MX2008014702A

MX2008014702A - Temperature managing for electronic components.

Info

Publication number: MX2008014702A
Application number: MX2008014702A
Authority: MX
Inventors: Torbjoern Nilsson
Original assignee: Telefonaktiebolaget Lm Ericcss
Priority date: 2006-06-02
Filing date: 2006-06-02
Publication date: 2008-12-01
Also published as: AU2006344160A1; EP2022302A1; CN101449637A; US20090283248A1; EP2022302A4; WO2007142558A1; JP2009539246A

Abstract

The invention provides a temperature managing arrangement (100, 200) comprising; a reservoir (240) arranged to accumulate a tempering liquid (242); a pressurizing device (210) arranged to pressurise the tempering liquid (242); at least one spray module (220) arranged to receive the pressurized liquid (242) and comprising at least one spraying device (222) arranged to spray the liquid (242) on at least one electronic component (224) so as to create a thermal coupling between the sprayed liquid (242) and the component (224); a heat remover (230) arranged to cool the tempering liquid (242), being in at least one of a liquid, a vapor or a mist form after spraying, when thermal energy is to be removed from said component (224); and wherein said tempering managing arrangement (200) is further comprising a heating device (245) arranged to heat the tempering liquid (242) before spraying when thermal energy is to be provided to said component (224). In addition, the invention provides a method for using said temperature managing arrangement.

Description

TEMPERATURE HANDLING FOR ELECTRONIC COMPONENTS TECHNICAL FIELD The present invention relates generally to a sprinkler attenuation arrangement capable of cooling and heating electronic components.

BACKGROUND OF THE INVENTION Nowadays, cooling with liquid is well known in the art for cooling electronic systems. As air cooling systems continue to advance to new levels of performance, so do their cost, complexity and weight. Cooling with liquid is replacing cooling with air and allows the performance of electronic systems to grow exponentially. A preferred method for cooling with liquid is the so-called double-phase cooling. A double-phase cooling occurs when the refrigerant changes from one phase to another, for example, from liquid to vapor. Due to the increased energy required for a phase change, dual phase cooling systems often offer the ability to provide more compact and higher performance cooling systems than single phase systems. In contrast, a single phase cooling occurs when the refrigerant remains in the same phase During the entire cooling process, for example, it remains liquefied or vaporized during the entire cooling process. An exemplary dual phase cooling method is spray cooling. The common spray cooling system uses at least one pump to supply fluid in at least one nozzle that transforms the fluid into droplets. These droplets collide on the surface of the component to be cooled to typically create a thin film of liquid. The energy is transferred from the surface of the component to the thin film of liquid as the liquid evaporates. Since the fluid can be distributed at or near its saturation point, the absorbed heat causes the thin film to become vapor. This steam is then condensed, often by means of a heat exchanger, or condenser, and returned to a tank and / or the pump. However, even if the cooling capacity of a spray cooling system can be satisfactory, the opposite problem is not achieved. Nowadays, there is a problem to make electronic systems start or start properly, at low temperatures. For example, this may be the case during start-up in winter conditions or at high altitudes. In addition, an operational electronic component also it can be exposed to ambient temperatures and / or operating conditions that lower the operating temperature of the operating component to an unsatisfactory level. However, there are some alternatives for dealing with low temperature electronic components: Metal tape or resistors or other types of electric heaters can be arranged near the electronic components. However, this requires a certain amount of volume, additional wiring and has to be designed in the system from the beginning. In addition, the trend is a dense packaging of the electronic components, not inserting a number of additional components. - The heated air can be arranged to flow around the electronic devices. However, this requires additional volume for air channels, fan and heater. It will also add additional weight to the system. - The heated liquid can be arranged to flow in radiators or convection heaters near electronic devices. However, this requires additional volume for piping, radiators / heaters by convection and pump. It will also add additional weight to the system. - Electronic components can be selected of components that are specified for particularly low temperatures. However, this is only possible to a certain degree, for example, depending on the limited availability of such components with the required functions. The components are also expensive and less common than normal components. Therefore, there is a need for an improved temperature management arrangement that utilizes the advantages of a double phase cooling method or at least a single phase cooling method for cooling electronic components., whose arrangement avoids at least one of the disadvantages associated with the commissioning and / or operation of electronic components at low temperatures as mentioned in the foregoing.

