrically connected with the metal base 302 . The height of the metal base 302 exposed outside the plastic package can be adjusted by setting the height of the first metal body to meet the needs of different heights of the metal base 302, without the need to develop a variety of metal bases 302 of different heights .

The integrated electronic device also includes passive components, which are electrically connected to the metal base 302 . The passive components may include inductors and capacitors, etc., because when the passive components such as inductors or capacitors are large in size or high in height, the passive components can be mounted on the plastic package by SMT technology, and connected with metal The base 302 is electrically connected to realize the electrical connection with other components of the plastic package, which is very convenient to implement.

It should be noted that since the bottom plate 301 and the metal base 302 are electrically connected by setting pits and metal bodies, it is not required that the bottom plate 301 has a larger area of reserved welding area than the pad of the passive device, so that the plastic package can The package is further miniaturized. That is, the upper surface of the metal base 302 exposed outside the plastic package can be larger than the surface of the bottom plate 301, realizing a structure with a large top and a small bottom. The contact area of the metal base enables the package to be made smaller to increase the power density. When the large-area metal base 302 is used as the pad of the passive device, the area of the pad of the passive device can be increased, so that the area reserved for welding on the bottom plate 301 is not limited to the size of the pad required by the passive device, and the packaging Further miniaturization is not limited. Metal bodies of different heights can also be selected to adjust the overall package height, which can avoid the development of metal bases 302 of different heights, save development time and development costs, realize different package thicknesses, and do not need to open molds for metal bases 302 of different thicknesses. Metal bodies of different heights are required.

In the embodiment of the present application, between the bottom plate 301 and the metal base 302, between the active device and the metal sheet 306, and between the bottom plate 301 and the metal sheet 306, corresponding pits can be provided at the positions where they are electrically connected to each other. A metal body is arranged in the pit, and electrical connection is realized through the metal body, and the shape, size and number of the pit can be flexibly set. The metal body can play the role of limiting and self-aligning in the pit, so that the coplanarity of the metal base 302 is strong. And the electrical connection is realized through the metal body, so that the same metal sheet 306 can be adapted to different types of active devices, and the metal sheet 306 does not need to be bent to connect to the bottom plate 301, but to realize the connection between the metal sheet 306 and the bottom plate 301 through the metal body, Exploitation of different types and sizes of sheet metal 306 is avoided. In addition, all components arranged on the bottom plate 301 can be provided with pits, and the metal body in the pits can be electrically connected to the bottom plate 301, so that the welding area can be reduced, occupying only the position of the metal body, and no large soldering area is required. Larger area for better heat dissipation.

The embodiment of the present application also provides a production method for the integrated electronic device in the above embodiment.

As shown in Figure 4, the production method of the integrated electronic device provided by the embodiment of the present application includes:

401. Set an active device on the bottom plate 301;

402. Set a first pit on the side of the base plate 301 where active devices are set;

403. Set a second pit on the metal base 302;

404. Electrically connect the first pit and the second pit through the first metal body, wherein the first metal body is partially embedded in the first pit and partially embedded in the second pit.

The production process provided by the embodiment of the present application can be understood in conjunction with FIG. 5 to FIG. 10 .

As shown in Figure 5, the active device is arranged on the bottom plate 301, which can be a metal frame, and the metal frame can be divided into a plurality of disconnected areas, and each component can be respectively arranged in different areas of the metal frame , the base plate 301 may also be a PCB board, or other board materials, which are not specifically limited here. The active device can be a control chip 303 and a field effect transistor, etc., and the active device can be directly welded on the base plate 301 by soldering, or some pits can be set on the base plate 301 by etching or punching, etc. A metal body is arranged in the pit, through which the active device is connected to the bottom plate 301 by soldering, or through the metal body, the active device is connected to the bottom plate 301 by electroplating.

