MXPA96002021A - Procedure for the manufacture of a plate printed decircuits and impro circuit plate - Google Patents
Procedure for the manufacture of a plate printed decircuits and impro circuit plateInfo
- Publication number
- MXPA96002021A MXPA96002021A MXPA/A/1996/002021A MX9602021A MXPA96002021A MX PA96002021 A MXPA96002021 A MX PA96002021A MX 9602021 A MX9602021 A MX 9602021A MX PA96002021 A MXPA96002021 A MX PA96002021A
- Authority
- MX
- Mexico
- Prior art keywords
- printed circuit
- circuit board
- printed
- cooling body
- components
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 25
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000001816 cooling Methods 0.000 claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Abstract
A printed circuit board (1), which must be equipped on both sides with components and must be provided with thermal conductive elements, is manufactured in the following stages of work: the printed circuit board (1) is printed with solder paste on its lower part, is equipped with components and soldered, on the bottom of the printed circuit board (1) a flat cooling body is fixed, and the printed circuit board (1) is printed with solder paste on its part superior, it is equipped with components and soldered. The equipped printed circuit board is especially used in automotive technology control devices
Description
ES $ PROCEDURE FOR THE MANUFACTURE OF A PRINTED CIRCUIT PLATE AND PRINTED CIRCUIT PLATE The invention relates to a method according to the preamble of patent claim 1 and to a printed circuit board manufactured according to such a process. Printed circuit boards of this type are used, for example, in electronic control devices, which serve to control or regulate the most different functions in a car (engine control, control of the gearbox, brake control, etc.). .) Equipped with integrated power modules and components, which generate high heat losses. This heat must be effectively removed, to prevent the destruction of the components. In the manufacture of known printed circuit boards, a partial layer of the cooling body is already laminated to the manufacturer of the printed circuit boards and the printed circuit boards with the cooling body referred to as the purchase part are equipped with components in the manufacture of control devices. The layer of the cooling body which is constituted, for example, of copper prevents, due to its height difference from the rest of the surface of the printed circuit board, that in a subsequent reflow welding process it can be printed with soldering on the printed circuit board (DE-U 81 14 325, DE-A 42 22 838). The object of the invention is to provide, in the manufacture of printed circuit boards, that on the lower part of the printed circuit board welding paste can be applied through printing, so that the printed circuit board is suitable for welding in the reflux procedure. This task is solved by means of the method according to claim 1, and by means of a printed circuit board according to claim 5. Suitable developments of the invention are presented in the dependent claims. Exemplary embodiments of the invention are explained below with the help of the drawings. In this case: Figure 1 shows a perspective representation of a printed circuit board, which serves to explain the method according to the invention, and Figure 2 shows a perspective representation of a printed circuit board used for the explanation of another embodiment of the method according to the invention.
On the lower part of a printed circuit board 1 (turned upwards in FIG. 1) a cooling body 2 is applied. The cooling body 2 consists of a printed strip of sheet metal or of a sheet, for example of copper or aluminum. It can be constituted in one piece, but it can also be constituted by several parts of cooling bodies 4, 5 and 6 -indicated by means of dashed lines 3-. Between the cooling body 2 and the printed circuit board 1 an adhesive sheet is inserted on both sides, the dimensions of which correspond to the dimensions of the cooling body 2, and then the cooling body is connected by means of a tightening process with the printed circuit board 1. This sheet consists of a good thermal conductor material. The manufacturing process according to the invention has the following steps: The lower part of the printed circuit board 1 is printed with solder paste, equipped with components and then welded, preferably by reflow welding. The individual work steps are not explained here in detail, since they are generally known. - The cooling body 2 or the parts of the cooling body 4, 5 and 6 provide with the adhesive sheet 7 on the sides on the lower part of the printed circuit board 1 and is fixed by means of clamping pressure. - The upper part of the printed circuit board 1 is printed with solder paste, equipped with components and finally soldered. This procedure has the advantage that in the process of tightening the cooling body 2 on the lower part of the printed circuit board 1, the upper part of the un-equipped printed circuit boards is still available as a flat surface for counter-support. A second embodiment of the process according to the invention has the following advantages: The upper part and the lower part of the printed circuit board 1 are printed with solder paste, are equipped with components and are welded, preferably by welding Reflux. The cooling body 2 or the parts of the cooling body 3, 4 and 5 are fixed with the adhesive sheet 7 on both sides on the lower part of the printed circuit board 1. In this procedure it is advantageous that the upper part and the lower part of the printed circuit board can be manufactured successively in a conventional manner. In addition, the cooling body 2 and the adhesive sheet 7 should not be subjected to the welding process, instead the tightening of the cooling body can be carried out after welding in a separate manufacturing line. However, a certain disadvantage is that when pressing the cooling body there is no flat surface for counter-support and, therefore, recesses must be provided for the components to be equipped on the upper part of the printed circuit board . In a further variant of the manufacturing process, the cooling body 2 or the parts of the cooling body 4, 5 and 6 are fixed by welding on the upper part of a printed circuit board 10 (FIG. 2). The printed circuit board 10 has a welding surface 8 for this purpose. This method is convenient when the contact surfaces (not shown here) on the printed circuit board 10 are at the housing potential and the cooling body 2 is weldable on the contact surfaces. In this case it is advantageous that the adhesive film on both sides is not necessary and that the welding process which must be carried out anyway can be used for fixing the cooling body. The cooling bodies 2, 4, 5 and 6 must not be applied and forcedly welded onto the lower part of the printed circuit board, but in the case of appropriate geometry of the printed circuit boards it is also possible to apply them on the upper part of the printed circuit board. The sequence in the application of the individual components of the printed circuit board is certainly optional, but the cooling bodies must be equipped before the last welding process.