COMPENDIUM OF THE INVENTION The present invention represents an improvement compared to the prior art in providing a sprinkler attenuation arrangement capable of heating and cooling electronic components. This is achieved by a temperature management arrangement comprising a reservoir arranged to operatively accumulate an attenuation liquid, a pressurization device arranged to operatively pressurize the attenuation liquid and at least one sprinkler module. arranged to operatively receive the pressurized liquid and comprising at least one spraying device, for example, a nozzle, arranged to operatively spray the liquid in at least one electronic component to create a thermal coupling between the sprayed liquid and the component. Further, in the temperature management arrangement it comprises a heat remover arranged to operatively cool the attenuation liquid after spraying when the thermal energy is to be removed from the component (224). Here, the attenuation liquid becomes at least one of a liquid, a vapor, or a vaporization after spraying, for example, due to splashing in the spraying or heating device by the electrical component. In addition, the temperature management arrangement comprises a heating device arranged to operatively heat the attenuation liquid before spraying when the thermal energy is to be provided to the component. Here, the attenuation liquid takes the form of a liquid before spraying. With respect to the removal of thermal energy, it is preferred that the thermal energy be removed from the component in accordance with a dual phase cooling. The attenuation liquid is preferably an electrically insulating fluid. The heating device is available Preference for operatively heating the attenuation liquid to a temperature near or above the average of the temperature range specified by the manufacturer for the electronic component to be provided with thermal energy. At least one spraying device may be arranged to operatively spray the quenching liquid in a first electronic component in the form of a cooling flange or a cooling surface thermally coupled to a second electronic component that is to be heated or cooled by the liquid. At least one spraying device may be arranged to operatively spray the attenuation liquid on an electronic component in the form of a circuit card, or a support provided with a plurality of circuit cards. At least one spraying device may be arranged to operatively spray the quenching liquid in a first electronic component in the form of a cooling flange or a cooling surface thermally coupled with a second electronic component that is to be heated or cooled by the liquid. The spray module may comprise at least two types of spray device, wherein a first type of spray device is arranged for Operationally used when the temperature management arrangement operates as a cooling arrangement and a second type of spray device is arranged to be used operatively when the temperature management arrangement operates as a heating system. In addition, the present invention represents an improvement compared to the prior art in providing a method for handling the temperature using the temperature management arrangement, which method comprises the steps of accumulating an attenuation liquid (242) in a reservoir (140, 240 ); pressurizing the attenuation liquid (242) by means of a pressurization device (110, 210); providing the pressurized liquid (242) to at least one sprinkler module (120, 220) comprising at least one sprinkler device (222) arranged to spray the liquid (242) in at least one electronic component (224) to create a thermal coupling between the liquid (242) sprayed and the component (224); cooling the quenching liquid (242), at least one of a liquid, a vapor or a form of vaporization after the spraying, by means of a heat remover (130, 230) when the thermal energy is to be removed from the component (224), and · heating the attenuation liquid (242) by means of a heating device (145, 245) before spraying, when the thermal energy is to be provided to the component (224). The stages do not necessarily have to be done in the previous order. According to the method, the attenuation liquid is preferably heated to a temperature close to