Abstract
With the rapid growth of the PCB manufacturing industry, there is an increasing demand for computer vision inspection to detect defects during production. Improving the accuracy and generalization of PCB defect detection models remains a significant challenge. This paper proposes a high-precision, robust, and real-time end-to-end method for PCB defect detection based on deep Convolutional Neural Networks (CNN). Traditional methods often suffer from low accuracy and limited applicability. We propose a novel approach combining YOLOv5 and multiscale modules for hierarchical residual-like connections. In PCB defect detection, noise can confuse the background and small targets. The YOLOv5 model provides a strong foundation with its real-time processing and accurate object detection capabilities. The multi-scale module extends traditional approaches by incorporating hierarchical residual-like connections within a single block, enabling multiscale feature extraction. This plug-and-play module significantly enhances performance by extracting features at multiple scales and levels, which are useful for identifying defects of varying sizes and complexities. Our multi-scale architecture integrates feature extraction, defect localization, and classification into a unified network. Experiments on a large-scale PCB dataset demonstrate significant improvements in precision, recall, and F1-score compared to existing methods. This work advances computer vision inspection for PCB defect detection, providing a reliable solution for high-precision, robust, real-time, and domain-adaptive defect detection in the PCB manufacturing industry.
B. Liu, D. Chen and X. Qi—These authors made equal contributions to this work.
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Liu, B., Chen, D., Qi, X. (2025). YOLO-Pdd: A Novel Multi-scale PCB Defect Detection Method Using Deep Representations with Sequential Images. In: Mahmud, M., Doborjeh, M., Wong, K., Leung, A.C.S., Doborjeh, Z., Tanveer, M. (eds) Neural Information Processing. ICONIP 2024. Lecture Notes in Computer Science, vol 15293. Springer, Singapore. https://doi.org/10.1007/978-981-96-6596-9_21
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