- Products
- Ceramic Packages
- Process Flow
Ceramic Packages
Process Flow
The manufacturing process flow of each product is illustrated with a short Flash video.
Multilayer Ceramic Packages
- LTCC Packages
(LTCC: Low Temperature Co-Fired Ceramics)
- PGA Packages
(PGA:Pin Grid Array)
Packages for Fiber-Optic Communication Modules
Fiber-Optic Connector Components
- Components for LiDAR and 3D Sensing
- Compact Ceramic RFID Tags
- Components for Fiber-Optic Communication Modules
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Ceramic Packages for MEMS Sensors
- Ceramic Packages and Optical Filters for Image Sensors
- Components for Fiber-Optic Connectors
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Surface Mount Ceramic Packages for Electronic Devices
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Ceramic Packages for Light Emitting Diodes (LEDs)
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LTCC Packages for RF Modules
- Ceramic Packages for Automotive Electronics
- Ceramic Packages for Power Electronics
- Components for Wireless Communication Devices
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Ceramic Packages for Large Scale Integration (LSI) Devices
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Ceramic Substrates for Probe Cards
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Glass Hermetic Feedthroughs
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Standard Packages and Lids for Device Evaluation
Product Categories
- Components for LiDAR and 3D Sensing
- Compact Ceramic RFID Tags
- Components for Fiber-Optic Communication Modules
-
Ceramic Packages for MEMS Sensors
- Ceramic Packages and Optical Filters for Image Sensors
- Components for Fiber-Optic Connectors
-
Surface Mount Ceramic Packages for Electronic Devices
-
Ceramic Packages for Light Emitting Diodes (LEDs)
-
LTCC Packages for RF Modules
- Ceramic Packages for Automotive Electronics
- Ceramic Packages for Power Electronics
- Components for Wireless Communication Devices
-
Ceramic Packages for Large Scale Integration (LSI) Devices
-
Ceramic Substrates for Probe Cards
-
Glass Hermetic Feedthroughs
-
Standard Packages and Lids for Device Evaluation