or higher than the average of the temperature range specified by the manufacturer for the electronic component to be supplied with thermal energy. According to the method, at least one spraying device is spraying the attenuation liquid in a first electronic component in the form of a cooling flange or a cooling surface thermally coupled to a second electronic component that is to be heated or cooled by the liquid According to the method, at least one spraying device can spray the attenuation liquid on an electronic component in the form of a circuit card, or a support provided with a plurality of circuit cards. According to the method, at least one spraying device can spray the attenuation liquid in a first electronic component in the form of a cooling flange or a cooling surface thermally coupled to a second electronic component that is to be heated or cooled by the liquid Further advantages of the present invention and modalities thereof will appear from the following detailed description of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic illustration of a temperature management arrangement in the form of an exemplary spray attenuation system 100 according to a first embodiment of the present invention. Figure 2 is a schematic illustration of a temperature management arrangement in the form of an exemplary spray attenuation system 200 according to a second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED MODALITIES A FIRST MODALITY Structural Elements Figure 1 is a schematic illustration of a closed-loop double-phase spray attenuation system 100 according to a first exemplary embodiment of the present invention. The exemplary spray attenuation system 100 comprises a pump 110, a spray module 120, a heat remover 130 and a reservoir 140 provided with a heating device 145. The attenuating system 100 also comprises a pipe system 150 for connecting the components in a suitable manner, i.e., the reservoir 140 to the pressurizing device 110 and in addition to the sprinkler module 120 and the heat remover 130 and again to the device 110. of pressurization. The pump 110 is adapted to pressurize a suitable attenuation liquid (not shown in Figure 1). Preferably, the pump 110 is driven by a direct current motor to create precise and accurate pressures and flow rates. However, the pump 110 can be driven by another means, for example, an alternating current motor, a hydraulic motor or any other suitable driving means. The pump 110 operates in accordance with any suitable method for pressurizing the attenuation liquid, for example, in accordance with a reciprocal method or a rotary method in conjunction with displacement pumping or dynamic pumping. The spray module 120 is provided with at least one nozzle. Several sprinkler modules 120 can be used with the sprinkler attenuation system 100 and each sprinkler module can comprise a plurality of nozzles. The heat remover 130 may be a heat exchanger or some other means of condensation suitable adapted to operatively condense the liquid mixture, vaporization (i.e., small droplets of liquids floating in the air or some other gas) and vapor (ie, the gaseous state of the liquid) that is created in or near the 120 spray module during cooling. The reservoir 140 is adapted to accumulate the attenuation liquid of the attenuation system 100. The deposit is illustrated as a separate unit in Figure 1, being connected to the sprinkler attenuation system by the pipe system 150. This indicates that the reservoir 140 is formed as a separate chamber of the appropriate size. However, in some embodiments, a reservoir can be formed entirely by the pipe system 150, i.e., the single tubes can provide sufficient volume to form a suitable reservoir. The heating device 145 is preferably arranged in the liquid-filled part of the attenuation system 100. As indicated in Figure 1, it is particularly preferred that the heating device 145 be disposed in the reservoir 140 to operatively heat the attenuation liquid therein. The heating device 145 is preferably an immersion heater or the like disposed within the attenuation liquid. However, other sources of heat are clearly acceptable, for example, a heat exchanger or even an emitter microwave .

