Kariya et al., 2005 - Google Patents
Isothermal fatigue properties of Sn–Ag–Cu alloy evaluated by micro size specimenKariya et al., 2005
View PDF- Document ID
- 879568540770567193
- Author
- Kariya Y
- Niimi T
- Suga T
- Otsuka M
- Publication year
- Publication venue
- Materials transactions
External Links
Snippet
Understanding fatigue properties of solder alloys is important to evaluate reliability of solder joints, since cyclic mechanical deformation can occur at solder joints due to thermomechanical fatigue (eg, environmental-temperature cycles on joined materials with …
- 229910045601 alloy 0 title abstract description 62
Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/10—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of nickel or cobalt or alloys based thereon
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