As shown in FIG. 6 , the side of the bottom plate 301 where the active devices are arranged is provided with a first pit by etching or stamping, and a first metal body is arranged in the first pit, and the first metal body can be an outer surface coated with solder spherical metal body. The first metal body is electrically connected to the metal base 302 through the second pit, wherein the second pit is disposed on the metal base 302 . The metal pedestal 302 may include a first metal pedestal 302 and a second metal pedestal 302, and a first array of recesses 501 for installing the first metal pedestal 302 is provided on the bottom plate 301, and the first metal pedestal 302 A fourth array of pits corresponding to the bottom plate 301 is provided in the interconnection area below the bottom plate 301 , so that the metal base 302 and the bottom plate 301 can be electrically connected by soldering through the first metal body. A second array of pits 502 for installing the second metal pedestal 302 is provided on the bottom plate 301, and a fifth array of pits corresponding to the bottom plate 301 is set on the area below the second metal pedestal 302 interconnected with the bottom plate 301, The metal base 302 and the bottom plate 301 can be electrically connected by soldering through the first metal body. A third array of pits 503 is also provided on the bottom plate 301 for connecting with the metal sheet 306 . The first array of pits 501 and the second array of pits 502 are included in the aforementioned first pits, and the fourth array of pits and the fifth array of pits are included in the aforementioned second pits.

When the metal base 302 is a cube, a pit can be respectively arranged at the four corners of the metal base 302, so that only the metal bodies arranged in the four pits are connected with the base plate 301, and the metal base 302 Other surfaces may not be in contact with the bottom plate 301, which saves the contact area between the bottom plate and the metal base, increases the grounding area of the bottom plate, and makes the integrated electronic device have better heat dissipation.

In the embodiment of the present application, pits may be provided between the bottom plate and the metal base 302 of the integrated electronic device at positions where they are electrically connected to each other, and a metal body may be provided in the pit to realize electrical connection through the metal body. The metal body can play a position-limiting and self-calibrating role in the pit, so that the metal base 302 is not easy to shift or tilt, and the coplanarity is strong. And the electrical connection is realized through the metal body, so that the thickness of the metal base 302 can be compensated by the metal body, and the same metal base can meet the needs of different types of thickness, and the connection between the metal base 302 and the base plate is realized through the metal body, which avoids different developments. thick metal base 302 .

In this embodiment, the production method also includes: disposing the metal sheet 306 on the top of the active device, the metal sheet 306 is used to connect the active device to the metal base 302, the metal sheet 306 can be a copper sheet, a silver sheet, Aluminum sheet and iron sheet etc. As shown in Figure 8, a third pit is provided on the top of the active device by etching or development, and a fourth pit is provided on the metal sheet 306; the third pit and the fourth pit are passed through the second metal body Electrical connection, wherein, the second metal body is partially embedded in the third cavity, and partially embedded in the fourth cavity. The second metal body may be a spherical metal body whose outer surface is coated with solder. By melting the solder, the second metal body can be electrically connected to the metal sheet 306 through the fourth pit. When there are multiple active devices that need to be electrically connected, the metal sheet 306 can electrically connect the multiple active devices that need to be electrically connected.

In FIG. 8, copper ball 6011 is taken as an example of metal body 601. Solder 6012 is coated on the outer surface of the copper ball 6011. A pit 801 of the same size can be provided on the upper surface of the active device. The bottom of the pit 801 conducts electricity. Then, copper balls 6011 are implanted in the pits 801. The outer surface of the copper balls 6011 is coated with solder 6012. The purpose is that after reflow soldering, the solder 6012 melts to fix the copper balls 6011 in the pits 801 and form a conductive interconnection. even. Similarly, as shown in FIG. 9, when the metal body 601 is a copper ball 6011 coated with solder 6012 on the outer surface, when the aforementioned base plate 301 and the metal base 302 are electrically connected, the base plate 301 can be arranged on the base plate 301. The copper ball 6011 fits into the pit 901, and the copper ball 6011 is implanted in the pit 901.