Function of and Cooperation between structural elements In operation, the attenuation liquid is pressurized by the pump 110 and subsequently moved to a series of components of the system by the pipe system 150. The pipe system 150 is made of a material that is compatible with the attenuation liquid. The material can be rigid or semi-rigid, or even flexible to allow variable configurations of three dimensions. The spray module 120 in the spray attenuation system 100 is arranged to operatively receive the pressurized attenuation liquid from the pump 110. The nozzle or nozzles of the spray module 120 are arranged to operatively spray the attenuation liquid received over the minus an electronic component (not shown in Figure 1). When the electronic components are cooled by the spray module 120, a mixture of liquid, vaporization and vapor is created within or in the vicinity of the spray module 120. The liquid and vaporization are essentially created by the spray activity of the spray module 120, while the steam is essentially created from the liquid which is gasified by absorbing energy from the heat components in or near the module 120 of aspersion. The resulting mixture of liquid, vaporization and vapor is received by the heat remover 130 by the pipe system 150 of the sprinkler attenuation system 100. It is preferred that the heat remover 130 is disposed in the full part of the mixture and not the liquid-filled part of the spray attenuation system 100. The heat remover 130 in Figure 1 is illustrated as a separate unit connected to the sprinkler attenuation system 100 by the pipe system 150. However, the heat remover 130 may alternatively be arranged in the spray module 120 or in the reservoir 140 or in any other suitable position in the mixture-filled parts of the spray attenuation system 100. The condensed liquid is collected in the tank 140 from which the liquid to be pressurized is subsequently recovered by the pump 110. The sprinkler cooling function of the exemplary sprinkler attenuation system 100 in Figure 1 has been presented in some detail in the foregoing. The description will now proceed with a presentation of the sprinkler heating capacity of the sprinkler attenuation system 100 in Fig. 1. The heating capacity of the sprinkler attenuation system 100 requires a sprinkler device. heating. Therefore, an exemplary heating device 145 disposed in the reservoir 140 is illustrated schematically in Figure 1. It is particularly preferred that the heater 145 be disposed in the reservoir 140 to operatively heat the attenuation liquid thereto to a temperature within the reservoir 140. of the temperature range specified by the manufacturer of the electronic component (for example, specified by the manufacturer of an integrated circuit). For components with a specific temperature range of 0-70 ° C, the attenuation liquid, for example, could be heated to a temperature within the range of 10-65 ° C or within the range of 20-55 ° C, or greater preference at a temperature close to the average of the temperature range specified by the manufacturer. For components with a specified temperature range of, for example 0-70 ° C, this means that the attenuation liquid can be heated to a temperature close to 35 ° C. However, due to the losses in the pipe system 250 and in other components of the sprinkler attenuation system 100, it may be necessary to heat the attenuation liquid further, for example, additionally heated to 5-20 ° C. The attenuation liquid heated in the reservoir 140 is moved by the pump 110 to the sprinkler module 120. The spray module 120 is arranged to spray operatively the heated attenuation liquid received in at least one electronic component (not shown in Figure 1). Preferably spraying is achieved by using the same spraying means, (for example, the same nozzle) that is used for the spray cooling in the electronic component as previously described. When the electronic components are spray-heated by the spray module 120, a heated mixture of the liquid and vaporization (ie, small droplets floating in the air or similar gas) is created by the spray activity of the spray module 102. However, since the temperature of the electronic components is presumed to be below the temperature of the sprayed mixture, there will be no energy transported from the components to the heated mixture when the spray heating capacity of the system 100 is used. Consequently, there is no vapor creation. In fact, the heated mixture will be cooled by the electronic components in the sprinkler module 120, at the same time that the mixture will assume a liquid state in accordance with the components and objects in the sprinkler module 120. The liquefied mixture is received by the heat remover 130 and then collected in the tank 140, where the liquid is heated and subsequently recovered to be Pressurized again by the pump 110. It should be added that the heat remover 130 can be inactivated or even turned off when the heating capacity of the spray attenuation system 100 is used, since substantially no vaporization or vapor exists to condense when the Spray heating capacity is used. In other words, the liquefied mixture (i.e., the quench liquid) simply moves through the heat remover 130, or alternatively divert the heat remover 130 as illustrated schematically by the bypass tube 151 in Figure 1. From the foregoing, it should be clear that the heated attenuation liquid allows the sprinkler attenuation system 100 to heat the electronic components as well as to cool the components as previously described. The heating of electronic components is particularly advantageous when the components are operated in cold environments, for example during commissioning in winter conditions or at high altitudes. Heating is also advantageous when an operational electronic component is exposed to ambient temperatures and / or operational conditions that lower the working temperature of the component to an unsatisfactory level. In general, the heating capacity of the sprinkler attenuation system 100 is generally advantageous if the temperature of an electronic component falls below or is close to the allowable lower working temperature specified by the manufacturer of the electronic component.