Claims (5)
- CLAIMS 1. Procedure for the manufacture of a printed circuit board, which must be equipped on both sides with components and which can be provided with thermally conductive elements, especially for use in a control apparatus of the automobile technique, with the following steps of work: the printed circuit board is printed with solder paste on its lower part, it is equipped with components and soldered; on the lower part of the printed circuit board is fixed at least one flat cooling body, and the printed circuit board is printed with solder paste on its upper part, equipped with components and soldered. Method according to claim 1, characterized in that the upper part and the lower part of the printed circuit board are printed with solder paste in a working step before the application of the cooling body part, are equipped with components and soldered. Method according to claim 1, characterized in that the cooling body part is fixed to the printed circuit board with an adhesive sheet on both sides and heat conductive. Method according to claim 1, characterized in that the cooling body part is fixed to the printed circuit board by welding. 5. Printed circuit board, which is equipped on both sides with components and is provided with heat conducting elements, especially for use in a control apparatus of the automobile technique, characterized in that it has been manufactured according to the method according to one of the preceding claims.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19519776A DE19519776A1 (en) | 1995-05-30 | 1995-05-30 | Method of manufacturing a printed circuit board and printed circuit board |
| DE19519776.3 | 1995-05-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MXPA96002021A true MXPA96002021A (en) | 1997-08-01 |
| MX9602021A MX9602021A (en) | 1997-08-30 |
Family
ID=7763204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX9602021A MX9602021A (en) | 1995-05-30 | 1996-05-29 | Process for the manufacture of a printed circuit plate, and printed circuit plate. |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR960044013A (en) |
| DE (1) | DE19519776A1 (en) |
| FR (1) | FR2734981B1 (en) |
| MX (1) | MX9602021A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10102848B4 (en) * | 2000-05-31 | 2004-04-15 | Sebastian Erb | Process for positive and bubble-free gluing of populated or non-populated printed circuits with flat heat sinks using adhesive foils |
| DE102010008553B4 (en) | 2010-02-19 | 2011-09-22 | Continental Automotive Gmbh | Device for shielding an electronic module |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE8114325U1 (en) * | 1981-05-14 | 1982-09-30 | Siemens AG, 1000 Berlin und 8000 München | Heat dissipation device |
| US5078082A (en) * | 1989-08-16 | 1992-01-07 | Smt East Corporation | Method and apparatus for applying bonding material to a populated mounting surface |
| DE4222838C2 (en) * | 1991-09-21 | 2002-03-28 | Bosch Gmbh Robert | Electrical device, in particular switching and control device for motor vehicles |
| JPH05343874A (en) * | 1992-06-11 | 1993-12-24 | Mitsubishi Materials Corp | Heat dissipation structure of hybrid ic |
| DE4234022C2 (en) * | 1992-10-09 | 1995-05-24 | Telefunken Microelectron | Layer circuit with at least one power resistor |
-
1995
- 1995-05-30 DE DE19519776A patent/DE19519776A1/en not_active Withdrawn
-
1996
- 1996-05-28 KR KR1019960018127A patent/KR960044013A/en not_active Withdrawn
- 1996-05-29 MX MX9602021A patent/MX9602021A/en unknown
- 1996-05-29 FR FR9606596A patent/FR2734981B1/en not_active Expired - Fee Related
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