The fifth pit is also set on the side where the metal sheet 306 is electrically connected to the active device by etching or punching, and the sixth pit is set on the conduction area between the base plate and the metal base 302; The sixth pit is electrically connected through the third metal body, wherein the third metal body is partially embedded in the fifth pit and partially embedded in the sixth pit. The third metal body may be a spherical metal body whose outer surface is coated with solder. By melting the solder, the third metal body can be electrically connected to the bottom plate 301 through the sixth recess. That is, a fifth recess corresponding to the bottom plate 301 is provided under the interconnection area between the metal sheet 306 and the bottom plate 301 , so that the metal sheet 306 and the bottom plate 301 can be electrically connected by soldering through the third metal body. The metal sheet 306 can be a coplanar metal sheet 306 without bending. Since the metal sheet 306 does not need to be bent, there is no need to increase the cost of bending molds and shorten the manufacturing cycle, and different active devices can be matched with the same metal sheet 306, so there is no need to open molds for multiple types of metal The sheet 306 improves the commonality of the metal sheet 306 .

Wherein, the active device can be a control chip 303 and a field effect transistor, etc., and the passive device can be an inductor and a capacitor, etc., the effect transistor is provided with a seventh pit, and the metal sheet 306 is also provided with an eighth pit; The seventh pit and the eighth pit are electrically connected through the fourth metal body, wherein the fourth metal body is partially embedded in the seventh pit and partially embedded in the eighth pit. The seventh pit is included in the third pit, the eighth pit is included in the fourth pit, and the fourth metal body is included in the second metal body. In Fig. 3, taking the step-down module as an example, the field effect transistor includes a first field effect transistor 304 and a second field effect transistor 305, the metal sheet 306 partially covers the first field effect transistor 304, and the metal sheet covers the second field effect transistor The effect tube 305 is completely covered. At this time, the first field effect transistor 304 is provided with a ninth recess, and is electrically connected to the corresponding tenth recess on the metal sheet 306 through the fifth metal body provided in the ninth recess. The second field effect transistor 305 can be directly connected to the metal sheet by soldering, or an eleventh pit can be set on the second field effect transistor 305, and the sixth metal body arranged in the eleventh pit can be connected with the metal sheet. The corresponding twelfth pits on the metal sheet 306 are electrically connected. Wherein, the ninth pit and the eleventh pit are included in the aforementioned seventh pit, the tenth pit and the twelfth pit are included in the aforementioned eighth pit, and the fifth metal body and the sixth metal body include in the aforementioned fourth metal body. It can be seen that, in order to facilitate the electrical connection between the first field effect transistor 304 and the second field effect transistor 305, it can be connected through the metal sheet 306, and the metal sheet 306 does not need to be bent, and does not need to increase the cost of the bending mold , the manufacturing cycle is shortened, so that the same metal sheet 306 can be adapted to different types of field effect transistors, and there is no need to open molds for various types of metal sheets 306, which is very convenient to implement.

It should be noted that the aforementioned first metal body, second metal body, and third metal body include various types, and each type of metal body has a different height. Taking the first metal body as an example, each type of first metal body has a different height, and the first metal body can be used to adjust the distance between the metal base 302 and the bottom plate 301 . That is, the thickness of the metal base 302 can be compensated by the metal body, and the same metal base 302 can meet the requirements of different types of thickness, avoiding the development of metal bases 302 with different thicknesses. For example, when the height of the first metal body is the first height, a second height is formed between the metal base 302 and the bottom plate 301; When the height of the first metal body is the fifth height, the sixth height is formed between the metal base 302 and the bottom plate 301, and so on. It can be seen that the electrical connection between the metal base 302 and the bottom plate 301 through the first metal body not only ensures that the metal base 302 has high precision in the horizontal direction, height direction, and inclination, and improves the packaging quality, but also The requirements for different heights of the metal base 302 can be adjusted by setting the height of the first metal body, avoiding the development of metal bases 302 of different heights, saving development costs, and shortening the development cycle. The metal base 302 is connected to the bottom plate 301 through a metal body. When the metal body is limited by the recess, it is not easy to shift during processing, which can effectively prevent the metal base 302 from shifting.

The first pit, the second pit, the third pit, the fourth pit, the fifth pit and the sixth pit are all pits with circular openings, and the first metal body and the second metal body Both the metal body and the third metal body are spherical metal bodies, and when the spherical metal body is placed in the pit, anastomosis and fixation are formed. As shown in FIG. 7 , FIG. 7 is a schematic diagram of disposing a metal body 601 in each pit, and the metal body 601 coincides with the pit.