A SECOND MODALITY Structural Elements Figure 2 is a schematic illustration of a closed-loop double-phase spray attenuation system 100 according to a second exemplary embodiment of the present invention. The exemplary spray attenuation system 200 comprises a pump 210, a filter 215, a spray module 220, a heat remover 230 and a reservoir 240. The attenuation system 200 also comprises a tubing system 250 for connecting the components in a suitable form, that is, the reservoir 240 to the pressurizing device 210 and in addition to the sprinkler module 220 and the heat remover 230, and again to the pressurizing device 110. The pump 210, the spray module 220, the heat remover 230, the tank 240 and the pipe system 250 operate in the same or similar manner as the corresponding components described in the foregoing together with the first embodiment of the present invention. Thus, for example, the pump 210 is arranged to pressurize a suitable attenuation liquid 242 in the same or similar manner as described above together with the pump 110 in the first embodiment. Similarly, the spray module 220 is preferably provided with at least one nozzle. More than one spray module 220 may be used with the spray attenuation system 200 and each spray module may comprise a plurality of nozzles. In addition, the heat remover 230 may be a heat exchanger or some other suitable condensation means arranged to operatively condense the resulting mixture in a liquid. However, in the second mode, the liquid 242 attenuation is defined as any of well-known electronic attenuation fluids such as, for example, Fluorinert ™, which is the trade name for the line of refrigerant liquids of electronic components sold commercially by 3M. This is an electrically insulating inert perfluorocarbon fluid which is used in various cooling applications. Different molecular formulations are available with a variety of boiling points, allowing them to be used in "single-phase" applications where it remains a fluid, or for "double phase" applications where the liquid bubbles to remove additional heat by evaporative cooling. An example of one of the uses of the 3M formulations may be, for example, FC-72, or perfluoroexan (C6Fi4) which is used for heat transfer application at low temperature due to its boiling point of 56 ° C. Fluorinert ™ is often used in situations where air may not carry enough heat, or where air flow is so restricted that some kind of forced pumping is required in any way. It is generally preferred that the attenuation liquid 2422 be in liquid form at the temperature when the electronic component is turned on.

Function of and cooperation between the structural elements In operation, the attenuation liquid 242 is pressurized by the pump 210 to be moved from the reservoir 240 by the pipe system 250 through the filter 215 and in the sprinkler module 220. Preferably, the sprinkler module 220 in the sprinkler attenuation system 200 comprises a substantially closed space-for example, a substantially closed box-arranged to receive the pressurized attenuation liquid 242 of the pump 210. Internally, the module 220 of spray is available to spray operatively the attenuation liquid 242 received on at least one electronic component 224. Preferably spraying is achieved by means of a nozzle arrangement 221 provided with at least one nozzle 222. The nozzle 222 is arranged to operatively direct a spray mist 223 and / or droplets on the electronic component 224 when the module 220 of spraying receives the pressurized attenuation liquid 242 from the pump 210. When the electronic component 224 is cooled by the spray 223, a liquid mixture, vaporization (ie, small droplets of liquid floating in the air or some other gas) and Steam (ie, the gaseous state of the liquid) is created within the sprinkler module 220. The liquid and vaporization are essentially created by the spray activity of the nozzle 222, while the steam is essentially created from the liquid that is gasified by absorbing energy from the heat component 224. The resulting mixture of liquid, vaporization and vapor is cooled by the heat remover 230 disposed in the spray module 220. The heat remover 230 in Figure 2 is disposed at an upper end of the spray module 220 under the assumption that steam is rising within the module 220. Other positions can be clearly devised to comply with other steam distributions within the module 220. It is preferred that the remover 230 from heat is a thermally conductive helix or some other thermally conductive structure through which a refrigerant can be circulated to condense the resulting mixture of liquid, vaporization and vapor in a liquid 242. However, other well-known cooling arrangements can be conceived clearly. The circulation of the refrigerant in the heat remover 230 is illustrated by two opposite arrows in the upper part of Figure 2. The condensed liquid 242 flows down in the sprinkler module 220 in Figure 2 by means of gravity at one end bottom of module 220, from where it is collected in the tank 240 through a part of the pipe system 250. The attenuation liquid 242 is subsequently recovered from the reservoir 240 to be pressurized again by the pump 210. The sprinkler cooling function of the exemplary sprinkler attenuation system 100 in Figure 1 has now been presented in some detail and the description proceeds with a presentation of the sprinkler heating capacity of the sprinkler attenuation system 200 in Fig. 2. The heating capacity of the sprinkler attenuation system 200 in Fig. 2 requires a heating device, that is, similar to the first modality presented in the previous with reference to the Figure 1. Therefore, an exemplary heating device 245 is illustrated schematically in Figure 2. The heating device 245 is disposed in the reservoir 240 to operatively heat the attenuation liquid 242 therein. It is preferred that the heating device 245 be an electrically driven immersion heater or the like, even if other sources of heat can be conceived. The electrical power of the heating device 245 is illustrated by two opposite arrows in the lower part of Figure 2. The attenuation liquid 242 heated in the reservoir 240 is moved by the pump 210 to the sprinkler module 220. The spray module 220 is arranged to operatively spray the heated attenuation liquid received in at least one electronic component 224. The preferred spraying is achieved by using the same spraying means (for example, the same nozzle) that is used for the spray cooling of the electronic component as previously described. When the electronic component 224 is heated by the spray 223, a hot mixture of the liquid and vaporization (ie, small droplets floating in the air or similar gas) is created in the spray module 220. However, since the temperature of the electronic component 224 is assumed to be below the temperature of the hot mixture, there will be no thermal energy transported from component 224 to the mixture. Consequently, there is no vapor creation. In fact, the hot mixture will be cooled by the electronic component 224 in the sprinkler module 220, at the same time that the mixture will resume a liquid state as it collides on the cold component 224 and other objects in the sprinkler module 220. The liquefied mixture is received by the heat remover 230 and then collected in the tank 240, where the liquid 242 is reheated. In general, it is preferred that the attenuation liquid 242 be heated to a temperature that ensures an adequate working temperature specified by the manufacturer of the electronic component 224 to be heated. However, as already mentioned previously, due to losses in the pipe system 250 and other components of the spray attenuation system 200, it may be necessary to heat the attenuation liquid 242 further, for example, heated in 20 ° C additional. From the foregoing, it should be clear that the heated attenuation liquid allows the sprinkler attenuation system 200 to heat the electronic component 224 as well as to cool the component 224 as previously described. It should be added that the invention is not limited by no means to one or more simple electronic components 242. In contrast, the electronic component can be a complete circuit card comprising a plurality of different electronic and non-electronic components. The electronic component may even be a support provided with a plurality of circuit cards comprising a plurality of different electronic and non-electronic components. A spray cooling system designed to operate on circuit boards in a support is described, for example, in the USPatent 5,718,117 issued to McDunn et al. However, the McDunn patent does not provide a heating capacity and particularly no heating capacity that is integrated into the spray cooling system as in the present invention. Furthermore, even if the sprinkler attenuation system 200 in Figure 2 is illustrated with a simple nozzle 222, it does not prevent another mode from using two or more different nozzle types. A first type of nozzle, for example, can be adapted for use when the attenuation system operates as a cooling system and a second type of nozzle can be adapted for use when the system operates as a heating system. Furthermore, even if the nozzle 222 of the spray module 220 distributes the spray 223 directly on the electronic component 224, it should be emphasized that the spraying can be distributed to a cooling flange or to some other cooling surface or cooling arrangement that is thermally coupled to the electronic component in question, i.e., the spraying is distributed directly to the cooling arrangement and possibly indirectly to the electronic component that is to be cooled or heated. In that case, the cooling tab or other cooling surface or cooling arrangement should be taken as the "electronic component". The present invention has now been described with reference to exemplary embodiments. However, the invention is not limited to the described modalities. On the contrary, the overall degree of the invention is determined by the scope of the appended claims.