It should be noted that the shape of the pit is not limited to the opening being circular, and the shape of the metal body 601 is not limited to a spherical shape, as long as the pit and the metal body 601 can be fit and fixed, and the metal body 601 can be fixed in the pit. It can play the role of limit and calibration. The opening size and depth of the pit can be flexibly set to ensure that the metal body 601 will not roll in the pit. For example, the opening size of the pit can be set to be close to the maximum circumference of the spherical metal body, and the pit's The depth is set to be close to the radius of the spherical metal body. Since the opening of the pit is circular, and the metal body 601 is a spherical metal body, the pit and the metal body 601 can be fitted and fixed, and the ball-shaped metal body can be conveniently placed in the pit through the ball planting process, and the processing is simple. Moreover, the ball planting process is mature and it is very convenient to implement.

In order to facilitate the fixing of the metal body 601 in the pit, the outer surface of the metal body 601 can be coated with solder. After planting the balls and setting the corresponding components, a reflow soldering process is required. After reflow soldering, the solder on the surface of the spherical metal body melts to form interconnections. The spherical metal body plays the role of limit and self-calibration, which can ensure that the metal base 302 and the metal sheet 306 have high precision in the horizontal direction, height direction, and inclination. Metal bases 302 of different heights can also It is adjusted by the diameter of the spherical metal body.

After completing the aforementioned processes of setting the recesses for the integrated electronic device, implanting metal bodies in the recesses, mounting components, and reflow soldering, the plastic packaging process for the integrated electronic device can be performed. At this time, the integrated electronic device also includes a plastic package, and the bottom plate 301, the metal sheet 306 and the active components can be packaged in the plastic package, and the surface of the metal base 302 is partially or completely exposed to the plastic package through the openings provided by the plastic package. Outside the shell, the terminal pins can be electrically connected with the metal base 302 when the passive components are mounted on the plastic package. The height of the metal base 302 exposed outside the plastic package can be adjusted by setting the height of the first metal body to meet the needs of different heights of the metal base 302, without the need to develop a variety of metal bases 302 of different heights . As shown in FIG. 10 , when the base plate 301 is electrically connected to the metal base 302 , the height of the metal base 302 from the base plate 301 can be adjusted by the size of the metal body.

It should be noted that since the outer surfaces of the first metal body, the second metal body and the third metal body can be externally coated with solder; the first metal body is set between the first pit and the second pit, and the third metal body After the second metal body is set between the pit and the fourth pit, and the third metal body is set between the fifth pit and the sixth pit, reflow can be performed before the integrated electronic device is plastic-encapsulated by the plastic package Solder melted solder. Fixing and electrical connection of the metal body is achieved by applying solder on the outer surface of the metal body and melting the tin material, which is simpler than electroplating copper or installing copper pillars on via holes. After reflow soldering, it can also be cleaned to wash off the flux, and then wire-bonding is performed on active devices that require wire-bonding, and then plastic-encapsulated.

After the plastic packaging process is completed, passive devices can be mounted on the metal base 302 exposed outside the plastic package. At this time, the integrated electronic device also includes passive devices, and the passive devices are electrically connected to the metal base 302 . The passive components may include inductors and capacitors, etc., because when the passive components such as inductors or capacitors are large in size or high in height, the passive components can be mounted on the plastic package by SMT technology, and connected with metal The base 302 is electrically connected to realize the electrical connection with other components of the plastic package, which is very convenient to implement.

It should be noted that since the bottom plate 301 and the metal base 302 are electrically connected by setting pits and metal bodies, it is not required that the bottom plate 301 has a larger area of reserved welding area than the pad of the passive device, so that the plastic package can The package is further miniaturized. That is, the upper surface area of the metal base 302 exposed outside the plastic package can be larger than the surface area of the bottom plate 301. As shown in FIG. , thereby saving the contact area between the bottom plate 301 and the metal base, making the package smaller and increasing the power density. When the large-area metal base 302 is used as the pad of the passive device, the area of the pad of the passive device can be increased, so that the area reserved for welding on the bottom plate 301 is not limited to the size of the pad required by the passive device, and the packaging Further miniaturization is not limited. Metal bodies of different heights can also be selected to adjust the overall package height, which can avoid the development of metal bases 302 of different heights, save development time and development costs, realize different package thicknesses, and do not need to open molds for metal bases 302 of different thicknesses. Metal bodies of different heights are required.