Claims

CLAIMS 1. A temperature management arrangement (100, 200) comprising: - a reservoir (140, 240) arranged to operatively accumulate an attenuation liquid (242); a pressurizing device (110, 210) arranged to operatively pressurize the attenuation liquid (242); - at least one spray module (120, 220) arranged to operatively receive the pressurized liquid (242) and comprising at least one spray device (222) arranged to operatively spray the liquid (242) in at least one electronic component (224) for creating a thermal coupling between the liquid (242) sprayed and the component (224); - a heat remover (130, 230) arranged to operatively cool the attenuation liquid (242), at least one of which is a liquid, a vapor or a form of vaporization after the spray, when the thermal energy is to be removed of the component (224); and wherein the attenuation management arrangement (100, 200) further comprises a heating device (145, 245) arranged to operatively heat the attenuation liquid (242) prior to spraying when the thermal energy is to be provided to the component (224). ).
2. A temperature management arrangement (100, 200) according to claim 1, wherein the thermal energy is to be removed from the component (224) in accordance with a dual phase cooling.
3. A temperature management arrangement (100, 200) according to any of claims 1-2, wherein the attenuation liquid (242) is an electrically insulating fluid.
4. A temperature management arrangement (100, 200) according to any of the claims 1-3, wherein the heating device (145, 245) is arranged to operatively heat the attenuation liquid (242) to a temperature near or above the average of the temperature range specified by the manufacturer for the component (224) electronic that will be provided with thermal energy.
5. A temperature management arrangement (100, 200) according to any of claims 1-4, wherein at least one spray device (222) is arranged to operatively spray the attenuation liquid (242) in a first electronic component in the form of a cooling flange or a cooling surface thermally coupled to a second electronic component that is to be heated or cooled by the liquid (242).
6. An arrangement (100, 200) for managing temperature according to any of claims 1-5, wherein at least one spray device (222) is arranged to operatively spray the attenuation liquid (242) in an electronic component in the form of a circuit board, or a support provided with a plurality of circuit cards.
7. A temperature management arrangement (100, 200) according to any of claims 1-6, wherein at least one spray device (222) is arranged to operatively spray the attenuation liquid (242) in a first electronic component in the form of a cooling flange or a cooling surface thermally coupled to a second electronic component that is to be heated or cooled by the liquid (242).
8. A temperature management arrangement (100, 200) according to claim 1, wherein the sprinkler module (120, 220) comprises at least two types of sprinkler devices (222), wherein a first type of device of spray is arranged to be used operatively when the temperature management arrangement (100, 200) operates as a cooling arrangement and a second type of spray device is arranged to be used operatively when the temperature management arrangement (100, 200) is provided Operate as a heating system.
9. A method for temperature management, whose The method comprises the steps of: - accumulating a liquid (242) of attenuation in a tank (140, 240); - pressurizing the attenuation liquid (242) by means of a pressurization device (110, 210); - providing the liquid (242) pressurized to at least one spray module (120, 220) comprising at least one spray device (222) arranged to spray the liquid (242) on at least one component (224) electronic to create a thermal coupling between the liquid (242) sprayed and the component (224); - cooling the attenuation liquid (242), being at least one of a liquid, a vapor or a form of vaporization after the spray, by means of a heat remover (130, 230) when the thermal energy is to be removed of the component (224); - heating the attenuation liquid (242) by means of a heating device (145, 245) before spraying, when the thermal energy is to be provided to the component (224). A method for temperature management according to claim 9, wherein the attenuation liquid (242) is heated to a temperature near or above the average of the temperature range specified by the manufacturer for the component (224) electronic that is going to get warm . A method for temperature management according to any of claims 9-10, wherein at least one spray device (222) is spraying the attenuation liquid (242) onto a first electronic component in the form of a flange cooling- or a cooling surface thermally coupled to a second electronic component that is to be heated or cooled by the liquid (242). 12. A method for temperature management according to any of claims 9-11, wherein at least one spraying device (222) is spraying the attenuation liquid (242) in an electronic component in the form of a memory card. circuit, or a support provided with a plurality of circuit cards. A method for temperature management according to any of claims 9-12, wherein at least one spraying device (222) is spraying the attenuation liquid (242) in a first electronic component in the form of a flange of cooling or a cooling surface thermally coupled to a second electronic component that is to be heated or cooled by the liquid (242).