In the embodiment of the present application, between the bottom plate 301 and the metal base 302, between the active device and the metal sheet 306, and between the bottom plate 301 and the metal sheet 306, corresponding pits can be provided at the positions where they are electrically connected to each other. A metal body is arranged in the pit, and electrical connection is realized through the metal body, and the shape, size and number of the pit can be flexibly set. The metal body can play the role of limiting and self-aligning in the pit, so that the coplanarity of the metal base 302 is strong. And the electrical connection is realized through the metal body, so that the same metal sheet 306 can be adapted to different types of active devices, and the metal sheet 306 does not need to be bent to connect to the bottom plate 301, but to realize the connection between the metal sheet 306 and the bottom plate 301 through the metal body, Exploitation of different types and sizes of sheet metal 306 is avoided. In addition, all components arranged on the bottom plate 301 can be provided with pits, and the metal body in the pits can be electrically connected to the bottom plate 301, so that the welding area can be reduced, occupying only the position of the metal body, and no large soldering area is required. Larger area for better heat dissipation.

An embodiment of the present application provides an electronic device, the electronic device includes the integrated electronic device shown in Figure 3 generated according to the production method shown in Figure 4 to Figure 10, the electronic device also includes a power module, a control module, a housing, etc. , wherein the integrated electronic device is connected to the power module and the control module respectively; the casing is used to encapsulate the integrated electronic device, the power module, and the control module as a whole. The type of the electronic device can be set according to actual needs, for example, a charger for a mobile phone, a charger for a tablet computer, and the like.

The integrated electronic device provided by the embodiment of the present application and its production method have been introduced in detail above. In this paper, specific examples are used to illustrate the principle and implementation of the present application. The description of the above embodiment is only used to help understand the present application. method and its core idea; at the same time, for those of ordinary skill in the art, according to the idea of this application, there will be changes in the specific implementation and scope of application. In summary, the content of this specification should not be understood as Limitations on this Application.

Claims (18)

1. An integrated electronic device, comprising:

a bottom plate, a metal base and an active device;

the active device is arranged on the bottom plate;

the active device is characterized in that a first pit is formed in one surface, provided with the active device, of the bottom plate, a second pit is formed in the metal base, the first pit is electrically connected with the second pit through a first metal body, and the first metal body is partially embedded in the first pit and partially embedded in the second pit.

2. The integrated electronic device according to claim 1, further comprising a metal sheet disposed on top of the active device, the metal sheet being used to connect the active device with the metal base, wherein a third recess is disposed on top of the active device, and a fourth recess is disposed on the metal sheet, and the third recess and the fourth recess are electrically connected through a second metal body, wherein the second metal body is partially embedded in the third recess and partially embedded in the fourth recess;

the metal sheet is provided with a metal base, the metal base is provided with a through hole, the metal sheet is electrically connected with the active device, the through hole is provided with a first concave pit, the metal base is provided with a second concave pit, the through hole is provided with a third metal body, the metal sheet is electrically connected with the active device, the bottom plate is provided with a sixth concave pit in a conduction area with the metal base, the fifth concave pit is electrically connected with the sixth concave pit through the third metal body.

3. The integrated electronic device according to claim 2, wherein the first metal body, the second metal body and the third metal body are each a spherical metal body externally coated with solder.

4. The integrated electronic device according to claim 3, wherein the first concave pit, the second concave pit, the third concave pit, the fourth concave pit, the fifth concave pit and the sixth concave pit are all concave pits with circular openings, and the first metal body and the second metal body, which are both spherical metal bodies, form an anastomotic fixation when being respectively placed in the concave pits corresponding to the first metal body and the second metal body.

5. The integrated electronic device according to claim 2, wherein the active device comprises a field effect transistor, a seventh recess is formed on a top of the field effect transistor, an eighth recess is further formed on the metal sheet, and the seventh recess and the eighth recess are electrically connected through a fourth metal body, wherein the fourth metal body is partially embedded in the seventh recess and partially embedded in the eighth recess;

The seventh pit is included in the third pit, the eighth pit is included in the fourth pit, and the fourth metal body is included in the second metal body.

6. The integrated electronic device according to any one of claims 1 to 5, wherein the first metal body includes a plurality of types, each type of the first metal body having a different height, the first metal body being used to adjust a distance between the metal base and the chassis base.

7. The integrated electronic device according to any one of claims 2 to 5, further comprising an encapsulant, wherein the base plate, the metal sheet and the active device are all encapsulated in the encapsulant, wherein a surface of the metal base is partially or completely exposed out of the encapsulant through an opening provided in the encapsulant, and an upper surface of the metal base exposed out of the encapsulant is larger than a bottom surface of the base plate.

8. the integrated electronic device according to any one of claims 1 to 5, further comprising a passive component electrically connected to the top of the metal base.

9. a production method of an integrated electronic device, characterized in that it is used for producing an integrated electronic device according to any one of claims 1 to 8, comprising:

An active device is arranged on the bottom plate;

Arranging a first pit on one surface of the base plate, on which the active device is arranged;

Arranging a second pit on the metal base;

And electrically connecting the first pit and the second pit through a first metal body, wherein the first metal body is partially embedded in the first pit and partially embedded in the second pit.

10. The production method according to claim 9, characterized in that the production method further comprises:

disposing a metal sheet on top of the active device, the metal sheet for connecting the active device with the metal base;

providing a third pit on top of the active device;

Arranging a fourth pit on the metal sheet;

Electrically connecting the third pit and the fourth pit through a second metal body, wherein the second metal body is partially embedded in the third pit and partially embedded in the fourth pit;

A fifth pit is further arranged on one surface of the metal sheet, which is electrically connected with the active device;

a sixth pit is arranged in a conduction area between the bottom plate and the metal base;

and electrically connecting the fifth pit and the sixth pit through a third metal body, wherein the third metal body is partially embedded in the fifth pit and partially embedded in the sixth pit.

11. The method of producing as claimed in claim 10, wherein said first metal body, said second metal body and said third metal body are each a spherical metal body having an outer surface coated with solder.

12. The production method according to claim 11, wherein the first concave pit, the second concave pit, the third concave pit, the fourth concave pit, the fifth concave pit, and the sixth concave pit are concave pits having circular openings, and the first metal body and the second metal body, which are spherical metal bodies, are placed in the concave pits corresponding thereto, respectively, to form an anastomosis fixation.

13. The method of manufacturing according to claim 10, wherein the active device comprises a field effect transistor;

arranging a seventh pit on the top of the field effect transistor;

An eighth pit is further arranged on the metal sheet;

The seventh pit and the eighth pit are electrically connected through a fourth metal body, wherein the fourth metal body is partially embedded in the seventh pit and partially embedded in the eighth pit;

The seventh pit is included in the third pit, the eighth pit is included in the fourth pit, and the fourth metal body is included in the second metal body.

14. the production method according to any one of claims 9 to 13, wherein the first metal body includes a plurality of types, each type of the first metal body having a different height, the first metal body being used to adjust a distance between the metal base and the bottom plate.

15. The production method according to any one of claims 11 or 12, characterized in that the production method further comprises:

and reflow soldering the solder after disposing the first metal body between the first recess and the second recess, disposing the second metal body between the third recess and the fourth recess, and disposing the third metal body between the fifth recess and the sixth recess.

16. The production method according to any one of claims 10 to 13, characterized in that the production method further comprises:

And packaging the bottom plate, the metal sheet and the active device in a plastic package, and exposing the surface of the metal base outside the plastic package through an opening part arranged on the plastic package or completely, wherein the upper surface of the metal base exposed outside the plastic package is larger than the bottom surface of the bottom plate.

17. The production method according to any one of claims 9 to 13, characterized in that the production method further comprises:

and a passive device is arranged on the top of the metal base, and the metal base is electrically connected with the passive device.

18. an electronic device comprising a power module, a control module, a housing, and the integrated electronic apparatus of any one of claims 1 to 8;

The integrated electronic device is respectively connected with the power supply module and the control module;

the housing is configured to integrally encapsulate the integrated electronic device, the power module, and the control module.